4235-00 [PSEMI]

SPDT UltraCMOS? RF Switch DC - 4000 MHz; SPDT的UltraCMOS ? RF开关直流 - 4000兆赫
4235-00
型号: 4235-00
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

SPDT UltraCMOS? RF Switch DC - 4000 MHz
SPDT的UltraCMOS ? RF开关直流 - 4000兆赫

开关 光电二极管
文件: 总8页 (文件大小:288K)
中文:  中文翻译
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Product Specification  
PE4235  
SPDT UltraCMOS™ RF Switch  
DC - 4000 MHz  
Product Description  
The PE4235 RF Switch is designed to cover a broad range of  
applications from near DC to 4000 MHz. This single-supply  
reflective switch integrates on-board CMOS control logic  
driven by a simple, single-pin CMOS or TTL control input.  
Using a nominal +3-volt power supply, a 1 dB compression  
point of +15 dBm can be achieved. The PE4235 also exhibits  
outstanding isolation of better than 40 dB at 1000 MHz and is  
offered in a small 3x3 mm DFN package.  
Features  
Single 3.0-volt power supply  
Low insertion loss: 0.40 dB at  
1000 MHz, 0.45 dB at 2000 MHz  
High isolation of 40 dB at 1000 MHz,  
30 dB at 2000 MHz  
Typical 1 dB compression point of  
+15 dBm  
The PE4235 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance  
of GaAs with the economy and integration of conventional  
CMOS.  
Single-pin CMOS or TTL logic control  
Available in a 6-lead DFN package  
Figure 1. Functional Diagram  
Figure 2. Package Type  
6-lead DFN  
RFC  
RF1  
RF2  
CMOS  
Control  
Driver  
CTRL  
Table 1. Electrical Specifications @ +25 °C, VDD = 3 V (ZS = ZL = 50 )  
Parameter  
Conditions  
Minimum  
Typical  
Maximum  
Units  
Operating Frequency1  
DC  
4000  
MHz  
1000 MHz  
2000 MHz  
0.40  
0.45  
0.50  
0.60  
dB  
dB  
Insertion Loss  
1000 MHz  
2000 MHz  
39  
29  
40  
30  
dB  
dB  
Isolation – RFC to RF1/RF2  
Isolation – RF1 to RF2  
Return Loss  
1000 MHz  
2000 MHz  
36  
28  
37  
29  
dB  
dB  
1000 MHz  
2000 MHz  
20  
17  
22  
19  
dB  
dB  
CTRL to 0.1 dB final value, 2 GHz  
CTRL to 25 dB isolation, 2 GHz  
200  
90  
ns  
‘ON’ Switching Time  
‘OFF’ Switching Time  
Video Feedthrough2  
Input 1 dB Compression  
Input IP3  
ns  
2.5  
15  
mVpp  
dBm  
dBm  
2000 MHz  
13.5  
32.5  
2000 MHz, 5 dBm  
36  
Notes: 1. Device linearity will begin to degrade below 10 MHz.  
2. The DC transient at the output of any port of the switch when the control voltage is switched from Low to  
High or High to Low in a 50 test set-up, measured with 1ns risetime pulses and 500 MHz bandwidth.  
Document No. 70-0069-03 www.psemi.com  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Page 1 of 8  
PE4235  
Product Specification  
Figure 3. Pin Configuration  
Table 4. Absolute Maximum Ratings  
Symbol Parameter/Conditions  
Min  
Max  
Units  
RF2  
GND  
RF1  
1
2
3
6
5
4
RFC  
CTRL  
VDD  
VDD  
Power Supply Voltage  
-0.3  
4.0  
V
Voltage on any input  
except for CTRL pin  
VI  
-0.3 VDD + 0.3  
V
Exposed Solder  
Pad - Shorted  
to Pin 2  
VCTRL  
TST  
Voltage on CTRL pin  
5
V
(bottom side)  
Storage temperature range  
-65  
-40  
150  
85  
°C  
Operating temperature  
range  
TOP  
PIN  
°C  
dBm  
V
Input power (50 )  
ESD Voltage (Human Body  
Model)  
19  
VESD  
200  
Table 2. Pin Descriptions  
Absolute Maximum Ratings are those values  
listed in the above table. Exceeding these values  
may cause permanent device damage.  
Pin  
No.  
Pin  
Name  
Description  
1
RF2  
RF2 port.1  
Functional operation should be restricted to the  
limits in the DC Electrical Specifications table.  
Exposure to absolute maximum ratings for  
extended periods may affect device reliability.  
2
GND  
Ground Connection. Traces should be  
physically short and connected to the  
ground plane. This pin is connected to  
the exposed solder pad that also must  
be soldered to the ground plane for best  
performance.  
3
4
RF1  
VDD  
RF1 port.1  
Control Logic Input  
Nominal 3 V supply connection.  
