2SC458(LG)C [RENESAS]
100mA, 30V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, TO-92(1), 3 PIN;型号: | 2SC458(LG)C |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | 100mA, 30V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92, TO-92(1), 3 PIN |
文件: | 总11页 (文件大小:164K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for oporate trademark, logo and
corporate statement, no changes whatsoever have been made to of the document, and
these changes do not constitute any alteration to the contenelf.
Renesas Technology Home Pcom
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonginto Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any ringement of any
third-party's rights, originating in the use of any product data, dims, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including programs and
algorithms represents information on products at the tirials, and are
subject to change by Renesas Technology Corporatct improvements or
other reasons. It is therefore recommended thachnology Corporation
or an authorized Renesas Technology Corporlatest product information
before purchasing a product listed herein.
The information described here may coypographical errors.
Renesas Technology Corporation assdamage, liability, or other loss
rising from these inaccuracies or
Please also pay attention to infTechnology Corporation by various
means, including the Renesmiconductor home page
(http://www.renesas.com
4. When using any or aln these materials, including product data, diagrams,
charts, programs, o evaluate all information as a total system before
making a final the information and products. Renesas Technology
Corporation ny damage, liability or other loss resulting from the
information
5. Renesas Technmiconductors are not designed or manufactured for use in a device
or system that is umstances in which human life is potentially at stake. Please contact
Renesas Technology on or an authorized Renesas Technology Corporation product distributor
when considering the usa product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
2SC458 (LG), 2SC2310
Silicon NPN Epitaxial
ADE-208-1044A (Z)
2nd. Edition
Mar. 2001
Application
•
Low frequency low noise amplifier
Outline
TO-92 (1)
tter
ollector
. Base
2SC458 (LG), 2SC2310
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
VCBO
VCEO
VEBO
IC
2SC458 (LG)
2SC2310
Unit
V
Collector to base voltage
Collector to emitter voltage
Emitter to base voltage
Collector current
30
55
30
50
V
5
5
V
100
100
mA
mA
mW
°C
°C
Emitter current
IE
–100
–100
Collector power dissipation
Junction temperature
Storage temperature
PC
200
200
Tj
150
150
Tstg
–55 to +150
to +150
2SC458 (LG), 2SC2310
Electrical Characteristics (Ta = 25°C)
2SC458 (LG)
2SC2310
Item
Symbol Min Typ Max Min Typ Max Unit Test conditions
Collector to base
breakdown voltage
V(BR)CBO
V(BR)CEO
V(BR)EBO
30
30
5
—
—
—
—
—
—
55
50
5
—
—
—
—
—
—
V
V
V
IC = 10 µA, IE = 0
IC = 1 mA, RBE
Collector to emitter
breakdown voltage
=
Emitter to base
IE = 10 µA, IC = 0
breakdown voltage
Collector cutoff current ICBO
Emitter cutoff current IEBO
DC current transfer ratio hFE*1
—
—
—
—
—
0.5
0.5
500
0.2
—
—
—
—
—
0.5
0.5
µA
VCB =18 V, IE = 0
—
—
VEB = 2 V, IC = 0
100
—
100
—
VCE = 12 V, IC = 2 mA
10 mA, IB = 1 mA
Collector to emitter
saturation voltage
VCE(sat)
Base to emitter voltage VBE
Gain bandwidth product fT
—
—
—
0.67 0.75
—
2 V, IC = 2 mA
230
1.8
—
E = 12 V, IC = 2 mA
Collector output
capacitance
Cob
NF
hie
3.5
VCB = 10 V, IE = 0,
f = 1 MHz
Noise figure
—
—
3
—
—
dB
VCE = 6 V, IC = 0.1 mA,
f = 120 Hz, Rg = 500 Ω
Small signal input
impedance
—
70
—
—
—
—
kΩ
VCE = 5V, IC = 0.1mA,
f = 270 Hz
Small signal voltage
feedback ratio
hre
× 10–6
Small signal current
transfer ratio
130
11.0
Small signal output
admittance
µS
Note: 1. The are grouped by hFE as follows.
B
D
2SC458 (LG) 100 to 2
320
to 320
250 to 500
—
2SC2310
100 to 200
2SC458 (LG), 2SC2310
Typical Output Characteristics
Maximum Collector Dissipation Curve
10
8
300
200
100
6
4
20
10 µA
2
IB = 0
0
5
15
20
25
0
50
100
150
Cololtage VCE (V)
Ambient Temperature Ta (°C)
atio vs.
ent
Typical Transfer Characteristics
VCE = 12 V
00
0
5
4
3
2
1
0
0.2
0.03
0.1
0.3
1.0
3
10
30
B
Collector Current IC (mA)
2SC458 (LG), 2SC2310
Small Signal Current Transfer Ratio vs.
