ASM3P622S00EF-16-TT [PULSECORE]

Low Frequency Timing-Safe™ Peak EMI reduction IC; 低频定时- SAFE™峰值EMI降低IC
ASM3P622S00EF-16-TT
型号: ASM3P622S00EF-16-TT
厂家: PulseCore Semiconductor    PulseCore Semiconductor
描述:

Low Frequency Timing-Safe™ Peak EMI reduction IC
低频定时- SAFE™峰值EMI降低IC

文件: 总15页 (文件大小:545K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
May 2008  
rev 0.5  
ASM3P622S00B/E  
Low Frequency Timing-Safe™ Peak EMI reduction IC  
one reference input and drives out eight low-skew Timing-  
Safe™clocks.  
General Features  
Low Frequency Clock distribution with Timing-  
ASM3P622S00B/E has an SS% that selects 2 different  
Deviation and associated Input-Output Skew (TSKEW). Refer  
Spread Spectrum Control and Input-Output Skew table  
for details.  
Safe™ Peak EMI Reduction  
Input frequency range: 4MHz - 20MHz  
2 different Spread Selection option  
Spread Spectrum can be turned ON/OFF  
External Input-Output Delay Control option  
Supply Voltage: 3.3V±0.3V  
ASM3P622S00E has a CLKOUT for adjusting the Input-  
Output clock delay, depending upon the value of capacitor  
connected at this pin to GND.  
Commercial and Industrial temperature range  
Packaging Information:  
ASM3P622S00B: 8 pin SOIC, and TSSOP  
ASM3P622S00E:16 pin SOIC, and TSSOP  
The First True Drop-in Solution  
ASM3P622S00B/E operates from a 3.3V supply and is  
available in two different packages, as shown in the  
ordering information table, over commercial and Industrial  
temperature range.  
Functional Description  
Application  
ASM3P622S00B/E is a versatile, 3.3V Zero-delay buffer  
designed to distribute low frequency Timing-Safe™ clocks  
with Peak EMI reduction. ASM3P622S00B is an eight-pin  
version, accepts one reference input and drives out one  
low-skew Timing-Safe™ clock. ASM3P622S00E accepts  
ASM3P622S00B/E is targeted for use in Displays and  
memory interface systems.  
General Block Diagram  
VDD  
DLY_CTRL  
SS%  
CLKIN  
PLL  
CLKOUT(s)*  
(Timing-Safe™)  
*For  
ASM3P622S00E -  
8 CLKOUTS  
SSON  
GND  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018  
www.pulsecoresemi.com  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Spread Spectrum Frequency Generation  
The clocks in digital systems are typically square waves  
with a 50% duty cycle and as frequencies increase the  
edge rates also get faster. Analysis shows that a square  
wave is composed of fundamental frequency and  
harmonics. The fundamental frequency and harmonics  
generate the energy peaks that become the source of  
EMI. Regulatory agencies test electronic equipment by  
measuring the amount of peak energy radiated from the  
equipment. In fact, the peak level allowed decreases as  
the frequency increases. The standard methods of  
reducing EMI are to use shielding, filtering, multi-layer  
PCBs etc. These methods are expensive. Spread  
spectrum clocking reduces the peak energy by reducing  
the Q factor of the clock. This is done by slowly  
modulating the clock frequency. The ASM3P622S00B/E  
uses the center modulation spread spectrum technique in  
which the modulated output frequency varies above and  
below the reference frequency with  
a
specified  
modulation rate. With center modulation, the average  
frequency is the same as the unmodulated frequency and  
there is no performance degradation  
Zero Delay and Skew Control  
All outputs should be uniformly loaded to achieve Zero  
Delay between input and output. Since the CLKOUT pin  
is the internal feedback to the PLL, its relative loading can  
adjust the input-output delay.  
For applications requiring zero input-output delay, all  
outputs, including CLKOUT, must be equally loaded.  
Even if CLKOUT is not used, it must have a capacitive  
load equal to that on other outputs, for obtaining zero-  
input-output delay.  
