SPM2007_27 [PULSE]
SMT POWER INDUCTORS Shielded Drum Core - P1172NL/P1173NL Series; SMT功率电感屏蔽鼓核 - P1172NL / P1173NL系列
| 型号： | SPM2007_27 |
| 厂家： | 
PULSE A TECHNITROL COMPANY |
| 描述： | SMT POWER INDUCTORS Shielded Drum Core - P1172NL/P1173NL Series |
| 文件： | 总2页 (文件大小：227K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMT POWER INDUCTORS
Shielded Drum Core - P1172NL/P1173NL Series
Height: 8.0mm Max
Footprint: 12.2mm x 12.2mm Max
Current Rating: up to 14A
Inductance Range: .8µH to 51µH
Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C
6
7
8
Inductance
@0ADC
Inductance
@Irated
(μH) MIN
Saturation
Current
-25% (A)
Heating
Current
+40°C(A)
Core Loss
Factor
(K2)
5
2,3
DCR (mΩ)
Part
Numbers
Irated
SRF
(MHz)
(ADC
)
(μH)
TYP
MAX
P1172.132NL
P1173.132NL
P1173.202NL
P1173.272NL
P1173.372NL
P1173.472NL
P1173.602NL
P1173.762NL
P1173.103NL
P1173.123NL
P1173.153NL
P1173.183NL
P1173.223NL
P1173.273NL
P1173.333NL
P1173.393NL
P1173.473NL
P1173.683NL
1.3*
2.0*
2.7*
3.7*
4.7*
6.0*
7.6*
10
0.8
1.3
14
10
9
2.3
4.5
3
15
13
14
10
90
>40
>40
>40
37
33
30
25
20
18
15
13
12
11
10
8
P1172.202NL
P1172.272NL
P1172.372NL
P1172.472NL
P1172.602NL
P1172.762NL
P1172.103NL
P1172.123NL
P1172.153NL
P1172.183NL
P1172.223NL
P1172.273NL
P1172.333NL
P1172.393NL
P1172.473NL
P1172.683NL
6
110
130
150
170
200
220
250
280
300
340
370
410
460
490
550
670
1.8
5.8
7.3
8.5
9.5
16.5
18.5
21.8
29
11
9
2.4
8.3
7.9
6
6.8
9.2
8.2
6.9
6.2
5.5
5.1
4.4
4.3
3.8
3.4
3
8.3
7.9
6
3.1
7.6
3.9
13
4.9
5.7
5.2
4.5
4.1
4
14.3
17.3
23.3
28.3
29.4
33.2
36.2
49.3
65.2
71.4
108
5.7
5.2
4.5
4.1
4
7.5
12
9
15
11.3
13.5
16.5
20.3
24.8
29.3
35.3
51
35.4
37
18
22
3.8
3.4
3
42
3.8
3.6
3.1
2.7
2.6
2.1
27
45.9
64.8
81.5
89
33
39
2.7
2.6
2.1
2.8
2.6
2.1
47
7
68
135
6
*Inductance at 0ADC tolerance on indicated part numbers is 30%ꢀ tolerance is 20% on all other parts.
NOTES FROM TABLE: (See page 43)
Mechanical
P1172/P1173
P1172
P1173
.315
8,00
.315
8,00
.315
8,00
.079
2,00
.315
8,00
.039
1,00
.039
1,00
.482
12,24
MAX
.197
5,00
.118
3,00
2
1
1
2
1
2
XXX
.472
.472
12,00
12,00
.075
1,91
.075
1,91
.482
12,24
MAX
.315
8,00
MAX
.134
3,40
.366
9,30
SUGGESTED PAD LAYOUT
SUGGESTED PAD LAYOUT
.362
9,20
.630
16,00
Schematic:
Weight . . . . . . . . 4.5 grams
Tape & Reel. . . . . . 400/reel
1
.945
24,00
.492
12,50
Inches
Dimensions:
mm
.010
0,25
Unless otherwise specified, all tolerances are
2
TAPE & REEL LAYOUT
•
•
•
•
•
USA 858 674 8100
Germany 49 7032 7806 0
Singapore 65 6287 8998
Shanghai 86 21 54643211 / 2
China 86 755 33966678 Taiwan 886 3 4641811
www.pulseeng.com
39
SPM2007 (11/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables (pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
8. In high volt*time (Et) or ripple current applications, addi-
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102NL
becomes P1166.102NLT). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. The "NL" suffix indicates an RoHS-compliant part
number. Non-NL suffixed parts are not necessarily
RoHS compliant, but are electrically and mechanically
equivalent to NL versions. If a part number does not Estimated Temperature Rise:
have the "NL" suffix, but an RoHS compliant version is
required, please contact Pulse for availability.
Trise = [Total loss (mW) / K0].833 (oC )
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
Total loss = Copper loss + Core loss (mW)
5. The rated current (Irated) as listed is either the satura-
2
Copper loss = IRMS x DCR (Typical) (mW)
tion current or the heating current depending on which
value is lower.
Irms = [IDC + ΔI2/12]1/2 (A)
2
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
Core loss = K1 x f (kHz)1.23 x Bac(Ga)2.38 (mW)
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
Bac (peak to peak flux density) = K2 x ΔI (Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
Trise Factor
(K0 )
Core Loss Factor
(K1)
CoreLoss/K1 Vs Flux Density
Part No.
3.00E+10
2.50E+10
2.00E+10
1.50E+10
1.00E+10
0.50E+10
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
100KHz
200KHz
300KHz
400KHz
500KHz
700KHz
1.0MHz
0
0
500
1000
1500
2000
2500
DB (Gauss)
where DB = K2 x DI [= K2/L(µH) x Et(V-µSec)]
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
•
•
•
•
•
USA 858 674 8100
Germany 49 7032 7806 0
Singapore 65 6287 8998
Shanghai 86 21 54643211 / 2
China 86 755 33966678 Taiwan 886 3 4641811
www.pulseeng.com
43
SPM2007 (11/07)
相关型号：
SPM2007_47
Tested and recommended by National Semiconductor Base material meets flammability requirements of UL 94V-0
PULSE
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