QPA9119 [QORVO]
½ W High Linearity Amplifier;型号: | QPA9119 |
厂家: | Qorvo |
描述: | ½ W High Linearity Amplifier |
文件: | 总14页 (文件大小:999K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
QPA9119
½ W High Linearity Amplifier
®
Product Overview
The QPA9119 is a high linearity driver amplifier in a low-
cost, RoHS compliant, surface mount package. This
InGaP/GaAs HBT delivers high performance across a
broad range of frequencies with +44ꢁdBm OIP3 and
+27.2ꢁdBm P1dB while only consuming 130ꢁmA quiescent
current. All devices are 100% RF and DC tested.
16 Pad 3ꢀxꢀ3ꢀmm QFN Package
The QPA9119 incorporates on-chip features that
differentiate it from other products in the market. The
amplifier integrates an on-chip DC over-voltage and RF
over-drive protection. This protects the amplifier from
electrical DC voltage surges and high input RF input power
levels that may occur in a system. On-chip ESD protection
allows the amplifier to have a very robust Class 1C HBM
ESD rating.
Key Features
• 400ꢁ–ꢁ4200ꢁMHz
• +27.2 dBm P1dB
• +44ꢁdBm Output IP3
• 17ꢁdB Gain at 2140ꢁMHz
• +5ꢁV Single Supply, ICQ =130ꢁmA
• Internal RF Overdrive Protection
• Internal DC Overvoltage Protection
• On Chip ESD Protection
• 3ꢁxꢁ3ꢁmm QFN Package
The QPA9119 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity, medium power,
and high efficiency are required. The device an excellent
candidate for transceiver line cards in current and next
generation multi-carrier 3G / 4G base stations.
Applications
Functional Block Diagram
• Repeaters / DAS
• Mobile Infrastructure
• Defense Communications
• General Purpose Wireless
Pin 1 Reference Mark
5
6
7
8
N/C
RF In
RF In
N/C
1
2
3
4
12 N/C
BIAS
11 RF Out
10 RF Out
9
N/C
5
6
7
8
Ordering Information
Backside Paddle - RF/DC GND
Top View
Part No.
Description
QPA9119
2,500 pieces on a 7” reel (standard)
869ꢁ–ꢁ960ꢀMHz Evaluation Board
2110ꢁ–2170ꢀMHz Evaluation Board
QPA9119ꢁ-ꢁPCB900
QPA9119ꢁ-ꢁPCB2140
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Rating
−65 to +150ꢁ°C
+27 dBm
+8 V
Parameter
Device Voltage (VCC
TCASE
Min
+4.75
−40
Typ
Max Units
Storage Temperature
RF Input Power, CW, 50ꢁΩ, T=25ꢁ°C
)
+5
+5.25
+105
+175
V
°C
°C
Device Voltage (VCC
)
Tj for >106 hours MTTF
Electrical specifications are measured at specified test conditions.
Specifications are not guaranteed over all recommended operating
conditions.
Dissipated Power (PDISS)
1.7 W
Exceeding any one or a combination of the Absolute Maximum Rating
conditions may cause permanent damage to the device. Extended
application of Absolute Maximum Rating conditions to the device may
reduce device reliability.
Electrical Specifications
Parameter
Conditionsꢀ(1)
Min
Typ
Max
Units
MHz
MHz
dB
Operational Frequency Range
Test Frequency
Gain
400
4200
2140
17.1
14
15.5
18.5
Input Return Loss
Output Return Loss
Output P1dB
dB
11
dB
+26.4
+41.0
+27.2
+43.8
+18.1
4.8
dBm
dBm
dBm
dB
Output IP3
LTE Channel Powerꢁ(2)
Poutꢁ=ꢁ+9ꢁdBm/tone, ∆fꢁ=ꢁ1ꢁMHz
−50ꢁdBc ACLR See Note 2
Noise Figure
Reference Bias current
Quiescent Current, ICQ
Total Current
Pin 15
7
mA
Pins 10, 11
115
130
137
155
mA
mA
Thermal Resistance, θjc
Junction to case
50.3
°C/W
Notes:
