3803L_08

更新时间:2025-07-03 09:04:29
品牌:RENESAS
描述:8-bit MICROCOMPUTER 38000 Series

3803L_08 概述

8-bit MICROCOMPUTER 38000 Series 8位单片机系列38000

3803L_08 数据手册

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8
-bit MICROCOMPUTER 38000 Series  
- Differences Between The 3803L Group/3803H Group/3803 Group -  
©2008. Renesas Technology Corp., All rights reserved.  
REJ99B0048-0401  
3803L/3803H/3803 Groups Products  
RAM  
size  
ROM  
size  
ROM  
size  
RAM  
size  
3803L Group Part Number  
3803H Group Part Number  
M38039MFL-XXXSP/HP/KP/WG  
(*1)  
60 K  
60 K  
2048  
M38039G4H-XXXHP/KP  
16 K  
24 K  
32 K  
48 K  
16 K  
24 K  
32 K  
48 K  
16 K  
24 K  
32 K  
48 K  
60 K  
2048  
M38039G6H-XXXHP/KP  
M38039G8H-XXXHP/KP  
M38039FFLSP/HP/KP/WG (*1)  
M38039GCH-XXXHP/KP/WG  
M38039G4HSP/HP/KP  
*1: 3803L features  
M38039G6HSP/HP/KP  
- Reduced current consumption in 32 kHz(low-speed) wait mode  
(Flash memory version)  
- Reduced EMI (unwanted radiation) noise level  
M38039G8HSP/HP/KP  
M38039GCHSP/HP/KP/WG  
M38034M4H-XXXSP/FP/HP/KP (*2)  
M38037M6H-XXXSP/FP/HP/KP (*2)  
M38037M8H-XXXSP/FP/HP/KP (*2)  
M38039MCH-XXXSP/FP/HP/KP (*2)  
RAM  
ROM  
640  
3803 Group Part Number  
size  
size  
16 K  
24 K  
32 K  
48 K  
60 K  
1024  
M38034M4-XXXSP/FP/HP (*2)  
M38037M6-XXXSP/FP/HP (*2)  
M38037M8-XXXSP/FP/HP (*2)  
M38039MC-XXXSP/FP/HP (*2)  
M38039MF-XXXSP/FP/HP (*2)  
640  
1024  
2048  
2048  
M38039MFH-XXXSP/FP/HP/KP/WG  
(*2)  
2048  
M38039FFHSP/FP/HP/KP/WG (*2)  
60 K  
M38039FFSP/FP/HP (*2)  
60 K  
*2: Recommended to replace. Please refer to page 22.  
©2008. Renesas Technology Corp., All rights reserved.  
2
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
3803L/3803H/3803 Groups Pin Configuration (SP)  
Completely  
VCC  
VREF  
AVSS  
1
2
3
4
5
6
7
8
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
P30/DA1  
P31/DA2  
P32  
Pin Compatible  
P67/AN7  
P66/AN6  
P65/AN5  
P64/AN4  
P63/AN3  
P62/AN2  
P61/AN1  
P60/AN0  
P33  
P34/RXD3  
P35/TXD3  
P36/SCLK3  
P37/SRDY3  
P00/AN8  
P01/AN9  
P02/AN10  
P03/AN11  
P04/AN12  
P05/AN13  
P06/AN14  
P07/AN15  
P10/INT41  
P11/INT01  
P12  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
P57/INT 3  
P5 6/PWM  
P55/CNTR 1  
P54/CNTR 0  
P53/SRDY2  
P52/SCLK2  
P51/SOUT2  
P50/SIN2  
P47/SRDY1 /CNTR 2  
P46/SCLK1  
P45/TXD1  
P44/RXD1  
P4 3/INT 2  
P4 2/INT 1  
P13  
P14  
P15  
P16  
P17  
P20(LED 0)  
P21(LED 1)  
P22(LED 2)  
P23(LED 3)  
P24(LED 4)  
P25(LED 5)  
P26(LED 6)  
P27(LED 7)  
CNV SS  
RESET  
P41/INT 00 /XCIN  
VPP  
P40/INT 40 /XCOUT  
XIN  
XOUT  
VSS  
Outline SP: PRDP0064BA-A (64P4B) (1.78 mm pitch)  
©2008. Renesas Technology Corp., All rights reserved.  
3
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
3803L/3803H/3803 Groups Pin Configuration (FP/HP/KP)  
Note: KP for 3808H/3803L Groups only.  
FP for 3803/3803H Groups  
Completely  
(Mask/Flash memory versions) only.  
Pin Compatible  
P37/SRDY3  
P36/SCLK3  
P35/TXD3  
P34/RXD3  
P33  
P32  
P31/DA2  
P30/DA1  
49  
50  
51  
52  
53  
54  
55  
56  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
P20(LED0)  
P21(LED1)  
P22(LED2)  
P23(LED3)  
P24(LED4)  
P25(LED5)  
P26(LED6)  
P27(LED7)  
M3803XMXH-XXXFP/HP/KP  
M38039MFL-XXXHP/KP  
M3803XMX-XXXFP/HP  
M38039FFHFP/HP/KP  
M38039FFLHP/KP  
M38039FFFP/HP  
M38039GXH-XXXHP/KP  
M38039GXHHP/KP  
VCC  
VREF  
AVSS  
57  
58  
59  
60  
61  
62  
63  
64  
VSS  
XOUT  
XIN  
P40/INT40/XCOUT  
P41/INT00/XCIN  
P67/AN7  
P66/AN6  
P65/AN5  
P64/AN4  
P63/AN3  
20  
19  
18  
17  
RESET  
CNVSS  
P42/INT1  
VPP  
Outline KP: PLQP0064GA-A (64P6U-A) (0.8 mm pitch, 14 mm square, 1.7 mm mounting height)  
FP: PRQP0064GA-A (64P6N-A) (0.8 mm pitch, 14 mm square, 3.05 mm mounting height)  
HP: PLQP0064KB-A (64P6Q-A) (0.5 mm pitch, 10 mm square, 1.7 mm mounting height)  
©2008. Renesas Technology Corp., All rights reserved.  
