TGA2526 [QORVO]

2-20 GHz Low Noise Amplifier with AGC;
TGA2526
型号: TGA2526
厂家: Qorvo    Qorvo
描述:

2-20 GHz Low Noise Amplifier with AGC

射频 微波
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中文:  中文翻译
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TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
General Description  
The Qorvo TGA2526 is a compact LNA Gain Block MMIC  
with adjustable gain control (AGC). The LNA operates from  
2-20 GHz and is designed using Qorvo proven standard  
0.15 um Power pHEMT production process.  
The TGA2526 provides a nominal 20 dBm of output power  
at 1 dB gain compression with a small signal gain of 17.5  
dB. Greater than 30 dB adjustable gain can be achieved  
using the Vg2 pin. Typical noise figure is 2.5 dB at 12 GHz.  
Special circuitry on Vd, Vg1 and Vg2 pins provides ESD  
protection.  
Measured Performance  
The TGA2526 is suitable for a variety of wideband systems  
such as point to point radios, radar warning receivers and  
electronic counter measures.  
Bias conditions: Vd = 5 V, Id = 100 mA, Vg1 = -0.55 V ,  
Vg2 = +1.3 V Typical  
The TGA2526 is 100% DC and RF tested on-wafer to  
ensure performance compliance. The TGA2526 has a  
protective  
surface  
passivation  
layer  
providing  
environmental robustness.  
Applications  
Wideband Gain Block/LNA  
X-Ku Point to Point Radio  
Electronic Warfare Applications  
10  
9
8
7
6
5
4
3
2
1
0
Product Features  
Frequency Range: 2-20 GHz  
Midband NF: 2.5 dB  
Gain: 17.5 dB  
>30 dB adjustable gain with Vg2  
TOI: 29 dBm Typical  
2
4
6
8
10 12 14 16 18 20  
Frequency (GHz)  
22 dBm Nominal Psat, 20 dBm Nominal P1dB  
ESD Protection circuitry on Vd, Vg1, and Vg2  
Bias: Vd = 5 V, Id = 100 mA, VG1 = -0.55 V,  
VG2 = +1.3 V, Typical  
Ordering Information  
Part  
Description  
Technology: 3 MI 0.15 um Power pHEMT  
Chip Dimensions: 2.090 x 1.350 x 0.100 mm  
TGA2526  
TGA2526EVB1  
GaAs MMIC Die, Gel Pack, Qty 100  
TGA2526 Evaluation Board, Qty 1  
TGA2526-XCC-  
SPACE  
Space Inspected Version; Contact Sales  
Data Sheet Rev C  
June 2021  
|
Subject to change without notice  
1 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Absolute Maximum Ratings1/  
Symbol  
Parameter  
Value  
Notes  
VD-VG  
Drain to Gate Voltage  
9 V  
VD  
Drain Voltage  
7 V  
2/  
VG1  
VG2  
ID  
Gate # 1 Voltage Range  
Gate # 2 Voltage Range  
Drain Current  
-2 to 0 V  
-2 to +3 V  
144 mA  
2/  
2/  
IG1  
IG2  
PIN  
Gate # 1 Current Range  
Gate # 2 Current Range  
Input Continuous Wave Power  
Channel Temperature  
Storage Temperature  
-20 to 14 mA  
-20 to 14 mA  
22 dBm  
200 °C  
T
T
channel  
storage  
55 to 150 °C  
Note:  
1/ These ratings represent the maximum operable values for this device. Stresses beyond those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and  
functional operation of the device at these conditions is not implied.  
2/  
Combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation  
listed in Table IV.  
3/  
ESD protection diodes on VD, VG1 and VG2 will conduct current for voltages approaching turn-on voltages. Diode turn-on voltage  
levels will decrease with decreasing temperature.  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
2 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Recommended Operating Conditions  
Symbol  
Parameter1/  
Value  
VD  
Drain Voltage  
5 V  
ID  
Drain Current  
100 mA  
ID_Drive  
VG1  
Drain Current under RF Drive  
Gate # 1 Voltage  
144 mA  
-0.55 V  
1.3 V  
VG2  
Gate # 2 Voltage  
Note:  
1/  
See assembly diagram for bias instructions.  