1. Test conditions unless otherwise noted: VCCꢁ=ꢁVPD = +5.0ꢁV, Tempꢁ=ꢁ+25ꢁ°C, 50ꢁΩ system.
2. ACLR test set-up: LTE, 20 MHz E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
S-Parameters
Freq (GHz) S11 (dB)
S11 (ang)
-174.41
-174.19
-152.53
-162.11
-177.80
174.16
168.52
163.75
159.42
155.28
151.20
147.13
142.97
138.79
134.61
130.44
126.28
122.34
118.66
115.17
111.69
109.84
107.48
105.44
103.60
102.20
100.98
100.03
99.00
S21 (dB)
27.28
23.31
17.32
20.48
19.46
17.80
16.25
14.88
13.67
12.59
11.59
10.68
9.83
S21 (ang)
124.83
125.16
131.27
144.17
120.55
105.64
94.63
85.61
77.74
70.57
63.86
57.49
51.35
45.42
39.65
34.07
28.70
23.53
18.51
13.69
9.01
S12 (dB)
-24.82
-36.26
-40.20
-33.75
-32.49
-32.11
-31.86
-31.62
-31.39
-31.16
-30.95
-30.74
-30.56
-30.40
-30.26
-30.15
-30.06
-30.00
-29.95
-29.93
-29.91
-29.84
-29.86
-29.88
-29.91
-29.93
-29.95
-29.97
-29.98
-29.98
-29.96
-29.92
S12 (ang)
87.65
0.46
S22 (dB)
-4.37
-2.80
-2.05
-4.17
-4.88
-4.89
-4.81
-4.73
-4.66
-4.57
-4.48
-4.38
-4.26
-4.15
-4.03
-3.89
-3.75
-3.63
-3.52
-3.38
-3.25
-3.09
-2.99
-2.88
-2.76
-2.68
-2.61
-2.54
-2.47
-2.41
-2.36
-2.32
S22 (ang)
-172.48
-159.87
-177.15
166.09
167.74
167.06
164.86
162.09
158.97
155.65
152.21
148.80
145.35
142.00
138.91
136.04
133.19
130.49
128.09
125.84
123.58
118.66
116.78
115.15
113.43
111.71
110.10
108.53
106.94
105.20
103.39
101.42
0.05
0.10
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
2.20
2.40
2.60
2.80
3.00
3.20
3.40
3.60
3.80
4.00
4.20
4.40
4.60
4.80
5.00
5.20
5.40
5.60
5.80
6.00
-6.62
-6.11
-7.34
-0.95
-0.67
-0.81
-0.92
-1.00
-1.06
-1.10
-1.12
-1.13
-1.13
-1.13
-1.12
-1.09
-1.05
-1.03
-1.00
-0.95
-0.91
-0.89
-0.86
-0.82
-0.79
-0.77
-0.76
-0.75
-0.74
-0.74
-0.75
-0.76
9.27
33.77
22.94
18.72
16.69
15.38
14.42
13.48
12.50
11.44
10.16
8.87
9.03
8.25
7.52
7.50
5.99
6.77
4.49
6.07
3.00
5.38
1.37
4.72
-0.17
-1.72
-3.69
-5.00
-6.15
-7.26
-8.27
-9.25
-10.10
-11.00
-11.73
-12.52
-13.30
4.09
3.55
2.95
4.09
-0.05
2.38
-3.91
1.84
-7.62
1.34
-11.12
-14.54
-17.85
-21.17
-24.43
-27.76
-31.12
0.87
0.44
0.04
98.11
-0.33
-0.67
-0.99
97.20
96.42
Test Conditions: VCC=+5 V, ICQ=130ꢁmA (typ.), Temp.=+25ꢁ°C, unmatched 50 Ohm system, reference plane at device leads
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
869–960 MHz Evaluation Board ꢀ–ꢀ QPA9119-PCB900
J3 Vcc
J5 Vpd
C8
C4
J5
R2
J3
R2
J4 GND
C4
0
J4
DNI
1 uF
C3
R1
380
C3
L2
C2
100 pF
L1
C7
U1
C8
R4
DNI
R4
33 nH
15
Q1
C8
C7
J1
J2
2,3
10,11
L2
2.2 nH
RF
Input
RF
Output
2.7
0402
100 pF
10 pF
C6
C5
1,4,5,6,7,8,9,
12,13,14,16
2.7 pF
5.6 pF
Notes:
1. See Evaluation Board PCB Information for material and stack up.
2. Critical component placement locations:
•
•
•
•
Distance from U1 (left edge) to R4 (right edge): 25 mils (1.2 deg. at 920 MHz)
Distance from U1 (left edge) to C5 (right edge): 360 mils (17 deg. at 920 MHz)
Distance from U1 (right edge) to L2 (left edge): 120 mils (5.7 deg. at 920 MHz)
Distance from U1 (right edge) to C6 (left edge): 347 mils (16.5 deg. at 920 MHz)
Bill of Material ꢀ–ꢀ QPA9119-PCB900
Reference Des.
n/a
U1
Value Description
Manuf.
