HYI25D256160CC-6 [QIMONDA]
256-Mbit Double-Data-Rate SDRAM; 256 - Mbit的双数据速率SDRAM
| 型号： | HYI25D256160CC-6 |
| 厂家： | 
QIMONDA AG |
| 描述： | 256-Mbit Double-Data-Rate SDRAM |
| 文件： | 总39页 (文件大小：2092K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
March 2007
HYB25D256[40/80/16]0CE(L)
HYB25D256[40/80/16]0C[T/C/F]
HYI25D256[80/16]0C[C/E/F/T]
256-Mbit Double-Data-Rate SDRAM
DDR SDRAM
RoHS Compliant or Lead-Containing
Internet Data Sheet
Rev. 2.3
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
HYB25D256[40/80/16]0CE(L), HYB25D256[40/80/16]0C[T/C/F], HYI25D256[80/16]0C[C/E/F/T]
Revision History: 2007-03, Rev. 2.3
Page
Subjects (major changes since last revision)
All
Adapted internet edition
17
Corrected table 7 mode register definition
Changed the 1.1 mA to 1.5 mA for low power
Changed the ball size from 0.460 mm to 0.450 mm
72
85, 86
Previous Revision: 2007-01, Rev. 2.2
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qag_techdoc_rev400 / 3.2 QAG / 2006-08-07
03062006-8CCM-VPUW
2
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
1
Overview
This chapter lists all main features of the product family HY[B/I]25D256[16/40/80]0C[E/C/F/T](L) and the ordering information.
1.1
Features
•
Double data rate architecture: two data transfers per clock
cycle
Bidirectional data strobe (DQS) is transmitted and
received with data, to be used in capturing data at the
receiver
•
•
•
•
•
Auto Precharge option for each burst access
Auto Refresh and Self Refresh Modes
RAS-lockout supported tRAP = tRCD
7.8 µs Maximum Average Periodic Refresh Interval
2.5 V (SSTL_2 compatible) I/O
•
•
DQS is edge-aligned with data for reads and is center-
aligned with data for writes
Differential clock inputs (CK and CK)
Four internal banks for concurrent operation
Data mask (DM) for write data
DLL aligns DQ and DQS transitions with CK transitions
Commands entered on each positive CK edge; data and
data mask referenced to both edges of DQS
Burst Lengths: 2, 4, or 8
• VDDQ = 2.5 V ± 0.2 V (DDR200, DDR266, DDR333);
DDQ = 2.6 V ± 0.1 V (DDR400)
• VDD = 2.5 V ± 0.2 V (DDR200, DDR266, DDR333);
DD = 2.6 V ± 0.1 V (DDR400)
V
•
•
•
•
•
V
•
Standard Temperature Range (0 °C - +70 °C) or Industrial
Temperature Range (–40 °C - +85 °C)
P-TFBGA-60-12 package with 3 depopulated rows
(8 × 12 mm2)
•
•
•
•
•
P-TSOPII-66 package
CAS Latency: 1.5 (DDR200 only), 2, 2.5, 3
RoHS1) compliant product types available (green product)
TABLE 1
Performance of –5, –6 and –7
Product Type Speed Code
–5
–6
–7
Unit
Speed Grade Component
DDR400B
200
DDR333B
166
DDR266A
—
—
Max. Clock
Frequency
@CL3
@CL2.5
@CL2
fCK3
MHz
MHz
MHz
fCK2.5
fCK2
166
166
143
133
133
133
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 2.3, 2007-03
3
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
1.2
Description
The 256 Mbit Double-Data-Rate SDRAM is a high-speed
CMOS, dynamic random-access memory containing
268,435,456 bits. It is internally configured as a quad-bank
DRAM.
DQS, as well as to both edges of CK. Read and write
accesses to the DDR SDRAM are burst oriented; accesses
start at a selected location and continue for a programmed
number of locations in a programmed sequence. Accesses
begin with the registration of an Active command, which is
then followed by a Read or Write command. The address bits
registered coincident with the Active command are used to
select the bank and row to be accessed. The address bits
registered coincident with the Read or Write command are
used to select the bank and the starting column location for
the burst access.
The 256 Mbit Double-Data-Rate SDRAM uses a double-
data-rate architecture to achieve high-speed operation. The
double data rate architecture is essentially a 2n-prefetch
architecture with an interface designed to transfer two data
words per clock cycle at the I/O pins. A single read or write
access
for
the
256 Mbit Double-Data-Rate SDRAM
effectively consists of a single 2n-bit wide, one clock cycle
data transfer at the internal DRAM core and two
corresponding n-bit wide, one-half-clock-cycle data transfers
at the I/O pins.
The DDR SDRAM provides for programmable Read or Write
burst lengths of 2, 4 or 8 locations. An Auto Precharge
function may be enabled to provide a self-timed row
precharge that is initiated at the end of the burst access. As
with standard SDRAMs, the pipelined, multibank architecture
of DDR SDRAMs allows for concurrent operation, thereby
providing high effective bandwidth by hiding row precharge
and activation time.
A bidirectional data strobe (DQS) is transmitted externally,
along with data, for use in data capture at the receiver. DQS
is a strobe transmitted by the DDR SDRAM during Reads and
by the memory controller during Writes. DQS is edge-aligned
with data for Reads and center-aligned with data for Writes.
An auto refresh mode is provided along with a power-saving
power-down mode. All inputs are compatible with SSTL_2. All
outputs are SSTL_2, Class II compatible.
The 256 Mbit Double-Data-Rate SDRAM operates from a
differential clock (CK and CK; the crossing of CK going HIGH
and CK going LOW is referred to as the positive edge of CK).
Commands (address and control signals) are registered at
every positive edge of CK. Input data is registered on both
edges of DQS, and output data is referenced to both edges of
Note: The functionality described and the timing
specifications included in this data sheet are for the
DLL Enabled mode of operation.
