PE83513_06 [PSEMI]

DC - 1500 MHz Low Power UltraCMOS Divide-by-8 Prescaler Military Operating Temperature Range; 直流 - 1500兆赫低功率的UltraCMOS分频预分频器的8军用工作温度范围
PE83513_06
型号: PE83513_06
厂家: Peregrine Semiconductor    Peregrine Semiconductor
描述:

DC - 1500 MHz Low Power UltraCMOS Divide-by-8 Prescaler Military Operating Temperature Range
直流 - 1500兆赫低功率的UltraCMOS分频预分频器的8军用工作温度范围

预分频器
文件: 总7页 (文件大小:237K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product Specification  
PE83513  
DC - 1500 MHz Low Power UltraCMOS™  
Divide-by-8 Prescaler  
Product Description  
Military Operating Temperature Range  
The PE83513 is a high-performance static UltraCMOS™  
prescaler with a fixed divide ratio of 8. Its operating frequency  
range is DC to 1500 MHz. The PE83513 operates on a nominal  
3 V supply and draws only 14 mA. It is packaged in a small  
8-lead plastic MSOP and is ideal for frequency scaling and  
clock generation solutions.  
Features  
DC to 1500 MHz operation  
Fixed divide ratio of 8  
Low-power operation: 14 mA  
The PE83513 is manufactured on Peregrine’s UltraCMOS™  
process, a patented variation of silicon-on-insulator (SOI)  
technology on a sapphire substrate, offering the performance  
of GaAs with the economy and integration of conventional  
CMOS.  
typical @ 3.0 V  
Ultra small package: 8-lead MSOP  
Figure 2. Package Type  
Figure 1. Functional Schematic Diagram  
8-lead MSOP  
Table 1. Electrical Specifications (ZS = ZL = 50 )  
2.85 V VDD 3.15 V; -55° C TA 125° C, unless otherwise specified  
Parameter  
Conditions  
Minimum  
Typical  
Maximum  
Units  
V
Supply Voltage  
2.85  
3.0  
7
3.15  
12  
OUTB Disabled  
OUTB Enabled  
mA  
mA  
Supply Current  
14  
25  
Input Frequency (FIN)  
DC  
-5  
1500  
+10  
MHz  
dBm  
100 MHz Fin 1200 MHz  
-55°C TA 85°C  
100 MHz Fin 1200 MHz  
85°C TA 125°C  
Input Power (PIN)  
Output Power  
0
+10  
+10  
dBm  
1200 MHz < Fin 1500 MHz  
-55°C TA 85°C  
+5  
+2  
dBm  
dBm  
DC < Fin 1500MHz  
Document No. 70-0118-03 www.psemi.com  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Page 1 of 7  
PE83513  
Product Specification  
Figure 3. Pin Configuration (Top View)  
Electrostatic Discharge (ESD) Precautions  
When handling this UltraCMOS™ device, observe  
the same precautions that you would use with  
other ESD-sensitive devices. Although this device  
contains circuitry to protect it from damage due to  
ESD, precautions should be taken to avoid  
exceeding the rating specified in Table 3.  
1
2
3
4
8
7
6
5
VDD  
IN  
GND  
OUT  
CTL  
OUT  
PE83513  
N/C  
GND  
Latch-Up Avoidance  
Unlike conventional CMOS devices, UltraCMOS™  
devices are immune to latch-up.  
Table 2. Pin Descriptions  
Device Functional Considerations  
Pin  
Name  
Pin No.  
Description  
The PE83513 divides an input signal, up to a  
frequency of 1500 MHz, by a factor of eight  
thereby producing an output frequency at one  
fourth the input frequency. To work properly at  
higher frequency, the input and output signals  
(pins 2 , 7 & optional 5) must be AC coupled via  
an external capacitor. The input may be DC  
coupled for low frequency operation with care  
taken to remain within the specified DC input  
range for the device.  
Power supply pin. Bypassing is required  
(eg 1000 pF & 100 pF).  
1
2
3
VDD  
Input signal pin. Should be coupled with a  
capacitor (eg 1000 pF).  
IN  
No connection. This pin should be left  
open.  
N/C  
Ground pin. Ground pattern on the board  
should be as wide as possible to reduce  
ground impedance.  
