3803L-SC

更新时间:2025-06-30 09:04:29
品牌:RENESAS
描述:(Spec.L) Standard characteristics

3803L-SC 概述

(Spec.L) Standard characteristics ( Spec.L )的标准特性

3803L-SC 数据手册

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3803 Group (Spec.L)  
Standard characteristics  
1 Standard characteristics  
Standard characteristics described below are just examples of the 3803 Group (spec. L)’s characteristics  
and are not guaranteed. For rated values, refer to “Electrical characteristics” of Datasheet.  
1.1 Mask ROM version power source current standard characteristics  
High-speed mode (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
16.8MHz  
12.5MHz  
8.4MHz  
4.2MHz  
2.1MHz  
Fig. 1 Mask ROM version power source current standard characteristics (in high-speed mode)  
Middle-speed mode (TYP, 25 °C)  
[φ = XIN/8, XCIN = stopped]  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc (V)  
16.8MHz  
12.5MHz  
8.4MHz  
6.3MHz  
Fig. 2 Mask ROM version power source current standard characteristics (in middle-speed mode)  
Page 1 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Low-speed mode (TYP, 25 °C)  
[φ = stopped, XCIN = 32.768 kHz]  
100.0  
80.0  
60.0  
40.0  
20.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc (V)  
32.768kHz  
Fig. 3 Mask ROM version power source current standard characteristics (in low-speed mode)  
High-speed mode, WAIT state (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
16.8MHz  
Fig. 4 Mask ROM version power source current standard characteristics (in high-speed mode,  
f(XIN) = 16.8 MHz, WAIT state)  
Page 2 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Middle-speed mode, WAIT state (TYP, 25 °C)  
[φ = XIN/8, XCIN = stopped]  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
16.8MHz  
Fig. 5 Mask ROM version power source current standard characteristics (in middle-speed mode,  
f(XIN) = 16.8 MHz, WAIT state)  
Low-speed mode, WAIT state (TYP, 25 °C)  
[φ = stopped, XCIN = 32.768 kHz]  
50.0  
40.0  
30.0  
20.0  
10.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
32.768kHz  
Fig. 6 Mask ROM version power source current standard characteristics (in low-speed mode,  
WAIT state)  
Page 3 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
High-speed mode, A-D converter operating (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
10.0  
8.0  
6.0  
4.0  
2.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
16.8MHz  
Fig. 7 Mask ROM version power source current standard characteristics (in high-speed mode,  
f(XIN) = 16.8 MHz, A-D converter operating)  
Oscillation stop mode (TYP, 25 °C)  
[STP instruction executing, XIN = stopped, XCIN = stopped]  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
Vcc(V)  
stopped  
Fig. 8 Mask ROM version power source current standard characteristics (at oscillation stopping)  
Page 4 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
1.2 Flash memory version power source current standard characteristics  
High-speed mode (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
8.0  
6.0  
4.0  
2.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
16.8 MHz  
12.5 MHz  
8.4 MHz  
4.2 MHz  
2.1 MHz  
Fig. 9 Flash memory version power source current standard characteristics (in high-speed mode)  
Middle-speed mode (TYP, 25 °C)  
[φ = XIN/8, XCIN = stopped]  
4.0  
3.0  
2.0  
1.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
16.8 MHz  
12.5 MHz  
8.4 MHz  
6.3 MHz  
Fig. 10 Flash memory version power source current standard characteristics (in middle-speed mode)  
Page 5 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Low-speed mode (TYP, 25 °C)  
[φ = XCIN/2, XIN = stopped]  
800.0  
600.0  
400.0  
200.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
32.768 kHz  
Fig. 11 Flash memory version power source current standard characteristics (in low-speed mode)  
High-speed mode, WAIT state (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
8.0  
6.0  
4.0  
2.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
16.8 MHz  
Fig. 12 Flash memory version power source current standard characteristics (in high-speed mode,  
f(XIN) = 16.8 MHz, WAIT state)  
Page 6 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Middle-speed mode, WAIT state (TYP, 25 °C)  
[φ = XIN/8, XCIN = stopped]  
4.0  
3.0  
2.0  
1.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
16.8 MHz  
Fig. 13 Flash memory version power source current standard characteristics (in middle-speed mode,  
f(XIN) = 16.8 MHz, WAIT state)  
Low-speed mode, WAIT state (TYP, 25 °C)  
[φ = XCIN/2, XIN = stopped, XCIN = 32.768 kHz]  
8.0  
6.0  
4.0  
2.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
32.768 kHz  
Fig. 14 Flash memory version power source current standard characteristics (in low-speed mode,  
WAIT state)  
Page 7 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
High-speed mode, A-D converter operating (TYP, 25 °C)  
[φ = XIN/2, XCIN = 32.768 kHz]  
8.0  
6.0  
4.0  
2.0  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
