7540 [RENESAS]
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER; 单片8位CMOS微机型号: | 7540 |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER |
文件: | 总88页 (文件大小:858K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
7540 Group
REJ03B0011-0400
Rev.4.00
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
Jun 21, 2004
DESCRIPTION
The 7540 Group is the 8-bit microcomputer based on the 740 fam-
APPLICATION
Office automation equipment, factory automation equipment,
ily core technology.
The 7540 Group has a serial I/O, 8-bit timers, a 16-bit timer, and
an A/D converter, and is useful for control of home electric appli-
ances and office automation equipment.
home electric appliances, consumer electronics, car, etc.
Notes 1: Serial I/O2 can be used in the following cases;
(1) Serial I/O1 is not used,
(2) Serial I/O1 is used as UART and BRG output divided by 16 is
selected as the synchronized clock.
2: In this version, the operating temperature range and total time
are limited as follows;
55 °C to 85 °C: within total 6000 hours,
85 °C to 125 °C: within total 1000 hours.
FEATURES
• Basic machine-language instructions ...................................... 71
• The minimum instruction execution time ......................... 0.34µs
(at 6 MHz oscillation frequency, double-speed mode for the
shortest instruction)
• Memory size ROM............................................ 8 K to 32 K bytes
RAM ............................................. 384 to 768 bytes
• Programmable I/O ports ....................... 29 (25 in 32-pin version)
• Interrupts ................................................. 15 sources, 15 vectors
................................. (14 sources, 14 vectors for 32-pin version)
• Timers ............................................................................. 8-b✕it 4
...................................................................................... 16-b✕it 1
• Serial I/O1 ................... 8-bit✕ 1 (UART or Clock-synchronized)
• Serial I/O2 (Note 1) ..................... 8-bit ✕ 1 (Clock-synchronized)
• A/D converter ............................................... 10-bit✕ 8 channels
.................................................... (6 channels for 32-pin version)
• Clock generating circuit............................................. Built-in type
(low-power dissipation by an on-chip oscillator enabled)
(connect to external ceramic resonator or quartz-crystal oscilla-
tor permitting RC oscillation)
• Watchdog timer ............................................................ 16-bi✕t 1
• Power source voltage
X
IN oscillation frequency at ceramic oscillation, in double-speed mode
At 6 MHz .................................................................... 4.5 to 5.5 V
XIN oscillation frequency at ceramic oscillation, in high-speed mode
At 8 MHz .................................................................... 4.0 to 5.5 V
At 4 MHz .................................................................... 2.4 to 5.5 V
At 2 MHz .................................................................... 2.2 to 5.5 V
XIN oscillation frequency at RC oscillation in high-speed mode or
middle-speed mode
At 4 MHz .................................................................... 4.0 to 5.5 V
At 2 MHz .................................................................... 2.4 to 5.5 V
At 1 MHz .................................................................... 2.2 to 5.5 V
• Power dissipation
Mask ROM version ....................................... 22.5 mW (standard)
One Time PROM version ................................ 30 mW (standard)
• Operating temperature range................................... –20 to 85 °C
(–40 to 85 °C for extended operating temperature version)
(–40 to 125 °C for extended operating temperature 125 °C ver-
sion (Note 2))
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7540 Group
PIN CONFIGURATION (TOP VIEW)
P0
7
1
1
16
15
14
13
12
11
10
9
25
26
27
28
29
30
31
32
P3
P3
P3
P3
P3
4
3
2
1
0
(LED
(LED
(LED
(LED
(LED
4
3
2
1
0
)
)
)
)
)
M37540Mx-XXXGP
M37540MxT-XXXGP
M37540MxV-XXXGP
M37540ExGP
M37540E8T-XXXGP
M37540E8V-XXXGP
P1
P1
0
/R
X
D
D
1
/TX
P1
2
/SCLK1/SCLK2
/SRDY1/SDATA2
P1
3
P1
4
/CNTR
P2 AN
P2 AN
0
V
X
X
SS
0
/
/
0
OUT
IN
1
1
Package type: 32P6U-A
Fig. 1 Pin configuration (32P6U-A type)
1
2
3
4
P1
2
/SCLK1/SCLK2
36
P1
1
/T
X
D
D
1
P1
3
/SRDY1/SDATA2
35
34
P10
/R
X
1
P1
4
/CNTR
0
P0
P0
P0
P0
7
6
5
4
P2
P2
P2
P2
0
1
2
3
/AN
/AN
/AN
/AN
0
1
2
3
33
32
5
6
31
30
29
28
7
P0
3
/TXOUT
8
P0
2
/TZOUT
P2
P2
P2
P2
4
5
6
/AN
/AN
/AN
/AN
4
5
6
9
P0
1
/TYOUT
10
11
12
27
26
P00
/CNTR
1
7
7
P3
P3
P3
P3
P3
P3
P3
P3
7
6
5
4
3
/INT
0
25
24
23
VREF
(LED
(LED
(LED
(LED
(LED
(LED
(LED
6
5
4
3
)/INT
1
13
14
15
16
17
18
)
)
)
)
)
)
RESET
CNVSS
22
21
20
Vcc
X
IN
OUT
SS
2
1
0
2
1
0
X
19
V
Package type: 36P2R-A
Fig. 2 Pin configuration (36P2R-A type)
Rev.4.00 Jun 21, 2004 page 2 of 82
REJ03B0011-0400Z
7540 Group
P1
2
/SCLK1/SCLK2
32
P11
/TXD
1
1
P13
/SRDY1/SDATA2
31
30
P1
0
/R
XD1
2
3
4
P14/CNTR0
P0
P0
P0
P0
7
29
28
P2
0
1
2
/AN
/AN
/AN
/AN
/AN
0
1
2
6
5
P2
P2
P2
P2
5
4
6
7
8
27
26
25
P0
P0
P0
3
/TXOUT
3
4
3
4
2
/TZOUT
24
23
9
1/TYOUT
P2
5
/AN5
VREF
10
P00
/CNTR
1
P3
7
/INT
0
11
12
22
21
RESET
CNVSS
P3
4
(LED
4
)
13
20
19
V
X
CC
IN
OUT
P3
P3
3
2
(LED
(LED
3
2
)
)
14
15
P3
1
0
(LED
(LED
1
0
)
)
X
18
17
16
P3
V
SS
Package type: 32P4B
Fig. 3 Pin configuration (32P4B-A type)
P14/CNTR0
NC
1
42
41
40
39
38
37
P13/SRDY1/SDATA2
P12/SCLK1/SCLK2
P11/TXD1
P10/RXD1
P07
2
3
NC
P20/AN0
P21/AN1
NC
4
5
6
P06
36
35
7
P05
P22/AN2
P23/AN3
8
P04
34
33
32
31
9
P03/TXOUT
P02/TZOUT
P01/TYOUT
P00/CNTR1
NC
P24/AN4
P25/AN5
P26/AN6
10
11
12
13
14
15
16
17
18
19
20
21
P27/AN7
NC
30
29
P37/INT0
NC
VREF
28
27
26
25
24
23
P36(LED6)/INT1
P35(LED5)
P34(LED4)
P33(LED3)
P32(LED2)
P31(LED1)
P30(LED0)
RESET
CNVSS
Vcc
XIN
XOUT
22
VSS
Outline 42S1M
Fig. 4 Pin configuration (42S1M type)
Rev.4.00 Jun 21, 2004 page 3 of 82
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7540 Group
FUNCTIONAL BLOCK
K e y - o n w a k e u p
Fig. 5 Functional block diagram (32P6U package)
Rev.4.00 Jun 21, 2004 page 4 of 82
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K e y - o n w a k e u p
Fig. 6 Functional block diagram (36P2R package)
Rev.4.00 Jun 21, 2004 page 5 of 82
REJ03B0011-0400Z
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K e y - o n w a k e u p
Fig. 7 Functional block diagram (32P4B package)
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PIN DESCRIPTION
Table 1 Pin description
Pin
Name
Function
Function expect a port function
Vcc, Vss
Power source
(Note 1)
•Apply voltage of 2.2 to 5.5 V to Vcc, and 0 V to Vss.
VREF
Analog reference •Reference voltage input pin for A/D converter
voltage
CNVss
RESET
XIN
CNVss
•Chip operating mode control pin, which is always connected to Vss.
Reset input
Clock input
•Reset input pin for active “L”
•Input and output pins for main clock generating circuit
•Connect a ceramic resonator or quartz crystal oscillator between the XIN and XOUT pins.
•For using RC oscillator, short between the XIN and XOUT pins, and connect the capacitor and resistor.
•If an external clock is used, connect the clock source to the XIN pin and leave the XOUT pin open.
• When the on-chip oscillator is selected as the main clock, connect XIN pin to VSS and leave XOUT open.
XOUT
Clock output
I/O port P0
•8-bit I/O port.
• Key-input (key-on wake up
interrupt input) pins
P00/CNTR1
P01/TYOUT
P02/TZOUT
P03/TXOUT
P04–P07
•I/O direction register allows each pin to be individually pro-
grammed as either input or output.
• Timer Y, timer Z, timer X and
timer A function pin
•CMOS compatible input level
•CMOS 3-state output structure
•Whether a built-in pull-up resistor is to be used or not can be de-
termined by program.
P10/RxD1
P11/TxD1
• Serial I/O1 function pin
•5-bit I/O port
I/O port P1
•I/O direction register allows each pin to be individually pro-
grammed as either input or output.
P12/SCLK1/SCLK2
• Serial I/O1 function pin
• Serial I/O2 function pin
P1
3/SRDY1/SDATA2
•CMOS compatible input level
P14/CNTR0
• Timer X function pin
•CMOS 3-state output structure
•CMOS/TTL level can be switched for P10, P12 and P13
•8-bit I/O port having almost the same function as P0
•CMOS compatible input level
P20/AN0–P27/AN7
I/O port P2
(Note 2)
• Input pins for A/D converter
•CMOS 3-state output structure
P30–P35
I/O port P3
(Note 3)
•8-bit I/O port
•I/O direction register allows each pin to be individually programmed as either input or output.
•CMOS compatible input level (CMOS/TTL level can be switched for P36 and P37).
•CMOS 3-state output structure
•P30 to P36 can output a large current for driving LED.
• Interrupt input pins
P36/INT1
P37/INT0
•Whether a built-in pull-up resistor is to be used or not can be de-
termined by program.
Notes 1: VCC = 2.4 to 5.5 V for the extended operating temperature version and the extended operating temperature 125 °C version.
2: P26/AN6 and P27/AN7 do not exist for the 32-pin version, so that Port P2 is a 6-bit I/O port.
3: P35 and P36/INT1 do not exist for the 32-pin version, so that Port P3 is a 6-bit I/O port.
Rev.4.00 Jun 21, 2004 page 7 of 82
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7540 Group
GROUP EXPANSION
Renesas plans to expand the 7540 group as follow:
Memory size
ROM/PROM size ................................................. 8 K to 32 K bytes
RAM size .............................................................. 384 to 768 bytes
Memory type
Support for Mask ROM version, One Time PROM version, and
Emulator MCU .
Package
32P4B .................................................. 32-pin plastic molded SDIP
32P6U-A ...................... 0.8 mm-pitch 32-pin plastic molded LQFP
36P2R-A ...................... 0.8 mm-pitch 36-pin plastic molded SSOP
42S1M.................................... 42-pin shrink ceramic PIGGY BACK
ROM size
(bytes)
M37540E8V
M37540E8T
32K
M37540E8
M37540M4V
M37540M4T
M37540M4
16K
M37540E2
M37540M2V
8K
M37540M2T
M37540M2
RAM size
(bytes)
384
512
768
0
Fig. 8 Memory expansion plan
Rev.4.00 Jun 21, 2004 page 8 of 82
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7540 Group
Currently supported products are listed below.
Table 2 List of supported products
(P) ROM size (bytes) RAM size
Part Number
Package
Remarks
ROM size for User ()
(bytes)
384
32P4B
Mask ROM version
Mask ROM version
M37540M2-XXXSP
M37540M2-XXXFP
M37540M2T-XXXFP
M37540M2V-XXXFP
M37540M2-XXXGP
M37540M2T-XXXGP
M37540M2V-XXXGP
M37540M4-XXXSP
M37540M4-XXXFP
M37540M4T-XXXFP
M37540M4V-XXXFP
M37540M4-XXXGP
M37540M4T-XXXGP
M37540M4V-XXXGP
M37540E2SP
8192
36P2R-A
(8062)
Mask ROM version (extended operating temperature version)
Mask ROM version (extended operating temperature 125 °C version)
Mask ROM version
32P6U-A
Mask ROM version (extended operating temperature version)
Mask ROM version (extended operating temperature 125 °C version)
Mask ROM version
32P4B
16384
512
36P2R-A
Mask ROM version
(16254)
Mask ROM version (extended operating temperature version)
Mask ROM version (extended operating temperature 125 °C version)
Mask ROM version
32P6U-A
Mask ROM version (extended operating temperature version)
Mask ROM version (extended operating temperature 125 °C version)
One Time PROM version (blank)
32P4B
36P2R-A
32P6U-A
32P4B
8192
384
768
One Time PROM version (blank)
M37540E2FP
(8062)
One Time PROM version (blank)
M37540E2GP
One Time PROM version (blank)
M37540E8SP
32768
36P2R-A
One Time PROM version (blank)
M37540E8FP
(32638)
One Time PROM version
M37540E8T-XXXFP
(shipped after programming, extended operating temperature version)
One Time PROM version (shipped after programming, extended
operating temperature 125 °C version)
M37540E8V-XXXFP
32P6U-A
42S1M
One Time PROM version (blank)
M37540E8GP
One Time PROM version
M37540E8T-XXXGP
(shipped after programming, extended operating temperature version)
One Time PROM version (shipped after programming, extended
operating temperature 125 °C version)
M37540E8V-XXXGP
M37540RSS
Emulator MCU
768
Rev.4.00 Jun 21, 2004 page 9 of 82
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FUNCTIONAL DESCRIPTION
Stack pointer (S)
The stack pointer is an 8-bit register used during subroutine calls
and interrupts. The stack is used to store the current address data
and processor status when branching to subroutines or interrupt
routines.
Central Processing Unit (CPU)
The MCU uses the standard 740 family instruction set. Refer to
the table of 740 family addressing modes and machine-language
instructions or the SERIES 740 <SOFTWARE> USER’S MANUAL
for details on each instruction set.
The lower eight bits of the stack address are determined by the
contents of the stack pointer. The upper eight bits of the stack ad-
dress are determined by the Stack Page Selection Bit. If the Stack
Page Selection Bit is “0”, then the RAM in the zero page is used
as the stack area. If the Stack Page Selection Bit is “1”, then RAM
in page 1 is used as the stack area.
Machine-resident 740 family instructions are as follows:
1. The FST and SLW instructions cannot be used.
2. The MUL and DIV instructions can be used.
3. The WIT instruction can be used.
4. The STP instruction can be used. (This instruction cannot be
used while an on-chip oscillator is operating.)
The Stack Page Selection Bit is located in the SFR area in the
zero page. Note that the initial value of the Stack Page Selection
Bit varies with each microcomputer type. Also some microcom-
puter types have no Stack Page Selection Bit and the upper eight
bits of the stack address are fixed. The operations of pushing reg-
ister contents onto the stack and popping them from the stack are
shown in Fig. 10.
Accumulator (A)
The accumulator is an 8-bit register. Data operations such as data
transfer, etc., are executed mainly through the accumulator.
Index register X (X), Index register Y (Y)
Both index register X and index register Y are 8-bit registers. In
the index addressing modes, the value of the OPERAND is added
to the contents of register X or register Y and specifies the real
address.
Program counter (PC)
The program counter is a 16-bit counter consisting of two 8-bit
registers PCH and PCL. It is used to indicate the address of the
next instruction to be executed.
When the T flag in the processor status register is set to “1”, the
value contained in index register X becomes the address for the
second OPERAND.
b7
b7
b7
b7
b7
b7
b0
b0
b0
b0
b0
b0
A
X
Accumulator
Index Register X
Y
Index Register Y
S
Stack Pointer
b15
PC
H
PC
L
Program Counter
Processor Status Register (PS)
N V T B D I Z C
Carry Flag
Zero Flag
Interrupt Disable Flag
Decimal Mode Flag
Break Flag
Index X Mode Flag
Overflow Flag
Negative Flag
Fig. 9 740 Family CPU register structure
Rev.4.00 Jun 21, 2004 page 10 of 82
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On-going Routine
Execute JSR
Interrupt request
(Note)
M (S) (PCH)
(S) (S – 1)
M (S) (PCL)
(S) (S – 1)
M (S) (PS)
(S) (S – 1)
Store Return Address
on Stack
M (S) (PCH)
(S) (S – 1)
M (S) (PCL)
(S) (S – 1)
Subroutine
Store Return Address
on Stack
Store Contents of Processor
Status Register on Stack
Interrupt
Service Routine
I Flag “0” to “1”
Execute RTS
(S) (S + 1)
Fetch the Jump Vector
Execute RTI
(S) (S + 1)
Restore Return
Address
Restore Contents of
Processor Status Register
(PCL) M (S)
(S) (S + 1)
(PCH) M (S)
(PS)
M (S)
(S) (S + 1)
(PCL) M (S)
(S) (S + 1)
Restore Return
Address
(PCH) M (S)
Note : The condition to enable the interrupt
Interrupt enable bit is “1”
Interrupt disable flag is “0”
Fig. 10 Register push and pop at interrupt generation and subroutine call
Table 3 Push and pop instructions of accumulator or processor status register
Push instruction to stack
Pop instruction from stack
Accumulator
PHA
PHP
PLA
PLP
Processor status register
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Processor status register (PS)
(5) Break flag (B)
The processor status register is an 8-bit register consisting of
flags which indicate the status of the processor after an arithmetic
operation. Branch operations can be performed by testing the
Carry (C) flag, Zero (Z) flag, Overflow (V) flag, or the Negative (N)
flag. In decimal mode, the Z, V, N flags are not valid.
The B flag is used to indicate that the current interrupt was gener-
ated by the BRK instruction. The BRK flag in the processor status
register is always “0”. When the BRK instruction is used to gener-
ate an interrupt, the processor status register is pushed onto the
stack with the break flag set to “1”. The saved processor status is
the only place where the break flag is ever set.
After reset, the Interrupt disable (I) flag is set to “1”, but all other
flags are undefined. Since the Index X mode (T) and Decimal
mode (D) flags directly affect arithmetic operations, they should
be initialized in the beginning of a program.
(6) Index X mode flag (T)
When the T flag is “0”, arithmetic operations are performed be-
tween accumulator and memory, e.g. the results of an operation
between two memory locations is stored in the accumulator. When
the T flag is “1”, direct arithmetic operations and direct data trans-
fers are enabled between memory locations, i.e. between memory
and memory, memory and I/O, and I/O and I/O. In this case, the
result of an arithmetic operation performed on data in memory lo-
cation 1 and memory location 2 is stored in memory location 1.
The address of memory location 1 is specified by index register X,
and the address of memory location 2 is specified by normal ad-
dressing modes.
(1) Carry flag (C)
The C flag contains a carry or borrow generated by the arithmetic
logic unit (ALU) immediately after an arithmetic operation. It can
also be changed by a shift or rotate instruction.
(2) Zero flag (Z)
The Z flag is set if the result of an immediate arithmetic operation
or a data transfer is “0”, and cleared if the result is anything other
than “0”.
(7) Overflow flag (V)
(3) Interrupt disable flag (I)
The V flag is used during the addition or subtraction of one byte
of signed data. It is set if the result exceeds +127 to -128. When
the BIT instruction is executed, bit 6 of the memory location oper-
ated on by the BIT instruction is stored in the overflow flag.
The I flag disables all interrupts except for the interrupt generated
by the BRK instruction. Interrupts are disabled when the I flag is
“1”.
When an interrupt occurs, this flag is automatically set to “1” to
prevent other interrupts from interfering until the current interrupt
is serviced.
(8) Negative flag (N)
The N flag is set if the result of an arithmetic operation or data
transfer is negative. When the BIT instruction is executed, bit 7 of
the memory location operated on by the BIT instruction is stored in
the negative flag.
(4) Decimal mode flag (D)
The D flag determines whether additions and subtractions are ex-
ecuted in binary or decimal. Binary arithmetic is executed when
this flag is “0”; decimal arithmetic is executed when it is “1”.
Decimal correction is automatic in decimal mode. Only the ADC
and SBC instructions can be used for decimal arithmetic.
Table 4 Set and clear instructions of each bit of processor status register
C flag
SEC
CLC
Z flag
I flag
SEI
D flag
SED
CLD
B flag
T flag
SET
CLT
V flag
–
N flag
Set instruction
–
–
–
–
–
–
Clear instruction
CLI
CLV
Rev.4.00 Jun 21, 2004 page 12 of 82
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[CPU mode register] CPUM
The CPU mode register contains the stack page selection bit.
This register is allocated at address 003B16.
b7
b0
CPU mode register
(CPUM: address 003B16, initial value: 8016
)
Switching method of CPU mode register
Processor mode bits (Note 1)
b1 b0
Switch the CPU mode register (CPUM) at the head of program af-
ter releasing Reset in the following method.
0
0
1
1
0
1
0
1
Single-chip mode
Not available
Stack page selection bit
0
1
: 0 page
: 1 page
On-chip oscillator oscillation control bit
0
1
: On-chip oscillator oscillation enabled
: On-chip oscillator oscillation stop
XIN oscillation control bit
0
1
: Ceramic or RC oscillation enabled
: Ceramic or RC oscillation stop
Oscillation mode selection bit (Note 1)
0
1
: Ceramic oscillation
: RC oscillation
Clock division ratio selection bits
b7 b6
0
0
1
1
0
1
0
1
:
:
:
:
f(φ) = f(XIN)/2 (High-speed mode)
f(φ) = f(XIN)/8 (Middle-speed mode)
applied from on-cihp oscillator
f(φ) = f(XIN) (Double-speed mode)(Note 2)
Note 1: The bit can be rewritten only once after releasing reset. After rewriting
it is disable to write any data to the bit. However, by reset the bit is
initialized and can be rewritten, again.
(It is not disable to write any data to the bit for emulator MCU
“M37540RSS”.)
2: These bits are used only when a ceramic oscillation is selected.
Do not use these when an RC oscillation is selected.
Fig. 11 Structure of CPU mode register
Start with an on-chip oscillator
After releasing reset
An initial value is set as a ceramic
oscillation mode. When it is switched to an
RC oscillation, its oscillation starts.
Switch the oscillation mode
selection bit (bit 5 of CPUM)
When using a ceramic oscillation, wait until
establlishment of oscillation from oscillation starts.
When using an RC oscillation, wait time is not required
basically (time to execute the instruction to switch from
an on-chip oscillator meets the requirement).
Wait by on-chip oscillator operation
until establishment of oscillator clock
Select 1/1, 1/2, 1/8 or on-chip oscillator.