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 2
Ordering Information for Lead-Free Products (RoHS Compliant)
Product Type1)
Organization CAS-RCD-RP Clock (MHz) Speed
Latencies
Package
Note
Standard Temperature Range (0 °C - +70 °C)
HYB25D256800CE–5A ×8
HYB25D256160CE–5A ×16
HYB25D256800CE–5 ×8
HYB25D256160CE–5 ×16
HYB25D256800CE–6 ×8
HYB25D256800CEL–6 ×8
HYB25D256160CE–6 ×16
HYB25D256160CEL–6 ×16
HYB25D256400CE–7 ×4
2.5-3-3
200
200
166
DDR400A PG-TSOPII-66
DDR400B
3-3-3
2.5-3-3
DDR333
143
200
DDR266A
HYB25D256400CF–5
HYB25D256800CF–5
HYB25D256160CF–5
HYB25D256400CF–6
HYB25D256800CF–6
HYB25D256160CF–6
×4
3-3-3
DDR400A PG-TFBGA-60
×8
×16
×4
2.5-3-3
166
DDR333
×8
×16
Industrial Temperature Range (–40 °C - +85 °C)
HYI25D256800CE–5
HYI25D256160CE–5
HYI25D256800CE–6
HYI25D256160CE–6
HYI25D256800CF–5
HYI25D256160CF–5
HYI25D256800CF–6
HYI25D256160CF–6
×8
3-3-3
200
166
200
166
DDR400B PG-TSOPII-66
DDR333
×16
×8
2.5-3-3
3-3-3
×16
×8
DDR400A PG-TFBGA-60
DDR333
×16
×8
2.5-3-3
×16
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 3
Ordering Information for Lead-Containing Products
Product Type1)
Oganization CAS-RCD-RP Clock (MHz) Speed
Latencies
Package
Note
Standard Temperature Range (0 °C - +70 °C)
HYB25D256400CT–5 ×4
HYB25D256800CT–5 ×8
HYB25D256160CT–5 ×16
HYB25D256400CT–6 ×4
HYB25D256800CT–6 ×8
HYB25D256800CTL–6 ×8
HYB25D256160CT–6 ×16
HYB25D256400CT–7 ×4
HYB25D256400CC–5 ×4
HYB25D256800CC–5 ×8
HYB25D256160CC–5 ×16
HYB25D256400CC–6 ×4
HYB25D256800CC–6 ×8
HYB25D256160CC–6 ×16
3-3-3
200
166
DDR400B P-TSOPII-66 —
DDR333
2.5-3-3
143
200
DDR266A
3-3-3
DDR400B P-TFBGA-60
2.5-3-3
166
DDR333
Industrial Temperature Range (–40 °C - +85 °C)
HYI25D256800CT–5
HYI25D256160CT–5
HYI25D256800CT–6
HYI25D256160CT–6
HYI25D256800CC–5
HYI25D256160CC–5
HYI25D256800CC–6
HYI25D256160CC–6
×8
3-3-3
200
166
200
166
DDR400B P-TSOPII-66 —
DDR333
×16
×8
2.5-3-3
3-3-3
×16
×8
DDR400A P-TFBGA-60
DDR333
×16
×8
2.5-3-3
×16
1) HYB and HYI: designator for memory components; 25D: DDR SDRAMs at VDDQ = 2.5 V; 256: 256-Mbit density; 400/800/160: product
variations ×4, ×8 and ×16; C: die revision C; L: low power (available on request); F/C/E/T: package type FBGA (lead & halogen free),
FBGA (lead containing), TSOP (lead & halogen free), and TSOP (lead containing)
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
2
Pin Configuration
The pin configuration of a DDR SDRAM is listed by function in Table 4 (60 pins). The abbreviations used in the Pin#/Buffer#
column are explained in Table 5 and Table 6 respectively. The pin numbering for FBGA is depicted in Figure 1 and that of the
TSOP package in Figure 2.
TABLE 4
Pin Configuration of DDR SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
Clock Signals
G2, 45
CK
I
I
I
SSTL
SSTL
SSTL
Clock Signal
G3, 46
CK
Complementary Clock Signal
Clock Enable
H3, 44
CKE
Control Signals
H7, 23
RAS
CAS
WE
I
I
I
I
SSTL
SSTL
SSTL
SSTL
Row Address Strobe
Column Address Strobe
Write Enable
G8, 22
G7, 21
H8, 24
CS
Chip Select
Address Signals
J8, 26
J7, 27
K7, 29
L8, 30
L7, 31
M8, 32
M2, 35
L3, 36
L2, 37
K3, 38
K2, 39
J3, 40
K8, 28
BA0
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
Bank Address Bus 2:0
Address Bus 11:0
BA1
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
AP
A11
A12
J2, 41
H2, 42
Address Signal 12
Note: 256 Mbit or larger dies
Note: 128 Mbit or smaller dies
Address Signal 13
NC
NC
I
—
F9, 17
A13
SSTL
Note: 1 Gbit based dies
Note: 512 Mbit or smaller dies
NC
NC
—
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
Data Signals ×4 Organization
B7, 5
DQ0
DQ1
DQ2
DQ3
I/O
I/O
I/O
I/O
SSTL
SSTL
SSTL
SSTL
Data Signal 3:0
D7, 11
D3, 56
B3, 62
Data Strobe ×4 Organisation
E3, 51
Data Mask ×4 Organization
F3, 47 DM
DQS
I/O
I
SSTL
SSTL
Data Strobe
Data Mask
Data Signals ×8 organization
A8, 2
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
Data Signal 7:0
B7, 5
C7, 8
D7, 11
D3, 56
C3, 59
B3, 62
A2, 65
Data Signal
Data Strobe ×8 organisation
E3, 51
Data Mask ×8 organization
F3, 47 DM
DQS
I/O
I
SSTL
SSTL
Data Strobe
Data Mask
Data Signals ×16 organization
A8, 2
DQ0
DQ1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
SSTL
Data Signal 15:0
B9, 4
B7, 5
DQ2
C9, 7
DQ3
C7, 8
DQ4
D9, 10
D7, 11
E9, 13
E1, 54
D3, 56
D1, 57
C3, 59
C1, 60
B3, 62
B1, 63
A2, 65
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Ball#/Pin#
Name
Pin
Type
Buffer
Type
Function
Data Strobe ×16 organization
E3, 51
UDQS
I/O
SSTL
SSTL
Data Strobe Upper Byte
Data Strobe Lower Byte
E7, 16
LDQS
I/O
Data Mask ×16 organization
F3, 47
UDM
LDM
I
I
SSTL
SSTL
Data Mask Upper Byte
Data Mask Lower Byte
F7, 20
Power Supplies
F1, 49
VREF
AI
—
—
I/O Reference Voltage
A9, B2, C8, D2, VDDQ
E8, 3, 9, 15, 55,
61
PWR
I/O Driver Power Supply
A7, F8, M7, 1, VDD
18, 33
PWR
PWR
—
—
Power Supply
Power Supply
A1, B8, C2, D8, VSSQ
E2, 6, 12, 52,
58, 64
A3, F2, M3, 34, VSS
PWR
—
Power Supply
48, 66
Not Connected
A2, 65
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
—
—
—
—
—
—
—
—
—
—
—
Not Connected
Note: ×4 organization
Not Connected
A8, 2
Note: ×4 organization
Not Connected
B1, 63
B9, 4
Note: ×8 and ×4 organisation
Not Connected
Note: ×8 and ×4 organization
Not Connected
C1, 60
C3, 59
C7, 8
Note: ×8 and ×4 organization
Not Connected
Note: ×4 organization
Not Connected
Note: ×4 organization
Not Connected
C9, 7
Note: ×8 and ×4 organization
Not Connected
D1, 57
D9, 10
E1, 54
Note: ×8 and ×4 organization
Not Connected
Note: ×8 and ×4 organization
Not Connected
Note: ×8 and ×4 organization
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Ball#/Pin#
E7, 16
Name
NC
Pin
Type
Buffer
Type
Function
NC
NC
NC
NC
—
—
—
—
Not Connected
Note: ×8 and ×4 organization
Not Connected
E9, 13
NC
Note: ×8 and ×4 organization
Not Connected
F7, 20
NC
Note: ×8 and ×4 organization
Not Connected
F9, 14, 17, 19, NC
25,43, 50, 53
Note: ×16,×8 and ×4 organization
TABLE 5
Abbreviations for Pin Type
Abbreviation
Description
I
Standard input-only pin. Digital levels.
Output. Digital levels.
I/O is a bidirectional input/output signal.
Input. Analog levels.
Power
O
I/O
AI
PWR
GND
NC
Ground
Not Connected
TABLE 6
Abbreviations for Buffer Type
Abbreviation
Description
SSTL
Serial Stub Terminated Logic (SSTL2)
Low Voltage CMOS
LV-CMOS
CMOS
OD
CMOS Levels
Open Drain. The corresponding pin has 2 operational states, active low and tristate, and
allows multiple devices to share as a wire-OR.
