PE43602 [PSEMI]

RF Digital Attenuator 6-bit, 31.5dB, DC-5.0 GHz; 射频数字衰减器6位, 31.5分贝DC- 5.0 GHz的
PE43602
型号: PE43602
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

RF Digital Attenuator 6-bit, 31.5dB, DC-5.0 GHz
射频数字衰减器6位, 31.5分贝DC- 5.0 GHz的

射频 衰减器
文件: 总11页 (文件大小:426K)
中文:  中文翻译
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Product Specification  
PE43602  
50 RF Digital Attenuator  
6-bit, 31.5 dB, DC-5.0 GHz  
Product Description  
Features  
The PE43602 is a HaRP-enhanced, high linearity, 6-bit RF  
Digital Step Attenuator (DSA) covering a 31.5 dB attenuation  
range in 0.5 dB steps. This Peregrine 50RF DSA provides  
both a serial and parallel CMOS control interface. It maintains  
high attenuation accuracy over frequency and temperature and  
exhibits very low insertion loss and low power consumption.  
Performance does not change with Vdd due to on-board  
regulator. This next generation Peregrine DSA is available in a  
4x4 mm 24 lead QFN footprint.  
HaRP™-enhanced UltraCMOS™ device  
Attenuation: 0.5 dB steps to 31.5-dB  
High Linearity: Typical +58 dBm IP3  
Excellent low-frequency performance  
3.3 V or 5.0 V Power Supply Voltage  
Fast switch settling time  
Programming Modes:  
The PE43602 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance  
of GaAs with the economy and integration of conventional  
CMOS.  
Direct Parallel  
Latched Parallel  
Serial  
High-attenuation state @ power-up (PUP)  
CMOS Compatible  
Figure 1. Package Photo  
24-lead 4x4x0.85 mm QFN Package  
No DC blocking capacitors required  
Packaged in a 24-lead 4x4x0.85 mm QFN  
Figure 2. Functional Schematic Diagram  
RF Output  
RF Input  
7
Parallel Control  
Serial In  
Control Logic Interface  
CLK  
LE  
P/S  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 1 of 11  
PE43602  
Product Specification  
Table 1. Electrical Specifications @ +25°C, VDD = 3.3 V or 5.0 V  
Parameter  
Frequency Range  
Attenuation Range  
Test Conditions  
Frequency  
Min  
Typical  
DC – 5  
Max  
Units  
GHz  
dB  
0.5 dB Step  
0 – 31.5  
Insertion Loss  
DC 5 GHz  
2.2  
2.7  
dB  
±(0.3 + 3)%  
+0.4 + 5%  
-0.3 - 3%  
0 dB - 31.5 dB Attenuation settings  
0 dB - 31.5 dB Attenuation settings  
0 dB - 31.5 dB Attenuation settings  
DC < 4 GHz  
4 GHz 5 GHz  
4 GHz 5 GHz  
dB  
dB  
dB  
Attenuation Error  
Return Loss  
Relative Phase  
P1dB  
DC - 5 GHz  
18  
55  
32  
dB  
deg  
dBm  
All States  
Input  
DC - 5 GHz  
20 MHz - 5 GHz  
30  
IIP3  
Two tones at +18 dBm, 20 MHz spacing  
20 MHz - 5 GHz  
1 MHz  
58  
-110  
10  
dBm  
dBm  
mVpp  
ns  
Typical Spurious Value  
Video Feed Through  
Switching Time  
RF Trise/Tfall  
50% DC CTRL to 10% / 90% RF  
10% / 90% RF  
650  
400  
ns  
RF settled to within 0.05 dB of final value  
RBW = 5 MHz, Averaging ON.  
Settling Time  
4
µs  
Performance Plots  
Figure 3. 0.5dB Step Error vs. Frequency*  
Figure 4. 1dB Attenuation vs. Attenuation State  
200MHz  
900MHz  
1800MHz  
5000MHz  
2200MHz  
4000MHz  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
35  
30  
25  
20  
15  
10  
5
900 MHz  
1800 MHz  
2200 MHz  
3800 MHz  
5000 MHz  
0
0
4
8
12  
16  
20  
24  
28  
32  
0
5
10  
15  
20  
25  
30  
35  
Attenuation Setting (dB.)  