4
GND  
Inverted divided frequency output. This pin  
should be coupled with a capacitor  
(eg 1000 pF).  
5
6
OUTB  
CTL  
The ground pattern on the board should be made  
as wide as possible to minimize ground  
impedance. See Figure 8 for a layout example.  
Control pin. When grounded OUTB is  
enabled.  
OUTB Control  
Divided frequency output. This pin should  
be coupled with a capacitor (eg 1000 pF).  
7
8
OUT  
GND  
Pin 6 controls whether OUTB is enabled or  
disabled. Pin 6 has an internal pull-up resistor.  
With no connection (floating), OUTB is disabled.  
By grounding pin 6, OUTB is enabled. By  
enabling OUTB, this part will use roughly 5 mA  
more current.  
Ground Pin.  
Table 3. Absolute Maximum Ratings  
Symbol  
Parameter/Conditions  
Min Max Units  
VDD  
Pin  
Supply voltage  
Input Power  
4.0  
15  
V
dBm  
VDD  
+0.3  
VIN  
TST  
Voltage on input  
-0.3  
-65  
V
Storage temperature range  
150  
°C  
Operating temperature  
range  
TOP  
-55  
125  
°C  
V
ESD voltage (Human Body  
Model, MIL-STD 883)  
VESD  
2000  
Absolute Maximum Ratings are those values  
listed in the above table. Exceeding these values  
may cause permanent device damage. Exposure  
to absolute maximum ratings for extended periods  
may affect device reliability.  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0118-03 UltraCMOS™ RFIC Solutions  
Page 2 of 7  
PE83513  
Product Specification  
Typical Performance Data: VDD = 3.0 V  
Figure 4. Input Sensitivity  
Figure 5. Device Current (OUTB Enabled)  
Figure 6. Output Power (OUT or OUTB)  
Document No. 70-0118-03 www.psemi.com  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Page 3 of 7  
PE83513  
Product Specification  
J2 provides DC power to the device. Starting from the  
lower left pin, the second pin to the right (J2-3) is  
connected to the device VDD pin (1). Two decoupling  
capacitors (10 pF, 1000 pF) are included on this trace.  
It is the responsibility of the customer to determine  
proper supply decoupling for their design application.  
Evaluation Kit  
Evaluation Kit Operation  
The PE83513 EK board was designed to ease  
customer evaluation of Peregrine’s high performance  
divide-by-8 Military Grade Prescaler. On this board,  
the device input (pin 2) is connected via J1 and a 50ꢀ  
transmission line. A series capacitor (C3) provides the  
necessary DC block for the device input. It is important  
to note that the value of this capacitance will impact the  
performance of the device. A value of 1000pF was  
found to be optimal for this board layout; other  
Applications Support  
If you have a problem with your evaluation kit or if you  
have applications questions call (858) 731-9400 and  
ask for applications support. You may also contact us  
by fax or e-mail:  
Fax: (858) 731-9499  
E-Mail: help@psemi.com  
applications may require a different value.  
The device output (pin 7) is connected to connector J3  
through a 50transmission line. A series capacitor  
(C1) provides the necessary DC block for the device  
output. Note that this capacitor must be chosen to  
have low impedance at the desired output frequency  
the device. The value of 1000pF was chosen to  
provide a wide operating range for the evaluation  
board.  
Figure 7. Evaluation Board Layouts  
Peregrine Specification 101/0190  
The board is constructed of a two-layer FR4 material  
with a total thickness of 0.031”. The bottom layer  
provides ground for the RF transmission lines. The  
transmission lines were designed using a coplanar  
waveguide above ground plane model with trace width  
of 0.030”, trace gaps of 0.007”, dielectric thickness of  
0.028”, metal thickness of 0.0014” and εr of 4.4. Note  
that the predominate mode for these transmission lines  
is coplanar waveguide.  