Rev. 2.3, 2007-03
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Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
FIGURE 1
Pin Configuration P-TFBGA-60 Top View, see the balls throught the package
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ꢐ
ꢖ
ꢒ
ꢕ
ꢁ
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ꢔ
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ꢀꢅꢅ
ꢀ
ꢅ
ꢍ
ꢀ
ꢅ
ꢍ
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ꢊꢋꢀꢋ
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ꢊꢋꢀꢋ
ꢊꢋꢀꢋ
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ꢀꢌꢍꢎ
ꢎ
ꢎ
ꢊꢀꢚꢁꢏꢖ
ꢊꢀꢚꢁꢏꢖ
ꢛ
ꢜ
ꢝ
ꢛ
ꢜ
ꢝ
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ꢀꢉ
ꢀꢁꢂ
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ꢀꢉ
ꢀꢉ
ꢀꢁꢂ
ꢀꢂ
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ꢌꢁꢂ
ꢘꢁꢏ
ꢊꢀ,ꢁꢏꢐ ꢀꢉꢍ
ꢌꢁꢂ
ꢘꢁꢏ
ꢁꢏꢏ
ꢁꢑ
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ꢁꢔ
ꢘꢁꢆ
ꢁꢏꢏ
ꢁꢑ
ꢁꢓ
ꢁꢔ
ꢘꢁꢆ
ꢉ
ꢉ
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ꢁꢆ ꢁꢏꢆꢙꢁꢄ
ꢞ
ꢞ
ꢁꢇ
ꢁꢕ
ꢁꢐ
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ꢁꢖ
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ꢁꢕ
ꢁꢐ
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ꢁꢖ
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ꢀꢅꢅ
ꢃ
ꢀꢁꢂꢃ
ꢃ
ꢀꢁꢄꢃ
ꢁꢒ
ꢁꢒ
ꢏ
ꢐ
ꢖ
ꢒ
ꢕ
ꢁ
ꢇ
ꢔ
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03062006-8CCM-VPUW
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Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
FIGURE 2
Pin Configuration P-TSOPII-66-1
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Rev. 2.3, 2007-03
03062006-8CCM-VPUW
12
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
3
Functional Description
The 256 Mbit Double-Data-Rate SDRAM is
a
high-speed CMOS, dynamic random-access memory containing
268,435,456 bits. The 256 Mbit Double-Data-Rate SDRAM is internally configured as a quad-bank DRAM.
The 256 Mbit Double-Data-Rate SDRAM uses a double-data-rate architecture to achieve high-speed operation. The double-
data-rate architecture is essentially a 2n prefetch architecture, with an interface designed to transfer two data words per clock
cycle at the I/O pins. A single read or write access for the 256 Mbit Double-Data-Rate SDRAM consists of a single 2n-bit wide,
one clock cycle data transfer at the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers
at the I/O pins.
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected location and continue for a
programmed number of locations in a programmed sequence. Accesses begin with the registration of an Active command,
which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used
to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address bits registered
coincident with the Read or Write command are used to select the starting column location for the burst access.
Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide detailed information covering
device initialization, register definition, command descriptions and device operation.
Rev. 2.3, 2007-03
13
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
%$ꢄ %$ꢁ $ꢄꢃ $ꢄꢄ $ꢄꢁ
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TABLE 7
Mode Register
Field
Bits
Type1) Description
Burst Length
BL
[2:0]
W
Number of sequential bits per DQ related to one read/write command.
Note: All other bit combinations are RESERVED.
001B
010B
011B
2
4
8
BT
CL
3
Burst Type
See Table 8 for internal address sequence of low order address bits.
0 Sequential
1 Interleaved
[6:4]
CAS Latency
Number of full clocks from read command to first data valid window.
Note: All other bit combinations are RESERVED.
010B
011B
2
3
110B 2.5
101B 1.5
Note: DDR200 components only
Operating Mode
MODE [12:7]
Note: All other bit combinations are RESERVED.
000000 Normal Operation without DLL Reset
000010 Normal Operation with DLL Reset
1) W = write only register bit
Rev. 2.3, 2007-03
14
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 8
Burst Definition
Burst Length
Starting Column Address
Order of Accesses Within a Burst
A2
A1
A0
Type = Sequential
Type = Interleaved
2
4
—
—
—
—
—
—
0
—
—
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0-1
0-1
1-0
1-0
0-1-2-3
0-1-2-3
0
1-2-3-0
1-0-3-2
1
2-3-0-1
2-3-0-1
1
3-0-1-2
3-2-1-0
8
0
0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-0
2-3-4-5-6-7-0-1
3-4-5-6-7-0-1-2
4-5-6-7-0-1-2-3
5-6-7-0-1-2-3-4
6-7-0-1-2-3-4-5
7-0-1-2-3-4-5-6
0-1-2-3-4-5-6-7
1-0-3-2-5-4-7-6
2-3-0-1-6-7-4-5
3-2-1-0-7-6-5-4
4-5-6-7-0-1-2-3
5-4-7-6-1-0-3-2
6-7-4-5-2-3-0-1
7-6-5-4-3-2-1-0
0
0
0
1
0
1
1
0
1
0
1
1
1
1
Notes
1. For a burst length of two, A1-Ai selects the two-data-element block; A0 selects the first access within the block.
2. For a burst length of four, A2-Ai selects the four-data-element block; A0-A1 selects the first access within the block.
3. For a burst length of eight, A3-Ai selects the eight-data- element block; A0-A2 selects the first access within the block.
4. Whenever a boundary of the block is reached within a given sequence above, the following access wraps within the block.
Rev. 2.3, 2007-03
15
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
%$ꢄ %$ꢁ $ꢄꢃ $ꢄꢄ $ꢄꢁ
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TABLE 9
Extended Mode Regsiter
Field
Bits
Type1)
Description
DLL Status
DLL
0
W
0B
1B
Enabled
Disabled
DS
1
W
W
Drive Strength
0B
1B
Normal
Weak
MODE
[12:2]
Operating Mode
Note: All other bit combinations are RESERVED.
00000000000BNormal Operation
1) W = write only register bit
Rev. 2.3, 2007-03
16
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 10
Truth Table 1a: Commands
Name (Function)
CS RAS CAS WE Address
MNE
Note
1)2)
Deselect (NOP)
H
L
L
L
L
L
L
L
L
X
H
L
X
H
H
L
X
H
H
H
L
X
X
NOP
NOP
1)2)
No Operation (NOP)
1)3)
Active (Select Bank And Activate Row)
Read (Select Bank And Column, And Start Read Burst)
Write (Select Bank And Column, And Start Write Burst)
Burst Terminate
Bank/Row ACT
1)4)
H
H
H
L
Bank/Col
Bank/Col
X
Read
Write
BST
1)4)
L
1)5)
H
H
L
L
1)6)
Precharge (Deactivate Row In Bank Or Banks)
Auto Refresh Or Self Refresh (Enter Self Refresh Mode)
Mode Register Set
L
Code
PRE
1)7)8)
1)9)
L
H
L
X
AR/SR
MRS
L
L
Op-Code
1) CKE is HIGH for all commands shown except Self Refresh.VREF must be maintained during Self Refresh operation
2) Deselect and NOP are functionally interchangeable.
3) BA0-BA1 provide bank address and A0-A12 provide row address.
4) BA0, BA1 provide bank address; A0-Ai provide column address (where i = 8 for x16, i = 9 for x8 and 9, 11 for x4); A10 HIGH enables the
Auto Precharge feature (nonpersistent), A10 LOW disables the Auto Precharge feature.
