3SK242-T2-V11 [RENESAS]

RF SMALL SIGNAL, FET;
3SK242-T2-V11
型号: 3SK242-T2-V11
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

RF SMALL SIGNAL, FET

文件: 总8页 (文件大小:176K)
中文:  中文翻译
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To our customers,  
Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
companies. Therefore, although the old company name remains in this document, it is a valid  
Renesas Electronics document. We appreciate your understanding.  
Renesas Electronics website: http://www.renesas.com  
April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
Send any inquiries to http://www.renesas.com/inquiry.  
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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
3SK242  
RF AMPLIFIER AND MIXER FOR VHF TV TUNER  
N-CHANNEL Si DUAL GATE MOS FIELD-EFFECT TRANSISTOR  
4 PINS SUPER MINI MOLD  
FEATURES  
PACKAGE DIMENSINS  
(Unit : mm)  
Low Noise Figure : NF = 1.3 dB TYP.  
High Power Gain : Gps = 24 dB TYP. (f = 200 MHz)  
Suitable for use as RF amplifier in VHF TV tuner.  
Small Package : 4 Pins Super Mini Mold  
2.1±0.2  
25±0
ORDERING INFORMATION  
PART  
QUANTITY  
NUMBER  
PACKING STYLE  
3SK242-T1  
3 Kpcs/Reel.  
Embossed tape 8 mm wide.  
Pin3 (Gate2), Pin4 (Gate1) face  
to perforation side of the tape.  
3SK242-T2  
3 Kpcs/Reel.  
Embossed tape 8 mm wide.  
Pin1 (Source), Pin2 (Drain)
to perforation side of thtape
*
Please contact with responsible NEC pesn, if yu require  
evaluation sample. Unit sample quanty shall be 50 pcs.  
(Part No.: 3SK242)  
PIN CONNECTIONS  
1. Source  
2. Drain  
3. Gate2  
4. Gate1  
ABSOLUTE MAXIMUM RTIGS (TA = 25 °C)  
Drain to Source Voltage  
Gate1 to Source Voltag
Gate2 to Source Voltage  
Drain Current  
VDSX  
VG1S  
VG2S  
ID  
20  
V
V
±8  
±8  
V
25  
mA  
mW  
°C  
°C  
Total Power Dissipatn  
Channel Teerare  
Storge Tmperature  
PD  
130*1/250*2  
Tch  
125  
Tstg  
–55 to +125  
ee air  
*2: 15 mm × 15 mm × 1.2 mm board by epoxy glass  
PRECAUTION  
Avoid high static voltages or electric fields so that this device would not suffer from any damage due to those voltage  
or fields.  
Document No. P10577EJ2V0DS00 (2nd edition)  
(Previous No. TD-2311)  
Date Published August 1995 P  
Printed in Japan  
1993  
©
3SK242  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
CHARACTERISTIC  
Drain to Source Breakdown Voltage  
Drain Current  
SYMBOL  
BVDSX  
IDSS  
MIN.  
20  
TYP.  
MAX.  
UNIT  
V
TEST CONDITION  
VG1S = VG2S = –2 V, ID = 10 µA  
VDS = 6 V, VG2S = 3 V, VG1S = 0  
VDS = 8 V, VG2S = 0 , ID = 5 µA  
VDS = 8 V, VG1S = 0, ID = 5 µA  
VDS = 0, VG2S = 0, VG1S = ±8 V  
VDS = 0, VG1S = 0, VG2S = ±8 V  
7.0  
25  
mA  
V
Gate1 to Source Cutoff Voltage  
Gate2 to Source Cutoff Voltage  
Gate1 Reverse Current  
VG1S(off)  
VG2S(off)  
IG1SS  
–2.0  
–1.5  
±20  
±20  
V
nA  
nA  
mS  
Gate2 Reverse Current  
IG2SS  
Forward Transfer Admittance  
|yfs|  
22  
28  
VDS = 6 V, VG2S = 3 V, ID = 10 mA  
f = 1 kHz  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Power Gain  
Ciss  
Coss  
Crss  
Gps  
NF  
4.0  
2.2  
5.0  
2.9  
0.05  
24  
6.5  
3.7  
pF  
pF  
pF  
dB  
dB  
VDS = 6 V, VG2S = V, I= 1mA  
f = 1 MHz  
0.08  
21  
VDS = 10 = 5 V, ID = 10 mA  
f = 20
Noise Figure  
1.3  
2.5  
IDSX Classification  
Rank  
V11/VAA*  
V11  
V12/VAB*  
V12  
V13/VAC*  
V13  
Marking  
IDSS (mA)  
7.0 to 13.0  
11.0 to 19.0  
17.0 to 25.0  
Old Specification / New Specification  
2
3SK242  
TYPICAL CHARACTERISTICS (TA = 25 ˚C)  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
20  
10  
VG2 = 3.0 V  
200  
V
G1S = 0 V  
–0.1  
–0.2  
130 mW  
100  
–0.3  
–0.4  
–0.5  
–0.6  
0
25  
50  
75  
100  
125  
0
10  
VDS – Drain to Source Voltage – V  
20  
T
A
– Ambient Temperature – °C  