4
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
3803L/3803H Groups Pin Configuration (WG)  
Completely  
(TOP view)  
A
B
C
D
E
F
G
H
Pin Compatible  
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
50  
46  
P02/AN10  
44  
41  
P07/AN15  
40  
32  
31  
30  
P25 (LED0)  
P21 (LED1)  
P22 (LED2)  
P10/INT41  
P36/SCLK3  
P04/AN12  
The pin number  
corresponds to  
the flat package.  
30  
51  
47  
45  
42  
39  
27  
29  
28  
P22 (LED2)  
P35/TxD3 P01/AN9 P03/AN11 P06/AN14 P11/INT01 P25 (LED5) P23 (LED3) P24 (LED4)  
53  
P33  
52  
48  
43  
38  
P12  
37  
P13  
26  
P26 (LED6)  
25  
P27 (LED7)  
P34/RxD3 P00/AN8 P05/AN13  
56  
55  
54  
P32  
49  
P37/SRDY3  
33  
P17  
36  
P14  
35  
P15  
34  
P16  
P30/DA1 P31/DA2  
Package top view  
1
P62/AN2  
64  
P63/AN3  
58  
VREF  
59  
AVss  
57  
VCC  
24  
VSS  
22  
XIN  
23  
XOUT  
M38039GCH  
-XXXWG  
M38039GCHWG  
M38039MFH  
-XXXWG  
M38039MFL  
-XXXWG  
M38039FFHWG  
M38039FFLWG  
60  
61  
4
7
12  
14  
21  
20  
P41/INT40/XCIN  
P67/AN7  
P66/AN6  
P57/INT3  
P45/TxD1  
P54/CNTR0  
P47/SRDY1/CNTR2  
P40/INT40/XCOUT  
62  
P65/AN5  
63  
P64/AN4  
5
8
10  
P51/SOUT2  
13  
17  
19  
RESET  
P56/PWM  
P46/SCLK1 P42/INT1  
P53/SRDY2  
2
3
6
9
11  
15  
16  
18  
CNVSS  
H
P61/AN1 P60/AN0 P55/CNTR1 P52/SCLK2 P50/SIN2  
P44/RxD1 P43/INT2  
A
B
C
D
E
F
G
Outline WG: PTLG0064JA-A (64F0G) (6 mm square FLGA package, 1.05 mm height)  
©2008. Renesas Technology Corp., All rights reserved.  
5
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Differences Between 3803L/3803H/3803 Groups (1)  
3803L Group  
3803H Group  
3803 Group  
Flash Memory ver.  
Mask ROM ver.  
Flash Memory ver.  
Mask ROM ver.  
Flash Memory ver.  
QzROM ver.  
QzROM  
Mask ROM ver.  
Program Memory  
Mask ROM  
60K/2K  
Flash memory  
60K/2K  
Mask ROM  
Flash memory  
60K/2K  
Mask ROM  
Flash memory  
Program Memory  
/RAM size  
16K/640, 24K/1K,  
32K/1K, 48K/2K,  
16K/2K, 24K/2K,  
32K/2K, 48K/2K  
16K/640, 24K/1K, 60K/2K  
32K/1K, 48K/2K,  
60K/2K  
60K/2K  
Package  
SP, HP, KP, WG  
1.8 to 5.5 V  
SP, HP, KP, WG  
2.7 to 5.5 V  
SP, FP, HP, KP,  
WG  
SP, FP, HP, KP, WG  
2.7 to 5.5V  
SP, HP, KP, WG  
1.8 to 5.5 V  
SP, FP, HP  
2.7 to 5.5 V  
SP,FP,HP  
Operating Power  
Source Voltage  
1.8 to 5.5 V  
4.0 to 5.5V  
2.0 to 5.5 V  
(8-bit A/D mode)  
2.2 to 5.5 V  
2.7 to 5.5 V  
(8-bit A/D mode)  
2.7 to 5.5 V  
2.0 to 5.5 V  
(8-bit A/D mode)  
2.2 to 5.5 V  
2.7 to 5.5V  
(8-bit A/D mode)  
2.7 to 5.5 V  
2.0 to 5.5 V  
(8-bit A/D mode)  
2.2 to 5.5 V  
2.7 to 5.5 V  
(8-bit A/D mode)  
2.7 to 5.5 V  
4.0 to 5.5V  
(8-bit A/D mode)  
4.0 to 5.5 V  
Power Source Voltage  
When using A/D  
Converter  
(10-bit A/D mode) (10-bit A/D mode)  
(10-bit A/D mode)  
(10-bit A/D mode)  
(10-bit A/D mode)  
(10-bit A/D mode) (10-bit A/D mode)  
Flash Memory ID  
Code  
Addresses FFD4 to  
FFDAh  
Addresses FFD4 to  
FFDAh  
Flash Memory ROM  
Code Protect  
Address FFDBh  
Address FFDBh  
QzROM ROM Code  
Protect  
Address FFDBh  
Flash Memory control  
registers 0 to 2  
Addresses 0FE0h to  
0FE2h  
Flash Memory control  
registers 0 to 2  
Addresses 0FE0h to  
0FE2h  
Flash Memory control  
register Address 0FFEh  
Flash command register  
Address 0FFFh  
Flash Memory Control  
Register  
Program/Erase  
Power Source  
Single power source  
(Vcc = 2.7 to 5.5 V)  
Single power source  
(Vcc = 2.7 to 5.5 V)  
Dual power source  
(Vcc = 2.7 V to 5.5 V,  
Vpp = 7.9 V ± 0.1 V)  
Dual power source  
(Vcc = 5 V ± 0.5 V,  
Vpp = 11.7 to 12.6 V)  
(Program-only for  
QzROM ver.)  