Timing-Safe™ technology  
Timing-Safe™ technology is the ability to modulate a  
clock source with Spread Spectrum technology and  
maintain synchronization with any associated data path.  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
2 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Pin Configuration for ASM3P622S00B  
CLKIN  
NC  
1
2
3
4
8
NC  
7
6
5
VDD  
ASM3P622S00B  
SS%  
GND  
CLKOUT  
SSON  
Pin Description for ASM3P622S00B  
Pin #  
Pin Name Type  
Description  
1
CLKIN1  
I
External reference Clock input , 5V tolerant input  
No Connect  
2
3
4
NC  
SS%3  
I
Spread Spectrum Selection. Has an internal pull up resistor  
GND  
P
Ground  
Spread Spectrum enable and disable option When SSON is HIGH, the spread  
5
SSON3  
I
spectrum is enabled and when LOW, it turns off the spread spectrum. Has an internal  
pull up resistor  
Buffered clock output4  
3.3V supply  
6
7
8
CLKOUT2  
VDD  
O
P
NC  
No Connect  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
3 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Pin Configuration for ASM3P622S00E  
1
16  
CLKOUT  
CLKIN  
CLKOUT7  
2
3
CLKOUT1  
VDD  
15  
14  
CLKOUT6  
13  
12  
4
5
6
SS%  
GND  
VDD  
GND  
ASM3P622S00E  
CLKOUT2  
11 CLKOUT5  
10  
9
CLKOUT4  
SSON  
7
8
CLKOUT3  
DLY_CTRL  
Pin Description for ASM3P622S00E  
Pin #  
Pin Name  
CLKIN1  
CLKOUT12  
VDD  
Type  
Description  
1
2
3
4
I
O
P
I
External reference Clock input, 5V tolerant input  
Buffered clock output4  
3.3V supply  
SS%3  
Spread Spectrum Selection. Refer Spread Spectrum Control and Input-Output Skew  
Table. Has an internal pull up resistor  
5
6
7
8
GND  
P
O
O
O
Ground  
Buffered clock output4  
Buffered clock output4  
CLKOUT22  
CLKOUT32  
DLY_CTRL  
External Input-Output Delay control.  
Spread Spectrum enable and disable option. When SSON is HIGH, the spread  
9
SSON3  
I
spectrum is enabled and when LOW, it turns off the spread spectrum. Has an internal  
pull up resistor  
10  
11  
12  
13  
14  
15  
16  
CLKOUT42  
CLKOUT52  
GND  
O
O
P
Buffered clock output4  
Buffered clock output4  
Ground  
VDD  
P
3.3V supply  
CLKOUT62  
CLKOUT72  
CLKOUT2  
O
O
O
Buffered clock output4  
Buffered clock output4  
Buffered clock output4  
Notes: 1.Weak pull down  
2. Weak pull-down on all outputs  
3. Weak pull-up on these Inputs  
4. Buffered clock output is Timing-Safe™  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
4 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Spread Spectrum Control and Input-Output Skew Table  
Device  
Input Frequency  
SS %  
Deviation  
Input-Output Skew (±TSKEW)  
0
1
±0.25 %  
±0.50 %  
0.0625  
0.125  
ASM3P622S00B/E  
12MHz  
Note: TSKEW is measured in units of the Clock Period  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
Unit  
VDD  
Supply Voltage to Ground Potential  
-0.5 to +4.6  
V
VIN  
TSTG  
Ts  
DC Input Voltage (CLKIN)  
Storage temperature  
-0.5 to +7  
-65 to +125  
°C  
°C  
°C  
KV  
Max. Soldering Temperature (10 sec)  
Junction Temperature  
260  
150  
2
TJ  
TDV  
Static Discharge Voltage (As per JEDEC STD22- A114-B)  
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect  
device reliability.  