Collector Current
Base to Emitter Voltage vs.
Ambient Temperature
300
200
100
0
0.9
0.8
0.7
0.6
0.5
0.4
f = 270 Hz
VCE = 12 V
VCE = 12 V
IC = 2 mA
0.03
0.1
0.3
1.0
3
10
30
–20
40
60
80
Collector Current IC (mA)
Ta (°C)
tance vs.
Voltage
Collector Output Capacitance vs.
Collector to Base Voltage
2
1
5
4
3
2
1
IC = 0
f = 1 MHz
IE = 0
f = 1 MHz
0
0
2
4
6
8
10
20
Emitter to Base Voltage VEB (V)
)
2SC458 (LG), 2SC2310
Contours of Constant Noise Figure
Contours of Constant Noise Figure
8
10
5
10
5
14
12
VCE = 6 V
4
f = 1 kHz
10
8
3
2
2
NF = 0.5 dB
NF = 1dB
2
1.0
1.0
1.0
6
3
2
0.5
0.5
4
6
3
0.2
0.1
0.2
0.1
4
VCE = 6 V
f = 120 Hz
8
8
0.05 0.1 0.2
0.5
1.0 2.0
0.05
0.5
1.0 2.0
Collector Current IC (mA)
IC (mA)
Contours of Constant Noise Figure
4
y
10
5
10
2
VCE = 6 V
f = 10 kHz
1
2
1.0
1
0.5
2
4
0.2
0.1
0
0.05 0.1
30
100
300
1k
3k
10k
30k
C
Frequency f (Hz)
2SC458 (LG), 2SC2310
Noise Figure vs. Collector to Emitter Voltage
8
6
IC = 0.1 mA
Rg = 500 Ω
f = 120 Hz
4
2
0
1
2
5
10
20
Collector to Emitter Voltage VCE
h Parameter vs. Collector Current
100
50
IC = 0.1 mA
f = 270 Hz
VCE = 6 V
f = 270 Hz
20
10
5
hoe
hie
h
h
2
r
h
re
fe
1.0
0.5
hoe
0.2
0.1
hoe
hre
hfe
hie
.0 hfe
hie
0.05
0.02
0.01
0.8
0.5
0.0
1.0
2
5
10
20
Collector to Emitter Voltage VCE (V)
2SC458 (LG), 2SC2310
Package Dimensions
As of January, 2001
Unit: mm
4.8 ± 0.4
3.8 ± 0.4
0.60 Max
0.55Max
Hitachi Code
JEDEC
EIAJ
TO-92 (1)
Conforms
Conforms
0.25 g
Mass (reference value)
2SC458 (LG), 2SC2310
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combusntrol, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranitachi particularly
for maximum rating, operating supply voltage range, heat radlation
conditions and other characteristics. Hitachi bears no respwhen used
beyond the guaranteed ranges. Even within the guaranforeseeable
failure rates or failure modes in semiconductor devires such as fail-
safes, so that the equipment incorporating Hitachinjury, fire or other
consequential damage due to operation of the
5. This product is not designed to be radiatio
6. No one is permitted to reproduce or dor part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office fdocument or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor &
Nippon Bldg., 2-6-0004, Japan
Tel: Tokyo (03) 3270
URL
NorthAmer
Europe
Asia
nductor.hitachi.com/
.hitachi-eu.com/hel/ecg
apac.hitachi-asia.com
Japan
www.hitachi.co.jp/Sicd/indx.htm
For further information write
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive, Dornacher Straβe 3
Hitachi Europe GmbH
Electronic Components Group
Hitachi Asia Ltd.
Hitachi Tower
16 Collyer Quay #20-00,
Singapore 049318
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower,
San Jose,CA 95134
D-85622 Feldkirchen, Munich
World Finance Centre,
Tel: <1> (408) 433-1990 Germany
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Tel : <65>-538-6533/538-8577
Fax : <65>-538-6933/538-3877
URL : http://www.hitachi.com.sg
Harbour City, Canton Road
Tsim Sha Tsui, Kowloon,
Hong Kong
Tel : <852>-(2)-735-9218
Fax : <852>-(2)-730-0281
URL : http://www.hitachi.com.hk
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Hitachi Asia Ltd.
(Taipei Branch Office)
4/F, No. 167, Tun Hwa North Road,
Hung-Kuo Building,
Taipei (105), Taiwan
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 585160
Tel : <886>-(2)-2718-3666
Fax : <886>-(2)-2718-8180
Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0
相关型号:
©2020 ICPDF网 联系我们和版权申明