CR5AS-12-A1

更新时间:2024-09-18 12:56:41
品牌:RENESAS
描述:Thyristor Medium Power Use

CR5AS-12-A1 概述

Thyristor Medium Power Use 晶闸管中等功率应用 可控硅整流器

CR5AS-12-A1 规格参数

生命周期:Obsolete零件包装代码:TO-252
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknownHTS代码:8541.30.00.80
风险等级:5.69Is Samacsys:N
外壳连接:ANODE配置:SINGLE
最大直流栅极触发电流:0.1 mAJESD-30 代码:R-PSIP-T3
元件数量:1端子数量:3
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE认证状态:Not Qualified
最大均方根通态电流:7.8 A断态重复峰值电压:600 V
重复峰值反向电压:600 V表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
触发设备类型:SCRBase Number Matches:1

CR5AS-12-A1 数据手册

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CR5AS-12  
Thyristor  
Medium Power Use  
REJ03G0346-0200  
Rev.2.00  
Apr.05.2005  
Features  
IT (AV) : 5 A  
VDRM : 600 V  
Lead Mounted Type  
Non-Insulated Type  
Glass Passivation Type  
I
GT : 100 µA  
Outline  
RENESAS Package code: PRSS0004ZD-D  
(Package name: DPAK(L)-(3))  
4
2, 4  
1. Cathode  
2. Anode  
3. Gate  
4. Anode  
3
1
1
2
3
Applications  
Switching mode power supply, regulator for autocycle, protective circuit for TV sets, VCRs, and printers, igniter for  
autocycle, electric tool, strobe flasher, and other general purpose control applications  
Maximum Ratings  
Voltage class  
Parameter  
Symbol  
Unit  
12  
Repetitive peak reverse voltage  
Non-repetitive peak reverse voltage  
DC reverse voltage  
Repetitive peak off-state voltageNote1  
DC off-state voltageNote1  
VRRM  
VRSM  
VR(DC)  
VDRM  
VD(DC)  
600  
720  
480  
600  
480  
V
V
V
V
V
Rev.2.00, Apr.05.2005, page 1 of 7  
CR5AS-12  
Parameter  
Symbol  
IT (RMS)  
IT (AV)  
Ratings  
Unit  
A
Conditions  
RMS on-state current  
7.8  
5
Average on-state current  
A
Commercial frequency, sine half wave  
180° conduction, Tc = 88°C  
Surge on-state current  
I2t for fusing  
ITSM  
I2t  
90  
33  
A
60Hz sine half wave 1 full cycle,  
peak value, non-repetitive  
A2s  
Value corresponding to 1 cycle of half  
wave 60Hz, surge on-state current  
Peak gate power dissipation  
Average gate power dissipation  
Peak gate forward voltage  
Peak gate reverse voltage  
Peak gate forward current  
Junction temperature  
Storage temperature  
PGM  
PG (AV)  
VFGM  
VRGM  
IFGM  
Tj  
0.5  
W
W
V
0.1  
6
6
V
0.3  
A
– 40 to +125  
– 40 to +125  
0.26  
°C  
°C  
g
Tstg  
Mass  
Typical value  
Notes: 1. With gate to cathode resistance RGK = 220 .  
Electrical Characteristics  
Parameter  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test conditions  
Repetitive peak reverse current  
IRRM  
2.0  
mA  
Tj = 125°C, VRRM applied,  
RGK = 220 Ω  
Repetitive peak off-state current  
On-state voltage  
IDRM  
VTM  
2.0  
1.8  
mA  
V
Tj = 125°C, VDRM applied,  
RGK = 220 Ω  
Tc = 25°C, ITM = 15 A,  
instantaneous value  
Gate trigger voltage  
VGT  
VGD  
0.8  
V
V
Tj = 25°C, VD = 6 V, IT = 0.1 A  
Gate non-trigger voltage  
0.1  
Tj = 125°C, VD = 1/2 VDRM,  
RGK = 220 Ω  
Gate trigger current  
Holding current  
IGT  
IH  
1
100Note3  
µA  
Tj = 25°C, VD = 6 V, IT = 0.1 A  
3.5  
mA  
Tj = 25°C, VD = 12 V,  
RGK = 220 Ω  
Thermal resistance  
Rth (j-c)  
3.0  
°C/W  
Junction to caseNote2  
Notes: 2. The measurement point for case temperature is at anode tab.  
3. If special values of IGT are required, choose item D or E from those listed in the table below if possible.  
Item  
A
B
C
D
E
IGT (µA)  
1 to 30  
20 to 50  
40 to 100  
1 to 50  