DRAIN CURRENT vs.  
GATE1 TO SOURCE VOLTAGE  
FORWARD TRANSFER ADMITTANCE vs.  
GATE1 TO SOURCE VOLTAGE  
20  
oduct  
3
V
4V  
VDS = 6 V  
2
V
V
G2S = 5 V  
1 V  
40  
20  
4 V  
3 V  
10  
2 V  
VG2S = 0  
1 V  
ued Pr  
0 V  
0
+1.0  
–1.0  
0
1.0  
–1.0  
0
V
G1S – Gate1 to Source Voltage – V  
VG1S – Gate1 to Source Voltage – V  
INPUT CAPACITANCE vs.  
GATE2 TO SOURCE VOLTAGE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
30  
25  
20  
15  
10  
5
V
DS = 6.0 V  
f = 1 MHz  
8.0  
6.0  
4.0  
V
G1S = 0, 0.5 V  
V
DS = 6 V  
G2 = 3 V  
2.0  
0
V
Discontin  
f = 1.0 kHz  
0
20  
–1.0  
0
1.0  
2.0  
3.0  
4.0  
10  
I
D
– Drain Current – mA  
VG2S – Gate2 to Source Voltage – V  
3
3SK242  
OUTPUT CAPACITANCE vs.  
GATE2 TO SOURCE VOLTAGE  
NOISE FIGURE vs. DRAIN CURRENT  
f = 200 MH  
5.0  
4.0  
3.0  
2.0  
Z
V
DS = 6.0 V  
V
V
V
V
DS = 10 V  
G2S = 5 V  
DS = 5 V  
f = 1.0 MHz  
4.0  
3.0  
2.0  
1.0  
G2S = 3 V  
VG1S = 0 V  
–0.5 V  
1.0  
0
–1.0  
0
1.0  
2.0  
3.0  
4.0  
0
2
4
6
8
10  
VG2S – Gate2 to Source Voltage – V  
ID – Drain Current – mA  
NOISE FIGURE, POWER GAIN vs.  
GATE2 TO SOURCE VOLTAGE  
f = 200 MH  
Z
DS = 10 V  
DS = 5 V  
V
V
30  
20  
4
G
PS  
3
10  
2
1
0
NF  
–10  
0
–1  
0
1
2
3
4
5
6
7
8
V
G2S – Gate2 to Source Voltage – V  
Gps AND NF TEST CIRCUIT AT f = 200 MHz  
V
G2S  
TEST CONDITION  
000
VDS = 10 V, VG2S = 5 V, ID = 10 mA  
f = 200 MHz  
L1: φ 0.6 mm U.E.W. 7 mm 3T  
L2: φ 0.6 mm U.E.W. 7 mm 3T  
L3: RFC 2.2 µH  
22 k  
1 000 p
Ferrite Beads  
7 pF OUTPUT  
50 Ω  
INP
50 Ω  
L
2
L1  
1 000 pF  
1 000 pF  
15 pF  
200 Ω  
1 000 pF  
15 pF  
L
3
22 kΩ  
1 000 pF  
1 000 pF  
VG1S  
V
DS  
4
3SK242  
[MEMO]  
5
3SK242  
No part of this document may be copied or reproduced in any form or by any means withprior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors whicappear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrr other intellectual  
property rights of third parties by or arising from use of a device described hereor any other liability arising  
from use of such device. No license, either express, implied or otheis ganted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or ot
While NEC Corporation has been making continuous effort to enhance the reliility of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minime risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, mer must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, ani-failure features.  
NEC devices are classified into the following three quality es:  
“Standard“, “Special, and “Specific“. The Specific quality radapplies only to devices developed based on  
a customer designated “quality assurance program“ for a pecific application. The recommended applications  
of a device depend on its quality grade, as indicated blow. Customers must check the quality grade of each  
device before using it in a particular application
Standard: Computers, office equipment, comunications equipment, test and measurement equipment,  
audio and visual equipmnt, hme lectronic appliances, machine tools, personal electronic  
equipment and industrial robts  
Special: Transportation equipmen(automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime stemssafety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerosquipment, submersible repeaters, nuclear reactor control systems, life  
support systems edical equipment for life support, etc.  
The quality grade of NEdevies in Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to uEC devices for applications other than those specified for Standard quality grade,  
they should contct C Sales Representative in advance.  
Anti-radioactivdesign is not implemented in this product.  
M4 94.11  

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