The control logic input pin (CTRL) is typically  
driven by a 3-volt CMOS logic level signal. For  
flexibility to support systems that have 5-volt  
control logic drivers, the control logic input has  
been designed to handle a standard 5-volt TTL  
control signal. This TTL control signal input must  
not exceed 5-volts or damage to the switch could  
result.  
5
CTRL  
CMOS or TTL logic level:  
High = RFC to RF1 signal path  
Low = RFC to RF2 signal path  
Common RF port for switch.1  
6
RFC  
Notes: 1. All RF pins must be DC blocked with an external series  
capacitor or held at 0 VDC  
.
Table 5. Control Logic Truth Table  
Table 3. DC Electrical Specifications  
Control Voltage  
Signal Path  
Parameter  
Min  
Typ  
Max  
Units  
CTRL = CMOS or TTL High  
CTRL = CMOS or TTL Low  
RFC to RF1  
RFC to RF2  
VDD Power Supply Voltage  
IDD Power Supply Current  
(VDD = 3V, VCNTL = 3V)  
Control Voltage High  
2.7  
3.0  
3.3  
V
250  
500  
nA  
Electrostatic Discharge (ESD) Precautions  
0.7xVDD  
V
V
When handling this UltraCMOS™ device, observe  
the same precautions that you would use with  
other ESD-sensitive devices. Although this device  
contains circuitry to protect it from damage due to  
ESD, precautions should be taken to avoid  
exceeding the rating specified in Table 4.  
Control Voltage Low  
0.3xVDD  
Latch-Up Avoidance  
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0069-03 UltraCMOS™ RFIC Solutions  
Page 2 of 8  
PE4235  
Product Specification  
Typical Performance Data @ -40 °C to 85 °C (Unless Otherwise Noted)  
Figure 4. Insertion Loss - RFC to RF1  
Figure 5. Input 1dB Compression Point and IIP3  
0
IIP3  
-40 C  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
-40 C  
-0.25  
25 C  
-0.5  
25 C  
85 C  
85 C  
-0.75  
-1  
-1.25  
-1.5  
1dB Compression  
25 C  
-40 C  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
500  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
Frequency (MHz)  
Figure 6. Insertion Loss - RFC to RF2  
Figure 7. Isolation - RFC to RF1  
T = 25 °C  
0
0
-20  
-40 8C  
-0.25  
-0.5  
25 8C  
-40  
85 8C  
-0.75  
-60  
-1  
-1.25  
-1.5  
-80  
-100  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
Document No. 70-0069-03 www.psemi.com  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Page 3 of 8  
PE4235  
Product Specification  
Typical Performance Data @ 25 °C  
Figure 8. Isolation – RFC to RF2  
Figure 9. Isolation – RF1 to RF2, RF2 to RF1  
0
-20  
0
-20  
RF2  
-40  
-40  
-60  
-60  
RF1  
-80  
-80  
-100  
-100  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
Figure 10. Return Loss – RFC  
Figure 11. Return Loss – RF1, RF2  
0
-10  
-20  
-30  
-40  
0
-10  
RF2  
-20  
-30  
-40  
RF1  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
0
500  
1000  
1500 2000 2500  
Frequency (MHz)  
3000 3500  
4000  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0069-03 UltraCMOS™ RFIC Solutions  
Page 4 of 8  
PE4235  
Product Specification  
Figure 12. Evaluation Board Layouts  
Peregrine Specification 101/0085  
Evaluation Kit  
The SPDT Switch Evaluation Kit board was  
designed to ease customer evaluation of the  
PE4235 SPDT switch. The RF common port is  
connected through a 50 transmission line to the  
top left SMA connector, J1. Port 1 and Port 2 are  
connected through 50 transmission lines to the top  
two SMA connectors on the right side of the board,  
J2 and J3. A through transmission line connects  
SMA connectors J4 and J5. This transmission line  
can be used to estimate the loss of the PCB over the  
environmental conditions being evaluated.  
The board is constructed of a two metal layer FR4  
material with a total thickness of 0.031”. The bottom  
layer provides ground for the RF transmission lines.  
The transmission lines were designed using a  
coplanar waveguide with ground plane model using  
a trace width of 0.0476”, trace gaps of 0.030”,  
dielectric thickness of 0.028”, metal thickness of  
0.0021” and εr of 4.4.  
J6 provides a means for controlling DC and digital  
inputs to the device. Starting from the lower left pin,  
the second pin to the right (J6-3) is connected to the  
device CTRL input. The fourth pin to the right (J6-7)  
is connected to the device VDD input. A decoupling  
capacitor (100 pF) is provided on both CTRL and  
VDD traces. It is the responsibility of the customer to  
determine proper supply decoupling for their design  
application. Removing these components from the  
evaluation board has not been shown to degrade RF  
performance.  