Attenuation State  
*Monotonicity is held so long as Step-Error does not cross zero  
Figure 5. 0.5dB Major State Bit Error  
Figure 6. 0.5dB Attenuation Error vs. Frequency  
200MHz  
2200MHz  
5000MHz  
3000MHz  
0.5 dB State  
8dB State  
1dB State  
2dB State  
4dB State  
4000MHz  
16dB State  
31.5dB State  
2
1.5  
1
2.00  
1.50  
1.00  
0.50  
0.00  
-0.50  
-1.00  
-1.50  
-2.00  
0.5  
0
-0.5  
-1  
-1.5  
-2  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
0
5
10  
15  
20  
25  
30  
35  
Frequency(GHz)  
Attenuation Setting (dB.)  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0248-04 UltraCMOS™ RFIC Solutions  
Page 2 of 11  
PE43602  
Product Specification  
Figure 7. Insertion Loss vs. Temperature  
Figure 8. Input Return Loss vs. Attenuation  
@ T = +25C  
0dB  
0.5dB  
1dB  
2dB  
-40C  
+25C  
+85C  
4dB  
8dB  
16dB  
31.5dB  
0
-0.5  
-1  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-1.5  
-2  
-2.5  
-3  
-3.5  
0
2
4
6
8
10  
0
1
2
3
4
5
6
7
8
9
Frequency (GHz.)  
Frequency (GHz.)  
Figure 10. Relative Phase vs. Frequency  
Figure 9. Output Return Loss vs. Attenuation  
@ T = +25C  
0dB  
4dB  
0.5dB  
8dB  
1dB  
2dB  
0dB  
4dB  
0.5dB  
8dB  
1dB  
2dB  
16dB  
31.5dB  
16dB  
31.5dB  
140  
120  
100  
80  
0
-5  
-10  
-15  
-20  
-25  
-30  
-35  
-40  
-45  
60  
40  
20  
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
9
Frequency (GHz.)  
Frequency (GHz.)  
Figure 12. Input IP3 vs. Frequency  
Figure 11. Attenuation Error vs. Temperature  
@ 5 GHz  
0dB  
4dB  
0.5dB  
8dB  
1dB  
2dB  
-40C  
+25C  
+85C  
16dB  
31.5dB  
2
1.5  
1
70  
65  
60  
55  
50  
45  
40  
35  
30  
0.5  
0
-0.5  
-1  
-1.5  
-2  
0
5
10  
15  
20  
25  
30  
35  
0
500 1000 1500 2000 2500 3000 3500 4000 4500  
Frequency (MHz)  
Attenuation Setting (dB.)  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 3 of 11  
PE43602  
Product Specification  
Figure 13. Pin Configuration (Top View)  
Table 3. Operating Ranges  
Parameter  
Min  
Typ  
3.3  
5.0  
70  
Max  
Units  
VDD Power Supply Voltage  
3.0  
V
V
VDD Power Supply Voltage  
IDD Power Supply Current  
Digital Input High  
5.5  
350  
5.5  
1
NC  
18  
17  
16  
SI  
µA  
V
2
3
4
VDD  
CLK  
LE  
Exposed  
Solder  
Pad  
2.6  
P/S  
PIN Input power (50):  
15 GND  
14 RF2  
GND  
RF1  
1 Hz 20 MHz  
Fig. 14 dBm  
5
6
20 MHz 4 GHz  
+23  
dBm  
13  
GND  
GND  
T
OP Operating temperature range  
-40  
0
25  
85  
°C  
Digital Input Low  
1
V
Digital Input Leakage1  
15  
µA  
Note 1. Input leakage current per Control pin  
Table 2. Pin Descriptions  
Pin No. Pin Name  
Table 4. Absolute Maximum Ratings  
Description  
Symbol  
VDD  
Parameter/Conditions  
Power supply voltage  
Min  
-0.3  
-0.3  
-65  
Max  
6.0  
Units  
V
1
GND  
Ground  
2
VDD  
Power supply pin  
VI  
Voltage on any Digital input  
Storage temperature range  
Input power (50)  
5.8  
V
3
P/S  
GND  
RF1  
GND  
RF2  
GND  
LE  
Serial/Parallel mode select  
Ground  
TST  
150  
°C  
4
5
RF1 port  
PIN  
1 Hz 20 MHz  
20 MHz 4 GHz  
ESD voltage (HBM)1  
ESD voltage (Machine Model)  
Fig. 14 dBm  
6 - 13  
14  
Ground  
+23  
dBm  
RF2 port  
500  
100  
V
V
VESD  
15  
Ground  
16  
Latch Enable input  
Serial interface clock input  
Serial Interface input  
Attenuation control bit, 16 dB  
Attenuation control bit, 8 dB  
Attenuation control bit, 4 dB  
Attenuation control bit, 2 dB  
Attenuation control bit, 1 dB  
Attenuation control bit, 0.5 dB  
Ground for proper operation  
Note: 1. Human Body Model (HBM, MIL_STD 883 Method 3015.7)  
17  
CLK  
SI  
Exceeding absolute maximum ratings may cause  
permanent damage. Operation should be restricted to  
the limits in the Operating Ranges table. Operation  
between operating range maximum and absolute  
maximum for extended periods may reduce reliability.  