Program/Erase Mode  
CPU Rewrite Mode  
Parallel I/O Mode  
Standard serial I/O Mode  
CPU Rewrite Mode  
Parallel I/O Mode  
Standard serial I/O  
Mode  
CPU Rewrite Mode  
Parallel I/O Mode  
Standard serial I/O Mode  
Serial I/O mode  
(Program-only for  
QzROM ver.)  
©2008. Renesas Technology Corp., All rights reserved.  
6
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Differences Between 3803L/3803H/3803 Groups (2)  
3803L Group  
3803H Group  
3803 Group  
Flash Memory ver.  
Mask ROM ver.  
Flash Memory ver.  
Mask ROM ver.  
Flash Memory ver.  
QzROM ver.  
Mask ROM ver.  
0 when reading  
0 when reading  
0 when reading  
0 when reading  
A/D Converter  
0 when reading  
(*1)  
Same as bit 4 of  
AD Conversion  
Register 2 (*1)  
0 when reading  
(*1)  
Bit 4 of AD Conversion  
Register 2  
Time until Flash Memory  
can Operate after  
Needed: 100 μsec  
Needed: 100 μsec  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Not needed  
Returning from Stop Mode  
Power Source Circuit  
Characteristics  
Needed  
Needed  
Internal Power Source  
Stable Time at Power-on  
: td (P-R)  
Electrical Characteristics  
Recommended Operating  
Conditions  
The power source current of the Flash memory version differs between the Groups. Also, the operating conditions differs according to different operating  
voltages.  
For details, refer to the corresponding datasheet.  
*1: Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).  
©2008. Renesas Technology Corp., All rights reserved.  
7
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Improvement in 3803H (L) & 3803 Groups Operating Frequency Characteristics  
Flash memory version  
Mask & QzROM versions  
f (Xin)  
f (Xin)  
High-speed mode  
High-speed mode  
16.8 MHz  
16.8 MHz  
12.5 MHz  
12.5 MHz  
8.4 MHz  
8.4 MHz  
Spec.H  
Spec.L  
Spec.H  
Standard  
Spec.L  
Standard  
4.2 MHz  
2.1 MHz  
2.2 V 2.7 V  
4.0 V4.5 V 5.5 V  
2.7 V  
4.0 V 4.5 V 5.5 V  
2.0 V  
Vcc  
Vcc  
f (Xin)  
Middle-speed mode  
f (Xin)  
Middle-speed mode  
16.8 MHz  
16.8 MHz  
12.5 MHz  
12.5 MHz  
Spec.H  
Standard  
Spec.L  
8.4 MHz  
6.3 MHz  
Standard  
Spec.H  
Spec.L  
1.8 V 2.2 V 2.7 V  
4.0 V4.5 V 5.5 V  
2.7 V  
4.0 V4.5 V 5.5 V  
Vcc  
Vcc  
©2008. Renesas Technology Corp., All rights reserved.  
8
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Differences Between Memory Maps of 3803L/3803H/3803 Groups  
Flash memory version  
3803 Group  
Flash memory version  
3803L, 3803H Group  
Qz-ROM version  
Mask ROM version  
000016  
004016  
000016  
000016  
000016  
004016  
SFR area  
SFR area  
SFR area  
SFR area  
004016  
004016  
010016  
010016  
010016  
010016  
RAM  
083F16  
083F16  
XXXX16  
083F16  
RAM size XXXX  
Not used  
Not used  
Not used  
Not used  
640  
02BF  
0FE016  
0FF616  
0FF016  
0FFF16  
0FE016  
0FF616  
0FE016  
0FF616  
SFR (incl. Reservation)  
SFR (incl. Reservation)  
Not used  
SFR (incl. Reservation)  
Not used  
SFR (incl. Reservation)  
1024  
2048  
043F  
083F  
Not used  
Not used  
YYYY16  
ZZZZ16  
100016  
ZZZZ16  
YYYY16  
ZZZZ16  
100016  
ZZZZ16  
Reserved ROM area  
Reserved ROM area  
ROM  
ROM size YYYY ZZZZ  
16384  
24576  
32768  
49152  
61440  
C000 C080  
A000 A080  
8000 8080  
4000 4080  
1000 1080  
FF0016  
FFD416  
FF0016  
FFD416  
FF0016  
FFD416  
FF0016  
FFD416  
ID code  
FFDA16  
FFDB16  
FFDC16  
FFDA16  
FFDB16  
FFDC16  
FFDA16  
FFDB16  
FFDC16  
FFDA16  
FFDB16  
FFDC16  
Protect address  
Interrupt vector area  
Reserved ROM area  
Protect address  
Interrupt vector area  
Reserved ROM area  
Interrupt vector area  
Reserved ROM area  
Interrupt vector area  
Reserved ROM area  
FFFE16  
FFFF16  
FFFE16  
FFFF16  
FFFE16  
FFFF16  
FFFE16  
FFFF16  
©2008. Renesas Technology Corp., All rights reserved.  
