7902402XA [RAYTHEON]
OTP ROM, 1KX8, 75ns, Bipolar, CQCC32, CERAMIC, LCC-32;
| 型号： | 7902402XA |
| 厂家： | 
RAYTHEON COMPANY |
| 描述： | OTP ROM, 1KX8, 75ns, Bipolar, CQCC32, CERAMIC, LCC-32 OTP只读存储器 内存集成电路 |
| 文件： | 总11页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
A
DESCRIPTION
DATE (YR-MO-DA)
88-01-15
APPROVED
M. A. Frye
Change to military drawing format. Change from a suggested source
drawing to an approved source drawing. Add CAGE 34335 and
device type 02. Add case outline letters K, L, X, and 3. Change
drawing CAGE to 67268.
B
C
Updated boilerplate. Removed programming specifics from drawing.
Separated source bulletin from body of drawing. - glg
00-08-01
05-03-02
Raymond Monnin
Raymond Monnin
Correction to marking paragraph 3.5, updated boilerplate paragraphs.
ksr
D
E
Boilerplate update, part of 5-year review. ksr
11-01-20
17-10-16
Charles F. Saffle
Charles Saffle
Update drawing to meet current MIL-PRF-38535 requirements. – glg
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
REV STATUS
OF SHEETS
REV
SHEET
10
PREPARED BY
A. J. Foley
PMIC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
C. R. Jackson
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY All
APPROVED BY
N. A. Hauck
MICROCIRCUITS, MEMORY, DIGITAL,
8192 BIT, SWITCHABLE, SCHOTTKY,
BIPOLAR PROM WITH TRI-STATE OUTPUT,
MONOLITHIC SILICON
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
DRAWING APPROVAL DATE
13 August 1979
AMSC N/A
REVISION LEVEL
E
SIZE
CAGE CODE
79024
A
14933
SHEET
1 OF 10
DSCC FORM 2233
APR 97
5962-E009-18
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
79024
|
01
|
J
|
A
|
|
|
|
|
|
|
|
|
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
Generic number
Circuit
Access time
01
02
1/
1/
1K x 8-bit power switched bipolar PROM
1K x 8-bit power switched bipolar PROM
90 ns
75 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
Descriptive designator
Terminals
Package style
J
GDIP1-T24 or CDIP2-T24
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N32
24
24
24
32
28
dual-in-line package
flat package
dual-in-line package
rectangular chip carrier package
square leadless chip carrier package
K
L
X
3
CQCC1-N28
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range............................................................ -0.5 V dc to +7.0 V dc
Address/enable Input voltages ............................................ -0.5 V dc to +5.5 V dc
Address/enable Input current ............................................. -30 mA dc to +5.5 mA dc
Storage temperature range ................................................. -65°C to +150°C
Lead temperature (soldering, 10 seconds) .......................... +300°C
Thermal resistance, junction-to-case (ΘJC) ......................... See MIL-STD-1835
1.4 Recommended operating conditions.
Case operating temperature range (TC)................................. -55°C to +125°C
Supply voltage range (VCC
)
..................................................... 4.5 V dc to 5.5 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
2
DSCC FORM 2234
APR 97
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Unprogrammed devices. Testing to the applicable truth table, or alternate testing as specified in 4.3.1d, shall be used
for unprogrammed devices for contracts involving no altered item drawing. When testing is required per 4.3 herein, the devices
shall be programmed by the manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number
of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits
programmed.
3.2.3 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing.
3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
1.2 herein. In addition, the manufacturer's PIN may also be marked.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
3
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
|
|
Conditions
|Group A
| Device | Limits
|
Test
|Symbol |
-55°C < TC < +125°C
4.5 V < VCC < 5.5 V
unless otherwise specified
|subgroups | type
|
|Unit
|
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|
|
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|
|
|
|Min | Max |
|
| 2.4 |
|
|
| V
|
High level output voltage |VOH
|VIL = 0.8 V, VIH = 2.0 V
| 1, 2, 3
|
|
| 1, 2, 3
|
|
|
| 1, 2, 3
|
| 1, 2, 3
All
All
|
|IOH = -2.0 mA, VCC = 4.5 V
|
|
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Low level output voltage |VOL
|VIL = 0.8 V, VIH = 2.0 V
|0.5 | V
|
|IOL = 16 mA, VCC = 4.5 V
|
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Low level input voltage |VIL
|VCC = 5.5 V
All
All
|0.8 | V
|
|
|
|
Input clamp voltage
|VIC
|VCC = 4.5 V, IIN = -18 mA,
|0.8 | V
|
|
|Ambient temperature = 25°C
|
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|2.0
|
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|-1.0 | -250|µA
|
|
|-12 |-100 |mA
|
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|
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| V
|
|
|
Input threshold voltage |VIH
|VCC = 4.5 V
|
|
|VIH = 5.5 V
|
| 1, 2, 3
|
|
| 1, 2, 3
|
All
All
All
All
All
|
|
|IIH
|
|
|IIL
|
|
|IOS
|
|
|IOHE
Address/enable input
Address/enable input
40 |µA
|
|
|
|
|VIN = 0.45 V
|
|
|VOUT = 0.2 V 1/
|
|
|VCC = 5.5 V, VOUT = 2.4 V
|
|
| 1, 2, 3
|
|
| 1, 2, 3
|
|
| 1, 2, 3
|
|
|
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|
Output short-circuit
current 1/ 2/
|
|
|
|
Output disable current
| 40 |µA
|
|
|
|
|
|
Output disable current
Supply current
|IOLE
|
|ICC
|
|
|
|VOL = 0.45 V, VOUT = 5.5 V 2/
|
| 1, 2, 3
|
|
|
|
|
|
|
|
All
All
|
|
|
|
|
|
|
| -40 |µA
|
|
|VCC = 5.5 V
Disabled | 1, 2, 3
| 80 |mA
|
|
|
|
|All inputs grounded Enabled
|
|VIN = 2.0 V dc; f = 1 MHz
|
|
|
| 185 |
|
|
Input capacitance
|CIN
4
All
| 8 | pF
|
|
|Ambient temperature = 25°C
|
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Address access time
|tAVQV
|See figure 2 and 3
|
|
|
|See figure 2 and 3
|
|
|
| 9, 10, 11
01
02
| 90 |ns
| 75 |
|
|
|
|
|
|
|
|
|
|
Chip power-down delay |tGVQZ
|9, 10, 11 | All
|
|
|
|9, 10, 11
|
|
| 50 |ns
to tri-state
|
|
|
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|
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Chip power-up access
time
|tGVQV
|
|
|See figure 2 and 3
|
|
01
02
| 115 |ns
| 225 |
|
|
1/ Not more than one output shall be shorted at a time for a maximum duration of one second.