18  
19  
C16  
C8  
20  
21  
C4  
22  
C2  
23  
C1  
Figure 14. Maximum Power Handling Capability  
24  
C0.5  
GND  
30.0  
Paddle  
25.0  
20.0  
15.0  
10.0  
5.0  
Exposed Solder Pad Connection  
The exposed solder pad on the bottom of the package  
must be grounded for proper device operation.  
Moisture Sensitivity Level  
The Moisture Sensitivity Level rating for the PE43602 in  
the 24-lead 4x4 QFN package is MSL1.  
0.0  
1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07 1.0E+08 1.0E+09  
Switching Frequency  
Hz  
Electrostatic Discharge (ESD) Precautions  
The PE43602 has a maximum 25 kHz switching rate.  
Switching rate is defined to be the speed at which the  
DSA can be toggled across attenuation states.  
When handling this UltraCMOS™ device, observe the  
same precautions that you would use with other ESD-  
sensitive devices. Although this device contains  
circuitry to protect it from damage due to ESD,  
precautions should be taken to avoid exceeding the  
specified rating.  
Latch-Up Avoidance  
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0248-04 UltraCMOS™ RFIC Solutions  
Page 4 of 11  
PE43602  
Product Specification  
Table 5. Control Voltage  
Table 8. Serial Attenuation Word Truth Table  
State  
Bias Condition  
Attenuation Word  
Attenuation  
Low  
0 to +1.0 Vdc at 2 µA (typ)  
Setting  
RF1-RF2  
D0  
(LSB)  
D6  
D7  
D5  
D4  
D3  
D2  
D1  
High  
+2.6 to +5 Vdc at 10 µA (typ)  
X
X
X
X
X
X
X
X
L
L
L
L
L
L
H
H
L
L
L
L
L
H
L
H
L
L
L
L
H
L
L
H
L
L
L
H
L
L
L
H
L
L
H
L
L
L
L
H
L
H
L
L
L
L
L
H
L
L
L
L
L
L
L
L
Reference I.L.  
0.5 dB  
1 dB  
Table 6. Latch and Clock Specifications  
2 dB  
Shift Clock  
Latch Enable  
Function  
4 dB  
X
Shift Register Clocked  
8 dB  
Contents of shift register  
transferred to attenuator core  
X
16 dB  
31.5 dB  
Table 7. Parallel Truth Table  
Parallel Control Setting  
Attenuation  
Setting  
RF1-RF2  
D6  
D5  
D4  
D3  
D2  
D1  
L
L
L
L
L
L
H
H
L
L
L
L
L
H
L
H
L
L
L
L
H
L
L
H
L
L
L
H
L
L
L
H
L
L
H
L
L
L
L
H
L
H
L
L
L
L
L
H
Reference I.L.  