Qorvo
Part Number
n/a
n/a
Printed Circuit Board
QPA9119 Amplifier, QFN pkg.
Resistor, Chip, 0603
Qorvo
QPA9119
R2
0 Ω
various
various
various
Toko
R4
2.7 Ω
380 Ω
2.2 nH
33 nH
10 pF
2.7 pF
Resistor, Chip, 0402, 1%, 1/16W
Resistor, Chip, 0603, 1%, 1/16W
Inductor, 0603, +/-0.3 nH
R1
L2
LL1608-FSL2N2S
0805CS-330XJLB
L1
Inductor, 0805, 5%, Coilcraft CS Series
Cap., Chip, 0603, 5%, 50V. NPO/COG
Coilcraft
various
various
various
various
various
C7
C6
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG NPO/COG
C2, C8
C4
100 pF Cap., Chip, 0603, 5%, 50V, NPO/COG
1.0 uF
5.6 pF
Cap., Chip, 0603, 10%, 10V, X5R
C5
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
Typical Performanceꢀ –ꢀ QPA9119-PCB900
Parameter
Frequency
Conditionsꢀ(1)
Typical Value
Units
MHz
dB
869
21.1
10
920
21.2
13
960
21.1
17
Gain
Input Return Loss
Output Return Loss
Output P1dB
OIP3
LTE Channel Powerꢁ(2)
Noise Figure
Notes:
dB
13
12
11
dB
+28.0
+43.5
+18.3
6.8
+28.2
+43.8
+18.7
6.7
+28.3
+43.5
+18.7
6.7
dBm
dBm
dBm
dB
Pout= +21 dBm/tone, Δf=1 MHz
−50 dBc ACLR
1. Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
2. ACLR Test set-up: LTE, 20 MHz E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Performance Plots – QPA9119-PCB900
Test conditions unless otherwise noted: VCC = VPD = +5ꢁV, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
Gain vs. Frequency
Input Return Loss vs. Frequency
Output Return Loss vs. Frequency
0
-5
25
23
21
19
17
15
0
-5
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
-10
-15
-20
-10
-15
-20
860
10
8
880
900
920
940
960
860
880
900
920
940
960
860
880
900
920
940
960
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
OIP3 vs Pout/tone
OIP3 vs Pout/tone
P1dB vs Frequency
55
50
45
40
35
30
55
50
45
40
35
30
30
29
28
27
26
25
Temp.=+25°C
F = 920 MHz
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
869 MHz
920 MHz
960 MHz
10
12
14
16
18
20
22
24
20
20
12
14
16
18
20
22
24
870 880 890 900 910 920 930 940 950 960
Frequency (MHz)
Pout/tone (dBm)
Pout/tone (dBm)
ACLR vs Pout
ACLR vs Pout
P1dB vs Frequency
-40
-45
-50
-55
-60
-65
-40
-45
-50
-55
-60
-65
30
29
28
27
26
25
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW F = 920 MHz
Temp.=+25°C
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW
F = 920 MHz
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
869 MHz
920 MHz
960 MHz
8
10
12
14
16
18
10
12
14
16
18
20
870 880 890 900 910 920 930 940 950 960
Frequency (MHz)
Pout (dBm)
Pout (dBm)
ACLR vs Pout
ACLR vs Pout
Icc vs. Pout
-40
-45
-50
-55
-60
-65
-40
-45
-50
-55
-60
-65
400
350
300
250
200
150
100
50
Temp.=+25°C
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 920 MHz
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 920 MHz
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
869 MHz
920 MHz
960 MHz
0
8
10
12
14
16
18
8
10
12
14
16
18
20
12
14
16
18
20
22
24
26
28
30
Pout (dBm)
Pout (dBm)
Pout (dBm)
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
2110–2170 MHz Evaluation Board ꢀ–ꢀ QPA9119-PCB2140
J3 Vcc
J5 Vpd
C8
J5
R2
J3
C4
R2
J4
0
DNI
1 uF
C3
C4
C3
R1
380
C2
R3
C7
U1
C8
R4
100 pF
C8
L1
18 nH
DNI
R4
15
C7
J1
J2
2,3
Q1
10,11
RF
Input
RF
Output
1.5
0402
3.3 pF
1.5 pF
C5
C6
1,4,5,6,7,8,9,
12,13,14,16
Notes:
