PKFC3.3C-LF-T75-2 [PROTEC]
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2;
| 型号： | PKFC3.3C-LF-T75-2 |
| 厂家： | 
PROTEK DEVICES |
| 描述： | Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS COMPLIANT, 0.050 X 0.030 INCH, CHIP SCALE, FLIP CHIP-2 局域网 二极管 |
| 文件： | 总5页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PKFC3.3C*
thru
PKFC36C*
Only One Name Means ProTek’Tion™
PACKAGED FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ CHIP SCALE PACKAGE 0.050”(1.270mm) x 0.030”(0.762mm)
✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ RoHS Compliant in Lead-FreeVersions
MECHANICAL CHARACTERISTICS
✔ Encapsulated 0502 Chip
✔ Weight 0.73 milligrams (Approximate)
✔ Available inTin-Lead or Lead-Free Pure-Tin Plating(Annealed)
✔ Solder ReflowTemperature:
Tin-Lead - Sn/Pb, 85/15:240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
PIN CONFIGURATION
*PATENT PENDING”
05180.R1 3/05
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PKFC3.3C*
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PKFC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Watts
°C
PARAMETER
PPP
TJ
250
Peak Pulse Power (tp = 8/20µs) - See Figure 1
OperatingTemperature
-55°C to 150°C
-55°C to 150°C
StorageTemperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
75*
10**
10***
1
1
1
150
100
75
50
40
13.4
19.0
24.0
43.0
64.0
30
25
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
1,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
80
60
40
td = 20µs
e-t
250W, 8/20µs Waveform
100
td = t
IPP/2
20
0
10
0.01
1
10
100
1,000
10,000
0
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
*PATENT PENDING
05180.R1 3/05
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PKFC3.3C*
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PKFC36C*
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
60
40
20
0
Average Power
0
25
50
75
100
125 150
TL - Lead Temperature - °C
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
*PATENT PENDING
05180.R1 3/05
3
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PKFC3.3C*
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PKFC36C*
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definition
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protective Finish
OSP(Entek Cu Plus 106A)
±50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-265°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Ramp-up
Ramp-down
TL
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
*PATENT PENDING
05180.R1 3/05
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PKFC3.3C*
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PKFC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
INCHES
MILLIMETERS
A
B
C
D
E
F
G
H
J
0.838
1.245
0.762
0.533
0.228
0.533
0.305
0.432
0.432
0.355
0.033
0.049
0.030
0.021
0.009
0.021
0.012
0.017
0.017
0.014
A
C
H
D
K
J
TOP
B
BOTTOM
SIDE
E
K
NOTES
F
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : ± 0.003”
(± 0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036”
(0.914mm).
G
4. All dimensions ±0.003” on package outline.
PAD DIMENSIONS
MOUNTING PAD
DIM
MILLIMETERS
INCHES
A
B
C
E
F
G
J
1.016
0.635
1.473
0.203
0.508
0.343
0.343
0.040
0.025
0.058
0.008
0.020
0.0135
0.0135
A
G
B
TAPE & REEL ORIENTATION
E
C
F
Package Outline
J
Package Contact Pads
Solder Print Diameter
0.010” - 0.012”
NOTE
1. Top view of tape. Solder PADS face down in tape
package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm PlasticTape:7 Inch Reels - 5,000 pieces per reel. Ordering Suffix:-T75-1 (i.e., PKFC05C-T75-1).
3. 8mm PaperTape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix:-T75-2 (i.e., PKFC05C-T75-2).
4. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-2.
Outline & Dimensions: Rev 1 - 8/03, 06040
COPYRIGHT © ProTek Devices 2005
ProTek Devices
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
2929 South Fair Lane, Tempe, AZ 85282
Tel:602-431-8101 Fax:602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
*PATENT PENDING
05180.R1 3/05
5
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