9
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Replacement Notes (1)  
According to the differences in the specifications shown in P.6 and 7, the following notes are suggested.  
Please also refer to P.6 and 7.  
1. Program Memory  
Depending on the memory type, program/erase specifications as well as applicable programmers and adaptors differ.  
Confirm the programmer applicable for your product.  
2. Program Memory/ RAM Sizes  
- As for the combination of the program memory and RAM sizes, the RAM of the QzROM version is 2K regardless of the program  
memory size. Even with the same program memory size, the RAM size may differ between the QzROM/Mask ROM versions.  
- In the QzROM version, 60K program memory is not available.  
3. Packages  
- In the QzROM version, the SP-package product is not available for programming before shipment.  
- The WG-package product is available only with 60K program memory version in the 3803H/3803L Groups.  
- In the 3803H Group QzROM version and the 3803L Group, the FP-package product is not available, but the thin KP package  
product is available for 0.8 mm-pitch.  
Even if the FP package product is available in other products, the KP package is recommended as 0.8 mm-pitch, because of its  
excellence in thinness, heat radiation, and stress characteristics.  
Confirm the mounting pad design standards of FP package and KP package on Renesas Surface Mount Package User's  
Manual (Document No.: REJ11K0001)  
4. Operating Power Source Voltage  
- The operating power source voltage for the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version  
ranges from 1.8 to 5.5V.  
This range differs for other products, so confirm the operating power source voltage for your product.  
5. Power Source Voltage when Using A/D Converter  
- As the operating power source differs, the power source voltage range when using an A/D converter also differs.  
Confirm the voltage when using an A/D converter for your product.  
- In the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version, the power source voltage ranges from  
2.0 to 5.5 V for 8-bit A/D mode, and 2.2 to 5.5 V for 10-bit A/D mode.  
©2008. Renesas Technology Corp., All rights reserved.  
10  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Replacement Notes (2)  
6. Flash Memory ID code and ROM Code Protect  
In the 3803H/3803L Groups Flash memory version, ID codes are assigned to addresses FFD to FFDA16, and ROM code protect is  
assigned to address FFDB16. Please note that these addresses are included in the user ROM area. The data of these addresses must be  
set to programming data before programming.  
7. QzROM ROM Code Protect  
In the QzROM version, ROM code protect is assigned to address FFDB16. If you select write to protect bit with a serial programmer or  
select programming by Renesas Technology before shipment to enable protect, “0016” (all area protected) or “FE16” (protect area 1  
protected) is written into this address. Otherwise, “FF16” is written to this address. The address cannot be used by user programs.  
8. Flash Memory Control Registers  
- In the 3803H/3803L Group Flash memory version, Flash Memory control registers 0 to 2 are assigned to addresses 0FE0 to 0FE216.  
- In the 3803 Group Flash memory version, Flash Memory control register is assigned to address 0FFE16 and Flash command register is  
assigned to address 0FFF16.  
- In the Mask ROM/QzROM versions, nothing is allocated to these addresses, so writing can be performed to them.  
When read, their values are undefined.  
9. Program/Erase Power Source  
The program/erase power source voltage as well as the absolute maximum ratings of the pins differ for each product. Ensure that the  
specified programmer is connected to your product to prevent a voltage that exceeds the ratings from being applied to the pins.  
10. Program/Erase Mode  
In the QzROM version, only serial I/O mode is available in program/erase mode. When requesting off-board programming, please prepare  
a separate board for that purpose. MCU units for serial programming may also be available from the programmer manufacturer.  
11. Time until Flash Memory can Operate after Returning from Stop Mode  
In the 3803H/3803L Group Flash memory version, the internal power supply circuit is switched to low power consumption mode for  
reducing consumption current during STP instruction. Although the internal power supply circuit is automatically switched to the normal  
operation mode when returning from the STP instruction, a certain time is required until the flash memory can operate after the power  
supply restarts. Therefore, set 100 μsec or more by the oscillation stabilization time setting function after the STP instruction which uses  
timer 1 is released.  
©2008. Renesas Technology Corp., All rights reserved.  
11  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Replacement Notes (3)  
12. Internal Power Source Stable Time at Power-on  
In the 3803H/3803L Group Flash memory version, input to the RESET pin at power-on (power-on reset) in the following procedure.  
(1) Input “L” level to RESET pin.  
(2) Increase the power source voltage to 2.7 V.  
(3) Wait for td(P-R) (*1) until internal power source has stabilized.  
(4) Input clock for 16 cycles or more to XIN pin.  
(5) Input “H” level to RESET pin.  
(*1) td(P-R): Internal power source stable time at power-on. Refer to Power Source Circuit timing Characteristics in the data sheet.  
13. Oscillation Circuit Constants  
The oscillation circuit structure differs between the 3803, 3803H, and 3803L Groups.  
This also applies between the 3803H Group Mask ROM/Flash memory versions and the QzROM version.  
