FX6ASJ-03 [RENESAS]

High-Speed Switching Use Pch Power MOS FET; 高速开关使用P沟道功率MOS FET
FX6ASJ-03
型号: FX6ASJ-03
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

High-Speed Switching Use Pch Power MOS FET
高速开关使用P沟道功率MOS FET

晶体 开关 晶体管 功率场效应晶体管 脉冲
文件: 总7页 (文件大小:105K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
FX6ASJ-03  
High-Speed Switching Use  
Pch Power MOS FET  
REJ03G0247-0100  
Rev.1.00  
Aug.20.2004  
Features  
Drive voltage : 4 V  
VDSS : – 30 V  
r
DS(ON) (max) : 0.29  
ID : – 6 A  
Recovery Time of the Integrated Fast Recovery Diode (TYP.) : 40 ns  
Outline  
MP-3A  
3
4
1. Gate  
2. Drain  
3. Source  
4. Drain  
1
1
2
3
2, 4  
Applications  
Motor control, lamp control, solenoid control, DC-DC converters, etc.  
Maximum Ratings  
(Tc = 25°C)  
Parameter  
Drain-source voltage  
Gate-source voltage  
Drain current  
Symbol  
VDSS  
VGSS  
ID  
Ratings  
Unit  
Conditions  
–30  
V
V
VGS = 0 V  
±20  
VDS = 0 V  
–6  
A
Drain current (Pulsed)  
Avalanche current (Pulsed)  
Source current  
IDM  
–24  
A
IDA  
–6  
–6  
A
L = 30 µH  
IS  
A
Source current (Pulsed)  
Maximum power dissipation  
Channel temperature  
Storage temperature  
Mass  
ISM  
–24  
A
PD  
20  
W
°C  
°C  
g
Tch  
Tstg  
– 55 to +150  
– 55 to +150  
0.32  
Typical value  
Rev.1.00, Aug.20.2004, page 1 of 6  
FX6ASJ-03  
Electrical Characteristics  
(Tch = 25°C)  
Parameter  
Drain-source breakdown voltage  
Gate-source leakage current  
Drain-source leakage current  
Gate-source threshold voltage  
Drain-source on-state resistance  
Drain-source on-state resistance  
Drain-source on-state voltage  
Forward transfer admittance  
Input capacitance  
Symbol  
V(BR)DSS  
IGSS  
Min.  
–30  
Typ.  
Max.  
Unit  
V
Test conditions  
ID = –1 mA, VGS = 0 V  
VGS = ±20 V, VDS = 0 V  
VDS = –30 V, VGS = 0 V  
ID = –1 mA, VDS = –10 V  
ID = –3 A, VGS = –10 V  
ID = –1 A, VGS = – 4 V  
ID = –3 A, VGS = –10 V  
ID = –3 A, VDS = – 5 V  
±0.1  
–0.1  
–2.3  
0.29  
0.62  
– 0.87  
µA  
mA  
V
IDSS  
VGS(th)  
rDS(ON)  
rDS(ON)  
VDS(ON)  
| yfs |  
Ciss  
–1.3  
–1.8  
0.23  
0.46  
– 0.69  
2.6  
550  
165  
45  
V
S
pF  
pF  
pF  
ns  
ns  
ns  
ns  
V
VDS = –10 V, VGS = 0 V,  
f = 1MHz  
Output capacitance  
Coss  
Crss  
td(on)  
Reverse transfer capacitance  
Turn-on delay time  
9
VDD = –15 V, ID = –3 A,  
GS = –10 V,  
GEN = RGS = 50 Ω  
V
R
Rise time  
tr  
14  
Turn-off delay time  
td(off)  
32  
Fall time  
tf  
14  
Source-drain voltage  
VSD  
–1.0  
–1.5  
6.25  
IS = –3 A, VGS = 0 V  
Channel to case  
Thermal resistance  
Rth(ch-c)  
trr  
°C/W  
ns  
Reverse recovery time  
40  
IS = –3 A, dis/dt = 50 A/µs  
Rev.1.00, Aug.20.2004, page 2 of 6  
FX6ASJ-03  
Performance Curves  
Drain Power Dissipation Derating Curve  
Maximum Safe Operating Area  
102  
–7  
–5  
40  
32  
24  
16  
8
–3  
–2  
tw = 10µs  
101  
–7  
–5  
100µs  
–3  
–2  
1ms  
100  
–7  
–5  
10ms  
DC  
–3  
–2  
Tc = 25°C  
Single Pulse  
10–1  
0
1
2
–2 –3 –5 –7  
–10  
–2  
0
50  
100  
150  
200  
100  
–2 –3 –5 –7 –2 –3 –5 –7  
–10  
Case Temperature Tc (°C)  
Drain-Source Voltage V  
DS  
(V)  
Output Characteristics (Typical)  
Output Characteristics (Typical)  
–10  
–8  
–6  
–4  
–2  
0
5.0  
4.0  
–3.0  
–2.0  
–1.0  
0
6V  
Tc = 25°C  
Pulse Test  
5V  
V
GS  
= –10V  
8V  
7V  
Tc = 25°C  
Pulse Test  
6V  
5V  
4V  
V
GS  
= –10V  
8V  
7V  
P
D
= 20W  
4V  
3V  
3V  
0
–1.0 2.0 3.0 4.0 5.0  
0
0.4  
0.8  
–1.2  
–1.6  
–2.0  
Drain-Source Voltage V  
DS  
(V)  
Drain-Source Voltage V  
DS  
(V)  
On-State Voltage vs.  
Gate-Source Voltage (Typical)  
On-State Resistance vs.  
