GRM1555C1H2N20J [RENESAS]

RF Amplifier 1.7GHz to 2.2GHz;
GRM1555C1H2N20J
型号: GRM1555C1H2N20J
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

RF Amplifier 1.7GHz to 2.2GHz

文件: 总17页 (文件大小:2463K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
RF Amplifier  
F1421  
1.7GHz to 2.2GHz  
Datasheet  
Description  
Features  
The F1421 is a high gain / high linearity RF amplifier used in high-  
performance RF applications. The F1421 provides 20.3dB gain  
with a +40dBm OIP3 and 5.5dB noise figure at 1.9GHz. This device  
uses a single 5V supply and 138mA of ICC.  
.
.
.
.
.
.
.
.
Broadband 1.7GHz to 2.2GHz  
20.3dB typical gain at 1.9GHz  
5.5dB noise figure at 1.9GHz  
+40dBm OIP3 at 1.9GHz  
In typical base stations, RF amplifiers are used in the RX and TX  
traffic paths to boost signal levels. The F1421 amplifier offers very  
high reliability due to its construction using silicon die in a QFN  
package.  
+23dBm output P1dB at 1.9GHz  
Single 5V supply voltage  
ICC = 138mA  
-40°C to +105°C operating temperature  
.
50single-ended input / output impedances  
Typical Applications  
.
.
Standby mode for power savings  
4mm x 4mm, 24-pin QFN package  
.
.
.
.
.
.
.
Multi-mode, multi-carrier transmitters  
PCS1900 base stations  
DCS1800 base stations  
Block Diagram  
Figure 1. Block Diagram  
WiMAX and LTE base stations  
UMTS/WCDMA 3G base stations  
PHS/PAS base stations  
Public safety infrastructure  
Zero-DistortionTM  
RFIN  
RFOUT  
STBY  
VCC  
1
Rev O May 11, 2018  
Pin Assignments  
Figure 2. Pin Assignments for 4mm x 4mm x 0.9mm QFN Package Top View  
1
18  
17  
16  
15  
14  
13  
NC  
NC  
NC  
NC  
NC  
NC  
NC  
EPAD  
2
3
4
5
6
NC  
NC  
GND  
RFOUT  
GND  
Control Circuit  
Pin Descriptions  
Table 1.  
Pin Descriptions  
Number  
Name  
Description  
1 - 7, 12,  
16 - 20, 24  
No internal connection. These pins can be left unconnected, have a voltage applied, or be connected to  
ground (recommended).  
NC  
Standby (HIGH = device power OFF, LOW/Open = device power ON). Internally this pin has a pull-down  
resistor that is connected to GND.  
8
STBY  
9
RSET  
RDSET  
VCC  
Amplifier bias current setting resistor. Connect a 2.26kΩ resistor to ground.  
Amplifier second bias current setting resistor. Connect a 5.76kΩ resistor to ground.  
Power supply for the amplifier.  
10  
11  
13, 15, 21,  
23  
GND  
RFOUT  
RFIN  
Internally grounded. These pins must be grounded as close to the device as possible.  
RF output. Must use an external DC block as close to the pin as possible.  
14  
RF input internally matched to 50Ω. Must use an external DC block. The DC block should be placed as  
close to the pin as possible for best RF performance.  
22  
Exposed paddle. Internally connected to ground. Solder this exposed paddle to a printed circuit board  
(PCB) pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground  
planes. These multiple ground vias are also required to achieve the specified RF performance.  
EPAD  
2
Rev O May 11, 2018  
Absolute Maximum Ratings  
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the device.  
Functional operation of the F1421 at absolute maximum ratings is not implied. Exposure to absolute maximum rating conditions may affect  
device reliability.  
Table 2.  
Absolute Maximum Ratings  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
Supply Voltage  
VCC  
VSTBY  
VRFIN  
-0.3  
-0.3  