Furthermore, the XIN-XOUT and XCIN-XCOUT oscillation circuit constants differ from product to product.  
Contact the oscillator manufacturer to select an appropriate oscillator and oscillation circuit constants  
so that the product used for mass production will obtain an stable operating clock with your system and conditions.  
Additional consideration is required when the voltage range or the temperature range is wide.  
Also, we recommend considering the wiring patterns of the feedback resistors, the damping resistors, and  
the load capacity beforehand when designing circuits.  
14. Differences between Mask ROM, Flash Memory, and QzROM Versions  
The Flash memory, Mask ROM, and QzROM versions differ in their manufacturing processes and mask  
patterns because of the different ROM types used. This also applies when the ROM type is the same but  
the memory capacities differ. Because of these differences, characteristics values, operation margins,  
noise immunity, noise radiation, and oscillation circuit constants may vary.  
When developing application products, perform careful system evaluations for each product.  
Additional care is required when replacing products (for example, replacing a Mask ROM version with a QzROM version).  
Careful system evaluations should be performed with replacement products before the mass production phase of  
application products.  
©2008. Renesas Technology Corp., All rights reserved.  
12  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Program change at replacing (1)  
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.  
Note: Program checksum  
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.  
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and  
calculated values of the checksum are also undefined.  
(1) Standard mask ROM version Æ Spec. L mask ROM version  
Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E  
Rev.2.00).  
(2) Standard flash memory version Æ Spec. L flash memory version  
1. When using the addresses FFD4h to FFDAh, check the followings:  
The codes written in these addresses are the ID codes of the Spec. L flash memory version when using a serial programmer. To input  
this code is necessary as the ID code for flash memory reprogramming by a serial programmer. Check the above only when using a  
serial programmer because the addresses can be executed as an instruction.  
2. The bits 7 to 2 of the address FFDBh are the protect set bits of the Spec. L flash memory version when using a parallel programmer.  
When the set condition is not unexpected, to change a program is necessary. Since the protect set bits do not affect when using a  
serial programmer, there is no problem. This address can be executed as an instruction same as the addresses FFD4h to FFDAh.  
3. When accessing the addresses 0FE0h to 0FEFh, to change a program not to access these addresses is necessary.  
4. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. L flash memory version. To change a program is not necessary  
even if programming in standard flash memory version is performed.  
5. To change a program is necessary when the oscillation stabilization time after the STP instruction is released is less than 100 μ sec in  
stop mode. Set 100 μ sec or more by the oscillation stabilization time setting function after the STP instruction which uses timer 1 is  
released.  
6. When using CPU rewrite mode, to change general processes regarding CPU rewrite mode is necessary.  
(3) Spec. H mask ROM version Æ Spec. L mask ROM version  
Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E  
Rev.2.00).  
©2008. Renesas Technology Corp., All rights reserved.  
13  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Program change at replacing (2)  
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.  
Note: Program checksum  
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.  
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and  
calculated values of the checksum are also undefined.  
(4) Spec. H flash memory version Æ Spec. L flash memory version  
To change a program is not necessary.  
(5) Standard mask ROM version Æ Spec. H QzROM version  
1. QzROM version does not have the ROM 60 Kbytes version.  
2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect  
address. Set this address FFh on a user program.  
3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).  
(6) Standard flash memory version Æ Spec. H QzROM version  
1. QzROM version does not have the ROM 60 Kbytes version.  
2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2  
bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program.  
3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect  
address. Set this address FFh on a user program.  
4. When accessing the addresses 0FE3h to 0FEFh, to change a program not to access these addresses is necessary.  
5. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. H QzROM version. To change a program is not necessary even if  
programming in standard flash memory version is performed.  
6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode.  
7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).  
©2008. Renesas Technology Corp., All rights reserved.  
14  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Program change at replacing (3)  
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product.  
Note: Program checksum  
When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation.  
When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and  
calculated values of the checksum are also undefined.  
(7) Spec. H/L mask ROM version Æ Spec. H QzROM version  
1. QzROM version does not have the ROM 60 Kbytes version.  
2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect  
address. Set this address FFh on a user program.  
3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).  
(8) Spec. H/L flash memory version Æ Spec. H QzROM version  
1. QzROM version does not have the ROM 60 Kbytes version.  
2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2  
bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program.  
3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect  
address. Set this address FFh on a user program.  
4. Although the ID code (addresses FFD4h to FFDAh) does not have any functions in Spec. H QzROM version, to change a program is  
not necessary.  
5. Nothing is assigned on the addresses 0FE0h to 0FE2h of Spec. H QzROM version. To change a program is not necessary even if  
programming in Spec. H/L flash memory version is performed.  
6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode.  
7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).  
©2008. Renesas Technology Corp., All rights reserved.  
15  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Reference: M38039FFH (L) and M38039GXH Serial Rewriting Circuit  
when Using a Suisei Electronics System Serial Unit  
Flash Memory ver.  
Differences  
Note:  
QzROM ver.  
The pin number indicates  
the flat package version.  
M38039FFH  
M38039FFL  
M38039GXH  
(QzROM Programming Mode)  
(Standard serial I/O Mode 1)  
57  
15  
13  
57  
15  
13  
*3  
*2  
T_VDD  
Vcc  
T_VDD  
Vcc  
N.C.  
RXD (P44/RXD1)  
T_TXD  
RXD (P44/RXD1)  
SCLK (P46/SCLK1)  
T_SCLK  
ESCLK (P46/SCLK1)  
T_SCLK  
Note: T_BUSY is not needed.  