Switch the clock division ratio
selection bits (bits 6 and 7 of CPUM)
Main routine
Fig. 12 Switching method of CPU mode register
Rev.4.00 Jun 21, 2004 page 13 of 82
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Memory
Zero page
Special function register (SFR) area
The SFR area in the zero page contains control registers such as
I/O ports and timers.
The 256 bytes from addresses 000016 to 00FF16 are called the
zero page area. The internal RAM and the special function regis-
ters (SFR) are allocated to this area.
The zero page addressing mode can be used to specify memory
and register addresses in the zero page area. Access to this area
with only 2 bytes is possible in the zero page addressing mode.
RAM
RAM is used for data storage and for a stack area of subroutine
calls and interrupts.
Special page
ROM
The 256 bytes from addresses FF0016 to FFFF16 are called the
special page area. The special page addressing mode can be
used to specify memory addresses in the special page area. Ac-
cess to this area with only 2 bytes is possible in the special page
addressing mode.
The first 128 bytes and the last 2 bytes of ROM are reserved for
device testing and the rest is a user area for storing programs.
Interrupt vector area
The interrupt vector area contains reset and interrupt vectors.
000016
SFR area
Zero page
004016
010016
RAM
RAM area
address
XXXX16
RAM capacity
(bytes)
XXXX16
384
512
768
01BF16
023F16
033F16
Reserved area
044016
Not used
YYYY16
Reserved ROM area
(128 bytes)
ZZZZ16
FF0016
ROM
ROM area
ROM capacity
(bytes)
address
YYYY16
address
ZZZZ16
Special page
FFDC16
8192
16384
32768
E00016
C00016
800016
E08016
C08016
808016
Interrupt vector area
FFFE16
Reserved ROM area
FFFF16
Fig. 13 Memory map diagram
Rev.4.00 Jun 21, 2004 page 14 of 82
REJ03B0011-0400Z
7540 Group
Timer Y, Z mode register (TYZM)
Port P0 (P0)
000016
002016
002116
002216
Port P0 direction register (P0D)
Port P1 (P1)
000116
000216
Prescaler Y (PREY)
Timer Y secondary (TYS)
Port P1 direction register (P1D)
Timer Y primary (TYP)
000316
000416
000516
002316
002416
002516
Timer Y, Z waveform output control register (PUM)
Port P2 (P2)
Port P2 direction register (P2D)
Port P3 (P3)
Prescaler Z (PREZ)
Timer Z secondary (TZS)
Timer Z primary (TZP)
Prescaler 1 (PRE1)
000616
000716
000816
000916
002616
002716
002816
002916
Port P3 direction register (P3D)
Timer 1 (T1)
One-shot start register (ONS)
Timer X mode register (TXM)
000A16
000B16
000C16
000D16
002A16
002B16
002C16
002D16
Prescaler X (PREX)
Timer X (TX)
Timer count source set register (TCSS)
000E16
000F16
001016
001116
002E16
002F16
003016
003116
Serial I/O2 control register (SIO2CON)
Serial I/O2 register (SIO2)
001216
001316
001416
001516
003216
003316
003416
003516
A/D control register (ADCON)
A/D conversion register (low-order) (ADL)
A/D conversion register (high-order) (ADH)
Pull-up control register (PULL)
001616
001716
001816
001916
003616
003716
003816
003916
Port P1P3 control register (P1P3C)
Transmit/Receive buffer register (TB/RB)
Serial I/O1 status register (SIO1STS)
Serial I/O1 control register (SIO1CON)
MISRG
Watchdog timer control register (WDTCON)
Interrupt edge selection register (INTEDGE)
001A16
001B16
001C16
003A16
003B16
003C16
UART control register (UARTCON)
Baud rate generator (BRG)
CPU mode register (CPUM)
Interrupt request register 1 (IREQ1)
Interrupt request register 2 (IREQ2)
Interrupt control register 1 (ICON1)
Timer A mode register (TAM)
001D16
003D16
003E16
003F16
001E16 Timer A (low-order) (TAL)
001F16
Interrupt control register 2 (ICON2)
Timer A (high-order) (TAH)
Note : Do not access to the SFR area including nothing.
Fig. 14 Memory map of special function register (SFR)
Rev.4.00 Jun 21, 2004 page 15 of 82
REJ03B0011-0400Z
7540 Group
I/O Ports
[Pull-up control register] PULL
[Direction registers] PiD
By setting the pull-up control register (address 001616), ports P0
and P3 can exert pull-up control by program. However, pins set to
output are disconnected from this control and cannot exert pull-up
control.
The I/O ports have direction registers which determine the input/
output direction of each pin. Each bit in a direction register corre-
sponds to one pin, and each pin can be set to be input or output.
When “1” is set to the bit corresponding to a pin, this pin becomes
an output port. When “0” is set to the bit, the pin becomes an in-
put port.
Note: P26/AN6, P27/AN7, P35 and P36 do not exist for the 32-pin
version.
When data is read from a pin set to output, not the value of the pin
itself but the value of port latch is read. Pins set to input are float-
ing, and permit reading pin values.
Accordingly, the following settings are required;
. Set direction registers of ports P26 and P27 to output.
. Set direction registers of ports P35 and P36 to output.
If a pin set to input is written to, only the port latch is written to and
the pin remains floating.
[Port P1P3 control register] P1P3C
By setting the port P1P3 control register (address 001716), a
CMOS input level or a TTL input level can be selected for ports
P10, P12, P13, P36, and P37 by program.
b7
b0
Pull-up control register
(PULL: address 001616, initial value: 0016
)
P0
0
pull-up control bit
pull-up control bit
P0
P0
P0
P3
P3
P3
P3
1
2
4
0
4
5
7
, P03 pull-up control bit
– P0
7
pull-up control bit
pull-up control bit
– P3
3
pull-up control bit
, P3 pull-up control bit
pull-up control bit
0 : Pull-up Off
1 : Pull-up On
6
Note : Pins set to output ports are disconnected from pull-up control.
Fig. 15 Structure of pull-up control register
b7
b0
Port P1P3 control register
(P1P3C: address 0017 16, initial value: 0016
)
P3
P3
P1
7
6
0
/INT0 input level selection bit
0 : CMOS level
1 : TTL level
/INT1 input level selection bit
0 : CMOS level
1 : TTL level
,P12,P13 input level selection bit
0 : CMOS level
1 : TTL level
Not used
6/INT1 input level selection bit
Note: Keep setting the P3
to “0” (initial value) for 32-pin version.
Fig. 16 Structure of port P1P3 control register
Rev.4.00 Jun 21, 2004 page 16 of 82
REJ03B0011-0400Z
7540 Group
Table 5 I/O port function table
Pin
Name
Input/output
I/O format
Non-port function
Key input interrupt
Timer X function output
Timer Y function output
Timer Z function output
Timer A function input
Related SFRs
Diagram No.
P00/CNTR1
P01/TYOUT
P02/TZOUT
P03/TXOUT
P04–P07
I/O port P0 I/O individual •CMOS compatible
Pull-up control register
Timer Y mode register
Timer Z mode register
Timer X mode register
Timer Y,Z waveform
output control register
Timer A mode register
(1)
(2)
(3)
(4)
bits
input level
•CMOS 3-state output
(Note 1)
P10/RxD1
P11/TxD1
I/O port P1
Serial I/O1 function
input/output
Serial I/O1 control register
(5)
(6)
P12/SCLK1/SCLK2
P13/SRDY1/SDATA2
Serial I/O2 function
input/output
Serial I/O1 control register
Serial I/O2 control register
(7)
(8)
P14/CNTR0
Timer X function input/output Timer X mode register
(9)
P20/AN0–
P27/AN7
I/O port P2
(Note 2)
A/D conversion input
A/D control register
(10)
P30–P35
I/O port P3
(Note 3)
(11)
(12)
P36/INT1
P37/INT0
External interrupt input
Interrupt edge selection
register
Notes 1: Ports P10, P12, P13, P36, and P37 are CMOS/TTL level.
2: P26/AN6 and P27/AN7 do not exist for the 32-pin version.
3: P35 and P36/INT1 do not exist for the 32-pin version.
Rev.4.00 Jun 21, 2004 page 17 of 82
REJ03B0011-0400Z
7540 Group
(1)Port P00
(2)Ports P01, P02
Pull-up control
Direction
Pull-up control
Direction
register
register
Port latch
Data bus
Port latch
Data bus
**
Programmable waveform generation mode
Timer output
CNTR1 interrupt input
To key input interrupt
generating circuit
P0
0 key-on wakeup
To key input interrupt
generating circuit
selection bit
(3)Port P03
(4)Ports P04–P07
Pull-up control
Pull-up control
Direction
register
Direction
register
Data bus
Port latch
Data bus
Port latch
Timer output
P03/TXOUT
output valid
To key input interrupt
generating circuit
To key input interrupt
generating circuit
(5)Port P10
(6)Port P11
Serial I/O1 enable bit
Receive enable bit
P11/TxD1 P-channel output disable bit
Serial I/O1 enable bit
Transmit enable bit
Direction
register
Direction
register
Data bus
Port latch
P1
0
, P12
, P13
input level
selection bit
Data bus
Port latch
Serial I/O1 input
*
(7)Port P12
Serial I/O1 output
S
CLK2 pin
selection bit
Serial I/O1 synchronous
clock selection bit
Serial I/O1 enable bit
Serial I/O1 mode selection bit
Serial I/O1 enable bit
Direction
register
Data bus
Port latch
P1
0
, P12, P13
input level
selection bit
Serial I/O1, serial I/O2 clock output
Serial I/O1, serial I/O2 clock input
*
P1
0
, P1
2
, P1
3
, P3
6
, and P3
7
input level are switched to the CMOS/TTL level by the port P1P3 control register.
*
When the TTL level is selected, there is no hysteresis characteristics.
P02/TZOUT;
**Programmable waveform generation mode
Programmable one-shot generation mode
Programmable wait one-shot generation mode
Fig. 17 Block diagram of ports (1)
Rev.4.00 Jun 21, 2004 page 18 of 82
REJ03B0011-0400Z
7540 Group
(8) Port P1
3
(9) Port P1
4
SDATA2 output in operation signal
S
DATA2 pin selection bit
Direction
register
Serial I/O mode selection bit
Serial I/O1 enable bit
SRDY1 output enable bit
Direction
register
Port
latch
Data bus
Data bus
Port latch
Pulse output mode
Timer output
P10, P12, P13
input level
CNTR0 interrupt input
selection bit
Serial I/O1 ready output
Serial I/O2 output
Serial I/O2 input
*
(11) Ports P30–P35
(10) Ports P20–P27
Direction
Pull-up control
register
Direction
register
Data bus
Port latch
Data bus
Port
latch
A/D converter input
Analog input pin
selection bit
(12) Ports P36, P37
Pull-up control
Direction
register
Data bus
Port
latch
P3 input level
selection bit
INT interrupt input
*
P1
0
, P12, P13, P36, and P37 input level are switched to the CMOS/TTL level by the port P1P3 control register.
*
When the TTL level is selected, there is no hysteresis characteristics.
Fig. 18 Block diagram of ports (2)
Rev.4.00 Jun 21, 2004 page 19 of 82
REJ03B0011-0400Z
7540 Group
Interrupts
✕✕Notes on use
Interrupts occur by 15 different sources : 5 external sources, 9 in-
When setting the followings, the interrupt request bit may be set to
“1”.
ternal sources and 1 software source.
•When setting external interrupt active edge
Related register: Interrupt edge selection register (address
003A16)
Interrupt control
All interrupts except the BRK instruction interrupt have an interrupt
request bit and an interrupt enable bit, and they are controlled by
the interrupt disable flag. When the interrupt enable bit and the in-
terrupt request bit are set to “1” and the interrupt disable flag is set
to “0”, an interrupt is accepted.
Timer X mode register (address 2B16)
Timer A mode register (address 1D16)
When not requiring the interrupt occurrence synchronized with
these setting, take the following sequence.
The interrupt request bit can be cleared by program but not be set.
The interrupt enable bit can be set and cleared by program.
The reset and BRK instruction interrupt can never be disabled with
any flag or bit. All interrupts except these are disabled when the
interrupt disable flag is set.
✕ Set the corresponding interrupt enable bit to “0” (disabled).
✕ Set the interrupt edge select bit (active edge switch bit) to “1”.
✕ Set the corresponding interrupt request bit to “0” after 1 or
more instructions have been executed.
When several interrupts occur at the same time, the interrupts are
received according to priority.
✕ Set the corresponding interrupt enable bit to “1” (enabled).
Interrupt operation
Upon acceptance of an interrupt the following operations are auto-
matically performed:
1. The processing being executed is stopped.
2. The contents of the program counter and processor status reg-
ister are automatically pushed onto the stack.
3. The interrupt disable flag is set and the corresponding interrupt
request bit is cleared.
4. Concurrently with the push operation, the interrupt destination
address is read from the vector table into the program counter.
Table 6 Interrupt vector address and priority
Vector addresses (Note 1)
Interrupt source Priority
Interrupt request generating conditions
At reset input
Remarks
High-order Low-order
Reset (Note 2)
1
2
3
Non-maskable
FFFD16
FFFB16
FFF916
FFFC16
FFFA16
FFF816
Serial I/O1 receive
Serial I/O1 transmit
At completion of serial I/O1 data receive
Valid only when serial I/O1 is selected
At completion of serial I/O1 transmit shift or
when transmit buffer is empty
Valid only when serial I/O1 is
selected
INT0
4
5
6
7
8
At detection of either rising or falling edge of External interrupt
FFF716
FFF516
FFF316
FFF116
FFEF16
FFF616
FFF416
FFF216
FFF016
FFEE16
INT0 input
(active edge selectable)
INT1 (Note 3)
Key-on wake-up
CNTR0
At detection of either rising or falling edge of External interrupt
INT1 input
(active edge selectable)
At falling of conjunction of input logical level External interrupt (valid at falling)
for port P0 (at input)
At detection of either rising or falling edge of External interrupt
CNTR0 input
(active edge selectable)
CNTR1
At detection of either rising or falling edge of External interrupt
CNTR1 input
(active edge selectable)
Timer X
9
At timer X underflow
FFED16
FFEB16
FFE916
FFE716
FFE516
FFE316
FFE116
FFDF16
FFDD16
FFEC16
FFEA16
FFE816
FFE616
FFE416
FFE216
FFE016
FFDE16
FFDC16
Timer Y
10
11
12
13
14
15
16
17
At timer Y underflow
Timer Z
At timer Z underflow
Timer A
At timer A underflow
Serial I/O2
A/D conversion
Timer 1
At completion of transmit/receive shift
At completion of A/D conversion
At timer 1 underflow
STP release timer underflow
Reserved area
BRK instruction
Not available
At BRK instruction execution
Non-maskable software interrupt
Note 1: Vector addressed contain internal jump destination addresses.
2: Reset function in the same way as an interrupt with the highest priority.
3: It is an interrupt which can use only for 36 pin version.
Rev.4.00 Jun 21, 2004 page 20 of 82
REJ03B0011-0400Z
7540 Group
Interrupt request bit
Interrupt enable bit
Interrupt disable flag I
BRK instruction
Reset
Interrupt request
Fig. 19 Interrupt control
b7
b0
Interrupt edge selection register
(INTEDGE : address 003A16, initial value : 0016
)
INT
INT
0 interrupt edge selection bit
0 : Falling edge active
1 : Rising edge active
1
interrupt edge selection bit
0 : Falling edge active
1 : Rising edge active
Not used (returns “0” when read)
P00
key-on wakeup enable bit
0 : Key-on wakeup enabled
1 : Key-on wakeup disabled
b7
b0
Interrupt request register 1
(IREQ1 : address 003C16, initial value : 0016
)
Serial I/O1 receive interrupt request bit
Serial I/O1 transmit interrupt request bit
INT
INT
0
1
interrupt request bit
interrupt request bit
Key-on wake up interrupt request bit
CNTR
0
1
interrupt request bit
interrupt request bit
CNTR
0 : No interrupt request issued
1 : Interrupt request issued
Timer X interrupt request bit
b7
b0
Interrupt request register 2
(IREQ2 : address 003D16, initial value : 0016
)
Timer Y interrupt request bit
Timer Z interrupt request bit
Timer A interrupt request bit
Serial I/O2 interrupt request bit
A/D conversion interrupt request bit
Timer 1 interrupt request bit
Not used (returns “0” when read)
0 : No interrupt request issued
1 : Interrupt request issued
b7
b0
Interrupt control register 1
(ICON1 : address 003E16, initial value : 0016
)
Serial I/O1 receive interrupt enable bit
Serial I/O1 transmit interrupt enable bit
INT
INT
0
1
interrupt enable bit
interrupt enable bit (Do not write “1” to this bit for 32-pin version)
Key-on wake up interrupt enable bit
CNTR
CNTR
0
1
interrupt enable bit
interrupt enable bit
Timer X interrupt enable bit
0 : Interrupts disabled
1 : Interrupts enabled
b7
b0
Interrupt control register 2
(ICON2 : address 003F16, initial value : 0016
)
Timer Y interrupt enable bit
Timer Z interrupt enable bit
Timer A interrupt enable bit
Serial I/O2 interrupt enable bit
A/D conversion interrupt enable bit
Timer 1 interrupt enable bit
Not used (returns “0” when read)
(Do not write “1” to this bit)
0 : Interrupts disabled
1 : Interrupts enabled
Fig. 20 Structure of Interrupt-related registers
Rev.4.00 Jun 21, 2004 page 21 of 82
REJ03B0011-0400Z
7540 Group
Key Input Interrupt (Key-On Wake-Up)
A key-on wake-up interrupt request is generated by applying “L”
level to any pin of port P0 that has been set to input mode.
In other words, it is generated when the AND of input level goes
from “1” to “0”. An example of using a key input interrupt is shown
in Figure 21, where an interrupt request is generated by pressing
one of the keys provided as an active-low key matrix which uses
ports P00 to P03 as input ports.
Port PXx
“L” level output
PULL register
bit 3 = “0”
Port P0
Direction register = “1”
7
Key input interrupt request
*
*
*
*
*
*
*
**
Port P0
latch
7
6
5
4
3
2
1
0
P0
P0
P0
P0
7
6
5
4
output
output
output
output
Falling edge
detection
PULL register
bit 3 = “0”
Port P0
6
Direction register = “1”
**
Port P0
latch
Falling edge
detection
PULL register
bit 3 = “0”
Port P0
5
Direction register = “1”
**
Port P0
latch
Falling edge
detection
PULL register
bit 3 = “0”
Port P0
4
Direction register = “1”
**
Port P0
latch
Falling edge
detection
PULL register
bit 2 = “1”
Port P0
3
Port P0
Input read circuit
Direction register = “0”
**
Port P0
latch
P0
P0
P0
P0
3
2
1
0
input
input
input
input
Falling edge
detection
PULL register
bit 2 = “1”
Port P0
2
Direction register = “0”
**
Port P0
latch
Falling edge
detection
PULL register
bit 1 = “1”
Port P0
1
Direction register = “0”
**
Port P0
latch
Falling edge
detection
PULL register
bit 0 = “1”
Port P0
0
Direction register = “0”
*
**
Port P0
latch
Falling edge
detection
Port P00 key-on wakeup
selection bit
* P-channel transistor for pull-up
** CMOS output buffer
Fig. 21 Connection example when using key input interrupt and port P0 block diagram
Rev.4.00 Jun 21, 2004 page 22 of 82
REJ03B0011-0400Z
7540 Group
✕Timer A
Timers
Timer A is a 16-bit timer and counts the signal which is the oscil-
lation frequency divided by 16. When Timer A underflows, the
timer A interrupt request bit is set to “1”.
The 7540 Group has 5 timers: timer 1, timer A, timer X, timer Y
and timer Z.
The division ratio of every timer and prescaler is 1/(n+1) provided
that the value of the timer latch or prescaler is n.
All the timers are down count timers. When a timer reaches “0”, an
underflow occurs at the next count pulse, and the corresponding
timer latch is reloaded into the timer. When a timer underflows, the
interrupt request bit corresponding to each timer is set to “1”.
Timer A consists of the low-order of Timer A (TAL) and the high-or-
der of Timer A (TAH).
Timer A has the timer A latch to retain the reload value. The value
of timer A latch is set to Timer A at the timing shown below.
• When Timer A undeflows.
• When an active edge is input from CNTR1 pin (valid only when
period measurement mode and pulse width HL continuously mea-
surement mode).
✕Timer 1
Timer 1 is an 8-bit timer and counts the prescaler output.
When Timer 1 underflows, the timer 1 interrupt request bit is set to
“1”.
When writing to both the low-order of Timer A (TAL) and the high-
order of Timer A (TAH) is executed, the value is written to both the
timer A latch and Timer A.
Prescaler 1 is an 8-bit prescaler and counts the signal which is the
oscillation frequency divided by 16.
When reading from the low-order of Timer A (TAL) and the high-or-
der of Timer A (TAH) is executed, the following values are read out
according to the operating mode.
Prescaler 1 and Timer 1 have the prescaler 1 latch and the timer 1
latch to retain the reload value, respectively. The value of
prescaler 1 latch is set to Prescaler 1 when Prescaler 1
underflows.The value of timer 1 latch is set to Timer 1 when Timer
1 underflows.
• In timer mode, event counter mode:
The count value of Timer A is read out.
• In period measurement mode, pulse width HL continuously mea-
surement mode:
When writing to Prescaler 1 (PRE1) is executed, the value is writ-
ten to both the prescaler 1 latch and Prescaler 1.
The measured value is read out.
When writing to Timer 1 (T1) is executed, the value is written to
both the timer 1 latch and Timer 1.
Be sure to write to/read out the low-order of Timer A (TAL) and the
high-order of Timer A (TAH) in the following order;
Read
When reading from Prescaler 1 (PRE1) and Timer 1 (T1) is ex-
ecuted, each count value is read out.
Read the high-order of Timer A (TAH) first, and the low-order of
Timer A (TAL) next and be sure to read out both TAH and TAL.
Write
Timer 1 always operates in the timer mode.
Prescaler 1 counts the signal which is the oscillation frequency di-
vided by 16. Each time the count clock is input, the contents of
Prescaler 1 is decremented by 1. When the contents of Prescaler
1 reach “0016”, an underflow occurs at the next count clock, and
the prescaler 1 latch is reloaded into Prescaler 1 and count contin-
ues. The division ratio of Prescaler 1 is 1/(n+1) provided that the
value of Prescaler 1 is n.
Write to the low-order of Timer A (TAL) first, and the high-order of
Timer A (TAH) next and be sure to write to both TAL and TAH.
Timer A can be selected in one of 4 operating modes by setting
the timer A mode register.
The contents of Timer 1 is decremented by 1 each time the under-
flow signal of Prescaler 1 is input. When the contents of Timer 1
reach “0016”, an underflow occurs at the next count clock, and the
timer 1 latch is reloaded into Timer 1 and count continues. The di-
vision ratio of Timer 1 is 1/(m+1) provided that the value of Timer
1 is m. Accordingly, the division ratio of Prescaler 1 and Timer 1 is
1/((n+1)✕(m+1)) provided that the value of Prescaler 1 is n and
the value of Timer 1 is m.