Figure 13. Evaluation Board Schematic  
Peregrine Specification 102/0108  
Document No. 70-0069-03 www.psemi.com  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Page 5 of 8  
PE4235  
Product Specification  
Figure 14. Package Drawing  
6-lead DFN  
- A -  
3.00  
- B -  
C
L
6
5
4
0.125  
C
3.00  
L
PIN  
MAR  
1
K
C
0.10  
4
1
2
3
0.10  
C
0.125  
4
+2°  
10°  
TOP  
DETAIL C  
-10°  
VIEW  
0.025  
±0.025  
0.100  
C
C
0.70 ± 0.05  
0.20 ±0.05  
0.90 ±0.10  
0.025±0.025  
0.080  
3
SEATING  
SIDE  
VIEW  
SEE DETAIL B  
PLANE  
DETAIL B  
- C -  
C
L
0.17 MIN.  
0.24  
+0.08  
-0.02  
+0.20  
-0.08  
0.95  
0.35  
0.10  
C A B  
0.05  
C
0.125  
EXPOSED PAD  
SEE DETAIL A  
+0.21  
0.29  
1
-0.08  
2
3
EXPOSED SLUG/  
HEAT SINK  
0.17  
0.30  
R0.127 TYP  
R 0.15 TYP  
1.21 ±0.10  
0.605 ±0.05  
THIS FEATURE  
APPLIES TO  
BOTH ENDS OF  
THE PKG.  
EXPOSED METALIZED  
FEATURE  
EXPOSED  
(2X)  
.20 MIN.  
3
EDGE OF PLASTIC BODY  
6
DETAIL A  
4
5
1.05±0.05  
2.01±0.10  
BOTTOM VIEW  
1. DIMENSIONS AND TOLERANCES ARE PER ANSi Y14.5  
2. DIMENSIONS ARE IN MILLIMETERS, ANGLES ARE IN DEGREES.  
3
COPLANARITY APPLIES TO EXPOSED HEAT SLUG AS WELL AS THE TERMINALS.  
PROFILE TOLERANCE APPLIES TO PLASTIC BODY ONLY.  
4
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0069-03 UltraCMOS™ RFIC Solutions  
Page 6 of 8  
PE4235  
Product Specification  
Figure 14. Tape and Reel Specifications  
6-lead DFN  
Table 6. Dimensions  
Dimension  
DFN 3x3 mm  
3.23 ± 0.1  
3.17 ± 0.1  
1.37 ± 0.1  
4 ± 0.1  
Ao  
Bo  
Ko  
P
W
8 +0.3, -0.1  
0.254 ± 0.02  
3000  
T
R7 Quantity  
R13 Quantity  
N.A.  
Note: R7 = 7 inch Lock Reel, R13 = 13 inch Lock Reel  
Table 7. Ordering Information  
Order Code  
4235-01  
Part Marking  
4235  
Description  
Package  
Shipping Method  
12800 units / Canister  
3000 units / T&R  
1 / Box  
PE4235-06DFN 3x3mm-12800F  
PE4235-06DFN 3x3mm-3000C  
PE4235-06DFN 3x3mm-EK  
PE4235G-06DFN 3x3mm-12800F  
PE4235G-06DFN 3x3mm-3000C  
6-lead 3x3 mm DFN  
6-lead 3x3 mm DFN  
Evaluation Kit  
4235-02  
4235  
4235-00  
PE4235-EK  
4235  
4235-51  
Green 6-lead 3x3 mm DFN  
Green 6-lead 3x3 mm DFN  
12800 units / Canister  
3000 units / T&R  
4235-52  
4235  
Document No. 70-0069-03 www.psemi.com  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Page 7 of 8  
PE4235  
Product Specification  
Sales Offices  
The Americas  
North Asia Pacific  
Peregrine Semiconductor Corp.  
9450 Carroll Park Drive  
San Diego, CA 92121  
Peregrine Semiconductor K.K.  
5A-5, 5F Imperial Tower  
1-1-1 Uchisaiwaicho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Tel 858-731-9400  
Fax 858-731-9499  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
Europe  
South Asia Pacific  
Peregrine Semiconductor Europe  
Commercial Products:  
Bâtiment Maine  
13-15 rue des Quatre Vents  
F- 92380 Garches, France  
Tel: +33-1-47-41-91-73  
Peregrine Semiconductor  
28G, Times Square,  
No. 500 Zhangyang Road,  
Shanghai, 200122, P.R. China  
Tel: +86-21-5836-8276  
Fax: +86-21-5836-7652  
Fax : +33-1-47-41-91-73  
Space and Defense Products:  
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Tel: +33(0) 4 4239 3361  
Fax: +33(0) 4 4239 7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS is a trademark of Peregrine Semiconductor  
Corp.  
©2005 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0069-03 UltraCMOS™ RFIC Solutions  
Page 8 of 8  

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