5) Applies only to read bursts with Auto Precharge disabled; this command is undefined (and should not be used) for read bursts with Auto
Precharge enabled or for write bursts.
6) A10 LOW: BA0, BA1 determine which bank is precharged. A10 HIGH: all banks are precharged and BA0, BA1 are “Don’t Care”.
7) This command is Auto Refresh if CKE is HIGH; Self Refresh if CKE is LOW.
8) Internal refresh counter controls row and bank addressing; all inputs and I/Os are “Don’t Care” except for CKE.
9) BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects Mode Register; BA0 = 1, BA1 = 0 selects
Extended Mode Register; other combinations of BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode
Register).
TABLE 11
Truth Table 1b: DM Operation
Name (Function)
DM
DQs
Note
1)
Write Enable
L
Valid
X
1)
Write Inhibit
H
1) Used to mask write data; provided coincident with the corresponding data.
Rev. 2.3, 2007-03
17
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 12
Truth Table 2: Clock Enable (CKE)
Current State CKE n-1
Previous Cycle
CKEn
Command n
Action n
Note
Current Cycle
1)
2)
Self Refresh
Self Refresh
Power Down
Power Down
All Banks Idle
All Banks Idle
Bank(s) Active
—
L
L
X
Maintain Self-Refresh
Exit Self-Refresh
L
H
L
Deselect or NOP
X
L
Maintain Power-Down
Exit Power-Down
L
H
L
Deselect or NOP
Deselect or NOP
AUTO REFRESH
Deselect or NOP
See Table 13
H
H
H
H
Precharge Power-Down Entry
Self Refresh Entry
Active Power-Down Entry
—
L
L
H
1)
VREF must be maintained during Self Refresh operation
2) Deselect or NOP commands should be issued on any clock edges occurring during the Self Refresh Exit (tXSNR) period. A minimum of 200
clock cycles are needed before applying a read command to allow the DLL to lock to the input clock.
Notes
1. CKEn is the logic state of CKE at clock edge n: CKE n-1 was the state of CKE at the previous clock edge.
2. Current state is the state of the DDR SDRAM immediately prior to clock edge n.
3. COMMAND n is the command registered at clock edge n, and ACTION n is a result of COMMAND n.
4. All states and sequences not shown are illegal or reserved.
Rev. 2.3, 2007-03
18
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 13
Truth Table 3: Current State Bank n - Command to Bank n (same bank)
Current State CS
RAS CAS WE
Command
Action
Note
1)2)3)4)5)6)
1) to 6)
Any
H
L
L
L
L
X
H
L
L
L
X
H
H
L
X
H
H
H
L
Deselect
NOP. Continue previous operation.
No Operation
Active
NOP. Continue previous operation.
1) to 6)
Idle
Select and activate row
1) to7)
AUTO REFRESH
—
—
1) to 7)
L
MODE REGISTER
SET
1) to 6),8)
1) to 6),8)
1) to 6),9)
1) to 6),8)
1) to 6),9)
1) to 6),10)
Row Active
L
L
L
L
L
L
H
H
L
L
H
L
Read
Select column and start Read burst
Select column and start Write burst
Deactivate row in bank(s)
L
Write
H
L
L
Precharge
Read
Read (Auto
Precharge
Disabled)
H
L
H
L
Select column and start new Read burst
Truncate Read burst, start Precharge
BURST TERMINATE
H
H
Precharge
H
L
BURST
TERMINATE
1) to 6), 8),11)
1) to 6),8)
Write (Auto
Precharge
Disabled)
L
L
L
H
H
L
L
L
H
H
L
Read
Select column and start Read burst
Select column and start Write burst
Truncate Write burst, start Precharge
Write
1) to 6),9),11)
L
Precharge
1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 12 and after tXSNR/tXSRD has been met (if the previous state
was self refresh).
2) This table is bank-specific, except where noted, i.e., the current state is for a specific bank and the commands shown are those allowed
to be issued to that bank when in that state. Exceptions are covered in the notes below.
3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated,
and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with
Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge
disabled, and has not yet terminated or been terminated.
4) The following states must not be interrupted by a command issued to the same bank. Precharging: Starts with registration of a Precharge
command and ends when tRP is met. Once tRP is met, the bank is in the idle state. Row Activating: Starts with registration of an Active
command and ends when tRCD is met. Once tRCD is met, the bank is in the “row active” state. Read w/Auto Precharge Enabled: Starts with
registration of a Read command with Auto Precharge enabled and ends when tRP has been met. Once tRP is met, the bank is in the idle
state. Write w/Auto Precharge Enabled: Starts with registration of a Write command with Auto Precharge enabled and ends when tRP has
been met. Once tRP is met, the bank is in the idle state. Deselect or NOP commands, or allowable commands to the other bank should be
issued on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and
according to Table 14.
5) The following states must not be interrupted by any executable command; Deselect or NOP commands must be applied on each positive
clock edge during these states. Refreshing: Starts with registration of an Auto Refresh command and ends when tRFC is met. Once tRFC is
met, the DDR SDRAM is in the “all banks idle” state. Accessing Mode Register: Starts with registration of a Mode Register Set command
and ends when tMRD has been met. Once tMRD is met, the DDR SDRAM is in the “all banks idle” state. Precharging All: Starts with
registration of a Precharge All command and ends when tRP is met. Once tRP is met, all banks is in the idle state.
6) All states and sequences not shown are illegal or reserved.
7) Not bank-specific; requires that all banks are idle.
8) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with
Auto Precharge disabled.
9) May or may not be bank-specific; if all/any banks are to be precharged, all/any must be in a valid state for precharging.
10) Not bank-specific; BURST TERMINATE affects the most recent Read burst, regardless of bank.
11) Requires appropriate DM masking.
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256 Mbit Double-Data-Rate SDRAM
TABLE 14
Truth Table 4: Current State Bank n - Command to Bank m (different bank)
Current State
CS
RAS CAS WE Command
Action
Note
1)2)3)4)5)6)
Any
H
L
X
H
X
X
H
X
X
H
X
Deselect
NOP. Continue previous operation.
1) to 6)
No Operation NOP. Continue previous operation.
1) to 6)
Idle
X
Any
—
Command
Otherwise
Allowed to
Bank m
1) to 6)
1) to7)
Row Activating,
Active, or
Precharging
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
H
H
L
Active
Select and activate row
Select column and start Read burst
Select column and start Write burst
—
H
H
L
Read
1) to 7)
1) to 6)
1) to 6)
1) to 7)
1) to 6)
1) to 6)
1) to8)
L
Write
H
H
L
L
Precharge
Active
Read (Auto
Precharge Disabled)
L
H
H
L
Select and activate row
Select column and start new Read burst
—
H
L
Read
H
H
L
Precharge
Active
Write (Auto
Precharge Disabled)
L
H
H
L
Select and activate row
Select column and start Read burst
Select column and start new Write burst
—
H
H
L
Read
1) to 7)
1) to 6)
1) to 6)
1) to 7),9)
1) to 7),9),10)
1) to 6)
1) to 6)
1) to 7),9)
1) to 7),9)
1) to 6)
L
Write
H
H
L
L
Precharge
Active
Read (With Auto
Precharge)
L
H
H
L
Select and activate row
Select column and start new Read burst
Select column and start Write burst
—
H
H
L
Read
L
Write
H
H
L
L
Precharge
Active
Write (With Auto
Precharge)
L
H
H
L
Select and activate row
Select column and start Read burst
Select column and start new Write burst
—
H
H
L
Read
L
Write
H
L
Precharge
1) This table applies when CKE n-1 was HIGH and CKE n is HIGH (see Table 12: Clock Enable (CKE) and after tXSNR/tXSRD has been met (if
the previous state was self refresh).