RF Characterization Table  
Bias: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V, typical. Ambient temperature: 25 °C  
Data de-embedded to the end of RF feeds, data include bond wire effects  
Symbol  
Parameter  
Test Conditions  
Min  
Normal  
Max  
Units  
f = 218 GHz  
f = 1820 GHz  
16  
15  
17.5  
16  
Gain  
Small Signal Gain  
dB  
f = 24 GHz  
f = 420 GHz  
10  
12  
11  
13  
IRL  
Input Return Loss  
Output Return Loss  
dB  
dB  
10  
10  
f = 26 GHz  
f = 620 GHz  
11  
13  
ORL  
f = 218 GHz  
f = 1820 GHz  
22  
20  
Psat  
Saturated Output Power  
dBm  
dBm  
f = 216 GHz  
f = 1620 GHz  
17  
15  
20  
17  
P1dB  
Output Power @ 1dB Compression  
f = 212 GHz  
f = 1220 GHz  
30  
26  
TOI  
NF  
Output TOI  
dBm  
dB  
f = 24 GHz  
f = 414 GHz  
f = 1420 GHz  
3
2.5  
3.5  
3.5  
3
4.5  
Noise Figure  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
3 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Measured Data  
Bias conditions: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V Typical, 25 °C  
25  
20  
15  
10  
5
0
5
10  
15  
20  
25  
30  
35  
Frequency (GHz)  
0
-5  
IRL  
ORL  
-10  
-15  
-20  
-25  
-30  
0
5
10  
15  
20  
25  
30  
35  
Frequency (GHz)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
4 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Measured Data  
Bias conditions: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V Typical, 25 °C  
25  
20  
15  
10  
25C  
70C  
-40C  
5
0
2
4
6
8
10 12 14 16 18 20 22 24  
Frequency (GHz)  
Gain tuned by adjusting Vg2  
Vd = 5 V, Vg1 = -0.55 V constant  
20  
15  
10  
5
Id = 100 mA,  
Vg2 = +1.3 V  
Id = 57 mA,  
Vg2 = -0.44 V  
Id = 43 mA,  
Vg2 = -0.65 V  
Id = 32 mA,  
Vg2 = -0.76 V  
0
Id = 23 mA,  
Vd2 = -0.84 V  
-5  
Id = 16 mA,  
Vd2 = -0.90 V  
-10  
-15  
Id = 10.6 mA,  
Vg2 = -0.95 V  
2
4
6
8
10 12 14 16 18 20 22 24  
Frequency (GHz)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
5 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Measured Data  
Bias conditions: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V Typical, 25 °C  
25  
250  
200  
150  
100  
50  
20  
15  
10  
5
Pout @ 12 GHz  
Gain @ 12 GHz  
Id @ 12 GHz  
0
0
-12 -10 -8 -6 -4 -2  
0
2
4
6
8
Pin (dBm)  
30  
25  
20  
15  
10  
5
Psat  
P1dB  
0
2
4
6
8
10 12 14 16 18 20 22 24  
Frequency (GHz)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
6 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Measured Data  
Bias conditions: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V Typical, 25 °C  
40  
35  
30  
25  
20  
15  
10  
5
0
-2  
0
2
4
6
8
10  
12  
14  
Pout/Tone (dBm)  
40  
35  
30  
25  
20  
15  
10  
5
VG2 = +2.5 V  
VG2 = +2.0 V  
VG2 = +1.3 V  
VG2 = -0.7 V  
0
2
4
6
8
10 12 14 16 18 20 22 24  
Frequency (GHz)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
7 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Measured Data  
Bias conditions: VD = 5 V, ID = 100 mA, VG1 = -0.55 V, VG2 = +1.3 V Typical, 25 °C  
20  
16  
10  
8
Gain  
12  
6
NF  
8
4
0
4
2
0
2
4
6
8 10 12 14 16 18 20 22 24  
Frequency (GHz)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
8 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Power Dissipation and Thermal Properties  
Parameter  
Test Conditions  
Value  
PD= 1.01 W  
Tchannel = 113 °C  
Tm = 9.1 E+7 Hrs  
θjc = 42.2 °C/W  
Maximum Power Dissipation  
Tbaseplate = 70 °C  
VD = 5 V  
Thermal Resistance, θjc  
ID = 100 mA  
PD = 0.5 W  
VD = 5 V  
ID = 144 mA  
POUT = 22 dBm  
PD = 0.562 W  
Tchannel = 91 °C  
Tm = 2.0 E+9 Hrs  
θjc = 42.2 °C/W  
Tchannel = 94 °C  
Tm = 1.3 E+9 Hrs  
Thermal Resistance, θjc Under RF Drive  
Median Lifetime vs Channel Temperature  
1.E+13  
1.E+12  
1.E+11  
1.E+10  
1.E+09  
1.E+08  
1.E+07  
1.E+06  
1.E+05  
FET5  
1.E+04  
25  
50  
75  
100  
125  
150  
175  
200  
Channel Temperature (C)  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
9 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Electrical Schematic  
Vd  
100 pF  
0.01 uF  
RF IN  
RF OUT  
TGA2526  
100 pF  
0.01 uF  
100 pF  
0.01 uF  
Vg1  
Vg2  
Bias Procedures  
Bias-down Procedure  
Set VG2 to +1.3 V  
Bias-up Procedure  
VG1 set to -1.5 V  
VD set to +5 V  
Turn off RF supply  
Reduce VG1 to -1.5 V. Ensure Id ~ 0 mA  
VG2 set to +1.3 V  
Adjust VG1 more positive until Id is 100 mA.  