V
CC(V)  
16.8 MHz  
Fig. 15 Flash memory version power source current standard characteristics (in high-speed mode,  
f(XIN) = 16.8 MHz, A-D converter operating)  
Oscillation stop mode (TYP, 25 °C)  
[STP instruction executing, XIN = stopped, XCIN = stopped]  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
Vcc (V)  
Stopped  
Fig. 16 Flash memory version power source current standard characteristics (at oscillation stopping)  
Page 8 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
1.3 Mask ROM version port standard characteristics  
Port P60 IOH–VOH characteristics (P-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P2, P30, P31, P34–P37, P4, P5, P6)  
–50  
–45  
–40  
–35  
–30  
IOH  
[mA]  
Vcc = 5V  
–25  
–20  
–15  
–10  
–5  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
VOH[V]  
Fig. 17 CMOS output port P-channel side characteristics (Ta = 25 °C)  
Port P60 IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P3, P4, P5, P6)  
50  
45  
40  
35  
30  
Vcc = 5V  
IOL  
[mA]  
25  
20  
15  
10  
5
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OL[V]  
V
Fig. 18 CMOS output port N-channel side characteristics (Ta = 25 °C)  
Page 9 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Port P3  
2
IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P3 , P3  
2
3)  
50  
45  
40  
35  
30  
Vcc = 5 V  
IOL  
[mA]  
25  
20  
15  
10  
5
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OL[V]  
V
Fig. 19 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C)  
Port P2  
0
IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P2)  
100  
90  
80  
70  
60  
Vcc = 5 V  
IOL  
[mA]  
50  
40  
30  
20  
10  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OL[V]  
V
Fig. 20 CMOS large current output port N-channel side characteristics (Ta = 25 °C)  
Page 10 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Port P60 IIL–VIL characteristics (at pull-up) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P2, P30, P31, P34–P37, P4, P5, P6)  
–400  
–360  
–320  
–280  
–240  
IIL  
[mA]  
–200  
–160  
–120  
–80  
Vcc = 5 V  
Vcc = 3 V  
–40  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
IL[V]  
V
Fig. 21 CMOS input port at pull-up characteristics (Ta = 25 °C)  
Page 11 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
1.4 Flash memory version port standard characteristics  
Port P60 IOH–VOH characteristics (P-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P2, P30, P31, P34–P37, P4, P5, P6)  
–50  
–45  
–40  
–35  
Vcc = 5.0 V  
Vcc = 4.0V  
–30  
I
OH  
[mA]  
–25  
–20  
–15  
–10  
Vcc = 2.7V  
–5  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OH [V]  
V
Fig. 22 CMOS output port P-channel side characteristics (Ta = 25 °C)  
Port P60 IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P3, P4, P5, P6)  
50  
45  
40  
35  
30  
Vcc = 5.0 V  
IOL  
[mA]  
Vcc = 4.0 V  
25  
20  
15  
10  
Vcc = 2.7 V  
5
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OL[V]  
V
Fig. 23 CMOS output port N-channel side characteristics (Ta = 25 °C)  
Page 12 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Port P32 IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P32, P33)  
50  
45  
40  
35  
30  
Vcc = 5.0 V  
IOL  
[mA]  
Vcc = 4.0 V  
25  
20  
15  
10  
Vcc = 2.7 V  
5
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
VOL[V]  
Fig. 24 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C)  
Port P2  
0
IOL–VOL characteristics (N-channel drive) [Ta = 25 °C]  
(Same characteristics pins: P2)  
100  
90  
80  
70  
60  
Vcc = 5.0 V  
Vcc = 4.0 V  
IOL  
[mA]  
50  
40  
30  
20  
Vcc = 2.7 V  
10  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
OL[V]  
V
Fig. 25 CMOS large current output port N-channel side characteristics (Ta = 25 °C)  
Page 13 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
Port P60 IIL–VIL characteristics (at pull-up) [Ta = 25 °C]  
(Same characteristics pins: P0, P1, P2, P30, P31, P34–P37, P4, P5, P6)  
–400  
–360  
–320  
Vcc = 6.0 V  
Vcc = 5.0 V  
–280  
–240  
IIL  
[mA]  
–200  
–160  
–120  
–80  
Vcc = 3.0 V  
–40  
0
0
0.5 1.0  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
IL[V]  
V
Fig. 26 CMOS input port at pull-up characteristics (Ta = 25 °C)  
Page 14 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
1.5 A-D conversion standard characteristics  
Figure. 27 and Figure. 28 show the mask ROM version A-D conversion standard characteristics. Figure.  
29, Figure. 30, and Figure. 31 show the flash memory version A-D conversion standard characteristics.  
The thick lines of the graph indicate the absolute precision errors, These are expressed as the deviation  
from the ideal value when the output code changes. For example, the change in output code from 512 to  
513 should occur at 2560 mV, but the measured value is –1.0 mV. Accordingly, the measured point of  
change is 2560 – 1.0 = 2559 mV.  
The thin lines of the graph indicate the input voltage width for which the output code is constant. For  