(1) Timer mode
Timer A counts the oscillation frequency divided by 16. Each time
the count clock is input, the contents of Timer A is decremented by
1. When the contents of Timer A reach “000016”, an underflow oc-
curs at the next count clock, and the timer A latch is reloaded into
Timer A. The division ratio of Timer A is 1/(n+1) provided that the
value of Timer A is n.
Timer 1 cannot stop counting by software.
(2) Period measurement mode
In the period measurement mode, the pulse period input from the
P00/CNTR1 pin is measured.
CNTR1 interrupt request is generated at rising/falling edge of
CNTR1 pin input singal. Simultaneousuly, the value in the timer A
latch is reloaded inTimer A and count continues. The active edge
of CNTR1 pin input signal can be selected from rising or falling by
the CNTR1 active edge switch bit .The count value when trigger
input from CNTR1 pin is accepted is retained until Timer A is read
once.
Rev.4.00 Jun 21, 2004 page 23 of 82
REJ03B0011-0400Z
7540 Group
(3) Event counter mode
✕Timer X
Timer A counts signals input from the P00/CNTR1 pin.
Except for this, the operation in event counter mode is the same
as in timer mode.
Timer X is an 8-bit timer and counts the prescaler X output.
When Timer X underflows, the timer X interrupt request bit is set
to “1”.
The active edge of CNTR1 pin input signal can be selected from
rising or falling by the CNTR1 active edge switch bit .
Prescaler X is an 8-bit prescaler and counts the signal selected by
the timer X count source selection bit.
Prescaler X and Timer X have the prescaler X latch and the timer
X latch to retain the reload value, respectively. The value of
prescaler X latch is set to Prescaler X when Prescaler X
underflows.The value of timer X latch is set to Timer X when Timer
X underflows.
(4) Pulse width HL continuously measurement mode
In the pulse width HL continuously measurement mode, the pulse
width (“H” and “L” levels) input to the P00/CNTR1 pin is measured.
CNTR1 interrupt request is generated at both rising and falling
edges of CNTR1 pin input signal. Except for this, the operation in
pulse width HL continuously measurement mode is the same as in
period measurement mode.
When writing to Prescaler X (PREX) is executed, the value is writ-
ten to both the prescaler X latch and Prescaler X.
When writing to Timer X (TX) is executed, the value is written to
both the timer X latch and Timer X.
The count value when trigger input from the CNTR1 pin is ac-
cepted is retained until Timer A is read once.
When reading from Prescaler X (PREX) and Timer X (TX) is ex-
ecuted, each count value is read out.
Timer A can stop counting by setting “1” to the timer A count stop
bit in any mode.
Timer X can can be selected in one of 4 operating modes by set-
ting the timer X operating mode bits of the timer X mode register.
Also, when Timer A underflows, the timer A interrupt request bit is
set to “1”.
(1) Timer mode
Note on Timer A is described below;
Prescaler X counts the count source selected by the timer X count
source selection bits. Each time the count clock is input, the con-
tents of Prescaler X is decremented by 1. When the contents of
Prescaler X reach “0016”, an underflow occurs at the next count
clock, and the prescaler X latch is reloaded into Prescaler X and
count continues. The division ratio of Prescaler X is 1/(n+1) pro-
vided that the value of Prescaler X is n.
✕✕Note on Timer A
CNTR1 interrupt active edge selection
CNTR1 interrupt active edge depends on the CNTR1 active edge
switch bit.
When this bit is “0”, the CNTR1 interrupt request bit is set to “1” at
the falling edge of the CNTR1 pin input signal. When this bit is “1”,
the CNTR1 interrupt request bit is set to “1” at the rising edge of
the CNTR1 pin input signal.
The contents of Timer X is decremented by 1 each time the under-
flow signal of Prescaler X is input. When the contents of Timer X
reach “0016”, an underflow occurs at the next count clock, and the
timer X latch is reloaded into Timer X and count continues. The di-
vision ratio of Timer X is 1/(m+1) provided that the value of Timer
X is m. Accordingly, the division ratio of Prescaler X and Timer X is
1/((n+1)✕(m+1)) provided that the value of Prescaler X is n and
the value of Timer X is m.
However, in the pulse width HL continuously measurement mode,
CNTR1 interrupt request is generated at both rising and falling
edges of CNTR1 pin input signal regardless of the setting of
CNTR1 active edge switch bit.
b7
b0
(2) Pulse output mode
Timer A mode register
In the pulse output mode, the waveform whose polarity is inverted
each time timer X underflows is output from the CNTR0 pin.
The output level of CNTR0 pin can be selected by the CNTR0 ac-
tive edge switch bit. When the CNTR0 active edge switch bit is “0”,
the output of CNTR0 pin is started at “H” level. When this bit is “1”,
the output is started at “L” level.
(TAM : address 001D16, initial value: 0016
)
Not used (return “0” when read)
Timer A operating mode bits
b5 b4
0
0
1
1
0 : Timer mode
1 : Period measurement mode
0 : Event counter mode
1 : Pulse width HL continuously
measurement mode
Also, the inverted waveform of pulse output from CNTR0 pin can
be output from TXOUT pin by setting “1” to the P03/TXOUT output
valid bit.
CNTR1 active edge switch bit
0 : Count at rising edge in event counter mode
Measure the falling edge period in period
measurement mode
When using a timer in this mode, set the port P14 and P03 direc-
tion registers to output mode.
Falling edge active for CNTR1 interrupt
1 : Count at falling edge in event counter mode
Measure the rising edge period in period
measurement mode
(3) Event counter mode
Rising edge active for CNTR
Timer A count stop bit
0 : Count start
1 interrupt
The timer A counts signals input from the P14/CNTR0 pin.
Except for this, the operation in event counter mode is the same
as in timer mode.
1 : Count stop
The active edge of CNTR0 pin input signal can be selected from
rising or falling by the CNTR0 active edge switch bit .
Fig. 22 Structure of timer A mode register
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(4) Pulse width measurement mode
b7
b0
In the pulse width measurement mode, the pulse width of the sig-
nal input to P14/CNTR0 pin is measured.
Timer X mode register
(TXM : address 002B16, initial value: 0016
)
Timer X operating mode bits
b1 b0
The operation of Timer X can be controlled by the level of the sig-
nal input from the CNTR0 pin.
0
0
1
1
0 : Timer mode
1 : Pulse output mode
0 : Event counter mode
When the CNTR0 active edge switch bit is “0”, the signal selected
by the timer X count source selection bit is counted while the input
signal level of CNTR0 pin is “H”. The count is stopped while the
pin is “L”. Also, when the CNTR0 active edge switch bit is “1”, the
signal selected by the timer X count source selection bit is
counted while the input signal level of CNTR0 pin is “L”. The count
is stopped while the pin is “H”.
1 : Pulse width measurement mode
CNTR
0
active edge switch bit
0 : Interrupt at falling edge
Count at rising edge
(in event counter mode)
1 : Interrupt at rising edge
Count at falling edge
(in event counter mode)
Timer X count stop bit
0 : Count start
1 : Count stop
Timer X can stop counting by setting “1” to the timer X count stop
bit in any mode.
P03/TXOUT output valid bit
0 : Output invalid (I/O port)
1 : Output valid (Inverted CNTR0 output)
Also, when Timer X underflows, the timer X interrupt request bit is
set to “1”.
Not used (return “0” when read)
Note on Timer X is described below;
Fig. 23 Structure of timer X mode register
✕✕Note on Timer X
b7
b0
CNTR0 interrupt active edge selection
Timer count source set register
(TCSS : address 002E16, initial value: 0016
)
CNTR0 interrupt active edge depends on the CNTR0 active edge
switch bit.
Timer X count source selection bits
b1 b0
When this bit is “0”, the CNTR0 interrupt request bit is set to “1” at
the falling edge of CNTR0 pin input signal. When this bit is “1”, the
CNTR0 interrupt request bit is set to “1” at the rising edge of
CNTR0 pin input signal.
0
0
1
1
0 : f(XIN)/16
1 : f(XIN)/2
0 : f(XIN) (Note 1)
1 : Not available
Timer Y count source selection bits
b3 b2
0
0
1
1
0 : f(XIN)/16
1 : f(XIN)/2
0 : On-chip oscillator output (Note 2)
1 : Not available
Timer Z count source selection bits
b5 b4
0
0
1
1
0 : f(XIN)/16
1 : f(XIN)/2
0 : Timer Y underflow
1 : Not available
Fix this bit to “0”.
Not used (return “0” when read)
Notes 1: f(XIN) can be used as timer X count source when using
a ceramic resonator or on-chip oscillator.
Do not use it at RC oscillation.
2: System operates using an on-chip oscillator as a count source
by setting the on-cihp oscillator to oscillation enabled by bit 3
of CPUM.
Fig. 24 Timer count source set register
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✕Timer Y
(2) Programmable waveform generation mode
Timer Y is an 8-bit timer and counts the prescaler Y output.
When Timer Y underflows, the timer Y interrupt request bit is set to
“1”.
In the programmable waveform generation mode, timer counts the
setting value of timer Y primary and the setting value of timer Y
secondary alternately, the waveform inverted each time Timer Y
underflows is output from TYOUT pin.
Prescaler Y is an 8-bit prescaler and counts the signal selected by
the timer Y count source selection bit.
When using this mode, be sure to set “1” to the timer Y write con-
trol bit to select “write to latch only”. Also, set the port P01 direction
registers to output mode.
Prescaler Y has the prescaler Y latch to retain the reload value.
Timer Y has the timer Y primary latch and timer Y secondary latch
to retain the reload value.
The active edge of output waveform is set by the timer Y output
level latch (b5) of the timer Y, Z waveform output control register
(PUM). When “0” is set to b5 of PUM, “H” interval by the setting
value of TYP or “L” interval by the setting value of TYS is output
alternately. When “1” is set to b5 of PUM, “L” interval by the setting
value of TYP or “H” interval by the setting value of TYS is output
alternately.
The value of prescaler Y latch is set to Prescaler Y when
Prescaler Y underflows.The value of timer Y primary latch or timer
Y secondary latch are set to Timer Y when Timer Y underflows.
As for the value to transfer to Timer Y, either of timer Y primary or
timer Y secondary is selected depending on the timer Y operating
mode.
Also, in this mode, the primary interval and the secondary interval
of the output waveform can be extended respectively for 0.5 cycle
of timer count source clock by setting the timer Y primary wave-
form extension control bit (b2) and the timer Y secondary
waveform extension control bit (b3) of PUM to “1”. As a result, the
waveforms of more accurate resolution can be output.
When b2 and b3 of PUM are used, the frequency and duty of the
output waveform are as follows;
When writing to Prescaler Y (PREY), timer Y primary (TYP) or
timer Y secondary (TYS) is executed, writing to “latch only” or
“latch and prescaler (timer)” can be selected by the setting value
of the timer Y write control bit. Be sure to set the timer Y write con-
trol bit because there are some notes according to the operating
mode.
When reading from Prescaler Y (PREY) is executed, the count
value of Prescaler Y is read out. When reading from timer Y pri-
mary (TYP) is executed, the count value of Timer Y is read out.
The count value of Timer Y can be read out by reading from the
timer Y primary (TYP) even when the value of timer Y primary
latch or timer Y secondary latch is counted. When reading the
timer Y secondary (TYS) is executed, the undefined value is read
out.
Waveform frequency:
2✕TMYCL
FYOUT=
2✕(TYP+1)+2✕(TYS+1)+(EXPYP+EXPYS)
Duty:
2✕(TYP+1)+EXPYP
Timer Y can be selected in one of 2 operating modes by setting
the timer Y operating mode bits of the timer Y, Z mode register.
DYOUT=
(2✕(TYP+1)+EXPYP)+(2✕(TYS+1)+EXPYS)
(1) Timer mode
TMYCL: Timer Y count source (frequency)
TYP: Timer Y primary (8bit)
Prescaler Y counts the count source selected by the timer Y count
source selection bits. Each time the count clock is input, the con-
tents of Prescaler Y is decremented by 1. When the contents of
Prescaler Y reach “0016”, an underflow occurs at the next count
clock, and the prescaler Y latch is reloaded into Prescaler Y. The
division ratio of Prescaler Y is 1/(n+1) provided that the value of
Prescaler Y is n.
TYS: Timer Y secondary (8bit)
EXPYP: Timer Y primary waveform extension control bit (1bit)
EXPYS: Timer Y secondary waveform extension control bit (1bit)
In the programmable waveform generation mode, when values of
the TYP, TYS, EXPYP and EXPYS are changed, the output wave-
form is changed at the beginning (timer Y primary waveform
interval) of waveform period.
The contents of Timer Y is decremented by 1 each time the under-
flow signal of Prescaler Y is input. When the contents of Timer Y
reach “0016”, an underflow occurs at the next count clock, and the
timer Y primary latch is reloaded into Timer Y and count continues.
(In the timer mode, the contents of timer Y primary latch is
counted. Timer Y secondary latch is not used in this mode.)
The division ratio of Timer Y is 1/(m+1) provided that the value of
Timer Y is m. Accordingly, the division ratio of Prescaler Y and
Timer Y is 1/((n+1)✕(m+1)) provided that the value of Prescaler Y
is n and the value of Timer Y is m.
When the count values are changed, set values to the TYS,
EXPYP and EXPYS first. After then, set the value to TYP. The val-
ues are set all at once at the beginning of the next waveform
period when the value is set to TYP. (When writing at timer stop is
executed, writing to TYP at last is required.)
Notes on programmable waveform generation mode is described
below;
In the timer mode, writing to “latch only” or “latches and Prescaler
Y and timer Y primary” can be selected by the setting value of the
timer Y write control bit.
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✕ Notes on programmable generation waveform mode
• Count set value
In the programmable waveform generation mode, values of TYS,
EXPYP, and EXPYS are valid by writing to TYP because the set-
ting to them is executed all at once by writing to TYP. Even when
changing TYP is not required, write the same value again.
• Write timing to TYP
In the programmable waveform generation mode, when the set-
ting value is changed while the waveform is output, set by
software in order not to execute the writing to TYP and the timing
of timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
The waveform extension function by the timer Y waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Y.
When the value other than “0016” is set to Prescaler Y, be sure to
set “0” to EXPYP and EXPYS.
• Timer Y write mode
When using this mode, be sure to set “1” to the timer Y write con-
trol bit to select “write to latch only”.
Timer Y can stop counting by setting “1” to the timer Y count stop
bit in any mode.
Also, when Timer Y underflows, the timer Y interrupt request bit is
set to “1”.
Timer Y reloads the value of latch when counting is stopped by the
timer Y count stop bit. (When timer is read out while timer is
stopped, the value of latch is read. The value of timer can be read
out only while timer is operating.)
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(2) Programmable waveform generation mode
✕Timer Z
In the programmable waveform generation mode, timer counts the
setting value of timer Z primary and the setting value of timer Z
secondary alternately, the waveform inverted each time Timer Z
underflows is output from TZOUT pin.
Timer Z is an 8-bit timer and counts the prescaler Z output.
When Timer Z underflows, the timer Z interrupt request bit is set to
“1”.
Prescaler Z is an 8-bit prescaler and counts the signal selected by
the timer Z count source selection bit.
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”. Also, set the port P02 direction
registers to output mode.
Prescaler Z has the prescaler Z latch to retain the reload value.
Timer Z has the timer Z primary latch and timer Z secondary latch
to retain the reload value.
The active edge of output waveform is set by the timer Z output
level latch (b4) of the timer Y, Z waveform output control register
(PUM). When “0” is set to b4 of PUM, “H” interval by the setting
value of TZP or “L” interval by the setting value of TZS is output al-
ternately. When “1” is set to b4 of PUM, “L” interval by the setting
value of TZP or “H” interval by the setting value of TZS is output
alternately.
The value of prescaler Z latch is set to Prescaler Z when Prescaler
Z underflows.The value of timer Z primary latch or timer Z second-
ary latch are set to Timer Z when Timer Z underflows.
As for the value to transfer to Timer Z, either of timer Z primary or
timer Z secondary is selected depending on the timer Z operating
mode.
Also, in this mode, the primary interval and the secondary interval
of the output waveform can be extended respectively for 0.5 cycle
of timer count source clock by setting the timer Z primary wave-
form extension control bit (b0) and the timer Z secondary
waveform extension control bit (b1) of PUM to “1”. As a result, the
waveforms of more accurate resolution can be output.
When b0 and b1 of PUM are used, the frequency and duty of the
output waveform are as follows;
When writing to Prescaler Z (PREZ), timer Z primary (TZP) or
timer Z secondary (TZS) is executed, writing to “latch only” or
“latches and Prescaler Z and Timer Z” can be selected by the set-
ting value of the timer Z write control bit. Be sure to set the write
control bit because there are some notes according to the operat-
ing mode.
When reading from Prescaler Z (PREZ) is executed, the count
value of Prescaler Z is read out. When reading from timer Z pri-
mary (TZP) is executed, the count value of Timer Z is read out.
The count value of Timer Z can be read out by reading from the
timer Z primary (TZP) even when the value of timer Z primary
latch or timer Z secondary latch is counted. When reading the
timer Z secondary (TZS) is executed, the undefined value is read
out.
Waveform frequency:
2✕TMZCL
FZOUT=
2✕(TZP+1)+2✕(TZS+1)+(EXPZP+EXPZS)
Duty:
2✕(TZP+1)+EXPZP
DZOUT=
Timer Z can be selected in one of 4 operating modes by setting
the timer Z operating mode bits of the timer Y, Z mode register.
(2✕(TZP+1)+EXPZP)+(2✕(TZS+1)+EXPZS
TMZCL: Timer Z count source (frequency)
TZP: Timer Z primary (8bit)
(1) Timer mode
Prescaler Z counts the count source selected by the timer Z count
source selection bits. Each time the count clock is input, the con-
tents of Prescaler Z is decremented by 1. When the contents of
Prescaler Z reach “0016”, an underflow occurs at the next count
clock, and the prescaler Z latch is reloaded into Prescaler Z. The
division ratio of Prescaler Z is 1/(n+1) provided that the value of
Prescaler Z is n.
TZS: Timer Z secondary (8bit)
EXPZP: Timer Z primary waveform extension control bit (1bit)
EXPZS: Timer Z secondary waveform extension control bit (1bit)
In the programmable waveform generation mode, when values of
the TZP, TZS, EXPZP and EXPZS are changed, the output wave-
form is changed at the beginning (timer Z primary waveform
interval) of waveform period.
The contents of Timer Z is decremented by 1 each time the under-
flow signal of Prescaler Z is input. When the contents of Timer Z
reach “0016”, an underflow occurs at the next count clock, and the
timer Z primary latch is reloaded into Timer Z and count continues.
(In the timer mode, the contents of timer Z primary latch is
counted. Timer Z secondary latch is not used in this mode.)
The division ratio of Timer Z is 1/(m+1) provided that the value of
Timer Z is m. Accordingly, the division ratio of Prescaler Z and
Timer Z is 1/((n+1)✕(m+1)) provided that the value of Prescaler Z
is n and the value of Timer Z is m.
When the count values are changed, set values to the TZS,
EXPZP and EXPZS first. After then, set the value to TZP. The val-
ues are set all at once at the beginning of the next waveform
period when the value is set to TZP. (When writing at timer stop is
executed, writing to TZP at last is required.)
In the timer mode, writing to “latch only” or “latches and Prescaler
Z and timer Z primary” can be selected by the setting value of the
timer Z write control bit.
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Notes on the programmable waveform generation mode are de-
scribed below;
The falling or rising can be selected as the edge of the valid trig-
ger of INT0 pin by the INT0 pin one-shot trigger edge selection bit.
During the one-shot pulse output interval, the one-shot pulse out-
put can be stopped forcibly by writing “0” to the timer Z one-shot
start bit.
✕✕Notes on programmable waveform generation mode
• Count set value
In the programmable waveform generation mode, values of TZS,
EXPZP, and EXPZS are valid by writing to TZP because the set-
ting to them is executed all at once by writing to TZP. Even when
changing TZP is not required, write the same value again.
• Write timing to TZP
In the programmable one-shot generation mode, when the count
values are changed, set value to the EXPZP first. After then, set
the value to TZP. The values are set all at once at the beginning of
the next one-shot pulse when the value is set to TZP. (When writ-
ing at timer stop is executed, writing to TZP at last is required.)
In the programmable waveform generation mode, when the set-
ting value is changed while the waveform is output, set by
software in order not to execute the writing to TZP and the timing
of timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
Notes on the programmable one-shot generation mode are de-
scribed below;
The waveform extension function by the timer Z waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Z.
When the value other than “0016” is set to Prescaler Z, be sure to
set “0” to EXPZP and EXPZS. Also, when the timer Y underflow is
selected as the count source, the waveform extension function
cannot be used.
✕ Notes on programmable one-shot generation mode
• Count set value
In the programmable one-shot generation mode, the value of
EXPZP becomes valid by writing to TZP. Even when changing
TZP is not required, write the same value again.
• Write timing to TZP
• Timer Z write mode
In the programmable one-shot generation mode, when the setting
value is changed while the waveform is output, set by software in
order not to execute the writing to TZP and the timing of timer un-
derflow simultanesously.
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
(3) Programmable one-shot generation mode
• Usage of waveform extension function
In the programmable one-shot generation mode, the one-shot
pulse by the setting value of timer Z primary can be output from
TZOUT pin by software or external trigger. When using this mode,
be sure to set “1” to the timer Z write control bit to select “write to
latch only”. Also, set the port P02 direction registers to output
mode. In this mode, TZS is not used.
The waveform extension function by the timer Z waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Z.
When the value other than “0016” is set to Prescaler Z, be sure to
set “0” to EXPZP. Also, when the timer Y underflow is selected as
the count source, the waveform extension function cannot be
used.
The active edge of output waveform is set by the timer Z output
level latch (b5) of the timer Y, Z waveform output control register
(PUM). When “0” is set to b5 of PUM, “H” pulse during the interval
of the TZP setting value is output. When “1” is set to b5 of PUM,
“L” pulse during the interval of the TZP setting value is output.
Also, in this mode, the interval of the one-shot pulse output can be
extended for 0.5 cycle of timer count source clock by setting the
timer Z primary waveform extension control bit (b2) of PUM to “1”.
As a result, the waveforms of more accurate resolution can be
output.
• Timer Z write mode
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
In the programmable one-shot generation mode, the trigger by
software or the external INT0 pin can be accepted by writing “0” to
the timer Z count stop bit after the count value is set. (At the time
when “0” is written to the timer Z count stop bit, Timer Z stops.)
