U0408FC36C-T75-2 [PROTEC]

Trans Voltage Suppressor Diode, 200W, 36V V(RWM), Bidirectional, 8 Element, Silicon, FLIP CHIP-8;


型号：	U0408FC36C-T75-2
厂家：	PROTEK DEVICES
描述：	Trans Voltage Suppressor Diode, 200W, 36V V(RWM), Bidirectional, 8 Element, Silicon, FLIP CHIP-8 局域网二极管
文件：	总6页 (文件大小：72K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

U0408FC3.3C

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U0408FC36C

UNBUMPED FLIP CHIP ARRAY

APPLICATIONS

✔ Cellular Phones

✔ MCM Boards

✔ Wireless Communication Circuits

✔ IR LEDs

✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV

✔ 61000-4-4 (EFT): 40A - 5/50ns

FEATURES

✔ ESD Protection > 25 kilovolts

✔ Available in Voltages Ranging From 3.3V to 36V

✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)

✔ Bidirectional Configuration & Monolithic Structure

✔ Protects 4 to 7 Lines

✔ RoHS Compliant

MECHANICAL CHARACTERISTICS

✔ Standard EIA Chip Size: 0408

✔ Weight 0.73 milligrams (Approximate)

✔ Available in Lead-Free Plating

✔ Solder Reflow Temperature:

Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C

✔ Flammability Rating UL 94V-0

✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481

✔ Device Marking On Reel

PIN CONFIGURATION

05161.R5 5/07

www.protekdevices.com

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DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

SYMBOL

VALUE

250

UNITS

Watts

°C

PARAMETER

Peak Pulse Power (tp = 8/20µs) - See Figure 1

Operating Temperature

P_PP

T_A

-55 to 150

Storage Temperature

T_STG

°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PART

NUMBER

(See Note 1)

RATED

STAND-OFF

VOLTAGE

MINIMUM

BREAKDOWN

VOLTAGE

MAXIMUM

CLAMPING

VOLTAGE

MAXIMUM

CLAMPING

VOLTAGE

MAXIMUM

LEAKAGE

CURRENT

(See Note 2)

TYPICAL

CAPACITANCE

(See Fig. 2)

@ 1mA

V_(BR)

VOLTS

@ I_P= 1A

V_C

VOLTS

@V_WM

I_D

µA

@0V, 1 MHz

V_WM

VOLTS

@8/20µs

V_C@ I_PP

U0408FC3.3C

U0408FC05C

U0408FC08C

U0408FC12C

U0408FC15C

U0408FC24C

U0408FC36C

3.3

5.0

8.0

12.0

15.0

24.0

36.0

4.0

6.0

8.5

13.3

16.7

26.7

40.0

7.0

9.8

12.5V @ 20A

14.7V @ 17A

19.2V @ 13A

29.7V @ 9.0A

35.7V @ 7.0A

55.0V @ 5.0A

84.0V @ 3.0A

75*

10**

10***

150

100

13.4

19.0

24.0

43.0

64.0

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.

Note 2: *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.

FIGURE 1

FIGURE 2

PEAK PULSE POWER VS PULSE TIME

PULSE WAVE FORM

120

100

10,000

1,000

TEST

t_f

WAVEFORM

PARAMETERS

t_f= 8µs

Peak Value I_PP

t_d= 20µs

e^-t

250W, 8/20µs Waveform

100

t_d= t

I_PP/2

0.01

100

1,000

10,000

t_d- Pulse Duration - µs

t - Time - µs

05161.R5 5/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”

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GRAPHS

FIGURE 3

POWER DERATING CURVE

100

Peak Pulse Power

8/20µs

Average Power

100

125 150

T_A- Ambient Temperature - °C

FIGURE 4

OVERSHOOT & CLAMPING VOLTAGE FOR U0408FC05C

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 5

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0408FC05C

I_PP- Peak Pulse Current - Amps

05161.R5 5/07

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APPLICATION INFORMATION

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

Pad Shape

0.275mm

Round

Pad Definition

Non-Solder Mask Defined Pads

0.325mm Round

0.150mm

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Paste Type

0.330mm Round

No Clean

Pad Protective Finish

OSP(Entek Cu Plus 106A)

50µm

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity

20µm

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

60 Seconds

270°C

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

REQUIREMENTS

Non-Solder Mask Defined Pad

0.275mm DIA.

Temperature:

T_Pfor Lead-Free (SnAgCu): 260-270°C

T_Pfor Tin-Lead: 240-245°C

Preheat time and temperature depends on solder paste and flux

activation temperature, component size, weight, surface area &

plating.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

T_P

Ramp-up

Ramp-down

T_SMAX

155°

T_SMIN

140°

T_S- Preheat

t 25°C to Peak

30-60 seconds

Ramp-up

15 seconds

Solder Time

15-20 seconds

Ramp-down

05161.R5 5/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”

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U0408 PACKAGE OUTLINE & DIMENSIONS

PACKAGE DIMENSIONS

PACKAGEOUTLINE

MILLIMETERS

DIM

INCHES

0.56 NOM

0.86 NOM

0.022 NOM

0.034 NOM

0.039 0.001

0.006 SQ

0.99 0.0254

0.15 SQ

TOP

2.0 0.0254

0.406 NOM

0.079 0.001

0.016 NOM

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad

and outline: .xxx 0.05mm ( 0.002”).

Metalized Die Contact

END

PAD DIMENSIONS

MOUNTING PAD LAYOUT - Option 1

MILLIMETERS

DIM

INCHES

0.51

0.30

0.46

0.20

0.15 SQ

0.71

0.020

0.012

0.018

0.008

0.006 SQ

0.028

DIE

SOLDER

CONTACT

0.99

0.51

0.039

0.020

NOTE:

1. Preferred: Using 0.1mm (0.004”) stencil.

SOLDER PADS

SOLDER PRINT 0.010” - 0.012” DIA.

SOLDER

MASK

Outline & Dimensions: Rev 3 - 2/04, 06026

05161.R5 5/07

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U0408 PACKAGE OUTLINE & DIMENSIONS

PACKAGE DIMENSIONS

MOUNTING PAD LAYOUT - Option 2

MILLIMETERS

DIM

INCHES

0.51

0.15 SQ

0.71

0.020

0.006 SQ

0.028

COPPER CONTACT 0.009” [0.23] DIA.

0.99

0.039

DIE

SOLDER

CONTACT

0.51

0.020

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad

and outline: .xxx 0.05mm ( 0.002”).

3. Preferred: Using 0.1mm (0.004”) stencil.

Outline & Dimensions: Rev 3 - 2/04, 06026

TAPE & REELORIENTATION

SOLDER PRINT 0.014” [0.36] DIA.

SOLDER

MASK

Quad Die - 0408

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

TAPE & REEL ORDERING NOMENCLA-

TURE

1. Surface mount product is taped and

reeled in accordance with EIA 481.

2. 8mm Plastic Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-1

(i.e., U0408FC05C-T75-1).

3. 8mm Paper Tape: 7 Inch Reels - 5,000

pieces per reel. Ordering Suffix: -T75-2

(i.e., U0408FC05C-T75-2).

ProTek Devices

2929 South Fair Lane, Tempe,AZ 85282

Tel: 602-431-8101 Fax: 602-431-2288

E-Mail: sales@protekdevices.com

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s

and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

Web Site: www.protekdevices.com

05161.R5 5/07

www.protekdevices.com

*U.S. Patent No. Des. “D456,367S”