U0408FC08C-LF [PROTEC]
Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 8 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-8;型号: | U0408FC08C-LF |
厂家: | PROTEK DEVICES |
描述: | Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 8 Element, Silicon, ROHS COMPLIANT, FLIP CHIP-8 |
文件: | 总6页 (文件大小:72K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
U0408FC3.3C
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U0408FC36C
UNBUMPED FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ ESD Protection > 25 kilovolts
✔ Available in Voltages Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 4 to 7 Lines
✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Standard EIA Chip Size: 0408
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Lead-Free Plating
✔ Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
PIN CONFIGURATION
05161.R5 5/07
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
250
UNITS
Watts
°C
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
PPP
TA
-55 to 150
-55 to 150
Storage Temperature
TSTG
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
(See Fig. 2)
(See Fig. 2)
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@VWM
ID
µA
@0V, 1 MHz
VWM
VOLTS
@8/20µs
VC @ IPP
C
pF
U0408FC3.3C
U0408FC05C
U0408FC08C
U0408FC12C
U0408FC15C
U0408FC24C
U0408FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
75*
10**
10***
1
1
1
150
100
75
50
40
13.4
19.0
24.0
43.0
64.0
30
25
1
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
FIGURE 1
FIGURE 2
PEAK PULSE POWER VS PULSE TIME
PULSE WAVE FORM
120
100
10,000
1,000
TEST
tf
WAVEFORM
PARAMETERS
tf = 8µs
Peak Value IPP
80
60
40
td = 20µs
e-t
250W, 8/20µs Waveform
100
td = t
IPP/2
20
0
10
0.01
1
10
100
1,000
10,000
0
5
10
15
20
25
30
td - Pulse Duration - µs
t - Time - µs
05161.R5 5/07
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
2
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GRAPHS
FIGURE 3
POWER DERATING CURVE
100
80
Peak Pulse Power
8/20µs
60
40
20
0
Average Power
0
25
50
75
100
125 150
TA - Ambient Temperature - °C
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR U0408FC05C
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0408FC05C
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
05161.R5 5/07
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APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
0.275mm
Round
Pad Definition
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
0.330mm Round
No Clean
Pad Protective Finish
OSP(Entek Cu Plus 106A)
50µm
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
20µm
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Ramp-up
Ramp-down
T
L
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05161.R5 5/07
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
4
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U0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
PACKAGEOUTLINE
MILLIMETERS
DIM
INCHES
A
B
C
E
F
I
0.56 NOM
0.86 NOM
0.022 NOM
0.034 NOM
0.039 0.001
0.006 SQ
0.99 0.0254
0.15 SQ
TOP
2.0 0.0254
0.406 NOM
0.079 0.001
0.016 NOM
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad
and outline: .xxx 0.05mm ( 0.002”).
E
F
Metalized Die Contact
END
I
PAD DIMENSIONS
MOUNTING PAD LAYOUT - Option 1
MILLIMETERS
DIM
INCHES
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.020
0.012
0.018
0.008
0.006 SQ
0.028
D
A
C
DIE
SOLDER
CONTACT
0.99
0.51
0.039
0.020
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT 0.010” - 0.012” DIA.
SOLDER
MASK
Outline & Dimensions: Rev 3 - 2/04, 06026
05161.R5 5/07
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U0408 PACKAGE OUTLINE & DIMENSIONS
PACKAGE DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
MILLIMETERS
DIM
INCHES
A
F
G
H
I
0.51
0.15 SQ
0.71
0.020
0.006 SQ
0.028
COPPER CONTACT 0.009” [0.23] DIA.
A
0.99
0.039
DIE
SOLDER
CONTACT
0.51
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad
and outline: .xxx 0.05mm ( 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
Outline & Dimensions: Rev 3 - 2/04, 06026
I
TAPE & REELORIENTATION
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER
MASK
Quad Die - 0408
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLA-
TURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., U0408FC05C-T75-1).
3. 8mm Paper Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., U0408FC05C-T75-2).
ProTek Devices
COPYRIGHT © ProTek Devices 2007
2929 South Fair Lane, Tempe,AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
Web Site: www.protekdevices.com
05161.R5 5/07
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
6
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