By writing “1” to the timer Z one-shot start bit, or by inputting the
valid trigger to the INT0 pin after the trigger to the INT0 pin be-
comes valid by writing “1” to the INT0 pin one-shot trigger control
bit, Timer Z starts counting, at the same time, the output of TZOUT
pin is inverted. When Timer Z underflows, the output of TZOUT pin
is inverted again and Timer Z stops. When also the trigger of INT0
pin is accepted, the contents of the one-shot start bit is changed to
“1” by hardware.
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(4) Programmable wait one-shot generation mode
✕✕Notes on programmable wait one-shot generation mode
• Count set value
In the programmable wait one-shot generation mode, the one-shot
pulse by the setting value of timer Z secondary can be output from
TZOUT pin by software or external trigger to INT0 pin after the wait
by the setting value of the timer Z primary. When using this mode,
be sure to set “1” to the timer Z write control bit to select “write to
latch only”. Also, set the port P02 direction registers to output
mode.
In the programmable wait one-shot generation mode, values of
TZS, EXPZP and EXPZS are valid by writing to TZP. Even when
changing TZP is not required, write the same value again.
• Write timing to TZP
In the programmable wait one-shot generation mode, when the
setting value is changed while the waveform is output, set by soft-
ware in order not to execute the writing to TZP and the timing of
timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
The active edge of output waveform is set by the timer Z output
level latch (b5) of the timer Y, Z waveform output control register
(PUM). When “0” is set to b5 of PUM, after the wait during the in-
terval of the TZP setting value, “H” pulse during the interval of the
TZS setting value is output. When “1” is set to b5 of PUM, after the
wait during the interval of the TZP setting value, “L” pulse during
the interval of the TZS setting value is output.
The waveform extension function by the timer Z waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Z.
When the value other than “0016” is set to Prescaler Z, be sure to
set “0” to EXPZP and EXPZS. Also, when the timer Y underflow is
selected as the count source, the waveform extension function
cannot be used.
Also, in this mode, the intervals of the wait and the one-shot pulse
output can be extended for 0.5 cycle of timer count source clock
by setting EXPZP and EXPZS of PUM to “1”. As a result, the
waveforms of more accurate resolution can be output.
• Timer Z write mode
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
In the programmable one-shot generation mode, the trigger by
software or the external INT0 pin can be accepted by writing “0” to
the timer Z count stop bit after the count value is set. (At the time
when “0” is written to the timer Z count stop bit, Timer Z stops.)
By writing “1” to the timer Z one-shot start bit, or by inputting the
valid trigger to the INT0 pin after the trigger to the INT0 pin be-
comes valid by writing “1” to the INT0 pin one-shot trigger control
bit, Timer Z starts counting.
Timer Z can stop counting by setting “1” to the timer Z count stop
bit in any mode.
Also, when Timer Z underflows, the timer Z interrupt request bit is
set to “1”.
Timer Z reloads the value of latch when counting is stopped by the
timer Z count stop bit. (When timer is read out while timer is
stopped, the value of latch is read. The value of timer can be read
out only while timer is operating.)
While Timer Z counts the TZP, the initial value of the TZOUT pin
output is retained. When Timer Z underflows, the value of TZS is
reloaded, at the same time, the output of TZOUT pin is inverted.
When Timer Z underflows, the output of TZOUT pin is inverted
again and Timer Z stops. When also the trigger of INT0 pin is ac-
cepted, the contents of the one-shot start bit is changed to “1” by
hardware.
The falling or rising can be selected as the edge of the valid trig-
ger of INT0 pin by the INT0 pin one-shot trigger edge selection bit.
During the wait interval and the one-shot pulse output interval, the
one-shot pulse output can be stopped forcibly by writing “0” to the
timer Z one-shot start bit.
In the programmable wait one-shot generation mode, when the
count values are changed, set values to the TZS, EXPZP and
EXPZS first. After then, set the value to TZP. The values are set all
at once at the beginning of the next wait interval when the value is
set to TZP. (When writing at timer stop is executed, writing to TZP
at last is required.)
Notes on the programmable wait one-shot generation mode are
described below;
Rev.4.00 Jun 21, 2004 page 30 of 82
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b7
b0
Timer Y, Z mode register
(TYZM : address 002016, initial value: 0016
)
Timer Y operating mode bit
0 : Timer mode
1 : Programmable waveform generation mode
Not used (return “0” when read)
Timer Y write control bit
0 : Write to latch and timer simultaneously
1 : Write to only latch
Timer Y count stop bit
0 : Count start
1 : Count stop
Timer Z operating mode bits
b5 b4
0
0
1
1
0 : Timer mode
1 : Programmable waveform generation mode
0 : Programmable one-shot generation mode
1 : Programmable wait one-shot generation mode
Timer Z write control bit
0 : Write to latch and timer simultaneously
1 : Write to only latch
Timer Z count stop bit
0 : Count start
1 : Count stop
Fig. 25 Structure of timer Y, Z mode register
b7
b0
Timer Y, Z waveform output control register
(PUM : address 002416, initial value: 0016
)
Timer Y primary waveform extension control bit
0 : Waveform not extended
1 : Waveform extended
Timer Y secondary waveform extension control bit
0 : Waveform not extended
1 : Waveform extended
Timer Z primary waveform extension control bit
0 : Waveform not extended
1 : Waveform extended
Timer Z secondary waveform extension control bit
0 : Waveform not extended
1 : Waveform extended
Timer Y output level latch
0 : “L” output
1 : “H” output
Timer Z output level latch
0 : “L” output
1 : “H” output
INT0 pin one-shot trigger control bit
0 : INT
1 : INT
0
0
pin one-shot trigger invalid
pin one-shot trigger valid
INT0 pin one-shot trigger active edge selection bit
0 : Falling edge trigger
1 : Rising edge trigger
Fig. 26 Structure of timer YZ waveform output control register
b7
b0
One-shot start register
(ONS : address 002A16, initial value: 0016
)
Timer Z one-shot start bit
0 : One-shot stop
1 : One-shot start
Not used (return “0” when read)
Fig. 27 Structure of one-shot start register
Rev.4.00 Jun 21, 2004 page 31 of 82
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Data bus
Timer 1 latch (8)
Prescaler 1 latch (8)
Prescaler 1 (8)
Timer 1 interrupt
request bit
Timer 1 (8)
f(XIN)/16
Pulse width HL
continuously
measurement mode
Rising edge detected
Falling edge detected
Period measurement mode
CNTR
edge switch bit
1 active
Data bus
P00/CNTR1
Timer A (high-order) latch (8)
Timer A (low-order) latch (8)
Timer A interrupt
request bit
Timer A (low-order) (8)
Timer A (high-order) (8)
Timer A count
stop bit
f(XIN)/16
Timer A operation mode bit
Fig. 28 Block diagram of timer 1 and timer A
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REJ03B0011-0400Z
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Data bus
f(XIN)/16
f(XIN)/2
Prescaler X latch (8)
Prescaler X (8)
Timer X latch (8)
Timer X (8)
Pulse width
measurement
mode
f(XIN
)
Timer mode
Pulse output
mode
Timer X count
source selection bits
Timer X
interrupt
request bit
CNTR0 active
edge switch bit
“0”
Event
counter
mode
Timer X count stop bit
P14/CNTR0
CNTR
0
interrupt
request bit
“1”
CNTR0 active
edge switch bit
“1”
“0”
Q
Toggle flip-flop
R
T
Q
Port P1
latch
4
Writing to timer X latch
Pulse output mode
Port P14 direction
register
Pulse output mode
P0
3/
TXOUT
Port P03 latch
Data bus
P03/TXOUT output valid
Port P0
3
direction
register
Prescaler Y latch (8)
Prescaler Y (8)
Timer Y primary latch (8)
Timer Y secondary latch (8)
Timer Y (8)
Timer Y count
source selection bits
Timer Y
interrupt
f(XIN)/16
f(XIN)/2
request bit
Timer Y count
stop bit
On-chip oscillator clock RING
(on-chip oscillator output
in Fig. 51, 52)
Timer Y primary waveform
extension control bit
Q
Q
T
Toggle flip-flop
Waveform extension function
P01/TYOUT
Port P01 latch
Timer Y output level latch
Timer Y secondary
waveform extension
control bit
Port P0
direction
register
1
Programmable waveform
gengeration mode
Data bus
Prescaler Z latch (8)
Prescaler Z (8)
Timer Z primary latch (8)
Timer Z secondary latch (8)
Timer Z count
source selection bits
f(XIN)/16
f(XIN)/2
Timer Z
interrupt
request bit
Timer Z (8)
Programmable one-shot generation mode
Programmable wait one-shot generation mode
Timer Z count
stop bit
Timer Z one-shot start bit
INT
0 pin trigger active edge
selection bit
INT0
P37/INT0
interrupt
request bit
One-shot pulse
trigger input
Timer Z primary waveform
extenstion control bit
Q
Q
T
Toggle flip flop
Waveform extension function
P02/TZOUT
Timer Z output
level latch
Port P02 latch
Timer Z secondary waveform
extenstion control bit
Port P0
register
2 direction
Programmable waveform generation mode
Programmable one-shot generation mode
Programmable wait one-shot generation mode
Fig. 29 Block diagram of timer X, timer Y and timer Z
Rev.4.00 Jun 21, 2004 page 33 of 82
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Serial I/O
(1) Clock Synchronous Serial I/O Mode
✕Serial I/O1
Clock synchronous serial I/O1 mode can be selected by setting
the serial I/O1 mode selection bit of the serial I/O1 control register
(bit 6) to “1”.
Serial I/O1 can be used as either clock synchronous or asynchro-
nous (UART) serial I/O. A dedicated timer is also provided for
baud rate generation.
For clock synchronous serial I/O1, the transmitter and the receiver
must use the same clock. If an internal clock is used, transfer is
started by a write signal to the TB/RB.
Data bus
Serial I/O1 control register
Address 001A16
Address 001816
Receive buffer register
Receive buffer full flag (RBF)
Receive shift register
Receive interrupt request (RI)
P10/RXD1
Shift clock
Clock control circuit
P12/SCLK1
Serial I/O1 synchronous
clock selection bit
Frequency division ratio 1/(n+1)
BRG count source selection bit
1/4
X
IN
Baud rate generator
Address 001C16
1/4
Clock control circuit
P1
3
/SRDY1
Falling-edge detector
F/F
Shift clock
Transmit shift register
Transmit buffer register
Transmit shift completion flag (TSC)
Transmit interrupt source selection bit
P11/TXD1
Transmit interrupt request (TI)
Transmit buffer empty flag (TBE)
Serial I/O1 status register
Address 001916
Address 001816
Data bus
Fig. 30 Block diagram of clock synchronous serial I/O1
Transfer shift clock
(1/2 to 1/2048 of the internal
clock, or an external clock)
Serial output TxD
Serial input RxD
D
D
0
0
D
D
1
1
D
D
2
2
D
D
3
3
D
D
4
4
D
D
5
5
D
D
6
6
D
D
7
7
Receive enable signal SRDY1
Write pulse to receive/transmit
buffer register (address 001816
)
RBF = 1
TSC = 1
TBE = 0
TBE = 1
TSC = 0
Overrun error (OE)
detection
Notes 1: As the transmit interrupt (TI), which can be selected, either when the transmit buffer has emptied (TBE=1) or after
the transmit shift operation has ended (TSC=1), by setting the transmit interrupt source selection bit (TIC) of the
serial I/O1 control register.
2: If data is written to the transmit buffer register when TSC=0, the transmit clock is generated continuously and serial
data is output continuously from the TxD pin.
3: The receive interrupt (RI) is set when the receive buffer full flag (RBF) becomes “1” .
Fig. 31 Operation of clock synchronous serial I/O1 function
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The transmit and receive shift registers each have a buffer, but the
two buffers have the same address in memory. Since the shift reg-
ister cannot be written to or read from directly, transmit data is
written to the transmit buffer register, and receive data is read
from the receive buffer register.
(2) Asynchronous Serial I/O (UART) Mode
Clock asynchronous serial I/O mode (UART) can be selected by
clearing the serial I/O1 mode selection bit of the serial I/O1 control
register to “0”.
Eight serial data transfer formats can be selected, and the transfer
formats used by a transmitter and receiver must be identical.
The transmit buffer register can also hold the next data to be
transmitted, and the receive buffer register can hold a character
while the next character is being received.
Data bus
Address 001816
Serial I/O1 control register Address 001A16
Receive buffer register
OE
Character length selection bit
Receive buffer full flag (RBF)
Receive interrupt request (RI)
P10/RXD1
ST detector
7 bits
8 bits
Receive shift register
PE FE SP detector
1/16
UART control register
Address 001B16
Clock control circuit
Serial I/O1 synchronous clock selection bit
P12/SCLK1
Frequency division ratio 1/(n+1)
BRG count source selection bit
1/4
X
IN
Baud rate generator
Address 001C16
ST/SP/PA generator
1/16
Transmit shift completion flag (TSC)
Transmit interrupt source selection bit
P11/TXD1
Transmit shift register
Transmit interrupt request (TI)
Character length selection bit
Transmit buffer empty flag (TBE)
Transmit buffer register
Address 001816
Address 001916
Serial I/O1 status register
Data bus
Fig. 32 Block diagram of UART serial I/O1
Transmit or receive clock
Transmit buffer write
signal
TBE=0
TSC=0
TBE=1
TBE=0
TSC=1✕
SP
TBE=1
Serial output TXD
ST
D0
D1
ST
D0
D1
SP
✕ Generated at 2nd bit in 2-stop-bit mode
1 start bit
7 or 8 data bit
1 or 0 parity bit
1 or 2 stop bit (s)
Receive buffer read
signal
RBF=0
RBF=1
SP
RBF=1
SP
ST
Serial input RXD
D0
D1
ST
D0
D1
Notes 1: Error flag detection occurs at the same time that the RBF flag becomes “1” (at 1st stop bit, during reception).
2: As the transmit interrupt (TI), when either the TBE or TSC flag becomes “1,” can be selected to occur depending on the setting of the transmit
interrupt source selection bit (TIC) of the serial I/O1 control register.
3: The receive interrupt (RI) is set when the RBF flag becomes “1.”
4: After data is written to the transmit buffer when TSC=1, 0.5 to 1.5 cycles of the data shift cycle is necessary until changing to TSC=0.
Fig. 33 Operation of UART serial I/O1 function
Rev.4.00 Jun 21, 2004 page 35 of 82
REJ03B0011-0400Z
7540 Group
[Transmit buffer register/receive buffer register (TB/RB)]
001816
✕✕Notes on serial I/O
• Serial I/O interrupt
The transmit buffer register and the receive buffer register are lo-
cated at the same address. The transmit buffer is write-only and
the receive buffer is read-only. If a character bit length is 7 bits, the
MSB of data stored in the receive buffer is “0”.
When setting the transmit enable bit to “1”, the serial I/O transmit
interrupt request bit is automatically set to “1”. When not requiring
the interrupt occurrence synchronized with the transmission en-
abled, take the following sequence.
✕ Set the serial I/O transmit interrupt enable bit to “0” (disabled).
✕ Set the transmit enable bit to “1”.
[Serial I/O1 status register (SIO1STS)] 001916
The read-only serial I/O1 status register consists of seven flags
(bits 0 to 6) which indicate the operating status of the serial I/O1
function and various errors.
✕ Set the serial I/O transmit interrupt request bit to “0” after 1 or
more instructions have been executed.
✕ Set the serial I/O transmit interrupt enable bit to “1” (enabled).
Three of the flags (bits 4 to 6) are valid only in UART mode.
The receive buffer full flag (bit 1) is cleared to “0” when the receive
buffer register is read.
• I/O pin function when serial I/O1 is enabled.
The functions of P12 and P13 are switched with the setting values
of a serial I/O1 mode selection bit and a serial I/O1 synchronous
clock selection bit as follows.
If there is an error, it is detected at the same time that data is
transferred from the receive shift register to the receive buffer reg-
ister, and the receive buffer full flag is set. A write to the serial I/O1
status register clears all the error flags OE, PE, FE, and SE (bit 3
to bit 6, respectively). Writing “0” to the serial I/O1 enable bit SIOE
(bit 7 of the serial I/O1 control register) also clears all the status
flags, including the error flags.
(1) Serial I/O1 mode selection bit → “1” :
Clock synchronous type serial I/O is selected.
Setup of a serial I/O1 synchronous clock selection bit
“0” : P12 pin turns into an output pin of a synchronous clock.
“1” : P12 pin turns into an input pin of a synchronous clock.
Setup of a SRDY1 output enable bit (SRDY)
Bits 0 to 6 of the serial I/O1 status register are initialized to “0” at
reset, but if the transmit enable bit of the serial I/O1 control regis-
ter has been set to “1”, the transmit shift completion flag (bit 2)
and the transmit buffer empty flag (bit 0) become “1”.
“0” : P13 pin can be used as a normal I/O pin.
“1” : P13 pin turns into a SRDY output pin.
[Serial I/O1 control register (SIO1CON)] 001A16
The serial I/O1 control register consists of eight control bits for the
serial I/O1 function.
(2) Serial I/O1 mode selection bit → “0” :
Clock asynchronous (UART) type serial I/O is selected.
Setup of a serial I/O1 synchronous clock selection bit
“0”: P12 pin can be used as a normal I/O pin.
[UART control register (UARTCON)] 001B16
“1”: P12 pin turns into an input pin of an external clock.
When clock asynchronous (UART) type serial I/O is selected, it is
P13 pin. It can be used as a normal I/O pin.
The UART control register consists of four control bits (bits 0 to 3)
which are valid when asynchronous serial I/O is selected and set
the data format of an data transfer and one bit (bit 4) which is al-
ways valid and sets the output structure of the P11/TXD1 pin.
[Baud rate generator (BRG)] 001C16
The baud rate generator determines the baud rate for serial transfer.
The baud rate generator divides the frequency of the count source
by 1/(n + 1), where n is the value written to the baud rate generator.
Rev.4.00 Jun 21, 2004 page 36 of 82
REJ03B0011-0400Z
7540 Group
b7
b0
b7
b0
Serial I/O1 status register
(SIO1STS : address 0019 16, initial value: 0016)
Serial I/O1 control register
(SIO1CON : address 001A 16, initial value: 0016)
BRG count source selection bit (CSS)
0: f(XIN)
1: f(XIN)/4
Transmit buffer empty flag (TBE)
0: Buffer full
1: Buffer empty
Serial I/O1 synchronous clock selection bit (SCS)
0: BRG output divided by 4 when clock synchronous
serial I/O is selected, BRG output divided by 16
when UART is selected.
Receive buffer full flag (RBF)
0: Buffer empty
1: Buffer full
1: External clock input when clock synchronous serial
I/O is selected, external clock input divided by 16
when UART is selected.
Transmit shift completion flag (TSC)
0: Transmit shift in progress
1: Transmit shift completed
SRDY1 output enable bit (SRDY)
0: P13 pin operates as ordinary I/O pin
1: P13 pin operates as SRDY1 output pin
Overrun error flag (OE)
0: No error
1: Overrun error
Transmit interrupt source selection bit (TIC)
0: Interrupt when transmit buffer has emptied
1: Interrupt when transmit shift operation is completed
Parity error flag (PE)
0: No error
1: Parity error
Transmit enable bit (TE)
0: Transmit disabled
1: Transmit enabled
Framing error flag (FE)
0: No error
1: Framing error
Receive enable bit (RE)
0: Receive disabled
1: Receive enabled
Summing error flag (SE)
0: (OE) U (PE) U (FE)=0
1: (OE) U (PE) U (FE)=1
Serial I/O1 mode selection bit (SIOM)
0: Clock asynchronous (UART) serial I/O
1: Clock synchronous serial I/O
Not used (returns “1” when read)
b7
b0
Serial I/O1 enable bit (SIOE)
0: Serial I/O1 disabled
(pins P10 to P13 operate as ordinary I/O pins)
1: Serial I/O1 enabled
(pins P10 to P13operate as serial I/O pins)
UART control register
(UARTCON : address 001B 16, initial value: E016)
Character length selection bit (CHAS)
0: 8 bits
1: 7 bits
Parity enable bit (PARE)
0: Parity checking disabled
1: Parity checking enabled
Parity selection bit (PARS)
0: Even parity
1: Odd parity
Stop bit length selection bit (STPS)
0: 1 stop bit
1: 2 stop bits
P11/TXD1 P-channel output disable bit (POFF)
0: CMOS output (in output mode)
1: N-channel open drain output (in output mode)
Not used (return “1” when read)
Fig. 34 Structure of serial I/O1-related registers
Rev.4.00 Jun 21, 2004 page 37 of 82
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✕Serial I/O2
The serial I/O2 function can be used only for clock synchronous
b7
b0
Serial I/O2 control register
(SIO2CON: address 003016, initila value: 0016)
serial I/O.
For clock synchronous serial I/O2 the transmitter and the receiver
must use the same clock. When the internal clock is used, transfer
is started by a write signal to the serial I/O2 register.
Note: Serial I/O2 can be used in the following cases;
(1) Serial I/O1 is not used,
Internal synchronous clock selection bits
000 : f(XIN)/8
001 : f(XIN)/16
010 : f(XIN)/32
011 : f(XIN)/64
110 : f(XIN)/128
111 : f(XIN)/256
(2) Serial I/O1 is used as UART and BRG output divided by 16 is
selected as the synchronized clock.
SDATA2 pin selection bit (Note)
0 : I/O port / SDATA2 input
1 : SDATA2 output
Not used
[Serial I/O2 control register] SIO2CON
The serial I/O2 control register contains 8 bits which control vari-
ous serial I/O functions.
(returns “0” when read)
Transfer direction selection bit
0 : LSB first
1 : MSB first
SCLK2 pin selection bit
0 : External clock (SCLK2 is an input)
1 : Internal clock (SCLK2 is an output)
• Set “0” to bit 3 to receive.
• At reception, clear bit 7 to “0” by writing a dummy data to the se-
rial I/O2 register after completion of shift.
Transmit / receive shift completion flag
0 : shift in progress
1 : shift completed
Note : When using it as a SDATA input, set the port P13
direction register to “0”.
Fig. 35 Structure of serial I/O2 control registers
Data bus
1/8
1/16
1/32
1/64
1/128
1/256
X
IN
S
CLK2 pin
selection bit “1”
S
CLK
Internal synchronous
clock selection bits
“0”
S
CLK2 pin selection bit
“0”
P12 latch
P12/SCLK2
Serial I/O2
interrupt request
Serial I/O counter 2 (3)
“1”
S
DATA2 pin selection bit
“0”
P13 latch
P13/SDATA2
“1”
DATA2 pin selection bit
S
Serial I/O shift register 2 (8)
Fig. 36 Block diagram of serial I/O2
Rev.4.00 Jun 21, 2004 page 38 of 82
REJ03B0011-0400Z
7540 Group
Serial I/O2 operation
By writing to the serial I/O2 register (address 003116) the serial I/
O2 counter is set to “7”.
After writing, the SDATA2 pin outputs data every time the transfer
clock shifts from “H” to “L”. And, as the transfer clock shifts from
“L” to “H”, the SDATA2 pin reads data, and at the same time the
contents of the serial I/O2 register are shifted by 1 bit.