Figure 8. Evaluation Board Schematic  
Peregrine Specification 102/0201  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0118-03 UltraCMOS™ RFIC Solutions  
Page 4 of 7  
PE83513  
Product Specification  
Figure 9. Package Drawing  
8-lead MSOP  
TOP VIEW  
0.65BSC  
.525BSC  
8
7
6
5
2.45±0.10  
2X  
3.00±0.10  
0.51±0.13  
0.51±0.13  
- B -  
2
3
4
1
.25 A B C  
- C -  
2.95±0.10  
0.86±0.08  
2.95±0.10  
1.10 MAX  
- A -  
+0.07  
-0.08  
3.00±0.10  
4.90±0.15  
0.10 A  
0.33  
0.08  
0.10±0.05  
A B C  
3.00±0.10  
FRONT VIEW  
SIDE VIEW  
Document No. 70-0118-03 www.psemi.com  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Page 5 of 7  
PE83513  
Product Specification  
Figure 10. Tape and Reel Specifications  
8-lead MSOP  
Pin1  
Table 4. Ordering Information  
Order Code  
83513-01  
Part Marking  
PE83513  
Description  
Package  
Shipping Method  
50 units / Tube  
2000 units / T&R  
1 / Box  
PE83513-08MSOP-50A  
8-lead MSOP  
83513-02  
PE83513  
PE83513-08MSOP-2000C  
PE83513-08MSOP-EK  
8-lead MSOP  
Evaluation Kit  
83513-00  
PE83513-EK  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Document No. 70-0118-03 UltraCMOS™ RFIC Solutions  
Page 6 of 7  
PE83513  
Product Specification  
Sales Offices  
The Americas  
North Asia Pacific  
Peregrine Semiconductor Corporation  
Peregrine Semiconductor K.K.  
9450 Carroll Park Drive  
San Diego, CA 92121  
Tel: 858-731-9400  
Teikoku Hotel Tower 10B-6  
1-1-1 Uchisaiwai-cho, Chiyoda-ku  
Tokyo 100-0011 Japan  
Fax: 858-731-9499  
Tel: +81-3-3502-5211  
Fax: +81-3-3502-5213  
Europe  
Peregrine Semiconductor, Korea  
#B-2402, Kolon Tripolis, #210  
Geumgok-dong, Bundang-gu, Seongnam-si  
Gyeonggi-do, 463-480 S. Korea  
Tel: +82-31-728-4300  
Peregrine Semiconductor Europe  
Bâtiment Maine  
13-15 rue des Quatre Vents  
F-92380 Garches, France  
Tel: +33-1-4741-9173  
Fax : +33-1-4741-9173  
Fax: +82-31-728-4305  
South Asia Pacific  
Space and Defense Products  
Americas:  
Peregrine Semiconductor, China  
Shanghai, 200040, P.R. China  
Tel: +86-21-5836-8276  
Tel: 858-731-9453  
Fax: +86-21-5836-7652  
Europe, Asia Pacific:  
180 Rue Jean de Guiramand  
13852 Aix-En-Provence Cedex 3, France  
Tel: +33-4-4239-3361  
Fax: +33-4-4239-7227  
For a list of representatives in your area, please refer to our Web site at: www.psemi.com  
Data Sheet Identification  
Advance Information  
The information in this data sheet is believed to be reliable.  
However, Peregrine assumes no liability for the use of this  
information. Use shall be entirely at the user’s own risk.  
The product is in a formative or design stage. The data  
sheet contains design target specifications for product  
development. Specifications and features may change in  
any manner without notice.  
No patent rights or licenses to any circuits described in this  
data sheet are implied or granted to any third party.  
Preliminary Specification  
Peregrine’s products are not designed or intended for use in  
devices or systems intended for surgical implant, or in other  
applications intended to support or sustain life, or in any  
application in which the failure of the Peregrine product could  
create a situation in which personal injury or death might occur.  
Peregrine assumes no liability for damages, including  
consequential or incidental damages, arising out of the use of  
its products in such applications.  
The data sheet contains preliminary data. Additional data  
may be added at a later date. Peregrine reserves the right  
to change specifications at any time without notice in order  
to supply the best possible product.  
Product Specification  
The data sheet contains final data. In the event Peregrine  
decides to change the specifications, Peregrine will notify  
customers of the intended changes by issuing a DCN  
(Document Change Notice).  
The Peregrine name, logo, and UTSi are registered trademarks  
and UltraCMOS and HaRP are trademarks of Peregrine  
Semiconductor Corp.  
Document No. 70-0118-03 www.psemi.com  
©2003-2006 Peregrine Semiconductor Corp. All rights reserved.  
Page 7 of 7  

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