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型号:  
描述:
HDSP-513G-IL000  HDSP-513A-KJ000  HDSP-513G  HDSP-513G-0L000  HDSP-511Y-HK000  HDSP-513E-IH000  HDSP-513G-JH000  HDSP-513A-LI000  HDSP-513A-HL000  HDSP-513E-KJ000  
BPD-RQ0ADY-A SIDE- LOOK PACKAGE PIN PHOTO DIODE
型号:   BPD-RQ0ADY-A
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描述:   SIDE- LOOK PACKAGE PIN PHOTO DIODE
文件大小 :   189 K    3 页
Logo:   
品牌   BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
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BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BPD-RQ0ADY-A
For AB
SIDE- LOOK PACKAGE
PIN PHOTO DIODE
Features
1. Wide receiving angle
2. Linear response vs. irradiance
3. Fast switching time
4. Side-looking Package ideal for space
limited applications
5. Lens Appearance: Black
Package Dimensions:
5.0
±
0.1
(.197
±
.004)
4.3
±
0.2
(.169
±
.008)
6.5
±
0.2
(.256
±
.008)
4.0
±
0.5
(.157
±
.020)
15.0(.591) MIN.
Description
The BPD-RQ09DY-Adevice consists
of a PIN silicon photodiode molded in
a
Black
epoxy package which allows
spectral response
infrared light wavelengths. The wide
receiving angle provides relatively even
reception over a large area. The
side-looking package is designed for
easy PC board mounting. This photodiode
is mechanically and spectrally matched to
BRIGHT’s GaAs and GaAlAs series of infrared
emitting diodes.
NOTES:
?0.5(.020)
1.0(.039) MIN.
2.54(.100)
1
2
3.8
±
0.1
(.150
±
.004)
1. Cathode
2. Anode
1
2
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3.Lead spacing is measured where the leads emerge from the package
4. Specifications are subject to change without notice
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Reverse Breakdown Voltage
Operating Temperature
Storage Temperature Range
Lead Soldering Temperature
Maximum Rating
100
60V
-45℃~+85℃
-45℃~+100℃
Unit
mW
260℃ for 5 seconds
REV.2.0
Page:1 of 2
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