1. See Evaluation Board PCB Information for material and stack up.
1.8 pF
0.8 pF
J4 GND
2. The recommended component values are dependent upon the frequency of operation.
3. All components are of 0603 size unless stated on the schematic.
4. Critical component placement locations:
•
•
•
•
•
Distance from U1 (left edge) to R4 (right edge): 32 mils (3.6 deg. at 2140 MHz)
Distance from U1 (left edge) to C5 (right edge): 70 mils (7.8 deg. at 2140 MHz)
Distance from U1 (left edge) to C7 (right edge): 152 mils (16.8 deg. at 2140 MHz)
Distance from U1 (right edge) to C8 (left edge): 380 mils (42.0 deg. at 2140 MHz)
Distance from U1 (right edge) to C6 (left edge): 305 mils (33.7 deg. at 2140 MHz)
Bill of Material QPA9119−PCB2140
Reference Des.
Value
n/a
Description
Printed Circuit Board
Manuf.
Qorvo
Qorvo
Part Number
n/a
U1
R2
R4
R1
C3
L1
n/a
QPA9119 Amplifier, QFN pkg.
Resistor, Chip, 0603
QPA9119
0 Ω
various
various
various
various
1.5ꢀΩ
380ꢀΩ
100 pF
18 nH
1.5 pF
0.8 pF
3.3 pF
1.0 uF
1.8 pF
Resistor, Chip, 0402, 1%, 1/16W
Resistor, Chip, 0603, 1%, 1/16W
Cap., Chip, 0603, 5%, 50V, NPO/COG
Inductor, 0805, 5%, Coilcraft CS Series
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG 5%,
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
Coilcraft
various
various
various
various
various
0805CS-180XJLB
C7
C6
C8
C4
C5
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
Cap., Chip, 0603, 10%, 10V, X5R
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
Typical Performanceꢀ –ꢀ QPA9119-PCB2140
Units
Parameter
Frequency
Conditions
Typical Value
2110
17.1
13
2140
17.1
14
2170
17.0
14
MHz
dB
Gain
Input Return Loss
Output Return Loss
Output P1dB
OIP3
LTE Channel Power(2)
Noise Figure
Notes:
dB
12
11
11
dB
+27.4
+43.5
+18.2
4.8
+27.2
+43.8
+18.1
4.8
+27.1
+43.6
+18.4
4.8
dBm
dBm
dBm
dB
Pout= +13 dBm/tone, Δf=1 MHz
−50 dBc ACLR
1. Test Conditions: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
2. ACLR Test set-up: LTE, 1-CH E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
Data Sheet, April 26, 2021 | Subject to change without notice
6 of 14
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QPA9119
®
½ W High Linearity Amplifier
Performance Plots – QPA9119-PCB2140
Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
Gain vs. Frequency
Input Return Loss vs. Frequency
Output Return Loss vs. Frequency
19
18
17
16
15
14
0
0
+105°C
+25°C
−40°C
-5
-5
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
-10
-15
-20
-10
-15
-20
2110
2120
2130
2140
2150
2160
2170
2110
2120
2130
2140
2150
2160
2170
2110
2120
2130
2140
2150
2160
2170
2170
15
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
OIP3 vs Pout/tone
OIP3 vs Pout/tone
P1dB vs Frequency
50
45
40
35
30
25
50
30
29
28
27
26
25
Temp.=+25°C
45
40
35
30
25
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
2110 MHz
F = 2140 MHz
2140 MHz
2170 MHz
10
13
16
19
22
10
13
16
19
22
2110
2120
2130
2140
2150
2160
Pout/tone (dBm)
Pout/tone (dBm)
Frequency (MHz)
ACLR vs Pout
ACLR vs Pout
Pout vs. Pin
-40
-45
-50
-55
-60
-65
-40
30
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW F = 2140 MHz
Temp.=+25°C
28
26
24
22
20
18
16
14
12
10
-45
-50
-55
-60
-65
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW
F = 2140 MHz
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
2110 MHz
2140 MHz