Note: T_VPP is not needed.  
12  
T_PGM/OE/MD  
ESPGMB  
12  
T_BUSY  
4.7 kΩ  
14  
(P47/SRDY1/CNTR2)  
BUSY (P47/SRDY1/CNTR2)  
TXD (P45/TXD1)  
CNVSS  
*1  
T_TXD  
T_RXD  
ESDA (P45/TXD1)  
CNVSS  
14  
18  
T_RXD  
18  
T_VPP  
T_PGM/OE/MD  
4.7 kΩ  
T_RESET  
USER RST  
GND  
19  
T_RESET  
RESET(RESET)  
19  
24  
RESET(RESET)  
USER RST  
GND  
24  
Vss  
Vss  
XIN XOUT  
XIN XOUT  
Perform the same pin processing as in single chip mode.  
Perform the same pin processing as in single chip mode.  
z As programming specifications differ for each product, specify the part number before programming.  
z As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash Memory versions.  
*1: For the QzROM version, connect both the serial unit’s T_TXD and T_RXD to TxD pin, and leave RxD pin open.  
*2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer.  
*3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for  
other than the MCU), supply the VDD from the user.  
©2008. Renesas Technology Corp., All rights reserved.  
16  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Reference: M38039FF and M38039FFH (L) Serial Rewriting Circuit  
when Using a Suisei Electronics System Serial Unit  
The pin number indicates  
the flat package version.  
M38039FFH  
Differences  
Note:  
M38039FFL  
M38039FF  
(Standard serial I/O Mode 1)  
(Standard serial I/O Mode)  
57  
15  
13  
*2  
57  
15  
13  
49  
12  
14  
18  
*3  
T_VDD  
Vcc  
T_VDD  
Vcc  
*1  
T_TXD  
T_TXD  
RXD (P44/RXD1)  
SCLK (P46/SCLK1)  
SDA (P44/RXD1)  
SCLK (P46/SCLK1)  
OE (P37/SRDY3)  
BUSY (P47/SRDY1 /CNTR2)  
TXD (P45/TXD1)  
VPP (CNVSS)  
T_RXD  
T_SCLK  
T_SCLK  
T_PGM/OE/MD  
T_BUSY  
12  
T_BUSY  
BUSY (P47/SRDY1/CNTR2)  
TXD (P45/TXD1)  
14  
18  
T_RXD  
N.C.  
T_PGM/OE/MD  
CNVSS  
T_VPP  
Note: T_VPP is not needed.  
T_RESET  
19  
24  
19  
24  
T_RESET  
USER RST  
GND  
RESET(RESET)  
RESET(RESET)  
USER RST  
GND  
Vss  
XIN XOUT  
Vss  
XIN XOUT  
Perform the same pin processing as in single chip mode.  
Perform the same pin processing as in single chip mode.  
z As programming specifications differ for each product, specify the part number before programming.  
z As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash memory versions.  
*1: For the standard version, connect both the serial unit’s T_TXD and T_RXD to SDA (RxD pin), and leave TxD pin open.  
*2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer.  
*3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for  
other than the MCU), supply the VDD from the user.  
©2008. Renesas Technology Corp., All rights reserved.  
17  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Renesas  
3803L/3803H/3803 Groups Development Support Tools  
Except programmers, development support tools are common to the Groups.  
Development Support Tool  
Part Number  
Assembler package  
Compiler Package  
Simulator Debugger  
M3T-SRA74  
(Simulator debugger incl. Integrated Development Environment with HEW)  
M3T-ICC740  
(Simulator debugger incl. Integrated Development Environment with HEW)  
M3T-SRA74, M3T-ICC740 or M3T-PD38SIM accessory (discontinued)  
On-chip Debugging Emulator  
(3803L Group)  
E8a  
(incl. HEW, 740 E8a emulator debugger, M3T-SRA74 free evaluation version,  
M3T-ICC740 free evaluation version, FDT free evaluation version, and more)  
M38000T2-CPE  
Compact  
Compact Emulator  
Emulator  
System  
(incl. 740 Compact emulator debugger, M3T-ICC740 (with HEW), and  
M3T-SRA74 (with HEW) )  
Emulator MCU  
M38049RLSS  
PC4701  
Emulator Debugger  
Emulator  
740 PC4701 emulator debugger or M3T-PD38 (discontinued)  
PC4701U (emulator debugger license bundled)  
M38000TL2-FPD (low voltage operation supported) (discontinued)  
M38049RLSS  
Emulator  
System  
(Discontinued  
Product)  
Emulation Pod  
Emulator MCU  
RSK (Renesas Starter Kit for 3803L)  
R0K338039S001BR  
Accessory  
Package Converter  
Pin processing board  
(Refer to the next page)  
M38007T-ADS (pin processing board for Emulator MCU)  
©2008. Renesas Technology Corp., All rights reserved.  
18  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Connecting Emulator and Target System  
Compact emulator system  
PC4701 System (discontinued)  
Emulation Pod  
M38000TL2-FPD  
(discontinued)  
Compact emulator  
M38000T-CPE  
*Emulator Pod Probe type  
30-pin narrow pitch connector x 1  
*1. This converter is included in Emulator Pod Package.  
*2. These 3 parts are as one set.  
*3. These 4 parts are as one set.  
