FRM9230H [RENESAS]

4A, 200V, 1.3ohm, P-CHANNEL, Si, POWER, MOSFET, TO-204AA;
FRM9230H
型号: FRM9230H
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

4A, 200V, 1.3ohm, P-CHANNEL, Si, POWER, MOSFET, TO-204AA

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FRM9230D, FRM9230R,  
FRM9230H  
4A, -200V, 1.30 Ohm, Rad Hard,  
P-Channel Power MOSFETs  
June 1998  
Features  
Package  
• 4A, -200V, RDS(on) = 1.30  
TO-204AA  
• Second Generation Rad Hard MOSFET Results From New Design Concepts  
• Gamma  
- Meets Pre-Rad Specifications to 100KRAD(Si)  
- Defined End Point Specs at 300KRAD(Si) and 1000KRAD(Si)  
- Performance Permits Limited Use to 3000KRAD(Si)  
• Gamma Dot  
- Survives 3E9RAD(Si)/sec at 80% BVDSS Typically  
- Survives 2E12 Typically If Current Limited to IDM  
• Photo Current - 3nA Per-RAD(Si)/sec Typically  
2
• Neutron  
- Pre-RAD Specifications for 1E13 Neutrons/cm  
2
- Usable to 1E14 Neutrons/cm  
Description  
Symbol  
The Harris Semiconductor Sector has designed a series of SECOND GENERA-  
TION hardened power MOSFETs of both N and P channel enhancement types  
with ratings from 100V to 500V, 1A to 60A, and on resistance as low as 25m.  
Total dose hardness is offered at 100K RAD(Si) and 1000KRAD(Si) with neutron  
hardness ranging from 1E13n/cm for 500V product to 1E14n/cm for 100V prod-  
uct. Dose rate hardness (GAMMA DOT) exists for rates to 1E9 without current lim-  
iting and 2E12 with current limiting.  
2
2
D
This MOSFET is an enhancement-mode silicon-gate power field effect transistor of  
the vertical DMOS (VDMOS) structure. It is specially designed and processed to  
exhibit minimal characteristic changes to total dose (GAMMA) and neutron (n )  
G
o
exposures. Design and processing efforts are also directed to enhance survival to  
heavy ion (SEE) and/or dose rate (GAMMA DOT) exposure.  
S
This part may be supplied as a die or in various packages other than shown above.  
Reliability screening is available as either non TX (commercial), TX equivalent of  
MIL-S-19500, TXV equivalent of MIL-S-19500, or space equivalent of  
MIL-S-19500. Contact the Intersil High-Reliability Marketing group for any desired  
deviations from the data sheet.  
o
Absolute Maximum Ratings (TC = +25 C) Unless Otherwise Specified  
FRM9230D, R, H  
UNITS  
Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDS  
Drain-Gate Voltage (RGS = 20k). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR  
Continuous Drain Current  
-200  
-200  
V
V
o
TC = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID  
4
2
12  
±20  
A
A
A
V
o
TC = +100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID  
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM  
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VGS  
Maximum Power Dissipation  
o
TC = +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT  
75  
30  
0.60  
W
W
o
TC = +100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PT  
o
o
Derated Above +25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
W/ C  
Inductive Current, Clamped, L = 100µH, (See Test Figure). . . . . . . . . . . . . . . . . . . . . . . . . . ILM  
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IS  
Pulsed Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ISM  
Operating And Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJC, TSTG  
Lead Temperature (During Soldering)  
12  
4
12  
A
A
A
o
-55 to +150  
C
o
Distance > 0.063 in. (1.6mm) From Case, 10s Max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL  
300  
C
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.  