2) This table describes alternate bank operation, except where noted, i.e., the current state is for bank n and the commands shown are those
allowed to be issued to bank m (assuming that bank m is in such a state that the given command is allowable). Exceptions are covered in
the notes below.
3) Current state definitions: Idle: The bank has been precharged, and tRP has been met. Row Active: A row in the bank has been activated,
and tRCD has been met. No data bursts/accesses and no register accesses are in progress. Read: A Read burst has been initiated, with
Auto Precharge disabled, and has not yet terminated or been terminated. Write: A Write burst has been initiated, with Auto Precharge
disabled, and has not yet terminated or been terminated.
Read with Auto Precharge Enabled: See 10)
Write with Auto Precharge Enabled: See 10)
.
.
4) AUTO REFRESH and Mode Register Set commands may only be issued when all banks are idle.
5) A BURST TERMINATE command cannot be issued to another bank; it applies to the bank represented by the current state only.
6) All states and sequences not shown are illegal or reserved.
7) Reads or Writes listed in the Command/Action column include Reads or Writes with Auto Precharge enabled and Reads or Writes with
Auto Precharge disabled.
8) Requires appropriate DM masking.
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9) Concurrent Auto Precharge: This device supports “Concurrent Auto Precharge”. When a read with auto precharge or a write with auto
precharge is enabled any command may follow to the other banks as long as that command does not interrupt the read or write data
transfer and all other limitations apply (e.g. contention between READ data and WRITE data must be avoided). The minimum delay from
a read or write command with auto precharge enable, to a command to a different banks is summarized in Table 15.
10) A Write command may be applied after the completion of data output.
TABLE 15
Truth Table 5: Concurrent Auto Precharge
From Command
To Command (different bank)
Minimum Delay with Concurrent Auto Unit
Precharge Support
WRITE w/AP
Read or Read w/AP
Write to Write w/AP
Precharge or Activate
Read or Read w/AP
Write or Write w/AP
Precharge or Activate
1 + (BL/2) + tWTR
tCK
tCK
tCK
tCK
tCK
tCK
BL/2
1
Read w/AP
BL/2
CL (rounded up) + BL/2
1
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256 Mbit Double-Data-Rate SDRAM
4
Electrical Characteristics
This chapter lists the electrical characteristics.
4.1
Operating Conditions
This chapter contains the operating conditions tables.
TABLE 16
Absolute Maximum Ratings
Parameter
Symbol
Values
Min. Typ. Max.
Unit Note/ Test Condition
Voltage on I/O pins relative to VSS
Voltage on inputs relative to VSS
Voltage on VDD supply relative to VSS
Voltage on VDDQ supply relative to VSS
Operating temperature (ambient)
VIN, VOUT –0.5
—
—
—
—
—
—
—
—
1
V
DDQ + 0.5
V
V
V
V
VIN
–1
–1
–1
0
+3.6
+3.6
+3.6
+70
+85
+85
+150
—
VDD
VDDQ
TA
°C
°C
°C
°C
W
HYB
HYI
–40
–25
–55
—
HYE
Storage temperature (plastic)
TSTG
PD
Power dissipation (per SDRAM component)
Short circuit output current
IOUT
—
50
—
mA
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings
are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated
circuit.
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256 Mbit Double-Data-Rate SDRAM
TABLE 17
Input and Output Capacitances
Parameter
Symbol
Values
Typ.
Unit
Note/
Test Condition
Min.
Max.
Input Capacitance: CK, CK
CI1
1.5
2.0
—
—
—
—
—
—
—
2.5
3.0
0.25
2.5
3.0
0.5
pF
pF
pF
pF
pF
pF
P-TFBGA-60-121)
P-TSOPII-66 1)
1)
Delta Input Capacitance
CdI1
CI2
Input Capacitance: All other input-only pins
1.5
2.0
—
P-TFBGA-60-12 1)
P-TSOPII-66 1)
1)
Delta Input Capacitance: All other input-only CdIO
pins
Input/Output Capacitance: DQ, DQS, DM
CIO
3.5
—
4.5
pF
P-TFBGA-60-12
P-TFBGA-60-12 1)2)
4.0
—
—
—
5.0
0.5
pF
pF
P-TSOPII-66 1)2)
1)
Delta Input/Output Capacitance: DQ, DQS,
DM
CdIO
1) These values are not subject to production test - verified by design/characterization and are tested on a sample base only. VDDQ = VDD
2.5 V ± 0.2 V, f = 100 MHz, TA = 25 °C, VOUT(DC) = VDDQ/2, VOUT (Peak to Peak) 0.2 V. Unused pins are tied to ground.
=
2) DM inputs are grouped with I/O pins reflecting the fact that they are matched in loading to DQ and DQS to facilitate trace matching at the
board level.
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256 Mbit Double-Data-Rate SDRAM
TABLE 18
Electrical Characteristics and DC Operating Conditions
Parameter
Symbol
Values
Unit Note/Test Condition1)
Min.
Typ.
Max.
Device Supply Voltage
Device Supply Voltage
Output Supply Voltage
Output Supply Voltage
VDD
2.3
2.5
2.3
2.5
0
2.5
2.6
2.5
2.6
—
2.7
2.7
2.7
2.7
0
V
V
V
V
V
fCK ≤ 166 MHz
f
CK > 166 MHz2)
fCK ≤ 166 MHz3)
VDD
VDDQ
VDDQ
fCK > 166 MHz 2)3)
Supply Voltage, I/O Supply VSS, VSSQ
Voltage
4)
5)
Input Reference Voltage
VREF
VTT
0.49 × VDDQ 0.5 × VDDQ 0.51 × VDDQ
V
V
I/O Termination Voltage
(System)
VREF – 0.04
—
VREF + 0.04
6)
6)
6)
Input High (Logic1) Voltage VIH(DC)
Input Low (Logic0) Voltage VIL(DC)
VREF + 0.15
–0.3
—
—
—
VDDQ + 0.3
VREF – 0.15
VDDQ + 0.3
V
V
V
Input Voltage Level, CK and VIN(DC)
–0.3
CK Inputs
6)7)
8)
Input Differential Voltage,
CK and CK Inputs
VID(DC)
0.36
0.71
–2
—
—
—
—
—
—
VDDQ + 0.6
V
VI-Matching Pull-up Current VRatio
to Pull-down Current
1.4
2
—
µA
µA
Input Leakage Current
Output Leakage Current
II
Any input 0 V ≤ VIN ≤ VDD; All
other pins not under test = 0 V9)
IOZ
–5
5
DQs are disabled; 0 V ≤ VOUT
VDDQ
≤
9)
Output High Current, Normal IOH
Strength Driver
—
–16.2
—
mA VOUT = 1.95 V
mA VOUT = 0.35 V
Output Low Current, Normal IOL
16.2
Strength Driver
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V;
2) DDR400 conditions apply for all clock frequencies above 166 MHz
3) Under all conditions, VDDQ must be less than or equal to VDD
4) Peak to peak AC noise on VREF may not exceed ± 2% VREF.DC. VREF is also expected to track noise variations in VDDQ
5) TT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected to be set equal to VREF, and
must track variations in the DC level of VREF
6) Inputs are not recognized as valid until VREF stabilizes.
7) ID is the magnitude of the difference between the input level on CK and the input level on CK.
.
