PCS3P25811AG-08SR [PULSECORE]
Clock Generator, 32MHz, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8;
| 型号： | PCS3P25811AG-08SR |
| 厂家： | 
PulseCore Semiconductor |
| 描述： | Clock Generator, 32MHz, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8 时钟 光电二极管 外围集成电路 晶体 |
| 文件： | 总11页 (文件大小：434K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PCS3P25811 and PCS3P25812 and PCS3P25814
Spread Spectrum Clock
Generator
Features
Generates a 1x (PCS3P25811), 2x (PCS3P25812)
savings by reducing the number of circuit board layers,
ferrite beads, shielding, and other passive components
that are traditionally required to pass EMI regulations.
and 4x(PCS3P25814) low EMI spread spectrum
clock of the input frequency
The PCS3P25811/12/14 can generate an EMI reduced
clock from crystal, ceramic resonator, or system clock.
Provides up to 15dB of EMI suppression
Input Frequency: 4MHz - 32MHz
Output Frequency:
The PCS3P25811/12/14 modulate the output of a single
PLL in order to “spread” the bandwidth of a synthesized
cock, and more importantly, decreases the peak
amplitudes of its harmonics. This results in significantly
lower system EMI compared to the typical narrow band
signal produced by oscillators and most frequency
generators. Lowering EMI by increasing a signal‟s
bandwidth is called „spread spectrum clock generation.‟
PCS3P25811: 4MHz - 32MHz
PCS3P25812: 8MHz - 64MHz
PCS3P25814: 16MHz - 128MHz
Selectable spread options: Down Spread and Center
Spread
Low Power Dissipation:
3.3V: 20mW (typ) @ 6MHz
The PCS3P25811/12/14 use the most efficient and
optimized modulation profile approved by the FCC and is
implemented in a proprietary all-digital method.
3.3V: 24mW (typ) @ 12MHz
3.3V: 30mW (typ) @ 24MHz
Low inherent Cycle-to-Cycle Jitter
Supply Voltage: 2.8V to 3.6V
The PCS3P25811/12/14 have 2 pins S0 and S1 to control
the selection of Center Spread, Down Spread and No-
Spread functions. Additionally there is a 3 level logic
contol FSEL, for selecting one of the three different
frequency ranges within the operating frequency range.
Refer Input/Output Frequency Range Selection Table.
LVCMOS Input and output
Functional and Pinout compatible to Cypress
CY25811, CY25812 and CY25814
Commercial and Industrial temperature range
8-pin SOIC, TSSOP and TDFN, COL(2X2) Packages
The PCS3P25811/12/14 operate from a 2.8V to 3.6V
supply and are available in 8 pin SOIC, TSSOP and
TDFN, COL(2X2) packages, over Commercial and
Industrial temperature range.
Product Description
The PCS3P25811/12/14 devices are versatile spread
spectrum frequency modulators designed specifically for
a wide range of input clock frequencies from 4MHz to
32MHz.
Applications
The PCS3P25811/12/14 are targeted towards EMI
management in applications such as LCD Panels, MFPs,
Digital copiers, Networking, PC peripheral devices,
consumer electronics, and embedded controller systems.
The
PCS3P25811/12/14
reduce
electromagnetic
interference (EMI) at the clock source, allowing system
wide reduction of EMI of down stream clock and data
dependent signals. It allows significant system cost
©2010 SCILLC. All rights reserved.
Publication Order Number:
JANUARY 2010 – Rev. 1
PCS3P25811/D
PCS3P25811 and PCS3P25812 and PCS3P25814
Block Diagram
S0
FSEL S1
VDD
Input Decoder
& Modulation
control
PLL
XIN / CLKIN
XOUT
Crystal
Oscillator
Frequency
Divider
Output
Divider
Phase
Detector
Loop
Filter
VCO
Feedback
Divide
ModOUT
VSS
Pin Configuration
XIN / CLKIN
1
8
XOUT
VDD
VSS
S1
PCS3P25811
PCS3P25812
PCS3P25814
2
7
6
5
FSEL
3
4
ModOUT
S0
Pin Description
Pin#
Pin Name
Type
Description
1
2
XIN / CLKIN
VSS
I
Crystal connection or External Clock input.
Ground to entire chip.
P
I
Digital 3 level logic input (1-M-0) used to select Center, Down and No spread
options. (Refer to Frequency Deviation Selection Table). Default=M.
3
S1
Digital 3 level logic input (1-M-0) used to select Center, Down and No spread
options. (Refer to Frequency Deviation Selection Table). Default=M.