File Number 3263.2  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 19994-1  
FRM9230D, FRM9230R, FRM9230H  
o
Pre-Radiation Electrical Specifications TC = +25 C, Unless Otherwise Specified  
LIMITS  
PARAMETER  
Drain-Source Breakdown Volts  
Gate-Threshold Volts  
SYMBOL  
BVDSS  
VGS(th)  
IGSSF  
TEST CONDITIONS  
VGS = 0, ID = 1mA  
MIN  
-200  
-2.0  
-
MAX  
-
UNITS  
V
VDS = VGS, ID = 1mA  
VGS = -20V  
-4.0  
100  
100  
V
Gate-body Leakage Forward  
Gate-Body Leakage Reverse  
nA  
IGSSR  
VGS = +20V  
-
nA  
Zero-Gate Voltage  
Drain Current  
IDSS1  
IDSS2  
IDSS3  
VDS = -200V, VGS = 0  
VDS = -160V, VGS = 0  
VDS = -160V, VGS = 0, TC = +125 C  
-
-
-
1
0.025  
0.25  
mA  
o
Rated Avalanche Current  
Drain-Source On-State Volts  
Drain-source On Resistance  
Turn-On Delay Time  
Rise Time  
IAR  
VDS(on)  
RDS(on)  
td(on)  
tr  
Time = 20µs  
-
-
12  
-5.46  
1.30  
46  
A
V
VGS = -10V, ID = 4A  
VGS = -10V, ID = 2A  
-
VDD = -100V, ID = 4A  
Pulse Width = 3µs  
-
-
74  
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
Period = 300µs, Rg = 25Ω  
0 VGS 10 (See Test Circuit)  
-
110  
54  
-
Gate-Charge Threshold  
Gate-Charge On State  
Gate-Charge Total  
Plateau Voltage  
QG(th)  
QG(on)  
QGM  
VGP  
1
4
14  
30  
-3  
3
58  
nc  
VDD = -100V, ID = 4A  
IGS1 = IGS2  
0 VGS 20  
120  
-12  
12  
V
Gate-Charge Source  
Gate-Charge Drain  
Diode Forward Voltage  
Reverse Recovery Time  
Junction-To-Case  
QGS  
QGD  
VSD  
nc  
5
20  
ID = 4A, VGD = 0  
-0.6  
-
-1.8  
400  
1.67  
60  
V
TT  
I = 4A; di/dt = 100A/µs  
ns  
Rθjc  
-
o
C/W  
Junction-To-Ambient  
Rθja  
Free Air Operation  
-
ELECTRONIC SWITCH OPENS  
WHEN I IS REACHED  
AS  
V
V
DS  
DD  
L
R
L
+
I
-
CURRENT  
TRANSFORMER  
AS  
V
DS  
VARY t TO OBTAIN  
+
P
0V  
50Ω  
REQUIRED PEAK I  
DUT  
AS  
V
DD  
0V  
-
t
P
50V-150V  
DUT  
V
= -12V  
GS  
R
GS  
50Ω  
V
20V  
GS  
FIGURE 2. UNCLAMPED ENERGY TEST CIRCUIT  
FIGURE 1. RESISTIVE SWITCHING TEST CIRCUIT  
4-2  
FRM9230D, FRM9230R, FRM9230H  
o
Post-Radiation Electrical Specifications TC = +25 C, Unless Otherwise Specified  
LIMITS  
PARAMETER  
SYMBOL  
BVDSS  
BVDSS  
VGS(th)  
VGS(th)  
IGSSF  
TYPE  
TEST CONDITIONS  
VGS = 0, ID = 1mA  
MIN  
MAX  
-
UNITS  
V
Drain-Source  
(Note 4, 6)  
FRM9230D, R  
FRM9230H  
-200  
Breakdown Volts  
(Note 5, 6)  
VGS = 0, ID = 1mA  
-190  
-
V
Gate-Source  
(Note 4, 6)  
FRM9230D, R  
FRM9230H  
VGS = VDS, ID = 1mA  
VGS = VDS, ID = 1mA  
VGS = -20V, VDS = 0  
VGS = -20V, VDS = 0  
VGS = +20V, VDS = 0  
VGS = +20V, VDS = 0  
VGS = 0, VDS = -160V  
VGS = 0, VDS = -160V  
VGS = -10V, ID = 4A  
VGS = -16V, ID = 4A  
VGS = -10V, ID = 2A  
VGS = -14V, ID = 2A  
-2.0  
-4.0  
-6.0  
100  
200  
100  
200  
25  
V
Threshold Volts  
(Note 3, 5, 6)  
(Note 4, 6)  
-2.0  
V
Gate-Body  
FRM9230D, R  
FRM9230H  
-
-
-
-
-
-
-
-
-
-
nA  
nA  
nA  
nA  
µA  
µA  
V
Leakage Forward  
(Note 5, 6)  
IGSSF  
Gate-Body  
(Note 2, 4, 6)  
(Note 2, 5, 6)  
(Note 4, 6)  
IGSSR  
IGSSR  
IDSS  
FRM9230D, R  
FRM9230H  
Leakage Reverse  
Zero-Gate Voltage  
Drain Current  
FRM9230D, R  
FRM9230H  
(Note 5, 6)  
IDSS  
100  
-5.46  
-8.19  
1.30  
1.95  
Drain-Source  
On-state Volts  
(Note 1, 4, 6)  
(Note 1, 5, 6)  
(Note 1, 4, 6)  
(Note 1, 5, 6)  
VDS(on)  
VDS(on)  
RDS(on)  
RDS(on)  
FRM9230D, R  
FRM9230H  
V
Drain-Source  
On Resistance  
FRM9230D, R  
FRM9230H  
NOTES:  
1. Pulse test, 300µs max  
2. Absolute value  
3. Gamma = 300KRAD(Si)  
4. Gamma = 10KRAD(Si) for “D”, 100KRAD(Si) for “R”. Neutron = 1E13  
5. Gamma = 1000KRAD(Si). Neutron = 1E13  
6. Insitu Gamma bias must be sampled for both VGS = -10V, VDS = 0V and VGS = 0V, VDS = 80% BVDSS  
7. Gamma data taken 2/19/90 on TA17732 devices by GE ASTRO SPACE; EMC/SURVIVABILITY LABORATORY; KING OF PRUSSIA,  
PA 19401  
8. Single event drain burnout testing by Titus, J.L., et al of NWSC, Crane, IN at Brookhaven Nat. Lab. Dec 11-14, 1989  
9. Neutron derivation, HARRIS Application note AN-8831, Oct. 1988  
