PF0560.103NLT [PULSE]
SMT POWER INDUCTORS; SMT功率电感
| 型号： | PF0560.103NLT |
| 厂家： | 
PULSE A TECHNITROL COMPANY |
| 描述： | SMT POWER INDUCTORS |
| 文件： | 总2页 (文件大小：234K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMT POWER INDUCTORS
Shielded Drum Core - PF0560NL Series
Height: 4.0mm Max
Footprint: 10.4 x 10.4mm Max
Current Rating: up to 6.5A
Inductance Range: 1.5µH to 330µH
260°C reflow peak temperature qualified
Leaded technology compatible
Electrical Specifications @ 25°C — Operating Temperature -40°C to +125°C 6
Inductance
@ 0ADC
(µH)
Inductance
@ Irated
(µH TYP)
Saturation 6
Current ISAT
-35% (A)
Heating 7
Current IDC
+30°C(A)
Core Loss 8
Part 2,3
Number
Irated 5
(A)
DCR
(mΩ MAX)
SRF
(MHz)
Factor
(K2)
PF0560.152NL
PF0560.252NL
PF0560.382NL
PF0560.522NL
PF0560.702NL
PF0560.103NL
PF0560.153NL
PF0560.223NL
PF0560.333NL
PF0560.473NL
PF0560.683NL
PF0560.104NL
PF0560.154NL
PF0560.224NL
PF0560.334NL
1.5 30%
2.5 30%
3.8 30%
5.2 30%
7.0 30%
10 30%
15 30%
22 30%
33 25%
47 25%
68 25%
100 25%
150 25%
220 25%
330 25%
1.5
2.5
3.8
5.2
7.0
10
6.5
6.1
8.1
10.5
13
10
7.5
6.5
6.1
260
330
>40
>40
39
5.5
6.0
5.5
420
5.4
22
5.5
5.4
480
34
4.5
27
4.8
4.5
500
29
3.8
35
4.4
3.8
630
25
15
3.1
50
3,6
3.1
790
19
22
2.5
73
2.9
2.5
910
17
33
2.2
93
2.3
2.2
1200
1300
1700
2000
2400
2900
3580
14
47
1.9
128
213
304
506
756
1090
2.1
1.9
10
68
1.42
1.25
0.85
0.7
1.5
1.42
1.25
0.85
0.7
9.0
6.6
5.4
5.2
3.2
100
150
220
330
1.35
1.15
0.92
0.70
0.52
0.52
NOTES FROM TABLE: (See page 43)
Schematic
Mechanical
1
.409
10,40
MAX
.421
10,70
TYP
.303
7,70
TYP
.287
7,30
TYP
PF0560.XXXNL
Country of Origin
Date Code
2
Inches
mm
Dimensions:
.138
3,50
TYP
.406
10,30
.118
3,00
TYP
.047
MAX
1,20
TYP
Unless otherwise specified,
.004
0,10
all tolerances are ±
SUGGESTED PAD LAYOUT
Weight . . . . . . . . . . .1.4 grams
Tape & Reel . . . . . . . .620/reel
Tray . . . . . . . . . . . . . . .60/tray
.157
4,00
MAX
Inductance vs Current Characteristics
120%
100%
80%
60%
40%
20%
0%
.005/0,13
.224
5,70
.630
16,00
.945 ± .012
24,00 ± 0,30
.413
10,50
USER DIRECTION
TAPE & REEL
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
OF FEED
LAYOUT
Normalized Isat
•
•
•
•
•
USA 858 674 8100
Germany 49 7032 7806 0
Singapore 65 6287 8998
Shanghai 86 21 54643211 / 2
China 86 755 33966678 Taiwan 886 3 4641811
www.pulseeng.com
36
SPM2007 (11/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables (pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
8. In high volt*time (Et) or ripple current applications, addi-
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102NL
becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. The "NL" suffix indicates an RoHS-compliant part
number. Non-NL suffixed parts are not necessarily
RoHS compliant, but are electrically and mechanically
equivalent to NL versions. If a part number does not Estimated Temperature Rise:
have the "NL" suffix, but an RoHS compliant version is
required, please contact Pulse for availability.
Trise = [Total loss (mW) / K0].833 (oC )
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
Total loss = Copper loss + Core loss (mW)
5. The rated current (Irated) as listed is either the satura-
2
Copper loss = IRMS x DCR (Typical) (mW)
tion current or the heating current depending on which
value is lower.
Irms = [IDC + ΔI2/12]1/2 (A)
2
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW)
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
Bac (peak to peak flux density) = K2 x ΔI (Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
Trise Factor
(K0 )
Core Loss Factor
(K1)
CoreLoss/K1 Vs Flux Density
Part No.
3.00E+10
2.50E+10
2.00E+10
1.50E+10
1.00E+10
0.50E+10
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
100KHz
200KHz
300KHz
400KHz
500KHz
700KHz
1.0MHz
0
0
500
1000
1500
2000
2500
DB (Gauss)
where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)]
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
•
•
•
•
•
USA 858 674 8100
Germany 49 7032 7806 0
Singapore 65 6287 8998
Shanghai 86 21 54643211 / 2
China 86 755 33966678 Taiwan 886 3 4641811
www.pulseeng.com
43
SPM2007 (11/07)
相关型号：
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