QPF4006 [QORVO]
37 â 40.5 GHz GaN Front End Module;
| 型号： | QPF4006 |
| 厂家： | 
Qorvo |
| 描述： | 37 â 40.5 GHz GaN Front End Module |
| 文件： | 总23页 (文件大小：1040K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Product Description
The QPF4006 is a multi-function Gallium Nitride MMIC
front-end module targeted for 39 GHz phased array 5G
base stations and terminals. The device combines a low
noise high linearity LNA, a low insertion-loss high-isolation
TR switch, and a high-gain high-efficiency multi-stage PA.
The QPF4006 operates from 37 GHz to 40.5 GHz range.
The receive path (LNA+TR SW) is designed to provide
18dB of gain and a noise figure less than 4.5 dB. The
transmit path (PA+SW) provides 23 dB of small signal gain
and a saturated output power of 2 W.
The compact 4.5 mm x 4.0 mm surface mount package
configuration is designed to meet the tight lattice spacing
requirements for phased array applications.
The QPF4006 is fabricated on Qorvo’s 0.15um GaN on
SiC process. It is housed in an air-cavity laminate package
with an embedded copper heat slug. The copper slug,
coupled with a low thermal resistance die-attach process,
allows the QPF4006 to operate at the extreme case
temperatures needed in phased array applications.
Functional Block Diagram
Product Features
• Frequency Range: 37ꢀ–ꢀ40.5ꢀGHz
• RX Noise Figure: 4.2 dB
• RX Small Signal Gain: 18 dB
• RX Saturated Power: 17 dBm
• RX TOI : 20 dBm @ - 5 dBm Pin / tone
• TX Small Signal Gain: 23 dB
• TX Saturated Power: 33 dBm
• TX TOI: 42 dBm @ 24 dBm Pout / tone
• TX ACPR: 32dBc @ 24dBm average Pout 2
• TX Linearity: 4% EVM @ 24 dBm average Pout 2
• TX PAE: 7% @ 24 dBm average Pout.
• Package Dimensions: 4.5 x 4.0 x 1.8 mm
1. Performance is typical at room temperature.
2. OFDM, 400 MHz modulation bandwidth, 64QAM.
Applications
Part No.
Description
• 5G Wireless Base stations and terminals
• Point to Point Communications
QPF4006SR
Tape and Reel, Qty 100
QPF4006EVB03
QPF4006 Evaluation Board, Qty 1
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 1 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Absolute Maximum Ratings
Parameter
Value
28 V
Drain Voltage (TXVD, RXVD)
Drain Current (TXID3+TXID12)
Drain Current (RXID)
800 mA
60 mA
Gate Voltage (RXVG, TXVG3, TXVG12)
Gate Current (RXIG, TXIG3, TXIG12)
Switch Control Voltage (TXSW, RXSW)
Switch Control Current
0 to −5 V
20 mA
0 to 28 V
20 mA
RF Input Power (All RF ports, 85 °C)
Channel Temperature, TCH
30 dBm
225 °C
Mounting Temperature (30 seconds)
Storage Temperature
260 °C
−55 to 150 °C
Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and
functional operation of the device at these conditions is not implied. Extended application of Absolute Maximum Rating conditions to
the device may reduce device reliability.
Normal Operating Conditions
Parameter
Drain Voltage
Value
20 V
Drain Current (TXIDQ12 / TXIDQ3)
Drain Current (RX, IDQ)
Gate Voltage (TXVG12/TXVG3)
Gate Voltage (RXVG)
135 mA / 24 mA
15 mA
*
−2 V / -2.4 V
-2 V
TXSW = 0 V, RXSW = 20V (RX on, TX off)
TXSW = 20 V, RXSW = 0V (RX off, TX on)
Control Voltage (TXSW, RXSW)
Operating Temperature Range
−40 to 95ꢀ°C
Gate voltage shown are typical, can be adjusted to set required drain current. Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all recommended operating conditions.
* Other current settings: 45 / 60 mA = 105 mA; 90 / 120 mA = 210 mA; 135 / 180 mA = 315 mA (gate controls combined together).