Drain Current (Typical)  
5.0  
4.0  
3.0  
2.0  
–1.0  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
Tc = 25°C  
Pulse Test  
Tc = 25°C  
Pulse Test  
V
= 4V  
GS  
I
D
= –10A  
6A  
–10V  
3A  
1A  
0
–2  
–4  
–6  
–8  
–10  
–10–1 –2 –3 57–100 –2 –3 57–101 –2 –3 57–102  
Gate-Source Voltage V  
(V)  
Drain Current I (A)  
D
GS  
Rev.1.00, Aug.20.2004, page 3 of 6  
FX6ASJ-03  
Forward Transfer Admittance vs.  
Drain Current (Typical)  
Transfer Characteristics (Typical)  
Tc = 25°C  
–10  
101  
7
V
= –10V  
Tc = 25°C  
DS  
Pulse Test  
5
75°C  
–8  
–6  
–4  
–2  
0
125°C  
3
2
100  
7
5
3
2
V
= 5V  
DS  
Pulse Test  
0
–2  
–4  
–6  
–8  
–10  
–10–1 –2 –3 –5 –7–100 –2 –3 –5 –7–101  
Drain Current I (A)  
D
Gate-Source Voltage V  
(V)  
GS  
Capacitance vs.  
Drain-Source Voltage (Typical)  
Switching Characteristics (Typical)  
102  
104  
7
5
Tch = 25°C  
f = 1MHz  
7
5
td(off)  
V
GS  
= 0V  
3
2
3
2
103  
7
tf  
td(on)  
tr  
5
Ciss  
101  
7
3
2
5
Coss  
Crss  
102  
7
3
2
Tch = 25°C  
V
V
= –15V  
= –10V  
DD  
GS  
5
3
2
R
= R  
= 50  
GS  
GEN  
100  
–10–1 –2 –3 –5 –7–100 –2 –3 –5 –7 –101  
–3 –5–7–100 –2–3 –5–7–101–2–3 –5–7–102 –2–3  
Drain-Source Voltage V  
(V)  
Drain Current I (A)  
D
DS  
Source-Drain Diode Forward  
Characteristics (Typical)  
Gate-Source Voltage vs.  
Gate Charge (Typical)  
–10  
–8  
–6  
–4  
–2  
0
–20  
–16  
–12  
–8  
–4  
0
Tch = 25°C  
= 6A  
V
= 0V  
GS  
Pulse Test  
I
D
V
= –10V  
DS  
20V  
25V  
Tc = 125°C  
75°C  
25°C  
0
4
8
12  
16  
20  
0
0.4 0.8  
–1.2 –1.6  
–2.0  
Source-Drain Voltage V  
(V)  
Gate Charge Qg (nC)  
SD  
Rev.1.00, Aug.20.2004, page 4 of 6  
FX6ASJ-03  
On-State Resistance vs.  
Channel Temperature (Typical)  
Threshold Voltage vs.  
Channel Temperature (Typical)  
101  
7
4.0  
3.2  
2.4  
–1.6  
0.8  
0
V
= –10V  
V
= –10V  
GS  
= 1/2 I  
Pulse Test  
DS  
I = –1mA  
D
I
D
D
5
3
2
100  
7
5
3
2
10–1  
–50  
0
50  
100  
150  
–50  
0
50  
100  
150  
Channel Temperature Tch (°C)  
Channel Temperature Tch (°C)  
Breakdown Voltage vs.  
Channel Temperature (Typical)  
Transient Thermal Impedance Characteristics  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
102  
7
5
V
= 0V  
GS  
= –1mA  
I
D
3
2
101  
7
5
D = 1.0  
0.5  
0.2  
3
2
P
DM  
0.1  
100  
7
5
0.05  
0.02  
0.01  
Single Pulse  
tw  
T
3
2
tw  
T
D =  
10–1  
–50  
0
50  
100  
150  
1042 3 571032 3 571022 3 5710–12 3 57100 2 3 57101 2 3 57102  
Channel Temperature Tch (°C)  
Pulse Width tw (s)  
Switching Time Measurement Circuit  
Switching Waveform  
Vout  
Monitor  
Vin  
Vin Monitor  
10%  
D.U.T.  
R
GEN  
R
L
90%  
V
90%  
90%  
DD  
R
GS  
10%  
10%  
Vout  
t
t
r
t
t
f
d(on)  
d(off)  
Rev.1.00, Aug.20.2004, page 5 of 6  
FX6ASJ-03  
Package Dimensions  
MP-3A  
EIAJ Package Code  
Mass (g) (reference value)  
0.32  
Lead Material  
Cu alloy  
JEDEC Code  
6.6  
2.3  
5.3 0.2  
0.5 0.1  
0.1 0.1  
0.76 0.2  
0.76  
0.5 0.2  
2.3 0.2  
Dimension in Millimeters  
Min Typ Max  
Symbol  
A
A
A
b
1
2
D
E
e
x
Note 1) The dimensional figures indicate representative values unless  
otherwise the tolerance is specified.  
y
y1  
ZD  
ZE  
Order Code  
Standard order  
code example  
Lead form  
Standard packing  
Quantity  
Standard order code  
Surface-mounted type Taping  
3000 Type name – T +Direction (1 or 2) +3 FX6ASJ-03-T13  
75 Type name FX6ASJ-03  
Surface-mounted type Plastic Magazine (Tube)  
Note : Please confirm the specification about the shipping in detail.  
Rev.1.00, Aug.20.2004, page 6 of 6  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
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