M3T-28DP-WS *1 M3T-28DP-WT  
*4. Available from Tokyo Eletech Corporation.  
* The z mark indicates the location of No.1 pin.  
RSS type emulator MCU  
M38049RLSS  
FP/KP package board-  
mounted evaluation  
M3T-64DIP-DMS  
HP package sample  
Board-mounted evaluation  
M38007T-PRB  
FP package :  
M3T-64LCC-QSD  
HQPACK064SA  
(Sold Separately) *4  
KP package :  
HQPACK064SA160  
(Sold Separately) *4  
HQPACK064SD  
(Sold Separately) *4  
YQSOCKET064SDF2  
(Sold Separately) *4  
*2  
*3  
64-pin SDIP socket  
(SP package)  
HP package version  
YQPACK064SD  
FP/KP package version  
(Sold Separately) *4  
M3T-DUMMY64  
64-pin 0.8 mm pitch QFP  
(FP package)  
M3T-FLX-64NSA  
64pin  
M3T-64LCC-QSD  
64-pin 0.5 mm pitch QFP  
(HP package)  
0.8 mm pitch QFP/LQFP  
(FP/KP package)  
NQPACK064SD-ND (Sold Separately) *4  
64-pin 0.5 mm pitch QFP  
(HP package)  
©2008. Renesas Technology Corp., All rights reserved.  
19  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
3803H/3803L Groups  
Suisei Electronics System Flash Memory/QzROM Programmers  
Main unit  
Serial/Parallel Unit  
On-board reprogramming/programming  
Off-board reprogramming/programming  
M38039FFH  
M38039FFL  
Flash memory version  
M38039FFH  
M38039FFL  
M38039GXH  
M38039GXH  
QzROM version  
QzROM version  
Flash memory version  
(Parallel programming)  
(Serial  
programming)  
(Serial programming +  
MCU unit for programming)  
(Serial programming)  
EFP-S2V  
EFP-S2  
EF1SRP-01US2  
EF1CNT-96P  
EF1SRP-01US2  
(or EF1CNT-96P  
+ EF1SRP-05U)  
+ Parallel unit  
EF3803F-64H (for HP)  
EF3803F-64F (for FP)  
EF3803F-64U (for KP)  
EF3803F-64S (for SP)  
EF3803F-64FL (for WG)  
in common  
EF1CNT-96P  
+
EF1CNT-96P  
+
+ MCU unit  
MS3803-64H (for HP)  
MS3803-64U (for KP)  
MS3803-64S (for SP)  
EF1SRP-01U  
EF1SRP-05U  
EFP-I  
EF1SRP-01U  
EF1SRP-05U  
Parallel unit  
EF1SRP-05U  
EF3803F-64H (for HP)  
EF3803F-64F (for FP)  
EF3803F-64U (for KP)  
EF3803F-64S (for SP)  
EF3803F-64FL (for WG)  
+ MCU unit  
MS3803-64H (for HP)  
MS3803-64U (for KP)  
MS3803-64S (for SP)  
EF1CNT-96P: Connector converter unit  
Each unit for EFP-I can be connected to EFP-S2 or EFP-S2V by EF1CNT-96P.  
As a Renesas Flash memory/QzROM programmer, the Flash Development Toolkit (FDT) and the E8 can be  
used together for on-board programming. (IC socket boards are required for the QzROM on-board programming.)  
©2008. Renesas Technology Corp., All rights reserved.  
20  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
3803 Group Programmers  
Tools  
3803 Group Products  
RENESAS  
PCA4738HF-64 (for 0.5 mm-pitch LQFP package)  
PCA4738FF-64 (for 0.8 mm-pitch QFP package)  
PCA4738SF-64 (for 1.778 mm-pitch SDIP package)  
EFP-I for Serial Interface  
Programming Adapter  
Flash Memory Programmer  
Available from Suisei Electronics System Co., Ltd.  
R4945, R4945A for Parallel Interface  
Available from ADVANTEST Corp.  
(RENESAS Programming Adapter required)  
AF9709, AF9708, AF9723 for Standard Parallel Interface  
Available from Flash Support Group, Inc.  
(RENESAS Programming Adapter required)  
©2008. Renesas Technology Corp., All rights reserved.  
21  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
Recommended 3803 Group Replacements  
The following 3803 Group products are recommended to  
Applicable Products  
Replacement product  
replace with the products shown as below.  
Please consider these replacements when adopting the  
applicable products to a new system.  
