LC0408FC3.3C-T710-2 [PROTEC]
Trans Voltage Suppressor Diode, 200W, 3.3V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8;![LC0408FC3.3C-T710-2](http://pdffile.icpdf.com/pdf2/p00314/img/icpdf/LC0408FC3-3C_1888022_icpdf.jpg)
型号: | LC0408FC3.3C-T710-2 |
厂家: | ![]() |
描述: | Trans Voltage Suppressor Diode, 200W, 3.3V V(RWM), Bidirectional, 7 Element, Silicon, DO-201, FLIP CHIP-8 局域网 二极管 |
文件: | 总5页 (文件大小:168K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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LC0408FC3.3C
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LC0408FC24C
Only One Name Means ProTek’Tion™
LOW CAPACITANCE FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ Personal Digital Assistant (PDA)
✔ Notebook Computers
✔ SMART Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
0408
(Single Chip Shown)
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Six Voltage Types Ranging From 3.3V to 24V
✔ 200 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Low ClampingVoltage
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ LOW CAPACITANCE
✔ LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts:Solder Bump 0.004”in Height (Nominal)
PIN CONFIGURATION
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LC0408FC24C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
200
UNITS
Watts
°C
PARAMETER
PPP
TJ
Peak Pulse Power (tp = 8/20µs) - See Figure 1
OperatingTemperature
-55°C to 150°C
-55°C to 150°C
StorageTemperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
LC0408FC3.3C
LC0408FC05C
LC0408FC08C
LC0408FC12C
LC0408FC15C
LC0408FC24C
3.3
5.9
8.0
12.0
15.0
24.0
4.0
6.0
8.5
13.3
16.7
26.7
7.0
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
75*
10**
1
1
1
70
35
32
30
25
20
11.0
13.2
19.8
25.4
37.2
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
1,000
80
60
40
td = 20µs
e-t
200W, 8/20µs Waveform
100
td = t
IPP/2
20
10
0.01
0
0
1
10
100
1,000
10,000
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
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LC0408FC24C
GRAPHS
FIGURE 4
FIGURE 3
REFLOW SOLDER PROFILE
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
225°C
5-10 sec
60
Instantaneous
to 200°C
200°C
100°C
40
20
0
1-2 Minutes
to 150°C
1-2 Minutes to 25°C
Average Power
0
25
50
75
100
125 150
Soldering
Time
Pre-Heat
Time
Cool Down
Time
TL - Lead Temperature - °C
Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0408FC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0408FC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
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PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
PACKAGE OUTLINE
MILLIMETERS
DIM
INCHES
A
B
C
E
F
0.56 NOM
0.86 NOM
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.99 ± 0.0254
0.15 SQ
2.0 ± 0.0254
0.15 NOM
0.079 ± 0.001
0.006 NOM
0.005 MAX
0.003 MIN
TOP
G
H
0.127 MAX
0.076 MIN
0.406 NOM
I
0.016 NOM
E
NOTES:
F
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
H
END
I
MOUNTING PAD LAYOUT - Option 1
PAD DIMENSIONS
MILLIMETERS
DIM
INCHES
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.020
0.012
0.018
0.008
0.006 SQ
0.028
D
A
C
DIE
SOLDER
BUMP
0.99
0.51
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
Outline & Dimensions: Rev 4 - 2/04, 06021
05153.R4 2/04
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LC0408FC24C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
MILLIMETERS
DIM
INCHES
A
F
G
H
I
0.51
0.15 SQ
0.71
0.020
0.006 SQ
0.028
COPPER CONTACT 0.009” [0.23] DIA.
A
0.99
0.039
DIE
SOLDER
BUMP
0.51
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 4 - 2/04, 06021
I
TAPE & REEL ORIENTATION
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0408FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels -5,000
pieces per reel. Ordering Suffix: -T710-2
(i.e., LC0408FC05C-T710-2).
COPYRIGHT © ProTek Devices 2004
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
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