When the internal clock is selected as the transfer clock source,
the following operations execute as the transfer clock counts up to
8.
• Serial I/O2 counter is cleared to “0”.
• Transfer clock stops at an “H” level.
• Interrupt request bit is set.
• Shift completion flag is set.
Also, the SDATA2 pin is in a high impedance state after the data
transfer is completed (refer to Fig.37).
When the external clock is selected as the transfer clock source,
the interrupt request bit is set as the transfer clock counts up to 8,
but external control of the clock is required since it does not stop.
Notice that the SDATA2 pin is not in a high impedance state on the
completion of data transfer.
Also, after the receive operation is completed, the transmit/receive
shift completion flag is cleared by reading the serial I/O2 register.
At transmit, the transmit/receive shift completion flag is cleared
and the transmit operation is started by writing to serial I/O2 regis-
ter.
Synchronous clock
Transfer clock
Serial I/O2 register
write signal
(Note)
S
DATA2 at serial I/O2
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D7
output transmit
S
DATA2 at serial I/O2
input receive
Serial I/O2 interrupt request bit set
Transmit/receive shift completion flag set
Note : When the internal clock is selected as the transfer and the direction register of P1
3/SDATA2 pin is set to the input mode,
the SDATA2 pin is in a high impedance state after the data transfer is completed.
Fig. 37 Serial I/O2 timing (LSB first)
Rev.4.00 Jun 21, 2004 page 39 of 82
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(2) When VREF voltage is lower than [3.0 V], the accuracy at the
low temperature may become extremely low compared with
that at room temperature When the system would be used at
low temperature, the use at VREF=3.0 V or more is recom-
mended.
A/D Converter
The functional blocks of the A/D converter are described below.
[A/D conversion register] AD
The A/D conversion register is a read-only register that stores the
result of A/D conversion. Do not read out this register during an A/
D conversion.
b7
b0
A/D control register
(ADCON : address 003416, initial value: 1016)
[A/D control register] ADCON
Analog input pin selection bits
000 : P20/AN0
001 : P21/AN1
010 : P22/AN2
011 : P23/AN3
100 : P24/AN4
101 : P25/AN5
110 : P26/AN6 (Note)
111 : P27/AN7 (Note)
The A/D control register controls the A/D converter. Bit 2 to 0 are
analog input pin selection bits. Bit 4 is the AD conversion comple-
tion bit. The value of this bit remains at “0” during A/D conversion,
and changes to “1” at completion of A/D conversion.
A/D conversion is started by setting this bit to “0”.
Not used (returns “0” when read)
[Comparison voltage generator]
AD conversion completion bit
0 : Conversion in progress
1 : Conversion completed
The comparison voltage generator divides the voltage between
AVSS and VREF by 1024, and outputs the divided voltages.
Not used (returns “0” when read)
Note: These can be used only for 36 pin version.
[Channel selector]
The channel selector selects one of ports P27/AN7 to P20/AN0,
and inputs the voltage to the comparator.
Fig. 38 Structure of A/D control register
[Comparator and control circuit]
Read 8-bit (Read only address 003516
b7
)
The comparator and control circuit compares an analog input volt-
age with the comparison voltage and stores its result into the A/D
conversion register. When A/D conversion is completed, the con-
trol circuit sets the AD conversion completion bit and the AD
interrupt request bit to “1”. Because the comparator is constructed
linked to a capacitor, set f(XIN) to 500 kHz or more during A/D con-
version.
b0
(Address 003516
)
b9 b8 b7 b6 b5 b4 b3 b2
Read 10-bit (read in order address 003616, 003516
b7
)
b0
b9 b8
(Address 003616
)
b7
b0
✕✕Note on A/D converter
(Address 003516
)
b7 b6 b5 b4 b3 b2 b1 b0
As for AD translation accuracy, on the following operating condi-
tions, accuracy may become low.
(1) Since the analog circuit inside a microcomputer becomes sensi-
tive to noise when VREF voltage is set up lower than Vcc
voltage, accuracy may become low rather than the case where
VREF voltage and Vcc voltage are set up to the same value.
Note: High-order 6-bit of address 003616 returns “0” when read.
Fig. 39 Structure of A/D conversion register
Data bus
b7
b0
A/D control register
(Address 003416
)
3
A/D interrupt request
A/D control circuit
P20/AN0
P21
P22
P23
P24
P25
P26
P27
/AN
/AN
/AN
/AN
/AN
/AN
/AN
1
2
3
4
5
6
7
A/D conversion register (high-order)
(Address 003616
(Address 003516
)
)
Comparator
A/D conversion register (low-order)
10
Resistor ladder
V
REF
VSS
Fig. 40 Block diagram of A/D converter
Rev.4.00 Jun 21, 2004 page 40 of 82
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7540 Group
Watchdog Timer
Operation of watchdog timer H count source selection bit
A watchdog timer H count source can be selected by bit 7 of the
watchdog timer control register (address 003916). When this bit is
“0”, the count source becomes a watchdog timer L underflow sig-
nal. The detection time is 131.072 ms at f(XIN)=8 MHz.
When this bit is “1”, the count source becomes f(XIN)/16. In this
case, the detection time is 512 µs at f(XIN)=8 MHz.
The watchdog timer gives a means for returning to a reset status
when the program fails to run on its normal loop due to a runaway.
The watchdog timer consists of an 8-bit watchdog timer H and an
8-bit watchdog timer L, being a 16-bit counter.
Standard operation of watchdog timer
The watchdog timer stops when the watchdog timer control regis-
ter (address 003916) is not set after reset. Writing an optional
value to the watchdog timer control register (address 003916)
causes the watchdog timer to start to count down. When the
watchdog timer H underflows, an internal reset occurs. Accord-
ingly, it is programmed that the watchdog timer control register
(address 003916) can be set before an underflow occurs.
When the watchdog timer control register (address 003916) is
read, the values of the high-order 6-bit of the watchdog timer H,
STP instruction disable bit and watchdog timer H count source se-
lection bit are read.
This bit is cleared to “0” after reset.
Operation of STP instruction disable bit
When the watchdog timer is in operation, the STP instruction can
be disabled by bit 6 of the watchdog timer control register (ad-
dress 003916).
When this bit is “0”, the STP instruction is enabled.
When this bit is “1”, the STP instruction is disabled, and an inter-
nal reset occurs if the STP instruction is executed.
Once this bit is set to “1”, it cannot be changed to “0” by program.
This bit is cleared to “0” after reset.
Initial value of watchdog timer
By a reset or writing to the watchdog timer control register (ad-
dress 003916), the watchdog timer H is set to “FF16” and the
watchdog timer L is set to “FF16”.
Data bus
Write “FF16” to the
watchdog timer
control register
Write "FF16" to the
watchdog timer
control register
“0”
“1”
Watchdog timer L (8)
Watchdog timer H (8)
1/16
X
IN
Watchdog timer H count
source selection bit
STP Instruction disable bit
STP Instruction
Reset
circuit
Internal reset
RESET
Fig. 41 Block diagram of watchdog timer
b7
b0
Watchdog timer control register
(WDTCON: address 003916, initial value: 3F16
)
Watchdog timer H (read only for high-order 6-bit)
STP instruction disable bit
0 : STP instruction enabled
1 : STP instruction disabled
Watchdog timer H count source selection bit
0 : Watchdog timer L underflow
1 : f(XIN)/16
Fig. 42 Structure of watchdog timer control register
Rev.4.00 Jun 21, 2004 page 41 of 82
REJ03B0011-0400Z
7540 Group
Reset Circuit
Poweron
(Note)
The microcomputer is put into a reset status by holding the RE-
SET pin at the “L” level for 2 µs or more when the power source
voltage is 2.2 to 5.5 V and XIN is in stable oscillation.
After that, this reset status is released by returning the RESET pin
to the “H” level. The program starts from the address having the
contents of address FFFD16 as high-order address and the con-
tents of address FFFC16 as low-order address.
Power source
voltage
0 V
RESET
VCC
Reset input
voltage
0 V
0.2 VCC
In the case of f(φ) ≤ 6 MHz, the reset input voltage must be 0.9 V
or less when the power source voltage passes 4.5 V.
In the case of f(φ) ≤ 4 MHz, the reset input voltage must be 0.8 V
or less when the power source voltage passes 4.0 V.
In the case of f(φ) ≤ 2 MHz, the reset input voltage must be 0.48 V
or less when the power source voltage passes 2.4 V.
In the case of f(φ) ≤ 1 MHz, the reset input voltage must be 0.44 V
or less when the power source voltage passes 2.2 V.
Note : Reset release voltage Vcc = 2.2 V
RESET
VCC
Power source
voltage
detection circuit
Fig. 43 Example of reset circuit
Clock from on-chip
oscillator RING
φ
RESET
RESETOUT
SYNC
AD
H
H,ADL
?
?
?
?
?
FFFC
FFFD
Address
Reset address from the
vector table
?
?
?
?
?
ADL
AD
Data
Notes
1 : An on-chip oscillator applies about RING•2 MHz, φ•250 kHz frequency clock
at average of Vcc = 5 V.
8-13 clock cycles
2 : The mark “?” means that the address is changeable depending on the previous state.
3 : These are all internal signals except RESET.
Fig. 44 Timing diagram at reset
Rev.4.00 Jun 21, 2004 page 42 of 82
REJ03B0011-0400Z
7540 Group
Address
Register contents
0016
000116
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Port P0 direction register
Port P1 direction register
Port P2 direction register
Port P3 direction register
X
X
X
0
0
0
0
0
000316
000516
000716
001616
001716
001916
001A16
001B16
0016
0016
0016
0016
Pull-up control register
Port P1P3 control register
1
1
0
1
0
1
0
0
0
0
0
0
0
0
Serial I/O1 status register
0016
(8) Serial I/O1 control register
0
0
(9)
UART control register
0016
001D16
001E16
001F16
002016
002116
002216
002316
002416
002516
002616
002716
002816
002916
002A16
002B16
002C16
002D16
002E16
003016
003116
003416
003816
003916
003A16
003B16
003C16
(10)
Timer A mode register
(11) Timer A (low-order)
(12)
FF16
FF16
0016
FF16
FF16
FF16
0016
FF16
FF16
Timer A (high-order)
(13) Timer Y, Z mode register
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23)
(24)
(25)
(26)
Prescaler Y
Timer Y secondary
Timer Y primary
Timer Y, Z waveform output control register
Prescaler Z
Timer Z secondary
Timer Z primary
Prescaler 1
FF16
FF16
0116
0016
0016
Timer 1
One-shot start register
Timer X mode register
Prescaler X
FF16
FF16
0016
0016
Timer X
(27) Timer count source set register
(28) Serial I/O2 control register
(29) Serial I/O2 register
0016
1016
0016
(30) A/D control register
(31) MISRG
0
1
0
0
1
0
1
1
1
0
1
0
1
0
(32) Watchdog timer control register
0016
Interrupt edge selection register
(33)
(34)
(35)
(36)
(37)
(38)
(39)
(40)
0
0
CPU mode register
0016
0016
0016
0016
Interrupt request register 1
Interrupt request register 2
Interrupt control register 1
Interrupt control register 2
Processor status register
003D16
003E16
003F16
X
X
X
X
X
1
X
X
(PS)
Contents of address FFFD16
Contents of address FFFC16
Note X : Undefined
Program counter
(PCH
)
(PCL
)
Fig. 45 Internal status of microcomputer at reset
Rev.4.00 Jun 21, 2004 page 43 of 82
REJ03B0011-0400Z
7540 Group
Clock Generating Circuit
Note:
Externally connect a
damping resistor Rd de-
p e n d i n g o n t h e
oscillation frequency.
(A feedback resistor is
built-in.)
Use the resonator
manufacturer’s recom-
mended value because
constants such as ca-
pacitance depend on the
resonator.
An oscillation circuit can be formed by connecting a resonator be-
tween XIN and XOUT, and an RC oscillation circuit can be formed
by connecting a resistor and a capacitor.
M37540
Use the circuit constants in accordance with the resonator
manufacturer's recommended values.
X
IN
XOUT
Rd
(1) On-chip oscillator operation
When the MCU operates by the on-chip oscillator for the main
clock, connect XIN pin to VSS and leave XOUT pin open.
The clock frequency of the on-chip oscillator depends on the sup-
ply voltage and the operation temperature range.
Be careful that variable frequencies when designing application
products.
C
OUT
C
IN
Fig. 46 External circuit of ceramic resonator
Note:
Connect the external
circuit of resistor R
and the capacitor C at
the shortest distance.
The frequency is af-
fected by a capacitor,
a resistor and a micro-
computer.
(2) Ceramic resonator
When the ceramic resonator is used for the main clock, connect
the ceramic resonator and the external circuit to pins XIN and
XOUT at the shortest distance. A feedback resistor is built in be-
tween pins XIN and XOUT.
M37540
X
IN
XOUT
R
C
(3) RC oscillation
So, set the constants
within the range of the
frequency limits.
When the RC oscillation is used for the main clock, connect the
XIN pin and XOUT pin to the external circuit of resistor R and the
capacitor C at the shortest distance.
The frequency is affected by a capacitor, a resistor and a micro-
computer.
Fig. 47 External circuit of RC oscillation
So, set the constants within the range of the frequency limits.
(4) External clock
M37540
When the external signal clock is used for the main clock, connect
the XIN pin to the clock source and leave XOUT pin open.
XIN
XOUT
Open
External oscillation
circuit
V
CC
SS
V
Fig. 48 External clock input circuit
Note:
The clock frequency of the
on-chip oscillator depends
on the supply voltage and
the operation temperature
range.
M37540
Be careful that variable fre-
quencies and obtain the
sufficient margin.
X
IN
XOUT
Open
Fig. 49 Processing of XIN and XOUT pins at on-chip oscillator
operation
Rev.4.00 Jun 21, 2004 page 44 of 82
REJ03B0011-0400Z
7540 Group
(1) Oscillation control
✕ Oscillation stop detection circuit (Note)
The oscillation stop detection circuit is used for reset occurrence
when a ceramic resonator or an oscillation circuit stops by discon-
nection. When internal reset occurs, reset because of oscillation
stop can be detected by setting “1” to the oscillation stop detection
status bit.
• Stop mode
When the STP instruction is executed, the internal clock φ stops at
an “H” level and the XIN oscillator stops. At this time, timer 1 is set
to “0116” and prescaler 1 is set to “FF16” when the oscillation sta-
bilization time set bit after release of the STP instruction is “0”. On
the other hand, timer 1 and prescaler 1 are not set when the
above bit is “1”. Accordingly, set the wait time fit for the oscillation
stabilization time of the oscillator to be used. f(XIN)/16 is forcibly
connected to the input of prescaler 1. When an external interrupt
is accepted, oscillation is restarted but the internal clock φ remains
at “H” until timer 1 underflows. As soon as timer 1 underflows, the
internal clock φ is supplied. This is because when a ceramic oscil-
lator is used, some time is required until a start of oscillation. In
case oscillation is restarted by reset, no wait time is generated. So
apply an “L” level to the RESET pin while oscillation becomes
stable.
Also, when using the oscillation stop detection circuit, an on-chip
oscillator is required.
Figure 53 shows the state transition.
Note: The oscillation stop detection circuit is not included in the
emulator MCU “M37540RSS”.
b7
b0
MISRG(address 003816, initial value: 0016
)
Oscillation stabilization time set bit after
release of the STP instruction
Also, the STP instruction cannot be used while CPU is operating
by an on-chip oscillator.
0: Set “0116” in timer1, and “FF16
in prescaler 1 automatically
1: Not set automatically
”
• Wait mode
Ceramic or RC oscillation stop detection
function active bit
0: Detection function inactive
1: Detection function active
If the WIT instruction is executed, the internal clock φ stops at an
“H” level, but the oscillator does not stop. The internal clock re-
starts if a reset occurs or when an interrupt is received. Since the
oscillator does not stop, normal operation can be started immedi-
ately after the clock is restarted. To ensure that interrupts will be
received to release the STP or WIT state, interrupt enable bits
must be set to “1” before the STP or WIT instruction is executed.
Reserved bits (return “0” when read)
(Do not write “1” to these bits)
Not used (return “0” when read)
Oscillation stop detection status bit
0: Oscillation stop not detected
1: Oscillation stop detected
✕ Notes on clock generating circuit
Fig. 50 Structure of MISRG
For use with the oscillation stabilization set bit after release of the
STP instruction set to “1”, set values in timer 1 and prescaler 1 af-
ter fully appreciating the oscillation stabilization time of the
oscillator to be used.
• Switch of ceramic and RC oscillations
After releasing reset the operation starts by starting an on-chip os-
cillator. Then, a ceramic oscillation or an RC oscillation is selected
by setting bit 5 of the CPU mode register.
• Double-speed mode
When a ceramic oscillation is selected, a double-speed mode can
be used. Do not use it when an RC oscillation is selected.
• CPU mode register
Bits 5, 1 and 0 of CPU mode register are used to select oscillation
mode and to control operation modes of the microcomputer. In or-
der to prevent the dead-lock by error-writing (ex. program
run-away), these bits can be rewritten only once after releasing re-
set. After rewriting it is disable to write any data to the bit. (The
emulator MCU “M37540RSS” is excluded.)
Also, when the read-modify-write instructions (SEB, CLB) are ex-
ecuted to bits 2 to 4, 6 and 7, bits 5, 1 and 0 are locked.
• Clock division ratio, XIN oscillation control, on-chip oscillator control
The state transition shown in Fig. 52 can be performed by setting
the clock division ratio selection bits (bits 7 and 6), XIN oscillation
control bit (bit 4), on-chip oscillator oscillation control bit (bit 3) of
CPU mode register. Be careful of notes on use in Fig. 52.
Rev.4.00 Jun 21, 2004 page 45 of 82
REJ03B0011-0400Z
7540 Group
XIN
XOUT
Rf
Clock division ratio selection bit
Middle-, high-, low-speed mode
Timer 1
Prescaler 1
1/2
1/2
1/4
On-chip oscillator mode
Clock division
ratio selection bit
Middle-speed mode
Timing φ
(Internal clock)
High-speed mode
Double-speed mode
On-chip oscillator mode
RING
1/8
On-chip oscillator
Q
S
R
S
R
Q
Q
S
R
RESET
WIT
instruction
STP instruction
STP instruction
Reset
Interrupt disable flag l
Interrupt request
Fig. 51 Block diagram of internal clock generating circuit (for ceramic resonator)
XOUT
XIN
Clock division ratio selection bit
Middle-, high-, low-speed mode
Timer 1
Prescaler 1
1/2
1/4
1/2
On-chip
oscillator
mode
Delay
Clock division
ratio selection bit
Middle-speed mode
Timing φ
(Internal clock)
High-speed mode
Double-speed mode
RING
1/8
On-chip oscillator
On-chip oscillator mode
Q
S
R
S
R
Q
Q
S
R
RESET
WIT
instruction
STP instruction
STP instruction
Reset
Interrupt disable flag l
Interrupt request
Fig. 52 Block diagram of internal clock generating circuit (for RC oscillation)
Rev.4.00 Jun 21, 2004 page 46 of 82
REJ03B0011-0400Z
7540 Group
Stop mode
Wait mode
Interrupt
WIT
instruction
Interrupt
STP
instruction
Interrupt
WIT
instruction
State 1
Operation clock source:
f(XIN) (Note 1)
f(XIN) oscillation enabled
On-chip oscillator stop
State 2
Operation clock source:
f(XIN) (Note 1)
f(XIN) oscillation enabled
On-chip oscillator enabled
State 3
State 4
CPUM76←102
Operation clock source:
On-chip oscillator (Note 3)
f(XIN) oscillation enabled
On-chip oscillator enalbed
Operation clock source:
On-chip oscillator (Note 3)
f(XIN) oscillation stop
CPUM3←02
CPUM3←12
CPUM4←12
CPUM4←02
On-chip oscillator enalbed
CPUM76←002
012
112
(Note 2)
Notes on switch of clock
(1) In operation clock source = f(XIN), the following can be
selected for the CPU clock division ratio.
MISRG1←12
MISRG1←02
✕ f(XIN)/2 (high-speed mode)
MISRG1←12
MISRG1←02
✕ f(XIN)/8 (middle-speed mode)
✕ f(XIN) (double-speed mode, only at a ceramic oscillation)
(2) Execute the state transition state 3 to state 2 or
state 3’ to state 2’ after stabilizing XIN oscillation.
(3) In operation clock source = on-chip oscillator, the middle-
speed mode is selected for the CPU clock division ratio.
(4) When the state transition state 2 → state 3 → state 4
is performed, execute the NOP instruction as shown below
according to the division ratio of CPU clock.
State 3’
State 2’
Operation clock source:
f(XIN) (Note 1)
CPUM76←102
Operation clock source:
On-chip oscillator (Note 3)
f(XIN) oscillation enabled
On-chip oscillator enalbed
On-chip oscillator enabled
CPUM76←002
012
112
(Note 2)
• CPUM76 → 10
• NOP instruction
• CPUM4 → 1 (State 3 → state 4)
2 (State 2 → state 3)
Oscillation stop detection circuit valid
2
Reset released
Double-speed mode at on-chip oscillator: NOP ✕ 3
High-speed mode at on-chip oscillator: NOP ✕ 1
Middle-speed mode at on-chip oscillator: NOP ✕ 0
Reset state
Fig. 53 State transition
Rev.4.00 Jun 21, 2004 page 47 of 82
REJ03B0011-0400Z
7540 Group
NOTES ON PROGRAMMING
State transition
Do not stop the clock selected as the operation clock because of
Processor Status Register
setting of CM3, 4.
The contents of the processor status register (PS) after reset are
undefined except for the interrupt disable flag I which is “1”. After
reset, initialize flags which affect program execution. In particular,
it is essential to initialize the T flag and the D flag because of their
effect on calculations.
NOTES ON HARDWARE
Handling of Power Source Pin
In order to avoid a latch-up occurrence, connect a capacitor suit-
able for high frequencies as bypass capacitor between power
source pin (Vcc pin) and GND pin (Vss pin). Besides, connect the
capacitor to as close as possible. For bypass capacitor which
should not be located too far from the pins to be connected, a ce-
ramic capacitor of 0.01 µF to 0.1 µF is recommended.
Interrupts
The contents of the interrupt request bit do not change even if the
BBC or BBS instruction is executed immediately after they are
changed by program because this instruction is executed for the
previous contents. For executing the instruction for the changed
contents, execute one instruction before executing the BBC or
BBS instruction.
One Time PROM Version
The CNVss pin is connected to the internal memory circuit block
by a low-ohmic resistance, since it has the multiplexed function to
be a programmable power source pin (VPP pin) as well.
To improve the noise reduction, connect a track between CNVss
pin and Vss pin with 1 to 10 kΩ resistance.