Operating Conditions  
Parameter  
Description  
Min  
3.0  
Max  
3.6  
+85  
30  
Unit  
V
VDD  
TA  
Supply Voltage  
Operating Temperature (Ambient Temperature)  
Load Capacitance  
-40  
°C  
CL  
pF  
pF  
CIN  
Input Capacitance  
7
Electrical Characteristics  
Parameter  
Description  
Test Conditions  
Min  
Typ  
Max  
Unit  
V
VIL  
VIH  
IIL  
Input LOW Voltage5  
Input HIGH Voltage5  
Input LOW Current  
Input HIGH Current  
Output LOW Voltage6  
Output HIGH Voltage6  
Supply Current  
0.8  
2.0  
V
VIN = 0V  
50  
100  
0.4  
µA  
µA  
V
IIH  
VIN = VDD  
VOL  
VOH  
IDD  
Zo  
IOL = 8mA  
IOH = -8mA  
2.4  
V
Unloaded outputs  
18  
mA  
Output Impedance  
23  
Note: 5. CLKIN input has a threshold voltage of VDD/2  
6. Parameter is guaranteed by design and characterization. Not 100% tested in production  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
5 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Switching Characteristics for ASM3P622S00B/E  
Parameter  
Test Conditions  
Min  
4
Typ  
Max  
20  
Unit  
MHz  
MHz  
%
Input Frequency  
Output Frequency  
30pF load  
4
20  
Duty Cycle 6,7 = (t2 / t1) * 100  
Output Rise Time 7, 8  
Output Fall Time 7, 8  
Output-to-output skew 7, 8  
Delay, CLKIN Rising Edge to  
CLKOUT Rising Edge 8  
Measured at VDD/2  
40  
50  
60  
Measured between 0.8V and 2.0V  
Measured between 2.0V and 0.8V  
All outputs equally loaded with SSOFF  
2.5  
2.5  
250  
nS  
nS  
pS  
Measured at VDD /2 with SSOFF  
±350  
700  
pS  
pS  
Measured at VDD/2 on the CLKOUT pins  
of the device  
Device-to-Device Skew 8  
Cycle-to-Cycle Jitter 7, 8  
PLL Lock Time 8  
< 8MHz  
Loaded outputs  
±1.6  
nS  
pS  
> 8MHz  
±200  
Stable power supply, valid clock presented  
on CLKIN pin  
1.0  
mS  
Note: 7. All parameters specified with 30pF loaded outputs.  
8. Parameter is guaranteed by design and characterization. Not 100% tested in production  
Switching Waveforms  
Duty Cycle Timing  
t1  
t2  
VDD/2  
VDD/2  
VDD/2  
OUTPUT  
All Outputs Rise/Fall Time  
2V  
2V  
0.8V  
3.3V  
0.8V  
OUTPUT  
0V  
t3  
t4  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
6 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Output - Output Skew  
VDD/2  
OUTPUT  
OUTPUT  
VDD/2  
t 5  
Input - Output Propagation Delay  
VDD/2  
INPUT  
VDD/2  
OUTPUT  
t 6  
Device - Device Skew  
VDD/2  
CLKOUT, Device 1  
CLKOUT, Device 2  
VDD/2  
t 7  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
7 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Input-Output Skew  
Test Circuit  
Timing-Safe™  
Output  
Input  
+3.3V  
VDD  
TSKEW  
+
0.1uF  
0.1uF  
TSKEW  
-
CLKOUT  
LOAD  
OUTPUT  
+3.3V  
Test Circuit  
VDD  
One clock cycle  
N=1  
GND  
T
SKEW represents input-output skew  
when spread spectrum is ON  
For example, TSKEW = ± 0.125 for an  
Input clock12MHz, translates in to  
(1/12MHz) * 0.125=10.41nS  
A Typical example of Timing-Safe™ waveform  
Input  
Input  
CLKOUT with SSOFF  
Timing-Safe™ CLKOUT  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
8 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Package Information  
8-lead (150-mil) SOIC Package  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min Max  
Min  
Max  
0.010  
0.069  
0.059  
0.020  
0.010  
A1  
A
0.004  
0.053  
0.049  
0.012  
0.007  
0.10  
1.35  
1.25  
0.31  
0.18  
0.25  
1.75  
1.50  
0.51  
0.25  
A2  
B
C
D
E
0.193 BSC  
0.154 BSC  
0.050 BSC  
0.236 BSC  
4.90 BSC  
3.91 BSC  
1.27 BSC  
6.00 BSC  
e
H
L
0.016  
0°  
0.050  
8°  
0.41  
0°  
1.27  
8°  
θ
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
9 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