0.5 dB  
1 dB  
2 dB  
4 dB  
8 dB  
16 dB  
31.5 dB  
Table 9. Serial Register Map  
MSB (last in)  
LSB (first in)  
Q7  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0  
Bits can either be set to logic high or logic low  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
Attenuation Word  
Attenuation Word is derived directly from the attenuation value. For example, to program the 12.5 dB state:  
Attenuation Word: Multiply by 4 and convert to binary 4 * 12.5 dB 50 X0110010  
Serial Input: X0110010  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 5 of 11  
PE43602  
Product Specification  
Programming Options  
The shift register must be loaded while LE is held  
LOW to prevent the attenuator value from changing  
as data is entered. The LE input should then be  
toggled HIGH and brought LOW again, latching the  
new data into the DSA. Attenuation Word truth table  
is listed in Table 8. A programming example of the  
serial register is illustrated in Table 9. The serial  
timing diagram is illustrated in Fig. 15.  
Parallel/Serial Selection  
Either a parallel or serial interface can be used to  
control the PE43602. The P/S bit provides this  
selection, with P/S=LOW selecting the parallel  
interface and P/S=HIGH selecting the serial  
interface.  
Parallel Mode Interface  
The parallel interface consists of six CMOS-  
compatible control lines that select the desired  
attenuation state, as shown in Table 7.  
Power-up Control Settings  
The PE43602 will always initialize to the maximum  
attenuation setting (31.5-dB) on power-up for both  
the serial and latched-parallel modes of operation  
and will remain in this setting until the user latches  
in the next programming word. In direct-parallel  
mode, the DSA can be preset to any state within  
the 31.5-dB range by pre-setting the parallel  
control pins prior to power-up. In this mode, there  
is a 400-µs delay between the time the DSA is  
powered-up to the time the desired state is  
set. During this power-up delay, the device  
attenuates to the maximum attenuation setting  
(31.5-dB) before defaulting to the user defined  
state. If the control pins are left floating in this  
mode during power-up, the device will default to  
the minimum attenuation setting (insertion loss  
state).  
The parallel interface timing requirements are  
defined by Fig. 16 (Parallel Interface Timing  
Diagram), Table 11 (Parallel Interface AC  
Characteristics), and switching speed (Table 1).  
For latched-parallel programming the Latch  
Enable (LE) should be held LOW while changing  
attenuation state control values, then pulse LE  
HIGH to LOW (per Fig. 16) to latch new  
attenuation state into device.  
For direct parallel programming, the Latch Enable  
(LE) line should be pulled HIGH. Changing  
attenuation state control values will change device  
state to new attenuation. Direct Mode is ideal for  
manual control of the device (using hardwire,  
switches, or jumpers).  
Serial Interface  
The serial interface is a 8-bit serial-in, parallel-out  
shift register buffered by a transparent latch. The  
8-bits make up the Attenuation Word that controls  
the DSA. Fig. 15 illustrates a example timing  
diagram for programming a state.  
The serial-interface is controlled using three  
CMOS-compatible signals: Serial-In (SI), Clock  
(CLK), and Latch Enable (LE). The SI and CLK  
inputs allow data to be serially entered into the  
shift register. Serial data is clocked in LSB first.  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0248-04 UltraCMOS™ RFIC Solutions  
Page 6 of 11  
PE43602  
Product Specification  
Figure 15. Serial Timing Diagram  
Bits can either be set to logic high or logic low  
TDISU  
TDIH  
P/S  
SI  
TPSSU  
TPSIH  
D[6]  
TCLKL  
D[5]  
D[4]  
D[3]  
D[2]  
D[1]  
D[0]  
TSISU  
TSIH  
CLK  
LE  
TCLKH  
TLESU  
TLEPW  
TPD  
VALID  
Figure 16. Latched-Parallel/Direct-Parallel Timing Diagram  
P/S  
TPSSU  
TPSIH  
VALID  
DI[6:0]  
TDISU  
TDIH  
LE  
TLEPW  
VALID  
TPD  
DO[6:0]  
TDIPD  
Table 10. Serial Interface AC Characteristics  
VDD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified  
Table 11. Parallel and Direct Interface AC  
Characteristics  
Symbol Parameter  
Min.  
-
Max.  