2170 MHz
8
10
12
14
16
18
20
8
10
12
14
16
18
20
-5
-3
-1
1
3
5
7
9
11
13
Pout (dBm)
Pout (dBm)
Pin (dBm)
ACLR vs Pout
ACLR vs Pout
Icc vs. Pout
-40
-45
-50
-55
-60
-65
-40
-45
-50
-55
-60
-65
400
350
300
250
200
150
100
50
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
Temp.=+25°C
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 2140 MHz
F = 2140 MHz
+105°C
+25°C
−40°C
+105°C
+25°C
−40°C
2110 MHz
2140 MHz
2170 MHz
0
8
10
12
14
16
18
20
8
10
12
14
16
18
20
12
14
16
18
20
22
24
26
28
30
Pout (dBm)
Pout (dBm)
Pout (dBm)
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
2300ꢀ–ꢀ2700ꢀMHz Reference Design
J3 Vcc
J5 Vpd
C8
C4
R2
J5
R2
J3
C4
0
1 uF
C3
DNI
J4
R1
380
C2
C3
22 pF
C8
L1
18 nH
J2
J1
R3
C7
U1
C8
R4
DNI
R4
15
C7
J1
J2
2,3
Q1
10,11
RF
Input
RF
Output
2.2
0402
39 pF
1.2 pF
C5
C6
1,4,5,6,7,8,9,
12,13,14,16
1.2 pF
0.8 pF
J4 GND
Notes:
1. See Evaluation Board PCB Information for material and stack up.
2. Critical component placement locations:
•
•
•
•
Distance between U1 (left edge) to R4 (right edge): 15 mil
Distance between U1 (left edge) to C5 (right edge): 80 mil
Distance between U1 (left edge) to C7 (right edge): 130 mil
Distance between U1 (right edge) to C6 (left edge): 130 mil
Bill of Material ꢀ–ꢀ 2300ꢀ–ꢀ2700 MHz Reference Design
Ref. Des.
n/a
Value
n/a
Description
Printed Circuit Board
Manuf.
Qorvo
Part Number
U1
n/a
0.5 W High Linearity Amplifier
Res., Chip, 0603, +/-1%, 1/10W
Res., Chip, 0603
Qorvo
QPA9119
R1
380 Ω
0 Ω
various
various
various
various
various
various
various
various
Coilcraft
R2, R3
C5, C7
C6
1.2 pF
0.8 pF
39 pF
22 pF
2.2 Ω
1.0 uF
18 nH
CAP, 0603, +/-0.1pF. 200V. NPO/COG
CAP, 0603, +/-0.1pF. 200V. NPO/COG
Cap., Chip, 0603, +/-5%. 50V NPO/COG
Cap., Chip, 0603, +/-5%. 50V NPO/COG
Res., Chip, 0402, +/-1%, 1/10W
CAP, 0603, 10%, X5R , 10V
Inductor, 0805, 5%, Coilcraft CS series
C8
C3
R4
C4
L1
0805CS-180XJLB
Typical Performance 2300 – 2700 MHz Reference Design
Parameter
Frequency
Conditions
Typical Value
Units
MHz
dB
2300
14.1
7.6
2400
2500
14.3
13
2600
2700
13.7
11
Gain
14.3
10
14.1
13
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
dB
9.1
8.8
8.6
8.3
8.2
dB
+27.3
+46.1
+27.6
+44.5
+27.6
+44.1
130
+27.3
+44.5
+27.1
+44.9
dBm
dBm
mA
Pout= +15 dBm/tone, f= 1 MHz
Quiescent Collector Current, ICQ
Notes:
1. Test Conditions: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Performance Plots 2300 – 2700 MHz Reference Design
Test Conditions: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7ꢀmA , Temp.=+25ꢀ°C
Gain vs. Frequency
Input Return Loss vs. Frequency
Output Return Loss vs. Frequency
16
15
14
13
12
11
0
0
-5
Temp.=+25°C
Temp.=+25°C
Temp.=+25°C
-5
-10
-15
-10
-15
2300
2400
2500
2600
2700
2300
2400
2500
2600
2700
2300
2400
2500
2600
2700
Frequency (MHz)
Frequency (MHz)
Frequency (MHz)
OIP3 vs. Pout/tone
P1dB vs. Frequency
50
45
40
29
28
27
26
25
24
TQP7M9102
Temp.=+25°C
Temp.=+25°C
F = 2.3 GHz
F = 2.4 GHz
F = 2.5 GHz
F = 2.6 GHz
F = 2.7 GHz
35
9
10
11
12
13
14
15
16
17
18
19
2.3
2.4
2.5
2.6
2.7
Pout/Tone (dBm)
Frequency (GHz)
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Pad Configuration and Description
Pin 1 Reference Mark
NC
I Ref NC
NC
13
16
15
14
NC
NC
RF In
RF In
NC
1
2
3
4
12
11
10
9
Bias
RF Out
RF Out
NC
5
6
7
8
NC
NC
NC
NC
Backside Paddle - RF/DC GND
Top View
Pad No.