.
V
.
V
8) The ratio of the pull-up current to the pull-down current is specified for the same temperature and voltage, over the entire temperature and
voltage range, for device drain to source voltage from 0.25 to 1.0 V. For a given output, it represents the maximum difference between
pull-up and pull-down drivers due to process variation.
9) Values are shown per pin.
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256 Mbit Double-Data-Rate SDRAM
4.2
AC Characteristics
(Notes 1-5 apply to the following Tables; Electrical Characteristics and DC Operating Conditions, AC Operating Conditions, IDD
Specifications and Conditions, and Electrical Characteristics and AC Timing.)
Notes
1. All voltages referenced to VSS.
2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at nominal reference/supply voltage
levels, but the related specifications and device operation are guaranteed for the full voltage range specified.
3. Figure 3 represents the timing reference load used in defining the relevant timing parameters of the part. It is not intended
to be either a precise representation of the typical system environment nor a depiction of the actual load presented by a
production tester. System designers will use IBIS or other simulation tools to correlate the timing reference load to a system
environment. Manufacturers will correlate to their production test conditions (generally a coaxial transmission line
terminated at the tester electronics).
4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5 V in the test environment, but input timing is still referenced
to VREF (or to the crossing point for CK, CK), and parameter specifications are guaranteed for the specified AC input levels
under normal use conditions. The minimum slew rate for the input signals is 1 V/ns in the range between VIL(AC) and VIH(AC)
5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the receiver effectively switches as
a result of the signal crossing the AC input level, and remains in that state as long as the signal does not ring back above
(below) the DC input LOW (HIGH) level).
.
6. For System Characteristics like Setup & Holdtime Derating for Slew Rate, I/O Delta Rise/Fall Derating, DDR SDRAM Slew
Rate Standards, Overshoot & Undershoot specification and Clamp V-I characteristics see the latest JEDEC specification
for DDR components.
FIGURE 3
AC Output Load Circuit Diagram / Timing Reference Load
VTT
50 Ω
Output
Timing Reference Point
(
VOUT)
30 pF
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TABLE 19
AC Operating Conditions
Parameter
Symbol
Values
Unit Note1)/
Test
Min.
Max.
Condition
2)3)
Input High (Logic 1) Voltage, DQ, DQS and DM Signals
Input Low (Logic 0) Voltage, DQ, DQS and DM Signals
Input Differential Voltage, CK and CK Inputs
VIH(AC)
VIL(AC)
VID(AC)
VIX(AC)
V
REF + 0.31
—
V
V
V
V
2)3)
—
0.7
V
V
REF – 0.31
DDQ + 0.6
2)3)4)
2)3)5)
Input Closing Point Voltage, CK and CK Inputs
0.5 × VDDQ
–
0.5 × VDDQ+
0.2
0.2
1)
VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR200 - DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V (DDR400); 0 °C ≤ TA ≤ 70 °C
2) Input slew rate = 1 V/ns.
3) Inputs are not recognized as valid until VREF stabilizes.
4)
VID is the magnitude of the difference between the input level on CK and the input level on CK.
5) The value of VIX is expected to equal 0.5 × VDDQ of the transmitting device and must track variations in the DC level of the same.
TABLE 20
AC Timing - Absolute Specifications for PC3200 and PC2700
Parameter
Symbol –5
–6
Unit Note/ Test
Condition1)
DDR400B
DDR333
Min.
Max.
Min.
Max.
2)3)4)5)
DQ output access time from
CK/CK
tAC
–0.5
+0.5
–0.7
+0.7
ns
2)3)4)5)
CK high-level width
Clock cycle time
tCH
tCK
0.45
0.55
8
0.45
6
0.55
12
tCK
5
ns
ns
ns
tCK
tCK
CL = 3.0 3)4)5)
CL = 2.5 2)3)4)5)
CL = 2.0 2)3)4)5)
2)3)4)5)
6
12
6
12
7.5
12
7.5
0.45
12
CK low-level width
tCL
0.45
0.55
0.55
2)3)4)5)6)
Auto precharge write recovery + tDAL
(tWR/tCK)+(tRP/tCK)
precharge time
2)3)4)5)
DQ and DM input hold time
tDH
0.4
—
—
0.45
1.75
—
—
ns
ns
2)3)4)5)6)
DQ and DM input pulse width
(each input)
tDIPW
1.75
2)3)4)5)
2)3)4)5)
DQS output access time from
CK/CK
tDQSCK
–0.6
0.35
—
+0.6
—
–0.6
0.35
—
+0.6
—
ns
tCK
ns
tCK
ns
DQS input low (high) pulse width tDQSL,H
(write cycle)
DQS-DQ skew (DQS and
associated DQ signals)
Write command to 1st DQS
latching transition
tDQSQ
tDQSS
tDS
+0.40
1.25
—
+0.40
1.25
—
TFBGA 2)3)4)5)
2)3)4)5)
0.72
0.4
0.75
0.45
2)3)4)5)
DQ and DM input setup time
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256 Mbit Double-Data-Rate SDRAM
Parameter
Symbol –5
DDR400B
–6
Unit Note/ Test
Condition1)
DDR333
Min.
Max.
Min.
Max.
2)3)4)5)
2)3)4)5)
DQS falling edge hold time from tDSH
CK (write cycle)
0.2
—
0.2
—
tCK
tCK
DQS falling edge to CK setup time tDSS
0.2
—
0.2
—
(write cycle)
2)3)4)5)
Clock Half Period
tHP
tHZ
Min. (tCL, tCH
)
—
Min. (tCL, tCH
)
—
ns
ns
2)3)4)5)7)
Data-out high-impedance time
from CK/CK
—
+0.7
–0.7
+0.7
Address and control input hold
time
tIH
0.6
0.7
2.2
0.6
0.7
–0.7
2
—
0.75
0.8
2.2
0.75
0.8
–0.7
2
—
ns
ns
ns
ns
ns
ns
tCK
Fast slew rate
3)4)5)6)8)
—
—
Slow slew rate
3)4)5)6)8)
2)3)4)5)9)
Control and Addr. input pulse
width (each input)
tIPW
—
—
Address and control input setup tIS
time
—
—
Fast slew rate
3)4)5)6)8)
—
—
Slow slew rate
3)4)5)6)8)
2)3)4)5)7)
2)3)4)5)
2)3)4)5)
Data-out low-impedance time
from CK/CK
tLZ
+0.7
—
+0.7
—
Mode register set command cycle tMRD
time
DQ/DQS output hold time
Data hold skew factor
tQH
t
HP –tQHS
—
t
HP –tQHS
—
ns
ns
ns
tQHS
tRAP
tRAS
tRC
—
+0.50
—
—
+0.50
—
TFBGA 2)3)4)5)
2)3)4)5)
Active to Autoprecharge delay
Active to Precharge command
tRCD
40
tRCD
42
2)3)4)5)
2)3)4)5)
70E+3
—
70E+3 ns
Active to Active/Auto-refresh
command period
55
60
—
ns
2)3)4)5)
Active to Read or Write delay
tRCD
15
—
65
—
18
—
72
—
ns
µs
ns
2)3)4)5)10)
2)3)4)5)
Average Periodic Refresh Interval tREFI
7.8
—
7.8
—
Auto-refresh to Active/Auto-
refresh command period
tRFC
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
Precharge command period
Read preamble
tRP
15
—
18
—
ns
tCK
tCK
ns
tRPRE
tRPST
tRRD
0.9
0.40
10
1.1
0.60
—
0.9
0.40
12
1.1
0.60
—
Read postamble
Active bank A to Active bank B
command
2)3)4)5)
Write preamble
tWPRE
tWPRES
tWPST
tWR
0.25
0
—
0.25
0
—
tCK
ns
tCK
ns
2)3)4)5)11)
2)3)4)5)12)
2)3)4)5)
Write preamble setup time
Write postamble
—
—
0.40
15
0.60
—
0.40
15
0.60
—
Write recovery time
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256 Mbit Double-Data-Rate SDRAM
Parameter
Symbol –5
DDR400B
–6
Unit Note/ Test
Condition1)
DDR333
Min.