Unit  
MHz  
ns  
V
DD = 3.3 or 5.0 V, -40° C < TA < 85° C, unless otherwise specified  
FCLK  
Serial clock frequency  
10  
-
Symbol  
Parameter  
Min Max Unit  
TCLKH Serial clock HIGH time  
30  
30  
Latch Enable minimum  
pulse width  
TCLKL  
Serial clock LOW time  
-
ns  
TLEPW  
30  
-
ns  
Last serial clock rising edge  
TLESU setup time to Latch Enable  
rising edge  
10  
-
ns  
TDISU  
TDIH  
TPSSU  
TPSIH  
Parallel data setup time  
Parallel data hold time  
Parallel/Serial setup time  
Parallel/Serial hold time  
100  
100  
100  
100  
-
-
-
-
ns  
ns  
ns  
ns  
Latch Enable minimum pulse  
TLEPW  
width  
30  
-
ns  
TSISU  
TSIH  
TDISU  
TDIH  
TASU  
TAH  
Serial data setup time  
Serial data hold time  
Parallel data setup time  
Parallel data hold time  
Address setup time  
Address hold time  
10  
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
10  
100  
100  
100  
100  
100  
100  
Digital register delay  
(internal)  
TPD  
-
-
10  
5
ns  
ns  
Digital register delay  
(internal, direct mode only)  
TDIPD  
TPSSU Parallel/Serial setup time  
TPSH  
TPD  
Parallel/Serial hold time  
Digital register delay (internal)  
-
10  
ns  
Note:  
fClk is verified during the functional pattern test. Serial  
programming sections of the functional pattern are clocked  
at 10 MHz to verify fclk specification.  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 7 of 11  
PE43602  
Product Specification  
Figure 17. Evaluation Board Layout  
Peregrine Specification 101-0310  
Evaluation Kit  
The Digital Attenuator Evaluation Kit board was  
designed to ease customer evaluation of the  
PE43602 Digital Step Attenuator.  
Direct-Parallel Programming Procedure  
For automated direct-parallel programming,  
connect the test harness provided with the EVK  
from the parallel port of the PC to the J1 & Serial  
header pin and set the D0-D6 SP3T switches to  
the ‘MIDDLE’ toggle position. Position the  
Parallel/Serial (P/S) select switch to the Parallel  
(or left) position. The evaluation software is  
written to operate the DSA in either Parallel or  
Serial-Addressable Mode. Ensure that the  
software is set to program in Direct-Parallel mode.  
Using the software, enable or disable each setting  
to the desired attenuation state. The software  
automatically programs the DSA each time an  
attenuation state is enabled or disabled.  
For manual direct-parallel programming,  
disconnect the test harness provided with the EVK  
from the J1 and Serial header pins. Position the  
Parallel/Serial (P/S) select switch to the Parallel  
(or left) position. The LE pin on the Serial header  
must be tied to VDD. Switches D0-D6 are SP3T  
switches which enable the user to manually  
program the parallel bits. When any input D0-D6  
is toggled ‘UP’, logic high is presented to the  
parallel input. When toggled ‘DOWN’, logic low is  
presented to the parallel input. Setting D0-D6 to  
the ‘MIDDLE’ toggle position presents an OPEN,  
which forces an on-chip logic low. Table 9 depicts  
the parallel programming truth table and Fig. 16  
illustrates the parallel programming timing  
diagram.  
Note: Reference Figure 18 for Evaluation Board Schematic  
as the parallel bits are applied. The user must  
then pulse LE from 0V to VDD and back to 0V to  
latch the programming word into the DSA. LE  
must be logic low prior to programming the next  
word.  
Serial Programming Procedure  
Position the Parallel/Serial (P/S) select switch to  
the Serial (or right) position. The evaluation  
software is written to operate the DSA in either  
Parallel or Serial Mode. Ensure that the software  
is set to program in Serial mode. Using the  
software, enable or disable each setting to the  
desired attenuation state. The software  
automatically programs the DSA each time an  
attenuation state is enabled or disabled.  
Latched-Parallel Programming Procedure  
For automated latched-parallel programming, the  
procedure is identical to the direct-parallel  
method. The user only must ensure that Latched-  
Parallel is selected in the software.  