Label
NC
Description
1, 4, 5, 6, 7, 8, 9,
12, 13, 14, 16
No electrical connection. Land pads should be provided for PCB mounting integrity.
2, 3
RF IN
RF input. External DC Block required. Requires conjugate match for optimal performance.
10, 11
15
RF OUTꢁ/ꢁVCC RF output. External DC Block and bias voltage required. Requires matching.
I REF
Sets the bias current for the amp. Also can be used to power down device.
RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See
PCB Mounting Pattern for suggested footprint.
Backside Paddle GND
Evaluation Board PCB Information
PC Board Layout
PCB 1130505 Material (stackup)
1 oz. Cu top layer
Nelco N-4000-13
0.014"
1 oz. Cu inner layer
0.062" ± 0.006"
Finished Board
Thickness
Core
1 oz. Cu inner layer
1 oz. Cu bottom layer
Nelco N-4000-13
0.014"
50 ohm line dimensions: width = 0.029”, spacing = 0.029”
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Package Marking and Dimensions
Marking: Part Number – 9119
Date Codeꢁ–ꢁYYWW
Lot Code – AaXXXX
9119
YYWW
AaXXXX
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
3. Contact plating: NiPdAu
PCB Mounting Pattern
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm
(#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Tape and Reel Information – Carrier and Cover Tape Dimensions
Feature
Measure
Symbol
Size (in)
0.126
0.126
0.039
0.157
0.079
0.217
0.362
0.472
Size (mm)
3.20
Length
A0
B0
K0
P1
P2
F
Width
3.20
Cavity
Depth
1.00
Pitch
4.00
Cavity to Perforation - Length Direction
2.00
Centerline Distance
Cavity to Perforation - Width Direction
5.50
Cover Tape
Carrier Tape
Width
Width
C
9.20
W
12.00
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Tape and Reel Information – Reel Dimensions
Standard T/R size = 2500 pieces on a 7” reel.
Feature
Measure
Symbol
Size (in)
6.969
0.717
0.504
2.283
0.512
0.079
0.795
Size (mm)
177.0
18.2
Diameter
A
W2
W1
N
Flange
Thickness
Space Between Flange
Outer Diameter
Arbor Hole Diameter
Key Slit Width
Key Slit Diameter
12.8
58.0
C
13.0
Hub
B
2.0
D
20.2
Tape and Reel Information – Tape Length and Label Placement
Notes:
1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A.
2. Labels are placed on the flange opposite the sprockets in the carrier tape.
Data Sheet, April 26, 2021 | Subject to change without notice
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QPA9119
®
½ W High Linearity Amplifier
Handling Precautions
Parameter
Rating
Standard
ESDꢁ–ꢁHuman Body Model (HBM)
Class 1C
ESDAꢀ/ꢀJEDEC JS-001-2012
JEDEC JESD22-C101F
IPC/JEDEC J-STD-020
Caution!
ESD-Sensitive Device
ESDꢁ–ꢁCharged Device Model (CDM) Class C3
MSLꢁ–ꢁMoisture Sensitivity Level Level 1
8
Solderability
Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes.
Solder profiles available upon request.
Contact plating: NiPdAu
RoHS Compliance
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment) as amended by Directive 2015/863/EU.
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
Pb
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.qorvo.com
Tel: 1-844-890-8163
Email: customer.support@qorvo.com
Important Notice
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
Copyright 2020 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc.
Data Sheet, April 26, 2021 | Subject to change without notice
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