Max.
Min.
Max.
2)3)4)5)
2)3)4)5)
2)3)4)5)
Internal write to read command
delay
tWTR
2
—
1
—
tCK
ns
Exit self-refresh to non-read
command
tXSNR
75
—
75
—
Exit self-refresh to read command tXSRD
200
—
200
—
tCK
1) 0 °C ≤ TA ≤ 70 °C; VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V (DDR333); VDDQ = 2.6 V ± 0.1 V, VDD = +2.6 V ± 0.1 V (DDR400)
2) Input slew rate ≥ 1 V/ns for DDR400, DDR333
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals
other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT
6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual systemclock cycle time.
7) HZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific
voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns, measured
between VIH(ac) and VIL(ac)
.
t
.
9) These parameters guarantee device timing, but they are not necessarily tested on each device.
10) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
11) The specific requirement is that DQS be valid (HIGH,LOW, or some point on a valid transition) on or before this CK edge. A valid transition
is defined as monotonic and meeting the input slew rate specificationsof the device. When no writes were previously in progress on the
bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW at this time, depending
on tDQSS
.
12) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system
performance (bus turnaround) degrades accordingly.
TABLE 21
AC Timing - Absolute Specifications for PC2700
Parameter
Symbol –7
Unit
Note/Test
Condition1)
DDR266A
Min.
Max.
2)3)4)5)
2)3)4)5)
DQ output access time from CK/CK
CK high-level width
tAC
tCH
tCK
–0.75
+0.75
0.55
12
ns
tCK
ns
ns
ns
tCK
tCK
ns
ns
ns
tCK
0.45
Clock cycle time
7.5
CL = 3.0 3)4)5)
CL = 2.5 2)3)4)5)
CL = 2.0 2)3)4)5)
2)3)4)5)
7.5
12
7.5
12
CK low-level width
tCL
0.45
0.55
—
2)3)4)5)6)
2)3)4)5)
Auto precharge write recovery + precharge time tDAL
(tWR/tCK)+(tRP/tCK)
DQ and DM input hold time
tDH
0.5
—
2)3)4)5)6)
2)3)4)5)
DQ and DM input pulse width (each input)
DQS output access time from CK/CK
DQS input low (high) pulse width (write cycle)
tDIPW
tDQSCK
tDQSL,H
1.75
–0.75
0.35
—
+0.75
—
2)3)4)5)
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Parameter
Symbol –7
DDR266A
Unit
Note/Test
Condition1)
Min.
Max.
DQS-DQ skew (DQS and associated DQ signals) tDQSQ
—
+0.5
+0.5
1.25
—
ns
ns
tCK
ns
tCK
tCK
ns
ns
ns
FBGA 2)3)4)5)
TSOPII 2)3)4)5)
—
2)3)4)5)
Write command to 1st DQS latching transition
DQ and DM input setup time
tDQSS
tDS
0.75
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)7)
0.5
DQS falling edge hold time from CK (write cycle) tDSH
DQS falling edge to CK setup time (write cycle) tDSS
0.2
—
0.2
—
Clock Half Period
tHP
tHZ
tIH
Min. (tCL, tCH
–0.75
0.9
)
—
Data-out high-impedance time from CK/CK
Address and control input hold time
+0.75
—
Fast slew rate
3)4)5)6)8)
1.0
—
ns
Slow slew rate
3)4)5)6)8)
2)3)4)5)9)
Control and Addr. input pulse width (each input) tIPW
2.2
0.9
—
—
ns
ns
Address and control input setup time
tIS
Fast slew rate
3)4)5)6)8)
1.0
—
ns
Slow slew rate
3)4)5)6)8)
2)3)4)5)7)
2)3)4)5)
2)3)4)5)
Data-out low-impedance time from CK/CK
Mode register set command cycle time
DQ/DQS output hold time
tLZ
–0.75
2
+0.75
—
ns
tCK
ns
ns
ns
ns
ns
ns
ns
µs
ns
tMRD
tQH
t
HP – tQHS
—
Data hold skew factor
tQHS
—
0.75
0.75
—
FBGA 2)3)4)5)
TSOPII 2)3)4)5)
—
2)3)4)5)
Active to Read w/AP delay
tRAP
tRAS
tRC
tRCD
45
65
20
7.8
75
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)10)
2)3)4)5)
Active to Precharge command
Active to Active/Auto-refresh command period
Active to Read or Write delay
120E+3
—
tRCD
tREFI
tRFC
—
Average Periodic Refresh Interval
—
Auto-refresh to Active/Auto-refresh command
period
—
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)
2)3)4)5)11)
2)3)4)5)12)
2)3)4)5)
2)3)4)5)
Precharge command period
Read preamble
tRP
20
0.9
0.4
15
0.25
0
—
1.1
0.6
—
—
—
—
—
—
ns
tRPRE
tRPST
tRRD
tCK
tCK
ns
Read postamble
Active bank A to Active bank B command
Write preamble
tWPRE
tWPRES
tWPST
tWR
tCK
ns
Write preamble setup time
Write postamble
0.4
15
1
tCK
ns
Write recovery time
Internal write to read command delay
tWTR
tCK
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Parameter
Symbol –7
DDR266A
Unit
Note/Test
Condition1)
Min.
Max.
2)3)4)5)13)
2)3)4)5)
Exit self-refresh to non-read command
Exit self-refresh to read command
tXSNR
tXSRD
75
—
—
ns
200
tCK
1)
VDDQ = 2.5 V ± 0.2 V, VDD = +2.5 V ± 0.2 V ; 0 °C ≤ TA ≤ 70 °C
2) Input slew rate ≥1 V/ns
3) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross: the input reference level for signals
other than CK/CK, is VREF. CK/CK slew rate are ≥ 1.0 V/ns.
4) Inputs are not recognized as valid until VREF stabilizes.
5) The Output timing reference level, as measured at the timing reference point indicated in AC Characteristics (note 3) is VTT
6) For each of the terms, if not already an integer, round to the next highest integer. tCK is equal to the actual system clock cycle time.
7) HZ and tLZ transitions occur in the same access time windows as valid data transitions. These parameters are not referred to a specific
voltage level, but specify when the device is no longer driving (HZ), or begins driving (LZ).
8) Fast slew rate ≥ 1.0 V/ns , slow slew rate ≥ 0.5 V/ns and < 1 V/ns for command/address and CK & CK slew rate > 1.0 V/ns, measured
between VIH(ac) and VIL(ac)
.
t
.
9) These parameters guarantee device timing, but they are not necessarily tested on each device.
10) A maximum of eight Autorefresh commands can be posted to any given DDR SDRAM device.
11) The specific requirement is that DQS be valid (HIGH, LOW, or some point on a valid transition) on or before this CK edge. A valid transition
is defined as monotonic and meeting the input slew rate specifications of the device. When no writes were previously in progress on the
bus, DQS will be transitioning from Hi-Z to logic LOW. If a previous write was in progress, DQS could be HIGH, LOW, or transitioning from
HIGH to LOW at this time, depending on tDQSS
.