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 2 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Electrical Specifications RX
Test conditions, unless otherwise noted: VD = 20 V, IDQ = 15 mA. Data de-embedded to device reference planes, 25 °C
Parameter
Frequency
Min
37
Typical
Max
40.5
Units
GHz
dB
Small Signal Gain (37 – 39 GHz)
Small Signal Gain (40 – 40.5 GHz)
Noise Figure
12
18
18
13
dB
4.2
17
dB
Saturated Output Power
Input Return Loss
dBm
dB
12
Output Return Loss
15
dB
Output TOI, @ -5 dBm Pin / tone, 10 MHz tone spacing
Gain Temperature Coefficient
20
dBm
dB/°C
−0.056
Electrical Specifications TX
Test conditions unless otherwise noted: VD = 20 V, TXIDQ12 / TXIDQ3 = 135mA / 24 mA
Data de-embedded to device reference planes, 25 °C
Parameter
Frequency
Min
37
Typical
Max
40.5
Units
GHz
dB
Small Signal Gain (37 GHz)
14
23
23
Small Signal Gain (38 - 39 GHz)
Small Signal Gain (40 - 40.5 GHz)
Saturated Output Power
12
dB
10
23
dB
33
dBm
dB
Input Return Loss
12
Output Return Loss
13
dB
Output TOI, @ 24dBm Pout / tone, 10 MHz tone spacing
ACPR (24 dBm average power, OFDM, 400MHz, 64QAM)
EVM (24 dBm average power, OFDM, 400MHz, 64QAM)
PAE at average output power (24dBm)
Gain Temperature Coefficient
42
dBm
dBc
%
-32
4
7
%
dB/°C
−0.112
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 3 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Small Signal, Receive Path
Test Conditions unless otherwise stated: RXVD = 20 V, RXIDQ = 15 mA, Data de-embedded to device reference planes, 25C
Input Return Loss vs Temp
Gain vs Temp
0
-5
24
22
20
18
16
14
12
10
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
-10
-15
-20
-25
-30
36
37
38
39
40
41
36
37
38
39
40
41
Freq (GHz)
Freq (GHz)
Reverse Isolation vs Temp
Output Return Loss vs Temp
-30
-35
-40
-45
-50
0
-5
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
-10
-15
-20
-25
-30
36
37
38
39
40
41
36
37
38
39
40
41
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 4 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Small Signal, Receive Path
Test Conditions unless otherwise stated: RXVD = 20 V, RXIDQ = 15 mA, Data de-embedded to device reference planes, 25 C
Gain vs Voltage
Gain vs Current
24
22
20
18
16
14
12
10
24
22
20
18
16
14
12
10
18 V
20 V
22 V
10 mA
15 mA
36
36
36
37
38
39
40
41
41
41
36
36
36
37
38
39
40
41
41
41
Freq (GHz)
Freq (GHz)
Input Return Loss vs Voltage
Input Return Loss vs Current
0
-5
0
-5
18 V
20 V
22 V
10 mA
15 mA
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
37
38
39
40
37
38
39
40
Freq (GHz)
Freq (GHz)
Output Return Loss vs Voltage
Output Return Loss vs Current
0
-5
0
-5
18 V
20 V
22 V
10 mA
15 mA
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
37
38
39
40
37
38
39
40
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 5 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Noise Figure, Receive Path
Test Conditions unless otherwise stated: RXVD = 20 V, RXIDQ = 15 mA, Data de-embedded to device reference planes, 25 C
Noise Figure vs Temp
8
7
6
5
4
3
2
1
- 40 C
+ 25 C
+ 85 C
0
36
37
38
39
40
41
Freq (GHz)
Noise Figure vs Voltage
Noise Figure vs Current
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
18 V
20 V
22 V
10 mA
38
15 mA
39
36
37
38
39
40
41
36