20 to 100  
The above values do not include the current flowing through the 220 resistance between the gate and  
cathode.  
Rev.2.00, Apr.05.2005, page 2 of 7  
CR5AS-12  
Performance Curves  
Maximum On-State Characteristics  
Rated Surge On-State Current  
102  
7
5
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Tc = 25°C  
3
2
101  
7
5
3
2
100  
7
5
3
2
10–1  
0.6 1.0 1.4 1.8 2.2 2.6 3.0 3.4 3.8  
100  
2
3 4 5 7 101  
2
3 4 5 7 102  
On-State Voltage (V)  
Conduction Time (Cycles at 60Hz)  
Gate Trigger Current vs.  
Junction Temperature  
Gate Characteristics  
102  
7
5
103  
7
5
Typical Example  
(25°C)  
I
GT  
#1  
3
2
3
2
#2  
# 1 11µA  
# 2 61µA  
V
FGM = 6V  
P
GM = 0.5W  
101  
7
5
102  
7
5
3
2
P
G(AV) = 0.1W  
3
2
V
GT = 0.8V  
100  
7
5
101  
7
5
IGT = 100µA  
(Tj = 25°C)  
IFGM = 0.3A  
3
2
3
2
V
= 6V  
R = 60Ω  
D
–1  
L
7
5
VGD = 0.1V  
100  
10-2 23 5710-123 5710023 5710123 57102 23  
–604020 0 20 40 60 80 100120 140  
Junction Temperature (°C)  
Gate Current (mA)  
Maximum Transient Thermal  
Impedance Characteristics  
(Junction to case, Junction to ambient)  
Gate Trigger Voltage vs.  
Junction Temperature  
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103  
103  
1.0  
7
5
Tj = 25°C  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
3
2
Distribution  
Typical Example  
Junction to ambient  
102  
7
5
3
2
101  
7
5
3
2
0.1  
0
Junction to case  
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100  
100  
–604020 0 20 40 60 80 100120 140  
Junction Temperature (°C)  
Time (s)  
Rev.2.00, Apr.05.2005, page 3 of 7  
CR5AS-12  
Allowable Case Temperature vs.  
Average On-State Current  
(Single-Phase Half Wave)  
Maximum Average Power Dissipation  
(Single-Phase Half Wave)  
16  
160  
140  
120  
100  
80  
180°  
14  
12  
10  
8
θ
120°  
90°  
360°  
Resistive,  
inductive loads  
60°  
6
60  
θ = 30°  
θ
4
40  
360°  
Resistive,  
inductive loads  
θ = 30°  
90°  
120°  
180°  
2
20  
60°  
0
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Average On-State Current (A)  
Average On-State Current (A)  
Allowable Ambient Temperature vs.  
Average On-State Current  
(Single-Phase Half Wave)  
Allowable Ambient Temperature vs.  
Average On-State Current  
(Single-Phase Half Wave)  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
θ
θ
360°  
360°  
Resistive,  
inductive loads  
Natural convection  
Resistive,  
inductive loads  
Natural convection  
60  
60  
θ = 30°  
60°  
90°  
120°  
180°  
θ = 30°  
60°  
90°  
120°  
180°  
Aluminum Board  
×
40  
40  
80  
80×t2.3  
20  
20  
0
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
Average On-State Current (A)  
0
1
2
3
4
5
6
7
8
Average On-State Current (A)  
Allowable Case Temperature vs.  
Average On-State Current  
(Single-Phase Full Wave)  
Maximum Average Power Dissipation  
(Single-Phase Full Wave)  
16  
160  
140  
120  
100  
80  
Resistive loads  
14  
12  
10  
8
θ
θ
θ
θ
180°  
360°  
360°  
120°  
90°  
60°  
Resistive  
loads  
θ = 30°  
6
60  
4
40  
θ = 30° 60° 90° 120°180°  
2
20  
0
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Average On-State Current (A)  
Average On-State Current (A)  
Rev.2.00, Apr.05.2005, page 4 of 7  
CR5AS-12  
Allowable Ambient Temperature vs.  
Average On-State Current  
(Single-Phase Full Wave)  
Allowable Ambient Temperature vs.  
Average On-State Current  