4
5
6
S0
I
O
I
ModOUT
FSEL
Spread Spectrum Clock Output.
Frequency range select. Digital 3 level logic input (1-M-0) used to select Input
Clock frequency range (Refer to Input/Output Frequency Range Selection Table).
Default=M.
7
8
VDD
P
Power supply for the entire chip (2.8V to 3.6V).
Crystal connection. If using an external reference, this pin must be left
unconnected.
XOUT
O
Rev. 1 | Page 2 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Input/Output Frequency Range Selection Table
Part Number
PCS3P25811
(1x)
PCS3P25812
(2x)
PCS3P25814
(4x)
FSEL (pin 6)
Modulation Rate
Input
(MHz)
Output
(MHz)
Input
(MHz)
Output
(MHz)
Input
(MHz)
Output
(MHz)
0
1
4-8
8-16
16-32
4-8
8-16
16-32
4-8
8-16
16-32
8-16
16-32
32-64
4-8
8-16
16-32
16-32
Input Frequency / 128
Input Frequency / 256
Input Frequency / 512
32-64
M
64-128
Output Frequency Deviation Selection Table
S1=0
S0=0
S1=0
S0=M
S1=0
S0=1
S1=M
S0=0
S1=1
S0=1
S1=1
S0=0
S1=M
S0=1
S1=1
S0=M
S1=M
S0=M
No
CLKIN
(MHz)
FSEL
Center
Center
Center
Center
Down
Down
Down
Down
Spread
4-5
5-6
0
0
±1.4
±1.3
±1.2
±1.1
±1.4
±1.3
±1.2
±1.1
±1.4
±1.3
±1.2
±1.1
±1.2
±1.1
±0.9
±0.9
±1.2
±1.1
±0.9
±0.9
±1.2
±1.1
±0.9
±0.9
±0.6
±0.5
±0.5
±0.4
±0.6
±0.5
±0.5
±0.4
±0.6
±0.5
±0.5
±0.4
±0.5
±0.4
±0.4
±0.3
±0.5
±0.4
±0.4
±0.3
±0.5
±0.4
±0.4
±0.3
-3
-2.2
-1.9
-1.8
-1.7
-2.2
-1.9
-1.8
-1.7
-2.2
-1.9
-1.8
-1.7
-1.9
-1.7
-1.5
-1.4
-1.9
-1.7
-1.5
-1.4
-1.9
-1.7
-1.5
-1.4
-0.7
-0.6
-0.6
-0.5
-0.7
-0.6
-0.6
-0.5
-0.7
-0.6
-0.6
-0.5
0
0
0
0
0
0
0
0
0
0
0
0
-2.7
-2.5
-2.3
-3
6-7
0
7-8
0
8-10
10-12
12-14
14-16
16-20
20-24
24-28
28-32
1
1
-2.7
-2.5
-2.3
-3
1
1
M
M
M
M
-2.7
-2.5
-2.3
Note: Frequency Deviation given in the table is for the Input Frequency Range covering PCS3P25811/12 /14.
3 Level Digital Logic
S0, S1, and FSEL digital inputs are designed to sense 3
different logic levels designated as High “1”, Low “0” and
Middle “M”. With this 3-Level digital input logic 9 different
logic states can be detected.
needed to implement the 3-Level logic levels as shown
VDD
below:
Logic
1
Control Pins
FSEL, S0, S1 to VDD
S0, S1 and FSEL pins include an on chip 100K (50K/50K)
resistor divider. No external application resistors are
FSEL, S0, S1
UNCONNECTED
FSEL, S0, S1 to VSS
M
0
VSS
Rev. 1 | Page 3 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Operating Conditions
Symbol
Parameter
Min
2.8
Max
3.6
+85
15
Unit
V
VDD
TA
Voltage on any pin with respect to VSS
Operating temperature
Load Capacitance
-40
°C
CL
pF
pF
CIN
Input Capacitance
7
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
V
VDD, VIN
TSTG
Ts
Voltage on any pin with respect to Ground
Storage temperature
-0.5 to +4.6
-65 to +125
°C
Max. Soldering Temperature (10 sec)
Junction Temperature
260
150
2
°C
TJ
°C
TDV
KV
Static Discharge Voltage (As per JEDEC STD 22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VDD
Supply Voltage
2.8
0
3.3
3.6
V
Commercial Temp.
Industrial Temp.