37
40
41
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 6 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Large Signal, Receive Path
Test Conditions unless otherwise stated: RXVD = 20 V, RXIDQ = 15 mA, CW. Data de-embedded to device reference planes, 25 C
Psat vs Temperature
Psat vs Voltage
20
18
16
14
12
10
20
18
16
14
12
10
20 V
38
22 V
18 V
39
- 40 C
38
+ 25 C
+ 85 C
39
37
-20
-20
40
10
10
37
-20
-20
40
10
10
Freq (GHz)
Freq (GHz)
Power Gain vs Pin vs Freq
Pout vs Pin vs Freq
20
15
10
5
20
15
10
5
0
37 GHz
-15
38 GHz
39 GHz
0
40 GHz
5
37 GHz
-15
38 GHz
39 GHz
0
40 GHz
5
0
-5
-10
-5
Pin (dBm)
-10
-5
Pin (dBm)
Pout vs Pin vs Temp
Drain Current vs Pin vs Freq
20
15
10
5
40
35
30
25
20
15
10
5
Freq = 39 GHz
0
- 40 C
-10
+ 25 C
+ 85 C
37 GHz
-15
38 GHz
39 GHz
0
40 GHz
5
-5
0
-15
-5
0
5
-10
-5
Pin (dBm)
Pin (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 7 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Linearity, ReceiveꢀPath
Test Conditions unless otherwise stated: RXVD = 20 V, RXIDQ = 15 mA, Tone spacing: 10 MHz
Data de-embedded to device reference planes, 25 C
RX OTOI vs Freq vs Temp
RX OTOI vs Freq vs Voltage
25
24
23
22
21
20
19
18
17
16
15
25
24
23
22
21
20
19
18
17
16
15
Pin = -5 dBm / tone
Pin = -5 dBm / tone
- 40 C
+ 25 C
+ 85 C
39
18 V
20 V
22 V
37
38
40
37
38
39
40
Freq (GHz)
Freq (GHz)
RX IMD3 vs Pout vs Freq
RX IMD5 vs Pout vs Freq
0
-10
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
-50
-60
-70
-80
37 GHz
38 GHz
39 GHz
40 GHz
37 GHz
38 GHz
39 GHz
40 GHz
-8
-6
-4
-2
0
2
4
6
8
10 12 14
-8
-6
-4
-2
0
2
4
6
8
10 12 14
Pout (dBm)
Pout (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 8 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Small Signal, Transmit Path
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA
Data de-embedded to device reference planes
Input Return Loss vs Temp
Gain vs Temp
0
-5
32
30
28
26
24
22
20
18
16
14
12
10
-10
-15
-20
-25
-30
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
36
37
38
39
40
41
36
37
38
39
40
41
Freq (GHz)
Freq (GHz)
Reverse Isolation vs Temp
Output Return Loss vs Temp
-40
-45
-50
-55
-60
-65
-70
-75
-80
0
-5
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
-10
-15
-20
-25
-30
36
37
38
39
40
41
36
37
38
39
40
41
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 9 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Small Signal, Transmit Path
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA
Data de-embedded to device reference planes, 25 C
Gain vs Voltage
Gain vs Current
32
30
28
26
24
22
20
18
16
14
12
10
32
30
28
26
24
22
20
18
16
14
12
10
105 mA
159 mA
210 mA
+ 18 V
+ 20 V
+ 22 V
36
36
36
37
38
39
40
41
41
41
36
36
36
37
38
39
40
41
41
41
Freq (GHz)
Freq (GHz)
Input Return Loss vs Voltage
Input Return Loss vs Current
0
-5
0
-5
105 mA
159 mA
210 mA
+ 18 V
+ 20 V
+ 22 V
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
37
38
39
40
37
38
39
40
Freq (GHz)
Freq (GHz)
Output Return Loss vs Voltage
Output Return Loss vs Current
0
-5
0
-5
105 mA
159 mA
210 mA
+ 18 V
+ 20 V
+ 22 V
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
37
38
39
40
37
38
39
40
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 10 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Large Signal, Transmit Path
