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型号:  
描述:
HDD50-12D24X  HDD55-12D12T  HDD50-48S12T  HDD50-48T24T  HDD50-24T24P  HDD55-12S512X  HDD50-48S05X  HDD55-12D05P  HDD50-48D512T  HDD100-48S24-P  
BL-B5141-TBF18C Chip material: GaP/GaP
型号:   BL-B5141-TBF18C
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描述:   Chip material: GaP/GaP
文件大小 :   167 K    3 页
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品牌   BRIGHT [ BRIGHT LED ELECTRONICS CORP ]
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100%
BRIGHT LED ELECTRONICS CORP.
SINCE 1981
BL-B5141-TBF18C
Features:
1. Chip material: GaP/GaP
2. Emitted color : Bright Red
3. Lens Appearance : Red Diffused
4. Low power consumption.
5. High efficiency.
6. Versatile mounting on P.C. Board or panel.
7. Low current requirement.
8. 3mm diameter package
Package dimensions:
3.00(.118)
0.81(.032)
5.30(.209)
1.5(.059)
MAX.
25.4(1.00) MIN.
0.5(.02)
SQ.TYP.
CATHODE
3.80(.150)
Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
Notes:
2.54(.100)
NOM.
1.00(.039) MIN.
Flat Denotes Cathode
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
Absolute Maximum Ratings(Ta=25℃)
Parameter
Power Dissipation
Forward Current
Peak Forward Current*
1
Reverse
Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Pd
I
F
I
FP
V
R
Topr
Tstg
Tsol
Rating
40
15
50
5
-40
~80
-40
~85
260
(for 5 seconds)
Unit
mW
mA
mA
V
*
1
Condition for I
FP
is pulse of 1/10 duty and 0.1msec width.
Ver.1.0 Page: 1 of 3
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