For manual latched-parallel programming, the  
procedure is identical to direct-parallel except now  
the LE pin on the Serial header must be logic low  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0248-04 UltraCMOS™ RFIC Solutions  
Page 8 of 11  
PE43602  
Product Specification  
Figure 18. Evaluation Board Schematic  
Peregrine Specification 102-0379  
VDD  
D5  
D4  
D6  
D0  
D1  
D3  
D2  
P/S  
J1  
HEADER 14  
D0  
2
4
6
1
3
5
7
9
11  
13  
2
4
6
8
10  
12  
14  
1
3
5
7
9
D1  
D2  
8
D3  
D4  
D5  
D6  
10  
12  
14  
11  
13  
C5  
C7  
C6  
SERIAL  
100pF  
100pF  
100pF  
HEADER 4  
CLK  
DATA  
LE  
1
2
3
4
C1  
C2  
CLOCK  
DATA  
LE  
C4  
C3  
100pF  
100pF  
100pF  
100pF  
GND  
VDD  
J3  
CON2  
D0  
VDD  
P/S  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
CP25  
VDD  
S/P  
SI  
CLK  
LE  
1
2
C9  
C10  
100pF  
U1  
C8  
100pF  
C13  
100pF  
C14  
100pF  
GND  
RF1  
GND  
RF2  
GND  
0.1µF  
43X0X DSA 50 Ohm 4x4 MLP24  
J5  
SMA  
J4  
SMA  
Z=50 Ohm  
1
GND  
1
Z=50 Ohm  
De-embeding trace  
Z=50 Ohm  
J6  
SMA  
J7  
SMA  
1
1
Figure 19. Package Drawing  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 9 of 11  
PE43602  
Product Specification  
Figure 20. Tape and Reel Drawing  
Tape Feed Direction  
Pin 1  
Top of  
Device  
A0 = 4.35  
B0 = 4.35  
K0 = 1.1  
Device Orientation in Tape  
Figure 21. Marking Specifications  
43602  
YYWW  
ZZZZZ  
YYWW = Date Code  
ZZZZZ = Last five digits of Lot Number  
Table 12. Ordering Information  
Order Code Part Marking  
Description  
Package  
Shipping Method  
Bulk or tape cut from reel  
3000 units / T&R  
PE43602 MLI  
PE43602 MLI-Z  
EK43602-01  
43602  
PE43602G-24QFN 4x4mm-75A  
PE43602G-24QFN 4x4mm-3000C  
PE43602-24QFN 4x4mm-EK  
Green 24-lead 4x4mm QFN  
Green 24-lead 4x4mm QFN  
Evaluation Kit  
43602  
PE43602 -EK  
1 / Box  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0248-04 UltraCMOS™ RFIC Solutions  
Page 10 of 11  
PE43602  
Product Specification  
Sales Offices  
The Americas  
Peregrine Semiconductor Corporation  
Peregrine Semiconductor, Asia Pacific (APAC)  
Shanghai, 200040, P.R. China  
Tel: +86-21-5836-8276  
Fax: +86-21-5836-7652  
9380 Carroll Park Drive  
San Diego, CA 92121  
Tel: 858-731-9400  
Fax: 858-731-9499  
Peregrine Semiconductor, Korea  
#B-2607, Kolon Tripolis, 210  
Geumgok-dong, Bundang-gu, Seongnam-si  
Gyeonggi-do, 463-943 South Korea  
Tel: +82-31-728-3939  
Europe  
Peregrine Semiconductor Europe  
Bâtiment Maine  
Fax: +82-31-728-3940  
13-15 rue des Quatre Vents  
F-92380 Garches, France  
Tel: +33-1-4741-9173  
Fax : +33-1-4741-9173  
Peregrine Semiconductor K.K., Japan  
Teikoku Hotel Tower 10B-6  
1-1-1 Uchisaiwai-cho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
High-Reliability and Defense Products  
Americas  
San Diego, CA, USA  
Phone: 858-731-9475  
Fax: 848-731-9499  
Europe/Asia-Pacific  
Aix-En-Provence Cedex 3, France  
Phone: +33-4-4239-3361  
Fax: +33-4-4239-7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS, HaRP, MultiSwitch and DuNE are trademarks  
of Peregrine Semiconductor Corp.  
Document No. 70-0248-04 www.psemi.com  
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.  
Page 11 of 11  

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