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Pulse Mode: PW = 100 uS, DC = 10%
Data de-embedded to device reference planes, 25 C
Psat vs Temperature
37
35
33
31
29
27
- 40 C
+ 25 C
+ 85 C
25
36
37
38
39
40
41
Freq (GHz)
Psat vs Voltage
Psat vs Current
37
35
33
31
29
27
25
37
35
33
31
29
27
25
18 V
20 V
22 V
105 mA
37
159 mA
38
210 mA
39
315 mA
40
36
37
38
39
40
41
36
41
Freq (GHz)
Freq (GHz)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 11 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Large Signal, TransmitꢀPath
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Pulse Mode: PW = 100 uS, DC = 10%
Data de-embedded to device reference planes. 25C
Pout vs Pin vs Temp
Pout vs Pin vs Freq
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
Freq = 39 GHz
37 GHz
38 GHz
39 GHz
10
40 GHz
15
0
0
- 40 C
0
+ 25 C
+ 85 C
10
-5
-5
-10
-5
5
15
20
20
20
-10
-5
0
5
20
20
35
Pin (dBm)
Pin (dBm)
Power Gain vs Pin vs Freq
Drain Current vs Pin vs Freq
30
25
20
15
10
5
800
700
600
500
400
300
200
100
0
37 GHz
-5
38 GHz
39 GHz
10
40 GHz
15
37 GHz
-5
38 GHz
39 GHz
10
40 GHz
15
0
-10
0
5
-10
0
5
Pin (dBm)
Pin (dBm)
PAE vs Pin vs Freq
PAE vs Pout vs Freq
25
20
15
10
5
25
20
15
10
5
37 GHz
38 GHz
39 GHz
40 GHz
37 GHz
38 GHz
39 GHz
40 GHz
0
0
-10
-5
0
5
10
15
10
15
20
25
30
Pin (dBm)
Pout (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 12 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Linearity, Transmit Path
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Tone Spacing = 10 MHz
Data de-embedded to device reference planes, 25 C
OTOI vs Freq vs Temp
OTOI vs Freq vs VD
50
45
40
35
30
50
45
40
35
30
Pout = 24 dBm / tone
Pout = 24 dBm / tone
- 40 C
38
+ 25 C
+ 85 C
39
18 V
20 V
39
37
40
37
38
40
Freq (GHz)
Freq (GHz)
IMD3 vs Pout vs Freq
IMD5 vs Pout vs Freq
0
-10
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
-50
-60
-70
-80
37 GHz
38 GHz
39 GHz
40 GHz
37 GHz
38 GHz
39 GHz
40 GHz
14
16
18
20
22
24
26
28
30
14
16
18
20
22
24
26
28
30
Pout (dBm)
Pout (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 13 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Modulated Signal, Transmit Pathꢀ
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Source: 400 MHz OFDM, 64 QAM
Data de-embedded to device reference planes, 25 C
ACPR Low vs Pout vs Temp
ACPR High vs Pout vs Temp
-15
-20
-25
-30
-35
-40
-45
-15
-20
-25
-30
-35
-40
-45
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
Freq = 39 GHz
Freq = 39 GHz
0
5
10
15
20
25
30
35
35
35
0
5
10
15
20
25
30
35
35
35
Pout (dBm)
Pout (dBm)
ACPR Low vs Pout vs Freq
ACPR High vs Pout vs Freq
-15
-20
-25
-30
-35
-40
-45
-15
-20
-25
-30
-35
-40
-45
37 GHz
39 GHz
38 GHz
40 GHz
37 GHz
39 GHz
38 GHz
40 GHz
5
10
15
20
Pout (dBm)
25
30
5
10
15
20
Pout (dBm)
25
30
ACPR High vs Pout vs Current
ACPR Low vs Pout vs Current
-15
-20
-25
-30
-35
-40
-45
-15
-20
-25
-30
-35
-40
-45
105 mA
159 mA
210 mA
315 mA
105 mA
159 mA
210 mA
315 mA
Freq = 39 GHz
Freq = 39 GHz
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Pout (dBm)
Pout (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 14 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Modulated Signal, Transmit Pathꢀ