12) The maximum limit for this parameter is not a device limit. The device operates with a greater value for this parameter, but system
performance (bus turnaround) degrades accordingly.
13) In all circumstances, tXSNR can be satisfied using tXSNR = tRFC,min + 1 × tCK
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 22
IDD Conditions
Parameter
Symbol
Operating Current: one bank; active/ precharge; tRC = tRCMIN; tCK = tCKMIN
;
IDD0
DQ, DM, and DQS inputs changing once per clock cycle; address and control inputs changing once every two
clock cycles.
Operating Current: one bank; active/read/precharge; Burst = 4;
IDD1
Refer to the following page for detailed test conditions.
Precharge Power-Down Standby Current: all banks idle; power-down mode; CKE ≤ VILMAX; tCK = tCKMIN
IDD2P
IDD2F
Precharge Floating Standby Current: CS ≥ VIHMIN, all banks idle;
CKE ≥ VIHMIN; tCK = tCKMIN, address and other control inputs changing once per clock cycle, VIN = VREF for DQ, DQS
and DM.
Precharge Quiet Standby Current:CS ≥ VIHMIN, all banks idle; CKE ≥ VIHMIN; tCK = tCKMIN, address and other
control inputs stable at ≥ VIHMIN or ≤ VILMAX; VIN = VREF for DQ, DQS and DM.
IDD2Q
IDD3P
Active Power-Down Standby Current: one bank active; power-down mode;
CKE ≤ VILMAX; tCK = tCKMIN; VIN = VREF for DQ, DQS and DM.
Active Standby Current: one bank active; CS ≥ VIHMIN; CKE ≥ VIHMIN; tRC = tRASMAX; tCK = tCKMIN; DQ, DM and DQS IDD3N
inputs changing twice per clock cycle; address and control inputs changing once per clock cycle.
Operating Current: one bank active; Burst = 2; reads; continuous burst; address and control inputs changing
once per clock cycle; 50 % of data outputs changing on every clock edge; CL = 2 for DDR200 and DDR266A,
CL = 3 for DDR333; tCK = tCKMIN; IOUT = 0 mA
IDD4R
Operating Current: one bank active; Burst = 2; writes; continuous burst; address and control inputs changing
once per clock cycle; 50 % of data outputs changing on every clock edge; CL = 2 for DDR200 and DDR266A,
CL = 3 for DDR333; tCK = tCKMIN
IDD4W
Auto-Refresh Current: tRC = tRFCMIN, burst refresh
IDD5
IDD6
IDD7
Self-Refresh Current: CKE ≤ 0.2 V; external clock on; tCK = tCKMIN
Operating Current: four bank; four bank interleaving with BL = 4; Refer to the following page for detailed test
conditions.
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
TABLE 23
IDD Specification
Symbol –5
DDR400B
–6
–7
Unit Note/Test Condition1)
DDR333
Typ.
DDR266A
Typ.
Typ.
Max.
Max.
Max.
IDD0
IDD1
70
75
90
90
60
65
70
80
4
75
75
50
55
65
70
3
65
65
75
85
4
mA ×4/×82)3)
mA ×16 3)
mA ×4/×8 3)
mA ×16 3)
80
100
110
5
85
95
95
3)
IDD2P
IDD2F
IDD2Q
IDD3P
IDD3N
4
5
mA
3)
30
36
25
17
11
32
36
70
85
75
90
120
1.4
—
30
20
15
9
24
21
13
36
40
70
85
75
90
140
3.0
mA
3)
20
28
24
mA
3)
13
18
15
mA
3)
38
45
38
28
30
60
70
65
75
100
1.4
—
mA
43
54
45
mA ×16 3)
mA ×4/×8 3)
mA ×16 3)
mA ×4/×8 3)
mA ×16 3)
IDD4R
IDD4W
85
100
120
105
130
190
3.0
—
85
100
90
100
90
100
140
1.4
—
110
160
3.0
1.5
215
215
3)
IDD5
IDD6
mA
4)
mA
—
mA Low power5)
mA ×4/×8 3)
mA ×16 3)
IDD7
210
210
250
250
180
180
140
140
170
170
1) Test conditions for typical values: VDD = 2.5 V (DDR333), VDD = 2.6 V (DDR400), TA = 25 °C, test conditions for maximum values:
DD = 2.7 V, TA = 10 °C
DD specifications are tested after the device is properly initialized and measured at 133 MHz for DDR266, 166 MHz for DDR333, and
200 MHz for DDR400.
V
2)
I
3) Input slew rate = 1 V/ns.
4) Enables on-chip refresh and address counters.
5) Low power available on request
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
5
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
•
TABLE 24
TFBGA Common Package Properties (non-green/green)
Description
Size
Units
Ball Size
0.450
0.500
0.400
mm
mm
mm
Recommended Landing Pad
Recommended Solder Mask
Rev. 2.3, 2007-03
33
03062006-8CCM-VPUW
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Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
FIGURE 4
Package Outline of P-TFBGA-60-12 (non-green/green)
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Rev. 2.3, 2007-03
34
03062006-8CCM-VPUW
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Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
FIGURE 5
Package Outline of P-TSOPII-66-1 (non-green/green)
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Rev. 2.3, 2007-03
35
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Pin Configuration P-TFBGA-60 Top View, see the balls throught the package . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin Configuration P-TSOPII-66-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AC Output Load Circuit Diagram / Timing Reference Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Package Outline of P-TFBGA-60-12 (non-green/green). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Package Outline of P-TSOPII-66-1 (non-green/green). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Rev. 2.3, 2007-03
36
03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Performance of –5, –6 and –7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering Information for Lead-Free Products (RoHS Compliant). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ordering Information for Lead-Containing Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Configuration of DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations for Pin Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations for Buffer Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Mode Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Burst Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Extended Mode Regsiter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Truth Table 1a: Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Truth Table 1b: DM Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Truth Table 2: Clock Enable (CKE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Truth Table 3: Current State Bank n - Command to Bank n (same bank) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Truth Table 4: Current State Bank n - Command to Bank m (different bank). . . . . . . . . . . . . . . . . . . . . . . . . . 20
Truth Table 5: Concurrent Auto Precharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Input and Output Capacitances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Electrical Characteristics and DC Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
AC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC Timing - Absolute Specifications for PC3200 and PC2700. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
AC Timing - Absolute Specifications for PC2700 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
Table 16
Table 17
Table 18
Table 19
Table 20
Table 21
Table 22
Table 23
Table 24
I
DD Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
IDD Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TFBGA Common Package Properties (non-green/green) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Rev. 2.3, 2007-03
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03062006-8CCM-VPUW
Internet Data Sheet
HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
Table of Contents
1
1.1
1.2
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
3
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4
4.1
4.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Rev. 2.3, 2007-03
38
03062006-8CCM-VPUW
Internet Data Sheet
Edition 2007-03
Published by Qimonda AG
Gustav-Heinemann-Ring 212
D-81739 München, Germany
© Qimonda AG 2007.
All Rights Reserved.
Legal Disclaimer
The information given in this Internet Data Sheet shall in no event be regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Qimonda hereby disclaims any and all warranties and liabilities of any kind,
including without limitation warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Qimonda Office.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please
contact your nearest Qimonda Office.
Qimonda Components may only be used in life-support devices or systems with the express written approval of Qimonda, if a
failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect
the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human
body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
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