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ALE2350T2 Internally Matched LNA Module
型号:   ALE2350T2
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描述:   Internally Matched LNA Module
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品牌   ASB [ ADVANCED SEMICONDUCTOR BUSINESS INC. ]
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plerow
TM
ALE2350T2
Internally Matched LNA Module
Features
·
S
21
= 24.8 dB@2300 MHz
= 24.2 dB@2400 MHz
·
NF of 0.75 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3@Low Current
Description
The plerow
TM
ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25°C, V
s
= 5 V, Freq. = 2350 MHz, Z
o.sys
= 50 ohms
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
(1)
S11/S22
(2)
Unit
MHz
dB
dB
dB
dBm
dB
dBm
Specifications
Min
2300
23.5
24.5
±0.3
0.75
39
42
-18/-15
23
24
-
200
5
50
C.W 29~31 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
220
±0.4
0.80
Typ
Max
2400
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Output P1dB
Switching Time
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
(3)
msec
mA
V
W
dBm
mm
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 7 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V
S
.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
RF Out
Vs
Ground
plerow
ALE2350T2
2
5
6
ASB Inc.
(Top View)
(Bottom View)
Others
Solder Stencil Area
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4
plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
July 2009
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