M38034M4H-XXXSP  
M38034M4H-XXXFP  
M38034M4H-XXXHP  
M38034M4H-XXXKP  
M38037M6H-XXXSP  
M38037M6H-XXXFP  
M38037M6H-XXXHP  
M38037M6H-XXXKP  
M38037M8H-XXXSP  
M38037M8H-XXXFP  
M38037M8H-XXXHP  
M38037M8H-XXXKP  
M38039MCH-XXXSP  
M38039MCH-XXXFP  
M38039MCH-XXXHP  
M38039MCH-XXXKP  
M38039MFH-XXXSP  
M38039MFH-XXXFP  
M38039MFH-XXXHP  
M38039MFH-XXXKP  
M38039MFH-XXXWG  
M38039FFHSP  
M38039G4HSP (*1)  
M38039G4H-XXXKP  
M38039G4H-XXXHP  
M38039G4H-XXXKP  
M38039G6HSP (*1)  
M38039G6H-XXXKP  
M38039G6H-XXXHP  
M38039G6H-XXXKP  
M38039G8HSP (*1)  
M38039G8H-XXXKP  
M38039G8H-XXXHP  
M38039G8H-XXXKP  
M38039GCHSP (*1)  
M38039GCH-XXXKP  
M38039GCH-XXXHP  
M38039GCH-XXXKP  
M38039MFL-XXXSP  
M38039MFL-XXXKP  
M38039MFL-XXXHP  
M38039MFL-XXXKP  
M38039MFL-XXXWG  
M38039FFLSP  
Applicable Products  
Replacement product  
M38034M4-XXXSP  
M38034M4-XXXFP  
M38034M4-XXXHP  
M38037M6-XXXSP  
M38037M6-XXXFP  
M38037M6-XXXHP  
M38037M8-XXXSP  
M38037M8-XXXFP  
M38037M8-XXXHP  
M38039MC-XXXSP  
M38039MC-XXXFP  
M38039MC-XXXHP  
M38039MF-XXXSP  
M38039MF-XXXFP  
M38039MF-XXXHP  
M38039FFSP  
M38039G4HSP (*1)  
M38039G4H-XXXKP  
M38039G4H-XXXHP  
M38039G6HSP (*1)  
M38039G6H-XXXK  
M38039G6H-XXXHP  
M38039G8HSP (*1)  
M38039G8H-XXXKP  
M38039G8H-XXXHP  
M38039GCHSP (*1)  
M38039GCH-XXXKP  
M38039GCH-XXXHP  
M38039MFL-XXXSP  
M38039MFL-XXXKP  
M38039MFL-XXXHP  
M38039FFLSP  
M38039FFFP  
M38039FFLKP  
M38039FFHP  
M38039FFLHP  
M38039FFHFP  
M38039FFLKP  
(*1): If requesting writing by Renesas, M38039MFL-XXXSP in the  
3803L Group mask ROM version is recommended as replacement.  
M38039FFHHP  
M38039FFLHP  
M38039FFHKP  
M38039FFLKP  
Please refer to the Differences between the 3803L/3803H/3803  
Groups (P.6 and 7).  
M38039FFHWG  
M38039FFLWG  
©2008. Renesas Technology Corp., All rights reserved.  
22  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
REVISION HISTORY  
Rev.  
Date  
Page  
1
Summary  
4.00  
May 08, 2008  
Title revised  
Page 2 to 4 in the previous version (Rev.3.03) deleted  
2
Table layout revised  
2 to 5  
6
3803L Group Flash memory version: Marks (**) for under development products deleted  
(1) added at end of the page title  
Program/erase power supply of QzROM version: Vcc revised  
7
9
Page added because of new items  
Newly added  
10  
11  
(1) Added at end of the page title  
Page title added  
Item 7: Values to be written for protection added  
Item 11, 12: Added  
12  
Page title added  
Item No. revised according to additions  
13 to 15  
18  
Newly added  
On-chip debugging emulator added  
Renesas Starter Kit for 3803L: Part number added  
19  
PC4701 system: “(discontinued)” added  
Part number revised: NQPACK064SD Æ NQPACK064SD-ND  
Version revised: Flash memory version Æ HP package version, FP/KP package version  
20  
3803L Group Flash memory version: Marks (**) for under development products deleted  
Replacements QzROM version SP package products: Note added  
ROM size in table changed: ZZZZ 1000 Æ 1080  
22  
4.01  
Jun. 16, 2008  
9
10  
Item 3: Information about mounting pad added  
7,13,14,15  
Spec.H QzROM version: “Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-  
A067B/E).” added  
©2008. Renesas Technology Corp., All rights reserved.  
23  
Rev.4.01  
Date: Jul.02.08  
REJ99B0048-0401  
©2008. Renesas Technology Corp., All rights reserved.  
To our customers,  
Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
companies. Therefore, although the old company name remains in this document, it is a valid  
Renesas Electronics document. We appreciate your understanding.  
Renesas Electronics website: http://www.renesas.com  
April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
Send any inquiries to http://www.renesas.com/inquiry.  
Notice  
1.  
2.  
All information included in this document is current as of the date this document is issued. Such information, however, is  
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please  
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to  
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.  
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights  
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.  
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights  
of Renesas Electronics or others.  
3.  
4.  
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.  
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of  
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,  
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by  
you or third parties arising from the use of these circuits, software, or information.  
5.  
When exporting the products or technology described in this document, you should comply with the applicable export control  
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas  
Electronics products or the technology described in this document for any purpose relating to military applications or use by  
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and  
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited  
under any applicable domestic or foreign laws or regulations.  
6.  
7.  
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics  
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages  
incurred by you resulting from errors in or omissions from the information included herein.  
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and  
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as  
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular  
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior  
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for  
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way  
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an  
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written  
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise  
expressly specified in a Renesas Electronics data sheets or data books, etc.  
“Standard”:  
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual  
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.  
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-  
crime systems; safety equipment; and medical equipment not specifically designed for life support.  
“Specific”:  
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or  
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare  
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.  
8.  
9.  
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,  
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation  
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or  
damages arising out of the use of Renesas Electronics products beyond such specified ranges.  
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have  
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,  
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to  
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a  
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire  
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because  
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system  
manufactured by you.  
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental  
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable  
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS  
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with  
applicable laws and regulations.  
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas  
Electronics.  
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this  
document or Renesas Electronics products, or if you have any other inquiries.  
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-  
owned subsidiaries.  
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.  

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