example, the measured input voltage width for which the output code is 512 is 5.0 mV, so that the  
differential non-linear error is 5.0 – 5.0 = 0.0 mV (0 LSB).  
Page 15 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039MFL-001SP A-D CONV. ERROR & STEP WIDTH  
V
X
DD = 5.12 [V], VREF = 5.12 [V]  
IN = 8 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 27 Mask ROM version A-D conversion standard characteristics (f(XIN) = 8 MHz)  
Page 16 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039MFL-001SP A-D CONV. ERROR & STEP WIDTH  
V
X
DD = 5.12 [V], VREF = 5.12 [V]  
IN = 12 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 28 Mask ROM version A-D conversion standard characteristics (f(XIN) = 12 MHz)  
Page 17 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039FFLSP A-D CONV. ERROR & STEP WIDTH  
V
X
DD = 5.12 [V], VREF = 5.12 [V]  
IN = 8 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 29 Flash memory version A-D conversion standard characteristics (f(XIN) = 8 MHz)  
Page 18 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039FFLSP A-D CONV. ERROR & STEP WIDTH  
V
X
DD = 5.12 [V], VREF = 5.12 [V]  
IN = 12 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 30 Flash memory version A-D conversion standard characteristics (f(XIN) = 12 MHz)  
Page 19 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039FFLSP A-D CONV. ERROR & STEP WIDTH  
V
X
DD = 5.12 [V], VREF = 5.12 [V]  
IN = 16 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 31 Flash memory version A-D conversion standard characteristics (f(XIN) = 16 MHz)  
Page 20 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
1.6 D-A conversion standard characteristics  
Figure. 32 shows the mask ROM version D-A conversion standard characteristics. Figure. 33 shows the  
flash memory version D-A conversion standard characteristics.  
M38039MFL-001SP D-A CONV. STEP WIDTH MEASUREMENT  
V
X
CC = 5.12 [V], VREF = 5.12 [V]  
IN = 16 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
30  
20  
30  
20  
10  
0
10  
0
-10  
-20  
-30  
-10  
-20  
-30  
0
8
16  
24  
32  
40  
48  
56  
64  
72  
80  
88  
96  
104  
112  
120  
128  
STEP No.  
30  
20  
30  
20  
10  
0
10  
0
-10  
-20  
-30  
-10  
-20  
-30  
128  
136  
144  
152  
160  
168  
176  
184  
192  
200  
208  
216  
224  
232  
240  
248  
256  
STEP No.  
Fig. 32 Mask ROM version D-A conversion standard characteristics (revised in rev. 2.00)  
Page 21 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
3803 Group (Spec.L)  
Standard characteristics  
M38039FFLSP D-A CONV. STEP WIDTH MEASUREMENT  
V
X
CC = 5.12 [V], VREF = 5.12 [V]  
IN = 16 [MHz], Ta = 25 [deg.]  
Error  
1 LSB Width  
Fig. 33 Flash memory version D-A conversion standard characteristics  
Page 22 of 22  
REJ99B1814-0200/Rev2.00  
September 2009  
To our customers,  
Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
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Renesas Electronics document. We appreciate your understanding.  
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April 1st, 2010  
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Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual  
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.  
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-  
crime systems; safety equipment; and medical equipment not specifically designed for life support.  
“Specific”:  
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or  
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare  
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.  
8.  
9.  
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,  
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation  
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or  
damages arising out of the use of Renesas Electronics products beyond such specified ranges.  
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have  
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,  
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to  
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a  
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire  
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because  
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system  
manufactured by you.  
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental  
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable  
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS  
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with  
applicable laws and regulations.  
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas  
Electronics.  
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this  
document or Renesas Electronics products, or if you have any other inquiries.  
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-  
owned subsidiaries.  
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.  

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