Decimal Calculations
• For calculations in decimal notation, set the decimal mode flag
D to “1”, then execute the ADC instruction or SBC instruction. In
this case, execute SEC instruction, CLC instruction or CLD in-
struction after executing one instruction before the ADC instruction
or SBC instruction.
The mask ROM version track of CNVss pin has no operational in-
terference even if it is connected via a resistor.
• In the decimal mode, the values of the N (negative), V (overflow)
and Z (zero) flags are invalid.
Ports
• The values of the port direction registers cannot be read.
That is, it is impossible to use the LDA instruction, memory opera-
tion instruction when the T flag is “1”, addressing mode using
direction register values as qualifiers, and bit test instructions such
as BBC and BBS.
It is also impossible to use bit operation instructions such as CLB
and SEB and read/modify/write instructions of direction registers
for calculations such as ROR.
For setting direction registers, use the LDM instruction, STA in-
struction, etc.
A/D Conversion
Do not execute the STP instruction during A/D conversion.
Instruction Execution Timing
The instruction execution time can be obtained by multiplying the
frequency of the internal clock φ by the number of cycles men-
tioned in the machine-language instruction table.
The frequency of the internal clock φ is the same as that of the XIN
in double-speed mode, twice the XIN cycle in high-speed mode
and 8 times the XIN cycle in middle-speed mode.
CPU Mode Register
The oscillation mode selection bit and processor mode bits can be
rewritten only once after releasing reset. However, after rewriting it
is disable to write any value to the bit. (Emulator MCU is ex-
cluded.)
When a ceramic oscillation is selected, a double-speed mode of
the clock division ratio selection bits can be used. Do not use it
when an RC oscillation is selected.
Rev.4.00 Jun 21, 2004 page 48 of 82
REJ03B0011-0400Z
7540 Group
NOTES ON PERIPHERAL FUNCTIONS
• Timer Y write mode
When using this mode, be sure to set “1” to the timer Y write con-
trol bit to select “write to latch only”.
✕ Interrupt
When setting the followings, the interrupt request bit may be set to “1”.
•When setting external interrupt active edge
Related register: Interrupt edge selection register (address 003A16)
Timer X mode register (address 2B16)
Timer Y can stop counting by setting “1” to the timer Y count stop bit
in any mode.
Also, when Timer Y underflows, the timer Y interrupt request bit is
set to “1”.
Timer A mode register (address 1D16)
When not requiring the interrupt occurrence synchronized with
these setting, take the following sequence.
Timer Y reloads the value of latch when counting is stopped by the
timer Y count stop bit. (When timer is read out while timer is
stopped, the value of latch is read. The value of timer can be read
out only while timer is operating.)
✕ Set the corresponding interrupt enable bit to “0” (disabled).
✕ Set the interrupt edge select bit (active edge switch bit) to “1”.
✕ Set the corresponding interrupt request bit to “0” after 1 or
more instructions have been executed.
✕ Timer Z: Programmable Waveform
Generation Mode
✕ Set the corresponding interrupt enable bit to “1” (enabled).
• Count set value
✕ Timers
In the programmable waveform generation mode, values of TZS,
EXPZP, and EXPZS are valid by writing to TZP because the set-
ting to them is executed all at once by writing to TZP. Even when
changing TZP is not required, write the same value again.
• Write timing to TZP
• When n (0 to 255) is written to a timer latch, the frequency divi-
sion ratio is 1/(n+1).
• When a count source of timer X, timer Y or timer Z is switched,
stop a count of timer X.
In the programmable waveform generation mode, when the set-
ting value is changed while the waveform is output, set by
software in order not to execute the writing to TZP and the timing
of timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
✕ Timer A
CNTR1 interrupt active edge selection
CNTR1 interrupt active edge depends on the CNTR1 active edge switch bit.
When this bit is “0”, the CNTR1 interrupt request bit is set to “1” at
the falling edge of the CNTR1 pin input signal. When this bit is “1”,
the CNTR1 interrupt request bit is set to “1” at the rising edge of
the CNTR1 pin input signal.
However, in the pulse width HL continuously measurement mode,
CNTR1 interrupt request is generated at both rising and falling
edges of CNTR1 pin input signal regardless of the setting of
CNTR1 active edge switch bit.
The waveform extension function by the timer Z waveform extension
control bit can be used only when “0016” is set to Prescaler Z. When
the value other than “0016” is set to Prescaler Z, be sure to set “0” to
EXPZP and EXPZS. Also, when the timer Y underflow is selected as
the count source, the waveform extension function cannot be used.
• Timer Z write mode
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
✕ Timer X
CNTR0 interrupt active edge selection
✕ Timer Z: Programmable One-shot
Generation Mode
CNTR0 interrupt active edge depends on the CNTR0 active edge switch bit.
When this bit is “0”, the CNTR0 interrupt request bit is set to “1” at the falling
edge of CNTR0 pin input signal. When this bit is “1”, the CNTR0 interrupt re-
quest bit is set to “1” at the rising edge of CNTR0 pin input signal.
• Count set value
In the programmable one-shot generation mode, the value of
EXPZP becomes valid by writing to TZP. Even when changing
TZP is not required, write the same value again.
• Write timing to TZP
✕ Timer Y: Programmable Generation
Waveform Mode
In the programmable one-shot generation mode, when the setting
value is changed while the waveform is output, set by software in
order not to execute the writing to TZP and the timing of timer un-
derflow simultanesously.
• Count set value
In the programmable waveform generation mode, values of TYS,
EXPYP, and EXPYS are valid by writing to TYP because the set-
ting to them is executed all at once by writing to TYP. Even when
changing TYP is not required, write the same value again.
• Write timing to TYP
• Usage of waveform extension function
The waveform extension function by the timer Z waveform extension con-
trol bit can be used only when “0016” is set to Prescaler Z. When the
value other than “0016” is set to Prescaler Z, be sure to set “0” to EXPZP.
Also, when the timer Y underflow is selected as the count source, the
waveform extension function cannot be used.
In the programmable waveform generation mode, when the set-
ting value is changed while the waveform is output, set by
software in order not to execute the writing to TYP and the timing
of timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
• Timer Z write mode
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
The waveform extension function by the timer Y waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Y.
When the value other than “0016” is set to Prescaler Y, be sure to
set “0” to EXPYP and EXPYS.
Rev.4.00 Jun 21, 2004 page 49 of 82
REJ03B0011-0400Z
7540 Group
(2) Serial I/O1 mode selection bit → “0” :
ꢀ Timer Z: Programmable Wait One-shot
Generation Mode
Clock asynchronous (UART) type serial I/O is selected.
Setup of a serial I/O1 synchronous clock selection bit
“0”: P12 pin can be used as a normal I/O pin.
• Count set value
In the programmable wait one-shot generation mode, values of
TZS, EXPZP and EXPZS are valid by writing to TZP. Even when
changing TZP is not required, write the same value again.
• Write timing to TZP
“1”: P12 pin turns into an input pin of an external clock.
When clock asynchronous (UART) type serial I/O is selected, it is
P13 pin. It can be used as a normal I/O pin.
In the programmable wait one-shot generation mode, when the
setting value is changed while the waveform is output, set by soft-
ware in order not to execute the writing to TZP and the timing of
timer underflow during the secondary interval simultanesously.
• Usage of waveform extension function
ꢀ A/D Converter
• The comparator uses internal capacitors whose charge will be
lost if the clock frequency is too low.
Make sure that f(XIN) is 500kHz or more during A/D conversion.
The waveform extension function by the timer Z waveform exten-
sion control bit can be used only when “0016” is set to Prescaler Z.
When the value other than “0016” is set to Prescaler Z, be sure to
set “0” to EXPZP and EXPZS. Also, when the timer Y underflow is
selected as the count source, the waveform extension function
cannot be used.
• As for AD translation accuracy, on the following operating condi-
tions, accuracy may become low.
(1) Since the analog circuit inside a microcomputer becomes sensi-
tive to noise when VREF voltage is set up lower than Vcc
voltage, accuracy may become low rather than the case where
VREF voltage and Vcc voltage are set up to the same value.
(2) When VREF voltage is lower than [3.0 V], the accuracy at the low
temperature may become extremely low compared with that at
room temperature When the system would be used at low tem-
perature, the use at VREF=3.0 V or more is recommended.
• Timer Z write mode
When using this mode, be sure to set “1” to the timer Z write con-
trol bit to select “write to latch only”.
Timer Z can stop counting by setting “1” to the timer Z count stop
bit in any mode.
ꢀ Notes on clock generating circuit
Also, when Timer Z underflows, the timer Z interrupt request bit is
set to “1”.
For use with the oscillation stabilization set bit after release of the
STP instruction set to “1”, set values in timer 1 and prescaler 1 after fully
appreciating the oscillation stabilization time of the oscillator to be used.
• Switch of ceramic and RC oscillations
Timer Z reloads the value of latch when counting is stopped by the
timer Z count stop bit. (When timer is read out while timer is
stopped, the value of latch is read. The value of timer can be read
out only while timer is operating.)
After releasing reset the operation starts by starting an on-chip os-
cillator. Then, a ceramic oscillation or an RC oscillation is selected
by setting bit 5 of the CPU mode register.
ꢀ Serial I/O
• Serial I/O interrupt
• Double-speed mode
When a ceramic oscillation is selected, a double-speed mode can
be used. Do not use it when an RC oscillation is selected.
When setting the transmit enable bit to “1”, the serial I/O transmit
interrupt request bit is automatically set to “1”. When not requiring
the interrupt occurrence synchronized with the transmission en-
abled, take the following sequence.
• CPU mode register
Bits 5, 1 and 0 of CPU mode register are used to select oscillation
mode and to control operation modes of the microcomputer. In or-
der to prevent the dead-lock by error-writing (ex. program
run-away), these bits can be rewritten only once after releasing re-
set. After rewriting it is disable to write any data to the bit. (The
emulator MCU “M37540RSS” is excluded.)
ꢀ Set the serial I/O transmit interrupt enable bit to “0” (disabled).
ꢀ Set the transmit enable bit to “1”.
ꢀ Set the serial I/O transmit interrupt request bit to “0” after 1 or
more instructions have been executed.
ꢀ Set the serial I/O transmit interrupt enable bit to “1” (enabled).
Also, when the read-modify-write instructions (SEB, CLB) are ex-
ecuted to bits 2 to 4, 6 and 7, bits 5, 1 and 0 are locked.
• I/O pin function when serial I/O1 is enabled.
The functions of P12 and P13 are switched with the setting values
of a serial I/O1 mode selection bit and a serial I/O1 synchronous
clock selection bit as follows.
• Clock division ratio, XIN oscillation control, on-chip oscillator control
The state transition shown in Fig. 53 can be performed by setting
the clock division ratio selection bits (bits 7 and 6), XIN oscillation
control bit (bit 4), on-chip oscillator oscillation control bit (bit 3) of
CPU mode register. Be careful of notes on use in Fig. 53.
(1) Serial I/O1 mode selection bit → “1” :
Clock synchronous type serial I/O is selected.
Setup of a serial I/O1 synchronous clock selection bit
“0” : P12 pin turns into an output pin of a synchronous clock.
“1” : P12 pin turns into an input pin of a synchronous clock.
Setup of a SRDY1 output enable bit (SRDY)
• On-chip oscillator operation
The clock frequency of the on-chip oscillator depends on the sup-
ply voltage and the operation temperature range.
Be careful that variable frequencies when designing application
products.
“0” : P13 pin can be used as a normal I/O pin.
“1” : P13 pin turns into a SRDY output pin.
Rev.4.00 Jun 21, 2004 page 50 of 82
REJ03B0011-0400Z
7540 Group
ꢀ Note on Power Source Voltage
ROM PROGRAMMING METHOD
When the power source voltage value of a microcomputer is less
than the value which is indicated as the recommended operating
conditions, the microcomputer does not operate normally and may
perform unstable operation.
The built-in PROM of the blank One Time PROM version can be
read or programmed with a general-purpose PROM programmer
using a special programming adapter. Set the address of PROM
programmer in the user ROM area.
In a system where the power source voltage drops slowly when
the power source voltage drops or the power supply is turned off,
reset a microcomputer when the supply voltage is less than the
recommended operating conditions and design a system not to
cause errors to the system by this unstable operation.
Table 7 Special programming adapter
Package
32P4B
Name of Programming Adapter
PCA7435SPG02
32P6U-A
36P2R-A
PCA7435GPG03
PCA7435FPG02
ꢀ Electric Characteristic Differences Among
Mask ROM and One TIme PROM Version
MCUs
There are differences in electric characteristics, operation margin,
noise immunity, and noise radiation among mask ROM and One
Time PROM version MCUs due to the differences in the manufac-
turing processes.
The PROM of the blank One Time PROM version is not tested or
screened in the assembly process and following processes. To en-
sure proper operation after programming, the procedure shown in
Figure 54 is recommended to verify programming.
When manufacturing an application system with One Time PROM
version and then switching to use of the mask ROM version, per-
form sufficient evaluations for the commercial samples of the
mask ROM version.
Programming with
PROM programmer
DATA REQUIRED FOR MASK ORDERS
The following are necessary when ordering a mask ROM produc-
tion:
Screening (Caution)
(150 °C for 40 hours)
1.Mask ROM Order Confirmation Form *
2.Mark Specification Form *
Verification with PROM
programmer
3.Data to be written to ROM, in EPROM form (three identical cop-
ies) or one floppy disk.
DATA REQUIRED FOR ROM PROGRAMMING
ORDERS
Functional check in
target device
The following are necessary when ordering a One Time PROM
production:
Caution:
The screening temperature is far higher
than the storage temperature. Never
expose to 150 °C exceeding 100 hours.
1.ROM Programming Order Confirmation Form *
2.Mark Specification Form *
3.Data to be written to ROM, in EPROM form (three identical cop-
ies) or one floppy disk.
* For the mask ROM confirmation and the mark specifications,
refer to the "Renesas Technology Corp." Homepage
(http://www.renesas.com/en/rom).
Fig. 54 Programming and testing of One Time PROM version
Rev.4.00 Jun 21, 2004 page 51 of 82
REJ03B0011-0400Z
7540 Group
ELECTRICAL CHARACTERISTICS
1.7540Group (General purpose)
Applied to: M37540M2-XXXFP/SP/GP, M37540M4-XXXFP/SP/GP, M37540E2FP/SP/GP, M37540E8FP/SP/GP
Absolute Maximum Ratings (General purpose)
Table 8 Absolute maximum ratings
Symbol
Parameter
Conditions
Ratings
Unit
V
VCC
Power source voltage
Input voltage
–0.3 to 6.5 (Note 1)
–0.3 to VCC + 0.3
VI
V
P00–P07, P10–P14, P20–P27, P30–P37, VREF
Input voltage RESET, XIN
Input voltage CNVSS (Note 2)
Output voltage
All voltages are
based on VSS.
Output transistors
are cut off.
VI
–0.3 to VCC + 0.3
–0.3 to 13
V
V
V
VI
VO
–0.3 to VCC + 0.3
P00–P07, P10–P14, P20–P27, P30–P37, XOUT
Power dissipation
Pd
Ta = 25°C
300 (Note 3)
–20 to 85
mW
°C
Topr
Tstg
Operating temperature
Storage temperature
–40 to 125
°C
Notes 1: This is the rating value for the Mask ROM version.
The rating value for the One Time PROM version is –0.3 to 7.0 V.
2: It is a rating only for the One Time PROM version. Connect to VSS for the mask ROM version.
3: 200 mW for the 32P6U package product.
Rev.4.00 Jun 21, 2004 page 52 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (General purpose)
Table 9 Recommended operating conditions (1) (VCC = 2.2 to 5.5 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
Min.Typ.Max.
VCC
Power source voltage (ceramic)
f(XIN) = 8 MHz (High-, Middle-speed mode)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 2 MHz (High-, Middle-speed mode)
f(XIN) = 6 MHz (Double-speed mode)
f(XIN) = 4 MHz (Double-speed mode)
4.0
2.4
2.2
4.5
4.0
2.4
2.2
4.0
2.4
2.2
5.0
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
V
V
V
V
V
V
V
V
V
V
V
V
V
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
0
f(XIN) = 2 MHz (Double-speed mode)
f(XIN) = 1 MHz (Double-speed mode)
Power source voltage (RC)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 2 MHz (High-, Middle-speed mode)
f(XIN) = 1 MHz (High-, Middle-speed mode)
VSS
VREF
VIH
Power source voltage
Analog reference voltage
“H” input voltage
2.0
VCC
VCC
0.8VCC
P00–P07, P10–P14, P20–P27, P30–P37
“H” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“H” input voltage
VCC
VCC
0.3VCC
0.8
VIH
2.0
V
V
VIH
0.8VCC
RESET, XIN
VIL
“L” input voltage
0
0
0
0
V
P00–P07, P10–P14, P20–P27, P30–P37
“L” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“L” input voltage
VIL
V
0.2VCC
0.16VCC
–80
VIL
V
RESET, CNVSS
VIL
“L” input voltage
V
XIN
∑IOH(peak)
∑IOL(peak)
∑IOL(peak)
∑IOH(avg)
∑IOL(avg)
∑IOL(avg)
“H” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
“L” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total peak output current (Note 2)
P30–P36
mA
mA
mA
mA
mA
mA
80
60
–40
“H” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
40
“L” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total average output current (Note 2)
P30–P36
30
Note 1: Vcc = 4.0 to 5.5V
2: The total output current is the sum of all the currents flowing through all the applicable ports. The total average current is an average value measured
over 100 ms. The total peak current is the peak value of all the currents.
Rev.4.00 Jun 21, 2004 page 53 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (General purpose)(continued)
Table 10 Recommended operating conditions (2) (VCC = 2.2 to 5.5 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
P00–P07, P10–P14, P20–P27, P30–P37
Unit
Min.
Typ.
Max.
–10
10
30
–5
5
“H” peak output current (Note 1)
“L” peak output current (Note 1)
“L” peak output current (Note 1)
mA
mA
mA
mA
mA
mA
MHz
IOH(peak)
IOL(peak)
IOL(peak)
IOH(avg)
IOL(avg)
IOL(avg)
f(XIN)
P00–P07, P10–P14, P20–P27, P37
P30–P36
“H” average output current (Note 2) P00–P07, P10–P14, P20–P27, P30–P37
“L” average output current (Note 2)
“L” average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
P30–P36
15
6
Internal clock oscillation frequency (Note 3) VCC = 4.5 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.2 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.2 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
4
2
1
8
4
2
4
2
1
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
at RC oscillation
High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at RC oscillation
High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.2 to 5.5 V
at RC oscillation
High-, Middle-speed mode
Notes 1: The peak output current is the peak current flowing in each port.
2: The average output current IOL (avg), IOH (avg) in an average value measured over 100 ms.
3: When the oscillation frequency has a duty cycle of 50 %.
Rev.4.00 Jun 21, 2004 page 54 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (General purpose)
Table 11 Electrical characteristics (1) (VCC = 2.2 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
IOH = –5 mA
Unit
V
Min.Typ.Max.
VCC–1.5
VOH
“H” output voltage
VCC = 4.0 to 5.5 V
P00–P07, P10–P14, P20–P27, P30–P37 (Note 1)
IOH = –1.0 mA
VCC = 2.2 to 5.5 V
VCC–1.0
V
V
V
V
V
V
V
V
VOL
“L” output voltage
IOL = 5 mA
VCC = 4.0 to 5.5 V
1.5
0.3
1.0
2.0
0.3
1.0
P00–P07, P10–P14, P20–P27, P37
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 1.0 mA
VCC = 2.2 to 5.5 V
VOL
“L” output voltage
P30–P36
IOL = 15 mA
VCC = 4.0 to 5.5 V
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 10 mA
VCC = 2.2 to 5.5 V
VT+–VT–
Hysteresis
0.4
CNTR0, CNTR1, INT0, INT1(Note 2)
P00–P07 (Note 3)
VT+–VT–
VT+–VT–
IIH
Hysteresis
RXD, SCLK1, SCLK2, SDATA2 (Note 2)
0.5
0.5
V
V
Hysteresis
RESET
VI = VCC
(Pin floating. Pull up
transistors “off”)
5.0
5.0
µA
“H” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIH
IIH
IIL
“H” input current
RESET
VI = VCC
µA
µA
µA
VI = VCC
4.0
“H” input current
XIN
VI = VSS
(Pin floating. Pull up
transistors “off”)
–5.0
–5.0
“L” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIL
IIL
IIL
“L” input current
RESET, CNVSS
VI = VSS
µA
µA
VI = VSS
–4.0
–0.2
“L” input current
XIN
VI = VSS
–0.5
mA
“L” input current
(Pull up transistors “on”)
P00–P07, P30–P37
VRAM
ROSC
DOSC
RAM hold voltage
When clock stopped
2.0
5.5
V
VCC = 5.0 V, Ta = 25 °C
VCC = 5.0 V, Ta = 25 °C
1000
62.5
2000
125
3000
187.5
kHz
kHz
On-chip oscillator oscillation frequency
Oscillation stop detection circuit detection frequency
Notes 1: P11 is measured when the P11/TXD1 P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”.
2: RXD1, SCLK1, SCLK2, SDATA2, INT0, and INT1 have hysteresises only when bits 0 to 2 of the port P1P3 control register are set to “0” (CMOS level).
3: It is available only when operating key-on wake up.
Rev.4.00 Jun 21, 2004 page 55 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (General purpose)(continued)
Table 12 Electrical characteristics (2) (VCC = 2.2 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
ICC
Parameter
Test conditions
Unit
mA
Min.Typ.Max.
5.0
8.0
1.5
Power source
current
One Time PROM
version
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
0.5
6.0
2.0
350
1.6
mA
mA
mA
µA
High-speed mode, f(XIN) = 2 MHz, VCC = 2.2 V
Output transistors “off”
10.0
5.0
Double-speed mode, f(XIN) = 6 MHz
Output transistors “off”
Middle-speed mode, f(XIN) = 8 MHz
Output transistors “off”
1000
3.2
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.2 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V
Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
1.0
10
µA
µA
All oscillation stopped
(in STP state)
Output transistors “off”
Ta = 25 °C
Ta = 85 °C
Mask ROM version
3.5
0.4
4.5
2.0
300
1.6
6.5
1.2
8.0
5.0
900
3.2
mA
mA
mA
mA
µA
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
High-speed mode, f(XIN) = 2 MHz, VCC = 2.2 V
Output transistors “off”
Double-speed mode, f(XIN) = 6 MHz
Output transistors “off”
Middle-speed mode, f(XIN) = 8 MHz
Output transistors “off”
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.2 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V
Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
Ta = 25 °C
1.0
10
µA
µA
All oscillation stopped
(in STP state)
Output transistors “off”
Ta = 85 °C
Rev.4.00 Jun 21, 2004 page 56 of 82
REJ03B0011-0400Z
7540 Group
A/D Converter Characteristics (General purpose)
Table 13 A/D Converter characteristics
(VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
Unit
Min.
Typ.Max.