0.15VDD
0.13 VDD
Input low voltage
(S0, S1, FSEL Inputs)
VIL
V
0
VIM
VIH
Input Middle Voltage (S0, S1, FSEL Inputs)
Input high voltage (S0, S1, FSEL Inputs)
0.4VDD
0.60VDD
VDD
V
V
0.85VDD
IOL= 4mA
0.4
1.2
Output low voltage
(ModOUT Output)
VOL
V
IOL= 10mA
IOH= -4mA
IOH= -6mA
2.4
2
Output high voltage
(ModOUT Output)
VOH
CIN
V
Input Capacitance (XIN And XOUT)
6
9
pF
XIN / CLKIN = 12MHz
XIN / CLKIN = 24MHz
XIN / CLKIN = 32MHz
XIN / CLKIN = 12MHz
XIN / CLKIN = 24MHz
XIN / CLKIN = 32MHz
8
Commercial
Temp
10
13
10
12
15
0.5
mA
Dynamic supply
current
(Unloaded Output)
IDD
Industrial
Temp
mA
mA
ICC
Static supply current (XIN / CLKIN pulled to VSS)
Note. The voltage on any input or I/O pin cannot exceed the power pin during power up. All parameters are specified at Commercial and Industrial
temperature unless stated otherwise.
Rev. 1 | Page 4 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
AC Electrical Characteristics
Symbol
Parameter
Min
4
Typ
Max
32
Unit
MHz
MHz
MHz
MHz
fIN
Input Clock frequency for PCS3P25811/12/14
ModOUT Clock frequency for PCS3P25811
ModOUT Clock frequency for PCS3P25812
ModOUT Clock frequency for PCS3P25814
4
32
fOUT
8
64
16
2
128
5
PCS3P25811/12/14
ModOUT Rise time
(Measured from 20% to 80%)
1, 2
tLH
nS
nS
PCS3P25814
When FSEL=M
1
2
1
2.2
4.4
2.2
PCS3P25811/12/14
ModOUT Fall time
(Measured from 80% to 20%)
1, 2
tHL
PCS3P25814
When FSEL=M
TDCIN
Input Clock Duty Cycle(XIN / CLKIN)
Output Clock Duty Cycle (ModOUT)
40
40
60
60
%
%
1, 2
TDCOUT
4MHz
600
450
400
380
380
380
PCS3P25811
Cy-Cy Jitter,
For ModOUT
8MHz
16MHz
32MHz
64MHz
128MHz
with Spread ON
PCS3P25812
pS
(For Commercial
temperature)
2
TJC
PCS3P25814
Cy-Cy Jitter,
For ModOUT
with Spread ON
PCS3P25812
500
400
380
CLKIN = 6MHz
CLKIN = 12MHz
CLKIN = 24MHz
PCS3P25811
pS
(For Industrial
temperature)
PCS3P25814
Commercial
Temp.
PLL Lock Time
2
3
2
tON
mS
(Stable power supply, valid input clock
to valid Clock on ModOUT)
Industrial Temp.
Notes: 1.Parameters are specified with 15pF loaded outputs.
2. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Rev. 1 | Page 5 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Application Schematic
VDD
C3
0.1µF
7
C1
VDD
XIN
Centre Spread ±0.5%
1
27pF
C2
Y1
12MHz
12MHz (PCS3P25811)
24MHz (PCS3P25812)
48MHz (PCS3P25814)
ModOUT 5
8
XOUT
PCS3P25811/12/14
27pF
VDD
VDD
S0
S1
4
3
6
FSEL
VSS
2
Typical Crystal Specifications
Fundamental AT cut parallel resonant crystal
Nominal frequency
12MHz
Frequency tolerance
±50ppm or better at 25°C
-25°C to +85°C
-40°C to +85°C
18pF
Operating temperature range
Storage temperature
Load capacitance
Shunt capacitance
7pF maximum
25
ESR
Note: CL is Load Capacitance and R1 is used to prevent oscillations at overtone frequency of the Fundamental frequency.
Typical Crystal Interface Circuit
R
R1
Crystal
C1=27pF
C2 = 27pF
Rev. 1 | Page 6 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Package Information
8-Pin SOIC Package
H
E
D
A2
A
C
e
A1
L
B
Dimensions
Millimeters
Symbol
Inches
Min
Max
0.010
0.069
0.059
0.020
0.010
Min
0.10
1.35
1.25
0.31
0.18
Max
0.25
1.75
1.50
0.51
0.25
A1
A
0.004
0.053
0.049
0.012
0.007
A2
B
C
D
E
0.193 BSC
0.154 BSC
0.050 BSC
0.236 BSC
4.90 BSC
3.91 BSC
1.27 BSC
6.00 BSC
e
H
L
0.016
0°
0.050
8°
0.41
0°
1.27
8°
θ
Note: Controlling dimensions are millimeters.