8-lead TSSOP (4.40-MM Body)  
H
E
D
A2  
A
C
θ
e
A1  
L
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
Min  
Max  
A
A1  
A2  
B
0.043  
0.006  
0.037  
0.012  
0.008  
0.122  
0.177  
1.10  
0.002  
0.033  
0.008  
0.004  
0.114  
0.169  
0.05  
0.85  
0.19  
0.09  
2.90  
4.30  
0.15  
0.95  
0.30  
0.20  
3.10  
4.50  
c
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.028  
8°  
0.50  
0°  
0.70  
8°  
θ
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
10 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
16-lead (150 Mil) Molded SOIC Package  
PIN 1 ID  
1
8
H
E
9
16  
h
D
Seating Plane  
A2  
A
C
θ
0.004  
e
L
A1  
B
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
0.069  
0.010  
0.059  
0.022  
0.012  
0.394  
0.157  
Min  
1.35  
0.10  
1.25  
0.33  
0.19  
9.80  
3.80  
Max  
1.75  
0.25  
1.50  
0.53  
0.27  
10.01  
4.00  
A
A1  
A2  
B
0.053  
0.004  
0.049  
0.013  
0.008  
0.386  
0.150  
C
D
E
e
0.050 BSC  
1.27 BSC  
H
h
0.228  
0.010  
0.016  
0°  
0.244  
0.016  
0.035  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.41  
0.89  
8°  
L
θ
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
11 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
16-lead TSSOP (4.40-MM Body)  
1
8
PIN 1 ID  
E
H
9
16  
A
Seating Plane  
C
θ
A2  
A1  
e
B
L
D
Dimensions  
Symbol  
Inches  
Millimeters  
Min  
Max  
Min  
Max  
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
4.50  
A
A1  
A2  
B
0.043  
0.006  
0.041  
0.012  
0.008  
0.201  
0.177  
0.002  
0.031  
0.007  
0.004  
0.193  
0.169  
0.05  
0.80  
0.19  
0.09  
4.90  
4.30  
C
D
E
e
0.026 BSC  
0.252 BSC  
0.65 BSC  
6.40 BSC  
H
L
0.020  
0°  
0.030  
8°  
0.50  
0°  
0.75  
8°  
θ
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
12 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Ordering Code  
Ordering Code  
Marking  
3P622S00BF  
3I622S00BF  
3P622S00BF  
3I622S00BF  
3P622S00BF  
3I622S00BF  
3P622S00BF  
3I622S00BF  
3P622S00EF  
3I622S00EF  
3P622S00EF  
3I622S00EF  
3P622S00EF  
3I622S00EF  
3P622S00EF  
3I622S00EF  
3P622S00BG  
3I622S00BG  
3P622S00BG  
3I622S00BG  
3P622S00BG  
3I622S00BG  
3P622S00BG  
3I622S00BG  
3P622S00EG  
3I622S00EG  
3P622S00EG  
3I622S00EG  
3P622S00EG  
3I622S00EG  
3P622S00EG  
3I622S00EG  
Package Type  
8-pin 150-mil SOIC-TUBE, Pb Free  
8-pin 150-mil SOIC-TUBE, Pb Free  
Temperature  
Commercial  
Industrial  
ASM3P622S00BF-08-ST  
ASM3I622S00BF-08-ST  
ASM3P622S00BF-08-SR  
ASM3I622S00BF-08-SR  
ASM3P622S00BF-08-TT  
ASM3I622S00BF-08-TT  
ASM3P622S00BF-08-TR  
ASM3I622S00BF-08-TR  
ASM3P622S00EF-16-ST  
ASM3I622S00EF-16-ST  
ASM3P622S00EF-16-SR  
ASM3I622S00EF-16-SR  
ASM3P622S00EF-16-TT  
ASM3I622S00EF-16-TT  
ASM3P622S00EF-16-TR  
ASM3I622S00EF-16-TR  
ASM3P622S00BG-08-ST  
ASM3I622S00BG-08-ST  
ASM3P622S00BG-08-SR  
ASM3I622S00BG-08-SR  
ASM3P622S00BG-08-TT  
ASM3I622S00BG-08-TT  
ASM3P622S00BG-08-TR  
ASM3I622S00BG-08-TR  
ASM3P622S00EG-16-ST  
ASM3I622S00EG-16-ST  
ASM3P622S00EG-16-SR  
ASM3I622S00EG-16-SR  
ASM3P622S00EG-16-TT  
ASM3I622S00EG-16-TT  
ASM3P622S00EG-16-TR  
ASM3I622S00EG-16-TR  
8-pin 150-mil SOIC-TAPE & REEL, Pb Free  
8-pin 150-mil SOIC-TAPE & REEL, Pb Free  
8-pin 4.4-mm TSSOP - TUBE, Pb Free  
8-pin 4.4-mm TSSOP - TUBE, Pb Free  
8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
16-pin 150-mil SOIC-TUBE, Pb Free  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
16-pin 150-mil SOIC-TUBE, Pb Free  
16-pin 150-mil SOIC-TAPE & REEL, Pb Free  
16-pin 150-mil SOIC-TAPE & REEL, Pb Free  
16-pin 4.4-mm TSSOP - TUBE, Pb Free  
16-pin 4.4-mm TSSOP - TUBE, Pb Free  