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Source: 400 MHz OFDM, 64 QAM
Data de-embedded to device reference planes, 25 C
PAR vs Pout vs Freq
PAR vs Pout vs Temp
14
12
10
8
14
12
10
8
37 GHz
39 GHz
38 GHz
40 GHz
- 40 C
+ 25 C
+ 85 C
6
6
4
4
2
2
PAR above 0.01 % of Signal Level
PAR above 0.01 % of Signal Level, Freq = 39 GHz
0
0
0
5
10
15
20
25
30
35
5
10
15
20
25
30
35
Pout (dBm)
Pout (dBm)
EVM vs Pout vs Temp
EVM vs Pout vs Frequency
10
9
8
7
6
5
4
3
2
1
0
10
9
8
7
6
5
4
3
2
1
0
- 40 C
+ 25 C
+ 85 C
37 GHz
38 GHz
39 GHz
40 GHz
Freq: 39 GHz
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
Pout (dBm)
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
Pout (dBm)
Data Sheet Rev. K, Aug 2021
|
Subject to change without notice - 15 of 23 -
www.qorvo.com
QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Performance Plots, Modulated Signal, Transmit Path
Test Conditions unless otherwise stated: TXVD = 20 V, TXIDQ12 = 135 mA, TXIDQ3 = 24 mA, Source: 400 MHz OFDM, 64 QAM
Data de-embedded to device reference planes, 25 C
Power Gain vs Pout vs Temp
Power Gain vs Pout vs Freq
35
30
25
20
15
10
35
30
25
20
15
10
- 40 C
+ 25 C
+ 85 C
37 GHz
39 GHz
38 GHz
40 GHz
Freq = 39 GHz
0
0
0
5
5
5
10
15
20
25
30
30
30
35
35
35
5
5
0
10
15
20
Pout (dBm)
25
30
35
35
35
Pout (dBm)
PAE vs Pout vs Freq
PAE vs Pout vs Temp
25
20
15
10
5
25
20
15
10
5
37 GHz
39 GHz
38 GHz
40 GHz
- 40 C
+ 25 C
+ 85 C
Freq = 39 GHz
Freq = 39 GHz
25 30
0
0
10
15
20
25
10
15
20
Pout (dBm)
Pout (dBm)
Pdiss vs Pout vs Temp
Current vs Pout vs Temp
10
8
400
350
300
250
200
150
100
50
- 40 C
+ 25 C
+ 85 C
- 40 C
+ 25 C
+ 85 C
Freq = 39 GHz
Freq = 39 GHz
6
4
2
0
0
10
15
20
25
5
10
15
20
25
30
Pout (dBm)
Pout (dBm)
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Mechanical Drawings & Pad Descriptions
Dimensions in mm
Part Marking:
QPF4006: Part Number
YY = Part Assembly Year
WW = Part Assembly Week
MXXX = Batch ID
Pin Number
1, 2, 4, 5, 13, 15, 17, slug
Label
GND
Description
GROUND
3
ANT
Antenna, DC Grounded
14
RXOUT
TXIN
Receive output, DC Blocked
Transmit input, DC Grounded
Receive gate control
16
18
RXVG
RXVD
TXVG12
TXVG3
TXVD
TXSW
RXSW
N/C
19
Receive Drain Voltage
20
Transmit stage 1 and 2 gate controls
Transmit stage 3 gate control
Transmit Drain Voltage
21
22
23
Transmit switch control
24
Receive switch control
6, 7, 8, 9, 10, 11, 12
No internal connection
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Evaluation Board and Assembly
RF Layer is 0.008” thick Rogers Corp. RO4003C (εr = 3.35). Metal layers are 0.5 oz. copper. The microstrip line at the
connector interface is optimized for the Southwest Microwave end launch connector 1492-04A-5.
Ref. Des.
Component Value
Manuf. Remark
C2, C4, C6, C8, C10 SMT Cap.
CAP, 0402 1000pF +/-10% 50V 0402 X7R ROHS
Various Red
C1, C3, C5, C7, C9
R2, R4, R6 - R10
R1, R3, R5
SMT Cap.
SMT Res.
SMT Res.
CAP, 1206 1.0uF +/-10% 50V X7R ROHS
RES, 0402 5.1 OHM, 5% 50V, ROHS
RES, 0402 0 OHM, 5%, ROHS
Various Grey
Various Green
Various Pink
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Application Circuit
Bias-up Procedure
Bias-down Procedure
1. Set drain supply TXVD limit to 700 mA, RXVD limit to
50 mA, gate and control supply limit to 10 mA each.