SOIC: 0.074 grams unit weight.
Rev. 1 | Page 7 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
8-Pin TSSOP Package
H
E
D
A2
A
C
e
A1
L
B
Dimensions
Symbol
Inches
Max
Millimeters
Min
Min
Max
A
0.043
1.10
A1
A2
0.002
0.033
0.006
0.037
0.05
0.85
0.15
0.95
B
c
0.008
0.004
0.114
0.169
0.012
0.008
0.122
0.177
0.19
0.09
2.90
4.30
0.30
0.20
3.10
4.50
D
E
e
0.026 BSC
0.252 BSC
0.65 BSC
6.40 BSC
0.70
8°
H
L
0.020
0°
0.028
8°
0.50
0°
θ
Note: Controlling dimensions are millimeters.
TSSOP: 0.0325 grams unit weight.
Rev. 1 | Page 8 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
TDFN COL 2x2 8L package
Dimensions
Symbol
Inches
Min
Millimeters
Max
Min
Max
A
A3
b
0.027
0.0315
0.70
0.80
0.008 BSC
0.203 BSC
0.008
0.077
0.077
0.012
0.080
0.080
0.20
1.95
1.95
0.30
2.05
2.05
D
E
e
0.020 BSC
0.50 BSC
0.60
L
0.020
0.024
0.50
Rev. 1 | Page 9 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Ordering Code
Part Number
Marking
3P2581xAGS
3P2581xAGS
3P2581xAGT
3P2581xAGT
Package Type
SOIC – Tape & Reel, Green
SOIC – Tube, Green
Temperature
Commercial
Commercial
Commercial
Commercial
PCS3P2581xAG-08SR
PCS3P2581xAG-08ST
PCS3P2581xAG-08TR
PCS3P2581xAG-08TT
TSSOP – Tape & Reel, Green
TSSOP – Tube, Green
BG1
LLYW
BI1
LLYW
BH1
PCS3P25811AG-08CR
PCS3P25812AG-08CR
PCS3P25814AG-08CR
TDFN COL - TAPE & REEL, Green
TDFN COL - TAPE & REEL, Green
TDFN COL - TAPE & REEL, Green
Commercial
Commercial
Commercial
LLYW
PCS3I2581xAG-08SR
PCS3I2581xAG-08ST
PCS3I2581xAG-08TR
PCS3I2581xAG-08TT
3I2581xAGS
3I2581xAGS
3I2581xAGT
3I2581xAGT
SOIC – Tape & Reel, Green
SOIC – Tube, Green
Industrial
Industrial
Industrial
Industrial
TSSOP – Tape & Reel, Green
TSSOP – Tube, Green
BG2
LLYW
BH2
LLYW
BI2
PCS3I25811AG-08CR
PCS3I25812AG-08CR
PCS3I25814AG-08CR
TDFN COL - TAPE & REEL, Green
TDFN COL - TAPE & REEL, Green
TDFN COL - TAPE & REEL, Green
Industrial
Industrial
Industrial
LLYW
x=1 for 25811; x=2 for 25812; x=4 for 25814.
LL = 2 Character LOT #.
YW=Year and Work Week Code.
Device Ordering Information
P C S 3 P 2 5 8 1 x A G - 0 8 S R
R = Tape & Reel, T = Tube or Tray
O = TSOT23
S = SOIC
T = TSSOP
A = SSOP
V = TVSOP
U = MSOP
E = TQFP
L = LQFP
U = MSOP
P = PDIP
J=TSOT26
C=TDFN (2X2) COL
DEVICE PIN COUNT
F = LEAD FREE AND RoHS COMPLIANT PART
G = GREEN PACKAGE, LEAD FREE, and RoHS
PART NUMBER
X= Automotive
(-40C to +125C) (-40C to +85C)
I= Industrial
P or n/c = Commercial
(0C to +70C)
1 = Clock Generator
2 = Non PLL based
3 = EMI Reduction
6 = Power Management
7 = Power Management
8 = Power Management
ON Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Rev. 1 | Page 10 of 11 | www.onsemi.com
PCS3P25811 and PCS3P25812 and PCS3P25814
Note: This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003.
Many ON Semiconductor products are protected by issued patents or applications for patent.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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