16-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
16-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
8-pin 150-mil SOIC-TUBE, Pb Free  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
8-pin 150-mil SOIC-TUBE, Pb Free  
8-pin 150-mil SOIC-TAPE & REEL, Pb Free  
8-pin 150-mil SOIC-TAPE & REEL, Pb Free  
8-pin 4.4-mm TSSOP - TUBE, Pb Free  
8-pin 4.4-mm TSSOP - TUBE, Pb Free  
8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free  
16-pin 150-mil SOIC-TUBE, Green  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
16-pin 150-mil SOIC-TUBE, Green  
16-pin 150-mil SOIC-TAPE & REEL, Green  
16-pin 150-mil SOIC-TAPE & REEL, Green  
16-pin 4.4-mm TSSOP - TUBE, Green  
16-pin 4.4-mm TSSOP - TUBE, Green  
16-pin 4.4-mm TSSOP - TAPE & REEL, Green  
16-pin 4.4-mm TSSOP - TAPE & REEL, Green  
Commercial  
Industrial  
Commercial  
Industrial  
Commercial  
Industrial  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
13 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
Device Ordering Information  
A S M 3 P 6 2 2 S 0 0 B G - 0 8 - T R  
R = Tape & Reel, T = Tube or Tray  
O = TSOT23  
S = SOIC  
T = TSSOP  
A = SSOP  
V = TVSOP  
B = BGA  
U = MSOP  
E = TQFP  
L = LQFP  
U = MSOP  
P = PDIP  
J=TSOT26  
C=TDFN (2X2) COL  
D = QSOP  
X = SC-70  
Q = QFN  
DEVICE PIN COUNT  
F = LEAD FREE AND RoHS COMPLIANT PART  
G = GREEN PACKAGE, LEAD FREE, and RoHS  
PART NUMBER  
X= Automotive  
(-40C to +125C) (-40C to +85C)  
I= Industrial  
P or n/c = Commercial  
(0C to +70C)  
1 = Clock Generator  
2 = Non PLL based  
3 = EMI Reduction  
4 = DDR support products  
5 = STD Zero Delay Buffer  
6 = Power Management  
7 = Power Management  
8 = Power Management  
9 = Hi Performance  
0 = Reserved  
PulseCore Semiconductor Mixed Signal Product  
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
14 of 15  
Notice: The information in this document is subject to change without notice.  
May 2008  
rev 0.5  
ASM3P622S00B/E  
PulseCore Semiconductor Corporation  
1715 S. Bascom Ave Suite 200  
Campbell, CA 95008  
Tel: 408-879-9077  
Fax: 408-879-9018  
Copyright © PulseCore Semiconductor  
All Rights Reserved  
Preliminary Information  
Part Number: ASM3P622S00B/E  
Document Version: 0.5  
www.pulsecoresemi.com  
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003  
Many PulseCore Semiconductor products are protected by issued patents or by applications for patent  
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of  
PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the  
right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that  
may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance.  
PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development,  
significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive  
information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or  
customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and  
disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to  
fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s  
Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to  
PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights,  
copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not  
authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to  
result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer  
assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.  
Low Frequency Timing-Safe™ Peak EMI Reduction IC  
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Notice: The information in this document is subject to change without notice.  

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