—
Resolution
10
±3
Bits
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
LSB
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±0.9
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
5
20
15
mV
mV
0
3
One Time
5105
3060
5115
3069
5125
3075
122
mV
PROM version
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
Reference power source input current
VREF = 5.0 V
VREF = 3.0 V
50
50
200
120
5.0
10
µA
II(AD)
—
A/D port input current
Resolution
µA
Bits
LSB
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
±3
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±1.5
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
15
9
35
21
mV
mV
0
Mask ROM version
5105
3060
5125
3075
5150
3090
122
mV
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
II(AD)
Reference power source
VREF = 5.0 V
VREF = 3.0 V
50
50
200
120
5.0
µA
input current
A/D port input current
µA
Rev.4.00 Jun 21, 2004 page 57 of 82
REJ03B0011-0400Z
7540 Group
Timing Requirements (General purpose)
Table 14 Timing requirements (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Min.Typ.Max.
Symbol
tW(RESET)
Parameter
Unit
Reset input “L” pulse width
2
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
125
50
tWH(XIN)
tWL(XIN)
50
tC(CNTR0)
200
80
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
80
2000
800
800
800
370
370
220
100
1000
400
400
200
200
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
Serial I/O1 input hold time
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
Serial I/O2 input hold time
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Table 15 Timing requirements (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.Typ.Max.
2
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Reset input “L” pulse width
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
250
tWH(XIN)
100
tWL(XIN)
100
tC(CNTR0)
500
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
230
230
4000
1600
1600
2000
950
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
950
400
Serial I/O1 input hold time
200
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
2000
950
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
950
400
Serial I/O2 input hold time
400
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Rev.4.00 Jun 21, 2004 page 58 of 82
REJ03B0011-0400Z
7540 Group
Table 16 Timing requirements (3) (VCC = 2.2 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.Typ.Max.
Reset input “L” pulse width
2
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
500
tWH(XIN)
200
tWL(XIN)
200
tC(CNTR0)
1000
460
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
460
8000
3200
3200
4000
1900
1900
800
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
Serial I/O1 input hold time
400
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
4000
1900
1900
800
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
Serial I/O2 input hold time
800
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Rev.4.00 Jun 21, 2004 page 59 of 82
REJ03B0011-0400Z
7540 Group
Switching Characteristics (General purpose)
Table 17 Switching characteristics (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–30
tC(SCLK1)/2–30
tWH(SCLK1)
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
140
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
30
30
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–30
tC(SCLK2)/2–30
140
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
30
30
30
30
tf(SCLK2)
tr(CMOS)
10
10
tf(CMOS)
Note 1: Pin XOUT is excluded.
Table 18 Switching characteristics (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
tWH(SCLK1)
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–50
tC(SCLK1)/2–50
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
350
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
50
50
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–50
tC(SCLK2)/2–50
350
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
50
50
50
50
tf(SCLK2)
tr(CMOS)
20
20
tf(CMOS)
Note 1: Pin XOUT is excluded.
Rev.4.00 Jun 21, 2004 page 60 of 82
REJ03B0011-0400Z
7540 Group
Table 19 Switching characteristics (3) (VCC = 2.2 to 5.5 V, VSS = 0 V, Ta = –20 to 85 °C, unless otherwise noted)
Limits
Symbol
tWH(SCLK1)
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–70
tC(SCLK1)/2–70
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
450
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
70
70
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–70
tC(SCLK2)/2–70
450
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
70
70
70
70
tf(SCLK2)
tr(CMOS)
25
25
tf(CMOS)
Note 1: Pin XOUT is excluded.
Measured
output pin
100 pF
/ / /
CMOS output
Switching characteristics measurement circuit diagram (Gen-
eral purpose)
Rev.4.00 Jun 21, 2004 page 61 of 82
REJ03B0011-0400Z
7540 Group
t
C
(CNTR
(CNTR
0
)
)
t
t
t
WL(CNTR
0
)
)
)
t
WH(CNTR
0
)
)
)
0.8VCC
CNTR
0
0.2VCC
tC
1
WL(CNTR
1
tWH(CNTR1
0.8VCC
0.2VCC
CNTR
1
WL(CNTR
0
tWH(CNTR0
0.8VCC
INT
0, INT
1
0.2VCC
tW(RESET)
0.8VCC
RESET
0.2VCC
tC(XIN)
tWL(XIN
)
tWH(XIN)
0.8VCC
XIN
0.2VCC
t
C
(SCLK1
)
t
r
t
f
tWL(SCLK1
)
tWH(SCLK1)
0.8VCC
SCLK1
0.2VCC
tsu(RxD
1
-SCLK1
)
th(SCLK1-RxD1)
0.8VCC
0.2VCC
R
X
D
1
(at receive)
(at transmit)
td
(SCLK1-TxD
1
)
tv(SCLK1-TxD1)
T
X
D
1
t
C
(SCLK2
)
t
r
t
f
tWL(SCLK2
)
tWH(SCLK2)
0.8VCC
S
S
S
CLK2
0.2VCC
t
su(SDATA2-SCLK2
)
th(SCLK2-SDATA2)
0.8VCC
0.2VCC
DATA2 (at receive)
DATA2 (at transmit)
td(SCLK2-SDATA2)
tv(SCLK2-SDATA2)
Fig. 55 Timing chart (General purpose)
Rev.4.00 Jun 21, 2004 page 62 of 82
REJ03B0011-0400Z
7540 Group
ELECTRICAL CHARACTERISTICS
2.7540Group (Extended operating temperature version)
Applied to: M37540M2T-XXXFP/GP, M37540M4T-XXXFP/GP, M37540E8T-XXXFP/GP
Absolute Maximum Ratings (Extended operating temperature version)
Table 20 Absolute maximum ratings
Symbol
Parameter
Conditions
Ratings
Unit
V
VCC
Power source voltage
Input voltage
–0.3 to 6.5 (Note 1)
–0.3 to VCC + 0.3
VI
V
All voltages are
based on VSS.
Output transistors
are cut off.
P00–P07, P10–P14, P20–P27, P30–P37, VREF
Input voltage RESET, XIN, CNVSS
Output voltage
VI
–0.3 to VCC + 0.3
–0.3 to VCC + 0.3
V
V
VO
P00–P07, P10–P14, P20–P27, P30–P37, XOUT
Power dissipation
Ta = 25°C
Pd
300 (Note 2)
–40 to 85
mW
°C
Topr
Tstg
Operating temperature
Storage temperature
–65 to 150
°C
Notes 1: This is the rating value for the Mask ROM version.
The rating value for the One Time PROM version is –0.3 to 7.0 V.
2: 200 mW for the 32P6U package product.
Rev.4.00 Jun 21, 2004 page 63 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (Extended operating temperature version)
Table 21 Recommended operating conditions (1) (VCC = 2.4 to 5.5 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
Min.
4.0
2.4
4.5
4.0
2.4
4.0
2.4
Typ.Max.
5.0
VCC
Power source voltage (ceramic)
f(XIN) = 8 MHz (High-, Middle-speed mode)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 6 MHz (Double-speed mode)
f(XIN) = 4 MHz (Double-speed mode)
f(XIN) = 2 MHz (Double-speed mode)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 2 MHz (High-, Middle-speed mode)
5.5
5.5
5.5
5.5
5.5
5.5
5.5
V
V
V
V
V
V
V
V
V
V
5.0
5.0
5.0
5.0
Power source voltage (RC)
5.0
5.0
VSS
VREF
VIH
Power source voltage
Analog reference voltage
“H” input voltage
0
2.0
VCC
VCC
0.8VCC
P00–P07, P10–P14, P20–P27, P30–P37
“H” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“H” input voltage
VIH
2.0
VCC
VCC
0.3VCC
0.8
V
V
VIH
0.8VCC
RESET, XIN
VIL
“L” input voltage
0
0
0
0
V
P00–P07, P10–P14, P20–P27, P30–P37
“L” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“L” input voltage
VIL
V
0.2VCC
0.16VCC
–80
VIL
V
RESET, CNVSS
VIL
“L” input voltage
V
XIN
∑IOH(peak)
∑IOL(peak)
∑IOL(peak)
∑IOH(avg)
∑IOL(avg)
∑IOL(avg)
“H” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
“L” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total peak output current (Note 2)
P30–P36
mA
mA
mA
mA
mA
mA
80
60
–40
“H” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
40
“L” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total average output current (Note 2)
P30–P36
30
Note 1: Vcc = 4.0 to 5.5V
2: The total output current is the sum of all the currents flowing through all the applicable ports. The total average current is an average value measured
over 100 ms. The total peak current is the peak value of all the currents.
Rev.4.00 Jun 21, 2004 page 64 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (Extended operating temperature version)(continued)
Table 22 Recommended operating conditions (2) (VCC = 2.4 to 5.5 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
P00–P07, P10–P14, P20–P27, P30–P37
Unit
Min.
Typ.
Max.
–10
10
30
–5
5
“H” peak output current (Note 1)
“L” peak output current (Note 1)
“L” peak output current (Note 1)
mA
mA
mA
mA
mA
mA
MHz
IOH(peak)
IOL(peak)
IOL(peak)
IOH(avg)
IOL(avg)
IOL(avg)
f(XIN)
P00–P07, P10–P14, P20–P27, P37
P30–P36
“H” average output current (Note 2) P00–P07, P10–P14, P20–P27, P30–P37
“L” average output current (Note 2)
“L” average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
P30–P36
15
6
Internal clock oscillation frequency (Note 3) VCC = 4.5 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
4
2
8
4
4
2
MHz
MHz
MHz
MHz
MHz
MHz
at RC oscillation
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at RC oscillation High-, Middle-speed mode
Notes 1: The peak output current is the peak current flowing in each port.
High-, Middle-speed mode
2: The average output current IOL (avg), IOH (avg) in an average value measured over 100 ms.
3: When the oscillation frequency has a duty cycle of 50 %.
Rev.4.00 Jun 21, 2004 page 65 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (Extended operating temperature version)
Table 23 Electrical characteristics (1) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
IOH = –5 mA
Unit
V
Min.Typ.Max.
VCC–1.5
VOH
“H” output voltage
VCC = 4.0 to 5.5 V
P00–P07, P10–P14, P20–P27, P30–P37 (Note 1)
IOH = –1.0 mA
VCC = 2.4 to 5.5 V
VCC–1.0
V
V
V
V
V
V
V
V
VOL
IOL = 5 mA
VCC = 4.0 to 5.5 V
1.5
0.3
1.0
2.0
0.3
1.0
“L” output voltage
P00–P07, P10–P14, P20–P27, P37
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 1.0 mA
VCC = 2.4 to 5.5 V
VOL
IOL = 15 mA
VCC = 4.0 to 5.5 V
“L” output voltage
P30–P36
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 10 mA
VCC = 2.4 to 5.5 V
VT+–VT–
0.4
Hysteresis
CNTR0, CNTR1, INT0, INT1(Note 2)
P00–P07 (Note 3)
VT+–VT–
VT+–VT–
IIH
0.5
0.5
V
V
Hysteresis
RXD, SCLK1, SCLK2, SDATA2 (Note 2)
Hysteresis
RESET
VI = VCC
(Pin floating. Pull up
transistors “off”)
5.0
5.0
µA
“H” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIH
IIH
IIL
VI = VCC
µA
µA
µA
“H” input current
RESET
VI = VCC
4.0
“H” input current
XIN
VI = VSS
(Pin floating. Pull up
transistors “off”)
–5.0
–5.0
“L” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIL
IIL
IIL
VI = VSS
µA
µA
“L” input current
RESET, CNVSS
VI = VSS
–4.0
–0.2
“L” input current
XIN
VI = VSS
–0.5
mA
“L” input current
(Pull up transistors “on”)
P00–P07, P30–P37
VRAM
ROSC
DOSC
When clock stopped
2.0
5.5
V
RAM hold voltage
VCC = 5.0 V, Ta = 25 °C
VCC = 5.0 V, Ta = 25 °C
1000
62.5
2000
125
3000
187.5
kHz
kHz
On-chip oscillator oscillation frequency
Oscillation stop detection circuit detection frequency
Notes 1: P11 is measured when the P11/TXD1 P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”.
2: RXD1, SCLK1, SCLK2, SDATA2, INT0, and INT1 have hysteresises only when bits 0 to 2 of the port P1P3 control register are set to “0” (CMOS level).
3: It is available only when operating key-on wake up.
Rev.4.00 Jun 21, 2004 page 66 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (Extended operating temperature version)(continued)
Table 24 Electrical characteristics (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
ICC
Test conditions
Unit
mA
Min.
Typ.Max.
5.0
One Time PROM version
8.0
1.5
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
0.5
6.0
2.0
350
1.6
mA
mA
mA
µA
High-speed mode, f(XIN) = 2 MHz, VCC = 2.4 V
Output transistors “off”
10.0
5.0
Double-speed mode, f(XIN) = 6 MHz,
Output transistors “off”
Middle-speed mode, f(XIN) = 8 MHz,
Output transistors “off”
1000
3.2
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.4 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V (in WIT state),
functions except timer 1 disabled, Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
1.0
10
µA
µA
All oscillation stopped
(in STP state)
Output transistors “off”
Ta = 25 °C
Ta = 85 °C
3.5
0.4
4.5
2.0
300
1.6
6.5
1.2
8.0
5.0
900
3.2
mA
mA
mA
mA
µA
Mask ROM version
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
High-speed mode, f(XIN) = 2 MHz, VCC = 2.4 V
Output transistors “off”
Double-speed mode, f(XIN) = 6 MHz
Output transistors “off”
Middle-speed mode, f(XIN) = 8 MHz
Output transistors “off”
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.4 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V (in WIT state),
functions except timer 1 disabled, Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
1.0
10
µA
µA
All oscillation stopped
(in STP state)
Output transistors “off”
Ta = 25 °C
Ta = 85 °C
Rev.4.00 Jun 21, 2004 page 67 of 82
REJ03B0011-0400Z
7540 Group
A/D Converter Characteristics (Extended operating temperature version)
Table 25 A/D Converter characteristics
(VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
Unit
Min.
Typ.Max.
—
Resolution
10
±3
Bits
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
LSB
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±0.9
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
5
20
15
mV
mV
0
3
One Time
5105
3060
5115
3069
5125
3075
122
mV
PROM version
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
Reference power source input current
VREF = 5.0 V
VREF = 3.0 V
50
50
200
120
5.0
10
µA
II(AD)
—
A/D port input current
Resolution
µA
Bits
LSB
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
±3
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±1.5
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
15
9
35
21
mV
mV
0
Mask ROM version
5105
3060
5125
3075
5150
3090
122
mV
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
II(AD)
Reference power source
VREF = 5.0 V
VREF = 3.0 V
50
30
200
120
5.0
µA
input current
A/D port input current
µA
Rev.4.00 Jun 21, 2004 page 68 of 82
REJ03B0011-0400Z
7540 Group
Timing Requirements (Extended operating temperature version)
Table 26 Timing requirements (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.
2
Typ.Max.
Reset input “L” pulse width
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
125
50
tWH(XIN)
tWL(XIN)
50
tC(CNTR0)
200
80
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
80
2000
800
800
800
370
370
220
100
1000
400
400
200
200
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
Serial I/O1 input hold time
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
Serial I/O2 input hold time
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Table 27 Timing requirements (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.Typ.Max.
2
Reset input “L” pulse width
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
250
tWH(XIN)
100
tWL(XIN)
100
tC(CNTR0)
500
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
230
230
4000
1600
1600
2000
950
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
950
400
Serial I/O1 input hold time
200
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
2000
950
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
950
400
Serial I/O2 input hold time
400
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Rev.4.00 Jun 21, 2004 page 69 of 82
REJ03B0011-0400Z
7540 Group
Switching Characteristics (Extended operating temperature version)
Table 28 Switching characteristics (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–30
tC(SCLK1)/2–30
tWH(SCLK1)
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
140
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
30
30
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–30
tC(SCLK2)/2–30
140
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
30
30
30
30
tf(SCLK2)
tr(CMOS)
10
10
tf(CMOS)
Note 1: Pin XOUT is excluded.
Table 29 Switching characteristics (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 85 °C, unless otherwise noted)
Limits
Symbol
tWH(SCLK1)
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–50
tC(SCLK1)/2–50
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
350
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
50
50
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–50
tC(SCLK2)/2–50
350
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
50
50
50
50
tf(SCLK2)
tr(CMOS)
20
20
tf(CMOS)
Note 1: Pin XOUT is excluded.
Measured
output pin
100 pF
/ / /
CMOS output
Switching characteristics measurement circuit diagram (Gen-
eral purpose)
Rev.4.00 Jun 21, 2004 page 70 of 82
REJ03B0011-0400Z
7540 Group
t
C
(CNTR
(CNTR
0
)
)
t
t
t
WL(CNTR
0
)
)
)
t
WH(CNTR
0
)
)
)
0.8VCC
CNTR
0
0.2VCC
tC
1
WL(CNTR
1
tWH(CNTR1
0.8VCC
0.2VCC
CNTR
1
WL(CNTR
0
tWH(CNTR0
0.8VCC
INT
0, INT
1
0.2VCC
tW(RESET)
0.8VCC
RESET
0.2VCC
tC(XIN)
tWL(XIN
)
tWH(XIN)
0.8VCC
XIN
0.2VCC
t
C
(SCLK1
)
t
r
t
f
tWL(SCLK1
)
tWH(SCLK1)
0.8VCC
SCLK1
0.2VCC
tsu(RxD
1
-SCLK1
)
th(SCLK1-RxD1)
0.8VCC
0.2VCC
R
X
D
1
(at receive)
(at transmit)
td
(SCLK1-TxD
1
)
tv(SCLK1-TxD1)
T
X
D
1
t
C
(SCLK2
)
t
r
t
f
tWL(SCLK2
)
tWH(SCLK2)
0.8VCC
S
S
S
CLK2
0.2VCC
t
su(SDATA2-SCLK2
)
th(SCLK2-SDATA2)
0.8VCC
0.2VCC
DATA2 (at receive)
DATA2 (at transmit)
td(SCLK2-SDATA2)
tv(SCLK2-SDATA2)
Fig. 56 Timing chart (Extended operating temperature version)
Rev.4.00 Jun 21, 2004 page 71 of 82
REJ03B0011-0400Z
7540 Group
ELECTRICAL CHARACTERISTICS
3.7540Group (Extended operating temperature 125 °C version)
Applied to: M37540M2V-XXXFP/GP, M37540M4V-XXXFP/GP, M37540E8V-XXXFP/GP
Absolute Maximum Ratings (Extended operating temperature 125 °C version)
Table 30 Absolute maximum ratings
Symbol
Parameter
Conditions
Ratings
Unit
V
VCC
Power source voltage
Input voltage
–0.3 to 6.5 (Note 1)
–0.3 to VCC + 0.3
VI
V
All voltages are
based on VSS.
Output transistors
are cut off.
P00–P07, P10–P14, P20–P27, P30–P37, VREF
Input voltage RESET, XIN, CNVSS
Output voltage
VI
–0.3 to VCC + 0.3
–0.3 to VCC + 0.3
V
V
VO
P00–P07, P10–P14, P20–P27, P30–P37, XOUT
Power dissipation
Ta = 25°C
Pd
300 (Note 2)
–40 to 125 (Note 3)
–65 to 150
mW
°C
Topr
Tstg
Operating temperature
Storage temperature
°C
Notes 1: This is the rating value for the Mask ROM version.
The rating value for the One Time PROM version is –0.3 to 7.0 V.
2: 200 mW for the 32P6U package product.
3: In this version, the operating temperature range and total time are limited as follows;
55 °C to 85 °C: within total 6000 hours,
85 °C to 125 °C: within total 1000 hours.
Rev.4.00 Jun 21, 2004 page 72 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (Extended operating temperature 125 °C version)
Table 31 Recommended operating conditions (1) (VCC = 2.4 to 5.5 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
Min.
4.0
2.4
4.0
2.4
4.0
2.4
Typ.Max.
5.0
VCC
Power source voltage (ceramic)
f(XIN) = 8 MHz (High-, Middle-speed mode)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 4 MHz (Double-speed mode)
5.5
5.5
5.5
5.5
5.5
5.5
V
V
V
V
V
V
V
V
V
5.0
5.0
f(XIN) = 2 MHz (Double-speed mode)
5.0
Power source voltage (RC)
f(XIN) = 4 MHz (High-, Middle-speed mode)
f(XIN) = 2 MHz (High-, Middle-speed mode)
5.0
5.0
VSS
VREF
VIH
Power source voltage
Analog reference voltage
“H” input voltage
0
2.0
VCC
VCC
0.8VCC
P00–P07, P10–P14, P20–P27, P30–P37
“H” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“H” input voltage
VIH
2.0
VCC
VCC
0.3VCC
0.8
V
V
VIH
0.8VCC
RESET, XIN
VIL
“L” input voltage
0
0
0
0
V
P00–P07, P10–P14, P20–P27, P30–P37
“L” input voltage (TTL input level selected)
P10, P12, P13, P36, P37 (Note 1)
“L” input voltage
VIL
V
0.2VCC
0.16VCC
–80
VIL
V
RESET, CNVSS
VIL
“L” input voltage
V
XIN
∑IOH(peak)
∑IOL(peak)
∑IOL(peak)
∑IOH(avg)
∑IOL(avg)
∑IOL(avg)
“H” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
“L” total peak output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total peak output current (Note 2)
P30–P36
mA
mA
mA
mA
mA
mA
80
60
–40
“H” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P30–P37
40
“L” total average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
“L” total average output current (Note 2)
P30–P36
30
Note 1: Vcc = 4.0 to 5.5V
2: The total output current is the sum of all the currents flowing through all the applicable ports. The total average current is an average value measured
over 100 ms. The total peak current is the peak value of all the currents.
Rev.4.00 Jun 21, 2004 page 73 of 82
REJ03B0011-0400Z
7540 Group
Recommended Operating Conditions (Extended operating temperature 125 °C version)
(continued)
Table 32 Recommended operating conditions (2) (VCC = 2.4 to 5.5 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
Parameter
P00–P07, P10–P14, P20–P27, P30–P37
Unit
Min.
Typ.
Max.
–10
10
30
–5
5
“H” peak output current (Note 1)
“L” peak output current (Note 1)
“L” peak output current (Note 1)
mA
mA
mA
mA
mA
mA
MHz
IOH(peak)
IOL(peak)
IOL(peak)
IOH(avg)
IOL(avg)
IOL(avg)
f(XIN)
P00–P07, P10–P14, P20–P27, P37
P30–P36
“H” average output current (Note 2) P00–P07, P10–P14, P20–P27, P30–P37
“L” average output current (Note 2)
“L” average output current (Note 2)
P00–P07, P10–P14, P20–P27, P37
P30–P36
15
4
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input Double-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at ceramic oscillation or external clock input High-, Middle-speed mode
Internal clock oscillation frequency (Note 3) VCC = 4.0 to 5.5 V
2
8
4
4
2
MHz
MHz
MHz
MHz
MHz
at RC oscillation
Internal clock oscillation frequency (Note 3) VCC = 2.4 to 5.5 V
at RC oscillation High-, Middle-speed mode
Notes 1: The peak output current is the peak current flowing in each port.