1. Turn off RF signal
2. Set TXVG12, TXVG3, RXVG to −5 V
3. Set TXSW = 20 V (or 0 V), RXSW = 0 V (or 20 V)
4. Set VD = +20 V
2. Set TXVG12, TXVG3 and RXVG to −5 V
3. Set VD = 0 V
4. Turn off drain supply
5. For TX, adjust TXVG12 to get TXID12 current, then
adjust TXVG3 to achieve required total drain current;
For RX, adjust RXVG to achieve required drain
current.
5. Turn off TXSW, RXSW
6. Turn off gate supply
6. Apply RF signal
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Thermal and Reliability Information
Parameter
Values
Units
Conditions
Thermal Resistance (θJC), Quiescent, TX (1,2,3)
14.9
°C/W
°C
TX on, RX off, CW, VD = +20ꢀV, IDQ = 159ꢀmA,
TBASE = 85ꢀ°C
RF off, PDISS =3.18ꢀW
Channel Temperature (TCH), Quiescent, TX
132.4
Thermal Resistance (θJC), Under Drive, TX (1,2,3) 10.7
°C/W
°C
TX on, RX off, CW, VD = +20ꢀV, TBASE = 85ꢀ°C,
Freq = 39ꢀGHz, PIN = 10ꢀdBm, POUT = 25ꢀdBm,
ID_DRIVE = 0.25ꢀA, PDISS = 4.69ꢀW
Channel Temperature (TCH), Under Drive, TX
Thermal Resistance (θJC), Quiescent, RX (1,2,3)
Channel Temperature (TCH), Quiescent, RX
135.2
67.0
°C/W
°C
RX on, TX off, CW, VD = +20ꢀV, IDQ = 15ꢀmA
TBASE = 85ꢀ°C
RF off, PDISS = 0.3ꢀW
105.1
Notes:
1. Thermal resistance is measured to package backside
2. Base or ambient temperature is 85 °C
3. Refer to the following document: GaN Device Channel Temperature, Thermal Resistance, and Reliability Estimates
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Solderability
1. Compatible with the latest version of J-STD-020, Lead-free solder, 260ꢀ°C.
2. This package is non-hermetic, and therefore cannot be subjected to aqueous washing.
The use of no-clean solder to avoid washing is highly recommended.
Recommended Soldering Temperature Profile
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Tape and Reel Information
Standard T/R size = 100 pieces on a 7” reel.
Distance Between
Centerline (mm)
Carrier Tape Cover
(mm)
Carrier (mm)
Material
Vendor
Cavity (mm)
Length
direction
(P2)
Width
Direction
(F)
Length Width
Depth
(K0)
Pitch
(P1)
Width
(W)
Width
(W)
Vendor P/N
(A0)
(B0)
QFN0400X
0450C
Tek-Pak
4.25
4.75
2.1
8.0
2.00
5.50
12.0
9.20
Data Sheet Rev. K, Aug 2021
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QPF4006
37 –ꢀ40.5ꢀGHz GaN Front End Module
Handling Precautions
Parameter
Rating
Standard
ESDꢀ–ꢀHuman Body Model (HBM)
0B
ESDAꢁ/ꢁJEDEC JS-001-2012
ESDAꢁ/ꢁJEDEC JS-002-2014
Caution!
ESD-Sensitive Device
ESDꢀ–ꢀCharged Device Model (CDM) C3
JEDEC standard IPC/JEDEC
J-STD-020
MSLꢀ–ꢀConvection Reflow 260ꢀ°C
3
RoHS Compliance
This product is compliant with the 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical
and Electronic Equipment), as amended by Directive 2015/863/EU. This product also has the following attributes:
•
•
•
•
Lead Free
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Tel: 1-844-890-8163
Web: www.qorvo.com
Email: customer.support@qorvo.com
Important Notice
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
© 2021 Qorvo US, Inc. All rights reserved. This document is subject to copyright laws in various jurisdictions worldwide and may not be
reproduced or distributed, in whole or in part, without the express written consent of Qorvo US, Inc.
Data Sheet Rev. K, Aug 2021
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