4-3  
FRM9230D, FRM9230R, FRM9230H  
Typical Performance Characteristics  
4-4  
FRM9230D, FRM9230R, FRM9230H  
Rad Hard Data Packages - Intersil Power Transistors  
TXV Equivalent  
E. Preconditioning Attributes Data Sheet  
Hi-Rel Lot Traveler  
HTRB - Hi Temp Gate Stress Post Reverse  
Bias Data and Delta Data  
1. Rad Hard TXV Equivalent - Standard Data Package  
A. Certificate of Compliance  
B. Assembly Flow Chart  
HTRB - Hi Temp Drain Stress Post Reverse  
Bias Delta Data  
C. Preconditioning - Attributes Data Sheet  
F. Group A  
G. Group B  
H. Group C  
I. Group D  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
D. Group A  
E. Group B  
F. Group C  
G. Group D  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
- Attributes Data Sheet  
2. Rad Hard Max. “S” Equivalent - Optional Data Package  
A. Certificate of Compliance  
2. Rad Hard TXV Equivalent - Optional Data Package  
A. Certificate of Compliance  
B. Serialization Records  
B. Assembly Flow Chart  
C. Assembly Flow Chart  
C. Preconditioning - Attributes Data Sheet  
- Precondition Lot Traveler  
- Pre and Post Burn-In Read and Record  
Data  
D. SEM Photos and Report  
E. Preconditioning - Attributes Data Sheet  
- Hi-Rel Lot Traveler  
D. Group A  
- Attributes Data Sheet  
- Group A Lot Traveler  
- HTRB - Hi Temp Gate Stress Post  
Reverse Bias Data and Delta Data  
- HTRB - Hi Temp Drain Stress Post  
Reverse Bias Delta Data  
E. Group B  
- Attributes Data Sheet  
- Group B Lot Traveler  
- X-Ray and X-Ray Report  
- Pre and Post Read and Record Data for  
Intermittent Operating Life (Subgroup B3)  
- Bond Strength Data (Subgroup B3)  
- Pre and Post High Temperature Operating  
Life Read and Record Data (Subgroup B6)  
F. Group A  
G. Group B  
H. Group C  
I. Group D  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups A2, A3, A4, A5 and A7 Data  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups B1, B3, B4, B5 and B6 Data  
F. Group C  
- Attributes Data Sheet  
- Group C Lot Traveler  
- Pre and Post Read and Record Data for  
Intermittent Operating Life (Subgroup C6)  
- Bond Strength Data (Subgroup C6)  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Subgroups C1, C2, C3 and C6 Data  
G. Group D  
- Attributes Data Sheet  
- Group D Lot Traveler  
- Pre and Post RAD Read and Record Data  
- Attributes Data Sheet  
- Hi-Rel Lot Traveler  
- Pre and Post Radiation Data  
Class S - Equivalents  
1. Rad Hard “S” Equivalent - Standard Data Package  
A. Certificate of Compliance  
B. Serialization Records  
C. Assembly Flow Chart  
D. SEM Photos and Report  
4-5  
FRM9230D, FRM9230R, FRM9230H  
TO-204AA  
JEDEC TO-204AA HERMETIC STEEL PACKAGE  
SEATING  
PLANE  
R
INCHES  
MIN  
MILLIMETERS  
1
ØP  
TERM. 3  
SYMBOL  
MAX  
0.330  
0.065  
0.042  
0.145  
0.800  
MIN  
7.88  
1.53  
0.97  
3.51  
-
MAX  
8.38  
NOTES  
A
0.310  
0.060  
0.038  
0.138  
-
-
s
R
A
1
1.65  
-
Øb  
ØD  
Øb  
1.06  
2, 3  
q
2
1
Øb1  
Øb  
3.68  
-
-
1
ØD  
e
20.32  
0.215 TYP  
0.430 BSC  
5.46 TYP  
10.92 BSC  
4
4
-
A
1
e
e
1
A
e1  
L
L
ØP  
q
0.430  
-
10.93  
-
0.155  
0.160  
3.94  
4.06  
-
1.187 BSC  
30.15 BSC  
-
R
0.495  
0.131  
0.655  
0.525  
0.185  
0.675  
12.58  
3.33  
13.33  
4.69  
-
R
-
1
s
16.64  
17.14  
-
NOTES:  
1. These dimensions are within allowable dimensions of Rev. C of  
JEDEC TO-204AA outline dated 11-82.  
2. Lead dimension (without solder).  
3. Add typically 0.002 inches (0.05mm) for solder coating.  
4. Position of lead to be measured 0.250 inches (6.35mm) from bot-  
tom of seating plane.  
5. Controlling dimension: Inch.  
6. Revision 2 dated 6-93.  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without  
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate  
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
Taiwan Limited  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
4-6  

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