2/ Device is in the three state.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
4
DSCC FORM 2234
APR 97
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements
of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects
this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1) Test condition C, D or E. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Subgroup 4 (CIN measurement) shall be measured only for the initial test and after process or design changes which
may affect input capacitance.
d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of
group A, subgroups 9. 10, and 11. Either of two techniques is acceptable:
(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability
and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified
on all devices during subgroups 9, 10, and 11, group A testing per the sampling plan specified in MIL-STD-883,
method 5005.
(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy
programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to
programming. If more than 2 devices fail to program, the lot shall be rejected. At the manufacturer's option, the
sample may be increased to 24 total devices with no more than 4 total device failures allowable. Ten devices from
the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more
than 2 total devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be increased to 20
total devices with no more than 4 total device failures allowable.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
5
DSCC FORM 2234
APR 97
Device Types
All
Case Outlines
J, K, L
X
3
Terminal
Number
Terminal
Symbol
Terminal
Symbol
Terminal
Symbol
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
VSS
Q3
Q4
Q5
Q6
Q7
NC
NC
A7
A6
A5
A4
A3
A2
A1
NC
A7
A6
A5
A4
A3
A2
A1
A0
NC
Q0
Q1
Q2
VSS
NC
Q3
Q4
A0
NC
Q0
Q1
Q2
NC
VSS
Q3
18
19
E4
E3
NC
Q4
Q5
Q6
20
21
E
E
2
1
Q5
Q6
Q7
NC
E4
E3
22
23
A9
A8
Q7
NC
E4
E3
24
VCC
E
E
2
1
- - -
- - -
- - -
25
26
27
A9
E
2
A8
NC
- - -
VCC
28
E
1
- - -
- - -
- - -
- - -
- - -
- - -
- - -
- - -
29
30
31
32
A9
A8
NC
VCC
Note: - - - means no terminal.
FIGURE 1. Terminal connections.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
6
DSCC FORM 2234
APR 97
Device type 01
NOTES:
1. The tolerance for all load components is +5 percent.
2. The load capacitance includes the test jig and probe capacitances.
3. All device test loads should be located within two inches of device output pin.
4. Use this circuit or equivalent to test the outputs.
FIGURE 2. AC test load circuit.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
7
DSCC FORM 2234
APR 97
Device type 02
Output load for all switching tests except tGVQZ
.
Output load for tGVQZ.
NOTES:
1. All device test loads should be located within two inches of device output pin.
2. S1 is open for output data high to high-Z and high-Z to output data high tests.
S1 is closed for all other switching tests.
3. The load capacitance includes all stray and fixture capacitance.
FIGURE 2. AC test load circuit - continued.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
E
8
DSCC FORM 2234
APR 97
FIGURE 3. Switching time definitions.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
9
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements. 1/ 2/
MIL-STD-883 test requirements
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
Interim electrical parameters
(method 5004)
- - -
Final electrical test parameters
(method 5004)
1*, 2, 3, 9
Group A test requirements
(method 5005)
1, 2, 3, 7, 8, 9, 10, 11
1, 2, 3
Groups C and D end-point
electrical parameters
(method 5005)
*
PDA applies to subgroup 1.
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C, D or E. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1005 of MIL-STD-883.
(2) TA = +125°C, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or
telephone 614-692-0540.
6.6 Approved source of supply. Approved sources of supply are listed in MIL-HDBK-103 and QML-38535. The vendors listed
in MIL-HDBK-103 and QML-38535 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
SIZE
STANDARD
79024
MICROCIRCUIT DRAWING
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
E
SHEET
10
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 17-10-16
Approved sources of supply for SMD 79024 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is
superseded by the next dated revisions of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an
online database of all current sources of supply at https://landandmaritimeapps.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
7902401JA
3/
0C7V7
3/
29633DMB
R29633
HM-7681P-8
R29633
7902402JA
7902402KA
79024023A
7902402XA
7902402LA
0C7V7
3/
AM27PS181/BKA
R29633
0C7V7
3/
AM27PS181/BJA
R29633
0C7V7
3/
AM27PS181/B3A
R29633
0C7V7
3/
AM27PS181/BUA
R29633
0C7V7
3/
AM27PS181/BLA
1/ The lead finish shown for each PIN representing a hermetic package
is the most readily available from the manufacturer listed for that part.
If the desired lead finish is not listed contact the Vendor to determine
its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired
to this number may not satisfy the performance requirements of this
drawing.
3/ No longer available from an approved source.
Vendor CAGE
number
Vendor name
and address
0C7V7
e2v, Inc., dba QP Semiconductor, Inc.
765 Sycamore Drive
Milpitas, CA 95035
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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