(Single-Phase Full Wave)  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
Aluminum Board  
×
80  
80×t2.3  
θ
θ
θ
θ
360°  
360°  
Resistive loads  
Natural convection  
Resistive loads  
Natural convection  
θ = 30°  
60°  
90°  
60  
60  
θ = 30°  
60°  
90°  
120°  
180°  
120°  
180°  
40  
40  
20  
20  
0
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6  
Average On-State Current (A)  
0
1
2
3
4
5
6
7
8
Average On-State Current (A)  
Breakover Voltage vs.  
Junction Temperature  
Breakover Voltage vs.  
Gate to Cathode Resistance  
103  
7
5
160  
140  
120  
100  
80  
Typical Example  
Typical Example  
Tj = 125°C  
R
= 220Ω  
GK  
3
2
102  
7
5
3
2
60  
101  
7
5
40  
3
2
20  
100  
0
–4020 0 20 40 60 80 100120140160  
10-2 2 3 5 710-1 2 3 5 7100 2 3 5 7101  
Junction Temperature (°C)  
Gate to Cathode Resistance (k)  
Breakover Voltage vs.  
Rate of Rise of Off-State Voltage  
Holding Current vs.  
Junction Temperature  
160  
102  
7
5
4
Tj = 125°C  
= 220Ω  
R
140  
120  
100  
80  
GK  
Distribution  
Typical Example  
3
2
101  
7
5
4
3
2
60  
100  
7
5
4
40  
3
V
D
= 12V  
20  
2
R
= 220Ω  
GK  
10–1  
0
100 2 3 5 7 101 2 3 5 7 102 2 3 5 7 103  
–604020 0 20 40 60 80 100120140  
Junction Temperature (°C)  
Rate of Rise of Off-State Voltage (V/µs)  
Rev.2.00, Apr.05.2005, page 5 of 7  
CR5AS-12  
Holding Current vs.  
Gate to Cathode Resistance  
Repetitive Peak Reverse Voltage vs.  
Junction Temperature  
400  
350  
300  
160  
140  
120  
100  
80  
Typical Example  
Tj = 25°C  
Typical Example  
I
(25°C) I (1k)  
GT  
H
# 1  
# 2  
14µA  
48µA  
1.7mA  
2.7mA  
250  
200  
150  
100  
50  
# 1  
# 2  
60  
40  
20  
0
–4020 0 20 40 60 80 100120140160  
0
10-2 2 3 5 710-1 2 3 5 7100 2 3 5 7101  
Gate to Cathode Resistance (k)  
Junction Temperature (°C)  
Gate Trigger Current vs.  
Gate Current Pulse Width  
104  
7
5
Typical Example  
(DC)  
I
GT  
# 1  
# 1 11µA  
# 2 61µA  
3
2
# 2  
103  
7
5
3
2
102  
7
5
V
= 6V  
= 60Ω  
D
3
2
R
Ta = 25°C  
L
101  
100  
2
3 4 5 7 101  
2
3 4 5 7 102  
Gate Current Pulse Width (µs)  
Rev.2.00, Apr.05.2005, page 6 of 7  
CR5AS-12  
Package Dimensions  
JEITA Package Code  
RENESAS Code  
Package Name  
MASS[Typ.]  
0.36g  
Unit: mm  
PRSS0004ZD-D  
DPAK(L)-(3)/DPAK(L)-(3)V  
6.5 0.5  
5.4 0.5  
2.3 0.2  
0.55 0.1  
1.15 0.1  
1.2 0.3  
0.8 0.1  
0.6 0.1  
0.6 0.1  
0.55 0.1  
0.55 0.1  
0.55 0.1  
2.29  
2.29  
Order Code  
Standard order  
code example  
Lead form  
Standard packing  
Vinyl sack  
Quantity  
Standard order code  
Straight type  
100 Type name – A1  
CR5AS-12-A1  
Note : Please confirm the specification about the shipping in detail.  
Rev.2.00, Apr.05.2005, page 7 of 7  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,  
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life  
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and  
cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
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http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
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Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501  
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Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999  
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© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon .2.0  

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