This will be ~ VG1 = -0.55 V  
Turn VG2 to 0 V  
Turn VD to 0 V  
Turn VG1 to 0 V  
Apply RF signal to input  
Adjust VG2 to obtain desired gain.  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
10 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Mechanical Drawing and Bond Pad Description  
Unit: millimeters. Die thickness: 0.10, Die x, y size tolerance: +/- 0.050  
Chip edge to bond pad dimensions are shown to center of pad. Ground is backside of die  
Pad No.  
Label  
RF Input  
VG2  
Pad Size (mm)  
0.100 x 0.158  
Description  
1
RF Input Port, matched to 50 ohms, DC blocked  
2
Gate Voltage Control  
0.100 x 0.100  
0.135 x 0.110  
3
VD1  
Drain voltage termination, no connection required  
4
5
6
VD  
Drain Voltage  
0.110 x 0.135  
0.100 x 0.158  
0.100 x 0.100  
RF output  
VG1  
RF Output Port, matched to 50 ohms, DC blocked  
Gate Voltage Control  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
11 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Recommended Assembly Diagram  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
12 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Assembly Notes  
Component placement and adhesive attachment assembly notes:  
Vacuum pencils and/or vacuum collets are the preferred method of pick up.  
Air bridges must be avoided during placement.  
The force impact is critical during auto placement.  
Organic attachment (i.e. epoxy) can be used in low-power applications.  
Curing should be done in a convection oven; proper exhaust is a safety concern.  
Reflow process assembly notes:  
Use AuSn (80/20) solder and limit exposure to temperatures above 300 °C to 3-4 minutes, maximum.  
An alloy station or conveyor furnace with reducing atmosphere should be used.  
Do not use any kind of flux.  
Coefficient of thermal expansion matching is critical for long-term reliability.  
Devices must be stored in a dry nitrogen atmosphere.  
Interconnect process assembly notes:  
Thermosonic ball bonding is the preferred interconnect technique.  
Force, time, and ultrasonic are critical parameters.  
Aluminum wire should not be used.  
Devices with small pad sizes should be bonded with 0.0007-inch wire.  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
13 of 14  
www.qorvo.com  
TGA2526  
2-20 GHz Low Noise Amplifier with AGC  
®
Handling Precautions  
Parameter  
Rating  
TBD  
Standard  
ESDꢀ–ꢀHuman Body Model (HBM)  
ESDꢀ–ꢀCharged Device Model (CDM)  
ESDAꢁ/ꢁJEDEC JS-001-2017  
ESDAꢁ/ꢁJEDEC JS-002-2014  
Caution!  
ESD-Sensitive Device  
TBD  
MSLꢀ–ꢀConvection Reflow 260ꢀ°C  
N / A  
RoHS Compliance  
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and  
Electronic Equipment) as amended by Directive 2015/863/EU.  
This product also has the following attributes:  
Lead Free  
Halogen Free (Chlorine, Bromine)  
Antimony Free  
TBBP-A (C15H12Br402) Free  
SVHC Free  
PFOS Free  
Contact Information  
For the latest specifications, additional product information, worldwide sales and distribution locations:  
Tel: 1-844-890-8163  
Web: www.qorvo.com  
Email: customer.support@qorvo.com  
Important Notice  
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained  
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained  
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for  
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any  
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by  
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED  
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER  
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,  
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.  
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,  
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal  
injury or death.  
© 2021 Qorvo US, Inc. All rights reserved. This document is subject to copyright laws in various jurisdictions worldwide and may not be  
reproduced or distributed, in whole or in part, without the express written consent of Qorvo US, Inc.  
Data Sheet Rev C, June 2021  
|
Subject to change without notice  
14 of 14  
www.qorvo.com  

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