High-, Middle-speed mode
2: The average output current IOL (avg), IOH (avg) in an average value measured over 100 ms.
3: When the oscillation frequency has a duty cycle of 50 %.
Rev.4.00 Jun 21, 2004 page 74 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (Extended operating temperature 125 °C version)
Table 33 Electrical characteristics (1) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
IOH = –5 mA
Unit
V
Min.Typ.Max.
VCC–1.5
VOH
“H” output voltage
VCC = 4.0 to 5.5 V
P00–P07, P10–P14, P20–P27, P30–P37 (Note 1)
IOH = –1.0 mA
VCC = 2.4 to 5.5 V
VCC–1.0
V
V
V
V
V
V
V
V
VOL
IOL = 5 mA
VCC = 4.0 to 5.5 V
1.5
0.3
1.0
2.0
0.3
1.0
“L” output voltage
P00–P07, P10–P14, P20–P27, P37
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 1.0 mA
VCC = 2.4 to 5.5 V
VOL
IOL = 15 mA
VCC = 4.0 to 5.5 V
“L” output voltage
P30–P36
IOL = 1.5 mA
VCC = 4.0 to 5.5 V
IOL = 10 mA
VCC = 2.4 to 5.5 V
VT+–VT–
0.4
Hysteresis
CNTR0, CNTR1, INT0, INT1(Note 2)
P00–P07 (Note 3)
VT+–VT–
VT+–VT–
IIH
0.5
0.5
V
V
Hysteresis
RXD, SCLK1, SCLK2, SDATA2 (Note 2)
Hysteresis
RESET
VI = VCC
(Pin floating. Pull up
transistors “off”)
5.0
5.0
µA
“H” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIH
IIH
IIL
VI = VCC
µA
µA
µA
“H” input current
RESET
VI = VCC
4.0
“H” input current
XIN
VI = VSS
(Pin floating. Pull up
transistors “off”)
–5.0
–5.0
“L” input current
P00–P07, P10–P14, P20–P27, P30–P37
IIL
IIL
IIL
VI = VSS
µA
µA
“L” input current
RESET, CNVSS
VI = VSS
–4.0
–0.2
“L” input current
XIN
VI = VSS
–0.5
mA
“L” input current
(Pull up transistors “on”)
P00–P07, P30–P37
VRAM
ROSC
DOSC
When clock stopped
2.0
5.5
V
RAM hold voltage
VCC = 5.0 V, Ta = 25 °C
VCC = 5.0 V, Ta = 25 °C
1000
62.5
2000
125
3000
187.5
kHz
kHz
On-chip oscillator oscillation frequency
Oscillation stop detection circuit detection frequency
Notes 1: P11 is measured when the P11/TXD1 P-channel output disable bit of the UART control register (bit 4 of address 001B16) is “0”.
2: RXD1, SCLK1, SCLK2, SDATA2, INT0, and INT1 have hysteresises only when bits 0 to 2 of the port P1P3 control register are set to “0” (CMOS level).
3: It is available only when operating key-on wake up.
Rev.4.00 Jun 21, 2004 page 75 of 82
REJ03B0011-0400Z
7540 Group
Electrical Characteristics (Extended operating temperature 125°C version)(continued)
Table 34 Electrical characteristics (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
ICC
Test conditions
Unit
mA
Min.
Typ.Max.
5.0
One Time PROM version
8.0
1.5
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
0.5
2.0
350
1.6
mA
mA
µA
High-speed mode, f(XIN) = 2 MHz, VCC = 2.4 V
Output transistors “off”
5.0
Middle-speed mode, f(XIN) = 8 MHz,
Output transistors “off”
1000
3.2
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.4 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V (in WIT state),
functions except timer 1 disabled, Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
1.0
50
µA
µA
Ta = 25 °C
Ta = 125 °C
All oscillation stopped
(in STP state)
Output transistors “off”
3.5
0.4
2.0
300
1.6
6.5
1.2
5.0
900
3.2
mA
mA
mA
µA
Mask ROM version
High-speed mode, f(XIN) = 8 MHz
Output transistors “off”
High-speed mode, f(XIN) = 2 MHz, VCC = 2.4 V
Output transistors “off”
Middle-speed mode, f(XIN) = 8 MHz,
Output transistors “off”
On-chip oscillator operation mode, VCC = 5 V
Output transistors “off”
mA
f(XIN) = 8 MHz (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
0.2
mA
f(XIN) = 2 MHz, VCC = 2.4 V (in WIT state),
functions except timer 1 disabled,
Output transistors “off”
150
0.5
0.1
450
µA
On-chip oscillator operation mode, VCC = 5V (in WIT state),
functions except timer 1 disabled, Output transistors “off”
mA
Increment when A/D conversion is executed
f(XIN) = 8 MHz, VCC = 5 V
1.0
50
µA
µA
All oscillation stopped
(in STP state)
Output transistors “off”
Ta = 25 °C
Ta = 125 °C
Rev.4.00 Jun 21, 2004 page 76 of 82
REJ03B0011-0400Z
7540 Group
A/D Converter Characteristics (Extended operating temperature 125 °C version)
Table 35 A/D Converter characteristics
(VCC = 2.7 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
Parameter
Test conditions
Unit
Min.
Typ.Max.
—
Resolution
10
±3
Bits
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
LSB
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±0.9
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
5
20
15
mV
mV
0
3
One Time
5105
3060
5115
3069
5125
3075
122
mV
PROM version
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
Reference power source input current
VREF = 5.0 V
VREF = 3.0 V
50
30
200
120
7.0
10
µA
II(AD)
—
A/D port input current
Resolution
µA
Bits
LSB
—
Linearity error
VCC = 2.7 to 5.5 V
Ta = 25 °C
±3
—
Differential nonlinear error
Zero transition voltage
Full scale transition voltage
Conversion time
VCC = 2.7 to 5.5 V
Ta = 25 °C
±1.5
LSB
VOT
VFST
tCONV
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
VCC = VREF = 5.12 V
VCC = VREF = 3.072 V
0
15
9
35
21
mV
mV
0
Mask ROM version
5105
3060
5125
3075
5150
3090
122
mV
mV
tc(XIN)
kΩ
RLADDER Ladder resistor
55
150
70
IVREF
II(AD)
Reference power source
VREF = 5.0 V
VREF = 3.0 V
50
30
200
120
7.0
µA
input current
A/D port input current
µA
Rev.4.00 Jun 21, 2004 page 77 of 82
REJ03B0011-0400Z
7540 Group
Timing Requirements (Extended operating temperature 125 °C version)
Table 36 Timing requirements (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.
2
Typ.Max.
Reset input “L” pulse width
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
125
50
tWH(XIN)
tWL(XIN)
50
tC(CNTR0)
200
80
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
80
2000
800
800
800
370
370
220
100
1000
400
400
200
200
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
Serial I/O1 input hold time
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
Serial I/O2 input hold time
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Table 37 Timing requirements (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
tW(RESET)
Parameter
Unit
Min.Typ.Max.
2
Reset input “L” pulse width
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tC(XIN)
External clock input cycle time
External clock input “H” pulse width
External clock input “L” pulse width
CNTR0 input cycle time
250
tWH(XIN)
100
tWL(XIN)
100
tC(CNTR0)
500
tWH(CNTR0)
tWL(CNTR0)
tC(CNTR1)
CNTR0, INT0, INT1, input “H” pulse width
CNTR0, INT0, INT1, input “L” pulse width
CNTR1 input cycle time
230
230
4000
1600
1600
2000
950
tWH(CNTR1)
tWL(CNTR1)
tC(SCLK1)
CNTR1 input “H” pulse width
CNTR1 input “L” pulse width
Serial I/O1 clock input cycle time (Note)
Serial I/O1 clock input “H” pulse width (Note)
Serial I/O1 clock input “L” pulse width (Note)
Serial I/O1 input set up time
tWH(SCLK1)
tWL(SCLK1)
tsu(RxD1–SCLK1)
th(SCLK1–RxD1)
tC(SCLK2)
950
400
Serial I/O1 input hold time
200
Serial I/O2 clock input cycle time
Serial I/O2 clock input “H” pulse width
Serial I/O2 clock input “L” pulse width
Serial I/O2 input set up time
2000
950
tWH(SCLK2)
tWL(SCLK2)
tsu(SDATA2–SCLK2)
th(SCLK2–SDATA2)
950
400
Serial I/O2 input hold time
400
Note: In this time, bit 6 of the serial I/O1 control register (address 001A16) is set to “1” (clock synchronous serial I/O1 is selected).
When bit 6 of the serial I/O1 control register is “0” (clock asynchronous serial I/O1 is selected), the rating values are divided by 4.
Rev.4.00 Jun 21, 2004 page 78 of 82
REJ03B0011-0400Z
7540 Group
Switching Characteristics (Extended operating temperature 125 °C version)
Table 38 Switching characteristics (1) (VCC = 4.0 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–30
tC(SCLK1)/2–30
tWH(SCLK1)
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
140
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
30
30
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–30
tC(SCLK2)/2–30
140
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
30
30
30
30
tf(SCLK2)
tr(CMOS)
10
10
tf(CMOS)
Note 1: Pin XOUT is excluded.
Table 39 Switching characteristics (2) (VCC = 2.4 to 5.5 V, VSS = 0 V, Ta = –40 to 125 °C, unless otherwise noted)
Limits
Symbol
tWH(SCLK1)
Parameter
Unit
MinM.Tayxp..
tC(SCLK1)/2–50
tC(SCLK1)/2–50
Serial I/O1 clock output “H” pulse width
Serial I/O1 clock output “L” pulse width
Serial I/O1 output delay time
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tWL(SCLK1)
td(SCLK1–TxD1)
tv(SCLK1–TxD1)
tr(SCLK1)
350
Serial I/O1 output valid time
–30
Serial I/O1 clock output rising time
Serial I/O1 clock output falling time
Serial I/O2 clock output “H” pulse width
Serial I/O2 clock output “L” pulse width
Serial I/O2 output delay time
50
50
tf(SCLK1)
tWH(SCLK2)
tWL(SCLK2)
td(SCLK2–SDATA2)
tv(SCLK2–SDATA2)
tr(SCLK2)
tC(SCLK2)/2–50
tC(SCLK2)/2–50
350
Serial I/O2 output valid time
0
Serial I/O2 clock output rising time
Serial I/O2 clock output falling time
CMOS output rising time (Note 1)
CMOS output falling time (Note 1)
50
50
50
50
tf(SCLK2)
tr(CMOS)
20
20
tf(CMOS)
Note 1: Pin XOUT is excluded.
Measured
output pin
100 pF
/ / /
CMOS output
Switching characteristics measurement circuit diagram (Gen-
eral purpose)
Rev.4.00 Jun 21, 2004 page 79 of 82
REJ03B0011-0400Z
7540 Group
t
C
(CNTR
(CNTR
0
)
)
t
t
t
WL(CNTR
0
)
)
)
t
WH(CNTR
0
)
)
)
0.8VCC
CNTR
0
0.2VCC
tC
1
WL(CNTR
1
tWH(CNTR1
0.8VCC
0.2VCC
CNTR
1
WL(CNTR
0
tWH(CNTR0
0.8VCC
INT
0, INT
1
0.2VCC
tW(RESET)
0.8VCC
RESET
0.2VCC
tC(XIN)
tWL(XIN
)
tWH(XIN)
0.8VCC
XIN
0.2VCC
t
C
(SCLK1
)
t
r
t
f
tWL(SCLK1
)
tWH(SCLK1)
0.8VCC
SCLK1
0.2VCC
tsu(RxD
1
-SCLK1
)
th(SCLK1-RxD1)
0.8VCC
0.2VCC
R
X
D
1
(at receive)
(at transmit)
td
(SCLK1-TxD
1
)
tv(SCLK1-TxD1)
T
X
D
1
t
C
(SCLK2
)
t
r
t
f
tWL(SCLK2
)
tWH(SCLK2)
0.8VCC
S
S
S
CLK2
0.2VCC
t
su(SDATA2-SCLK2
)
th(SCLK2-SDATA2)
0.8VCC
0.2VCC
DATA2 (at receive)
DATA2 (at transmit)
td(SCLK2-SDATA2)
tv(SCLK2-SDATA2)
Fig. 57 Timing chart (Extended operating temperature 125 °C version)
Rev.4.00 Jun 21, 2004 page 80 of 82
REJ03B0011-0400Z
7540 Group
PACKAGE OUTLINE
Recommended
32P6U-A
Plastic 32pin 7✕7mm body LQFP
EIAJ Package Code
LQFP32-P-0707-0.80
JEDEC Code
–
Weight(g)
Lead Material
Cu Alloy
MD
HD
D
32
25
I2
1
24
Recommended Mount Pad
Dimension in Millimeters
Symbol
Min
–
0
Nom
–
Max
1.7
0.2
–
0.45
0.175
7.1
7.1
–
9.2
9.2
0.7
–
0.75
–
A
A
A
b
c
D
E
e
H
H
1
2
0.1
1.4
0.37
0.125
7.0
7.0
0.8
9.0
9.0
0.5
1.0
0.6
0.25
–
–
–
0.5
–
7.4
7.4
–
0.32
0.105
6.9
6.9
–
8.8
8.8
0.3
–
0.45
–
–
–
0°
8
17
9
16
A
D
E
L
L
1
L1
e
F
Lp
A3
x
0.2
0.1
10°
–
–
–
y
L
b
Lp
b2
–
1.0
–
x
M
I
2
y
Detail F
M
M
D
E
–
–
Recommended
36P2R-A
Plastic 36pin 450mil SSOP
EIAJ Package Code
SSOP36-P-450-0.80
JEDEC Code
–
Weight(g)
0.53
Lead Material
Alloy 42
e
b2
36
19
Recommended Mount Pad
Dimension in Millimeters
F
Symbol
Min
–
0.05
–
0.35
0.13
14.8
8.2
–
11.63
0.3
–
–
–
–
0°
–
–
1.27
Nom
–
–
Max
2.4
–
A
A
A
b
c
D
E
e
H
L
1
18
1
2
A
2.0
0.4
0.15
15.0
8.4
0.8
11.93
0.5
1.765
0.7
–
–
D
G
0.5
0.2
15.2
8.6
–
12.23
0.7
–
A2
A1
e
E
b
y
L1
z
–
Z
1
0.85
0.15
10°
–
–
–
y
–
–
c
z
b2
0.5
11.43
–
Z
1
Detail G
Detail F
e1
I
2
Rev.4.00 Jun 21, 2004 page 81 of 82
REJ03B0011-0400Z
7540 Group
Recommended
32P4B
Plastic 32pin 400mil SDIP
EIAJ Package Code
JEDEC Code
Weight(g)
2.2
Lead Material
Alloy 42/Cu Alloy
SDIP32-P-400-1.78
–
32
17
1
16
D
Dimension in Millimeters
Symbol
A
Min
–
0.51
–
Nom
–
–
Max
5.08
–
A
A
1
2
3.8
–
b
0.35
0.9
0.63
0.22
27.8
8.75
–
–
3.0
0°
0.45
1.0
0.73
0.27
28.0
8.9
1.778
10.16
–
0.55
1.3
1.03
0.34
28.2
9.05
–
–
–
15°
b1
b2
c
D
E
e
e
b1
b
b2
SEATING PLANE
e1
L
–
Rev.4.00 Jun 21, 2004 page 82 of 82
REJ03B0011-0400Z
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
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The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
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4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
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5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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©1999, 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0
REVISION DESCRIPTION LIST
7540 Group DATA SHEET
Rev.
Rev.
date
Revision Description
No.
1.0 First Edition
991122
010108
2.0 Page 1:
FEATURES
• The minimum instruction execution time revised;
0.34 µs (at 6 MHz oscillation frequency, double-speed mode for the shortest instruction)
• Power source voltage added;
XIN oscillation frequency at ceramic oscillation , in high-speed mode
At 6 MHz.......................................4.5 to 5.5 V
• Power dissipation revised;
Mask ROM version........................22.5 mW (standard)
One Time PROM version..............30 mW (standard)
PIN CONFIGURATION
Fig. 1 revised; Package type → 32P6U-A, Product name “M37540M4T-XXXGP” added
Page 2: Fig. 2 revised; Product name “M37540M4T-XXXFP” added
Page 3: Fig. 4 M37540RSS pin configuration (42S1M) added
Page 4: Fig. 5 Functional block diagram revised; Package type → 32P6U
Page 7: PIN DESCRIPTION revised; Notes 1 to 3 added
Page 8: Package type revised;
→ 32P6U-A.....0.8 mm-pitch plastic molded LQFP
→ 36P2R-A.....0.8 mm-pitch plastic molded SSOP
Table 2 revised; Package type → 32P6U-A
Pages 9 to 11: Structure of CPU added
Page 12: Fig. 11 Initial value added, Fig. 12 Description revised
Page 16: Table 5 Non-port function of port P0 revised, Notes 2 and 3 added
Page 17: Fig. 17 Port P0 revised
Page 18: Fig. 18 Note added
Page 20: Fig. 20 Initial values added, Interrupt enable bit of ICON1; Note added
Page 21: Fig. 21 Port P00 key-on wakeup selection bit added
(1/5)
REVISION DESCRIPTION LIST
7540 Group DATA SHEET
Rev.
Rev.
date
Revision Description
No.
2.0 (continued)
010108
Pages 22 to 30: Description of timers revised all
Page 31: Fig. 25 to Fig. 27 Initial values added
Page 33: Fig. 29 Reference of Figure revised → Fig. 50, 51
Page 36: Description of SIO1STS revised; “All bits” → “Bits 0 to 6”
Description of UARTCON revised; “P12/SCLK1” pin eliminated
Page 37: Fig. 34 Initial value added
Page 38: Fig. 35 Initial value added
Page 39: Fig. 37 Note revised
Page 40: Fig. 38 Initial value added
Page 41: Fig. 42 Initial value added
Page 42: Description in the case of 6 MHz added
Page 43: Fig. 45 Contents of (7), (8) revised
Page 45: Fig. 49 Functions of b1 and b7 revised, Initial value added
Page 46: Fig. 50 A resistor of XOUT pin eliminated
Page 47: Description of oscillation stop detection circuit added, Fig. 52 revised
Page 48: Notes on Ports revised
Pages 50 to 68: Electrical characteristics revised all
Page 69: Package type revised; 32P6U-A
3.0 All pages: The following is eliminated;
020610
“PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change.”
Page 1: • Memory size ROM/RAM size revised,
• Operating temperature range 125 °C version added, and Note revised
Page 2: Fig. 1 and Fig. 2 Product name revised
Page 3: Fig. 3 Product name revised
Page 7: Table 1 XIN, XOUT Functional description added, Note 1 125 °C version added
Page 8: Memory size ROM/RAM size, Package description, and Fig. 8 revised
Page 9: Table 2 revised
Page 14: Fig. 13 ROM/RAM area added
(2/5)
REVISION DESCRIPTION LIST
7540 Group DATA SHEET
Rev.
Rev.
date
Revision Description
No.
3.0 (continued)
020610
Page 19: Fig. 18 (9) Port P14 revised
Page 20: Note revised
Page 23: ✕ Timer 1 “Prescaler 1 counts the signal which is the oscillation frequency divided by 16.”
(1) Timer mode “Timer A counts the oscillation frequency divided by 16.”
Page 24: ✕ Timer X “Timer X can can be selected in one of 4 operating modes by setting the
timer X operating mode bits of the timer X mode register.”
(1) Timer mode
“Prescaler X counts the count source selected by the timer X count source selection bits.”
Page 26: ✕ Timer Y “Timer Y can can be selected in one of 4 operating modes by setting the
timer Y operating mode bits of the timer Y mode register.”
(1) Timer mode
“Prescaler Y counts the count source selected by the timer Y count source selection bits.”
Page 27: Note on reading timer added.
Page 28: ✕ Timer Z “Timer Z can can be selected in one of 4 operating modes by setting the
timer Z operating mode bits of the timer Z mode register.”
(1) Timer mode
“Prescaler Z counts the count source selected by the timer Z count source selection bits.”
Page 30: Note on reading timer added.
Page 36: Note on Serial I/O added.
Page 44: Clock generating circuit The following description added.
(1) On-chip oscillator operation, (2) Ceramic resonator, (3) RC oscillation, and (4) External clock
Fig. 46 Resistor and Note added, Fig. 47 Note added, and Fig. 49 added.
Page 45: ✕ Oscillation stop detection circuit Note added.
Page 46: Fig. 51 and Fig. 52 revised.
Page 47: Fig. 53 Note 4 added.
Pages 48 to 50: Notes revised
Page 51: DATA REQUIRED FOR MASK ORDERS revised
DATA REQUIRED FOR ROM PROGRAMMING ORDERS added
(3/5)
REVISION DESCRIPTION LIST
7540 Group DATA SHEET
Rev.
Rev.
date
Revision Description
No.
3.0 (continued)
020610
Page 52: Product name added, Table 8 Note revised.
Page 57: Table 13 Ladder resistor value revised, Layout revised.
Page 63: Product name added, Table 20 Note revised.
Page 67: Table 24 Characteristics for One Time PROM version added.
Mask ROM version; “VCC = 5 V” eliminated from the following Test condition.
f(XIN) = 6 MHz
f(XIN) = 8MHz, middle-speed mode
Page 68: Table 25 Ladder resistor value revised, Layout revised.
Page 72 to 80: Extended operating temperature 125 °C version added.
3.1 Page 57: Table 13, Page 68: Table 25 and Page 77: Table 35
Error of the ladder resistor in A/D converter characteristics corrected.
As usual, (Rev.2.0 or before), the value is not changed from Typical 55 kΩ.
020701
(4/5)
7540 Group Data Sheet
REVISION HISTORY
Rev.
Date
Description
Page
Summary
3.20 May. 28, 2003
16
[Pull-up control register] PULL; Note added.
Fig.15; Note 2 eliminated.
18
33
Fig.17; (2) Ports P01,P02 revised.
Fig.29; Port P03 direction register block, Port P01 direction register block and
Port P02 direction register block revised.
(3) RC oscillation revised.
44
4.00 Jun. 21, 2004
All pages Words standardized: On-chip oscillator, A/D converter
8
Fig. 8: “Under development” eliminated.
Table 2: “Under development” eliminated.
CPU: Description revised.
9
10
16
18
33
40
44
50
[Pull-up control register] PULL: Note added, Fig. 15: Note eliminated.
Fig.17 (2) Ports P01, P02 revised.
Fig. 29 P03/TXOUT, P01/TYOUT, P02/TZOUT revised.
Note on A/D converter added.
Fig. 49 revised.
Note on A/D converter added.
Notes on clock generating circuit added.
Note on Power Source Voltage, and Electrical Characteristic Difference Among
Mask ROM and One Time PROM Version MCUs added.
32P6U-A revised.
51
81
(5/5)
相关型号:
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