+5.5  
VCC + 0.25  
+0.3  
V
V
STBY  
RFIN Externally Applied DC Voltage  
RFOUT Externally Applied DC voltage  
Maximum RF CW Input Power  
Continuous Power Dissipation  
Junction Temperature  
-0.3  
V
VRFOUT  
PMAX_IN  
PDISS  
VCC - 0.15  
VCC + 0.15  
+18  
V
dBm  
W
1.5  
TJMAX  
TSTOR  
TLEAD  
+150  
°C  
°C  
°C  
Storage Temperature Range  
Lead Temperature (soldering, 10s)  
-65  
+150  
+260  
Electrostatic Discharge HBM  
(JEDEC/ESDA JS-001-2012)  
2000  
(Class 2)  
VESDHMB  
VESDCDM  
V
V
Electrostatic Discharge CDM  
(JEDEC 22-C101F)  
500  
(Class C2)  
3
Rev O May 11, 2018  
Recommended Operating Conditions  
Table 3.  
Recommended Operating Conditions  
Parameter  
Symbol  
Condition  
Minimum  
Typical  
Maximum  
Units  
Supply Voltage  
VCC  
TEP  
fRF  
4.75  
-40  
5.25  
+105  
2.2  
V
Operating Temperature Range  
RF Frequency Range  
Exposed Paddle  
°C  
Operating Range  
1.7  
GHz  
Maximum Operating Input  
RF Power [a]  
PIN_MAX  
+10  
dBm  
RF Source Impedance  
RF Load Impedance  
ZRFI  
Single Ended  
Single Ended  
50  
50  
Ω
Ω
ZRFO  
[a] Input / output load impedance < 2:1 VSWR any phase based in a 50Ω system.  
4
Rev O May 11, 2018  
Electrical Characteristics  
See the F1421 Typical Application Circuit. Specifications apply when operated at VCC = +5.0V, fRF = 1.9GHz, TEP = +25°C, ZS = ZL = 50, tone  
spacing = 5MHz, POUT = +4dBm/tone, evaluation board (EVKit) traces and connectors are de-embedded, unless otherwise stated.  
Table 4.  
Electrical Characteristics  
Parameter  
Symbol  
Condition  
Minimum  
Typical  
Maximum  
Units  
1.1 [a]  
Logic Input High Threshold  
Logic Input Low Threshold  
Logic Current  
VIH  
VIL  
VCC  
0.8  
10  
V
V
IIL, IIH,  
ICC  
ICC_STBY  
G1.7  
Standby Pin  
µA  
mA  
mA  
-10  
Standby = LOW or open  
Standby = HIGH  
fRF = 1.7GHz  
138  
0.6  
153  
1.2  
Supply Current  
19.6  
20.3  
21.0  
15  
Gain  
G1.9  
fRF = 1.9GHz  
dB  
18.8  
21.8  
G2.2  
fRF = 2.2GHz  
Input Return Loss  
Output Return Loss  
Gain Flatness  
RLIN  
RLOUT  
GFLAT  
dB  
dB  
dB  
15  
fRF = 1.7GHz to 2.2GHz  
1.3  
In any 20MHz range over RF  
Band  
Gain Ripple  
GRIPPLE  
0.06  
dB  
fRF = 1.7GHz  
5.6  
5.5  
5.6  
6.3  
fRF = 1.9GHz  
Noise Figure  
NF  
dB  
fRF = 2.2GHz  
fRF = 1.9GHz, TEP =+105°C  
POUT = +4dBm/tone  
5MHz tone delta  
Output Third Order Intercept Point  
Output 1dB Compression  
OIP3  
40  
23  
dBm  
dBm  
36  
21  
OP1dB  
50% STBY control to within  
0.2dB of the on state final gain  
value  
Power ON Switching Time  
tON  
120  
ns  
ns  
50% STBY control to 30dB  
below on state gain value  
Power OFF Switching Time  
tOFF  
80  
[a] Specifications in the minimum/maximum columns that are shown in bold italics are guaranteed by test. Specifications in  
these columns that are not shown in bold italics are guaranteed by design characterization.  
5
Rev O May 11, 2018  
 
Thermal Characteristics  
Table 5.  
Package Thermal Characteristics  
Parameter  
Symbol  
Value  
Units  
Junction to Ambient Thermal Resistance  
θJA  
45  
°C/W  
Junction to Case Thermal Resistance  
(Case is defined as the exposed paddle)  
θJC-BOT  
36  
°C/W  
Moisture Sensitivity Rating (Per J-STD-020)  
MSL 1  
Typical Operating Conditions (TOC)  
.
.
.
.
.
.
.
.
Vcc = 5.0V  
ZL = ZS = 50Single Ended  
fRF = 1.9GHz  
TEP = 25ºC (All temperatures are referenced to the exposed paddle)  
STBY = LOW (0V)  
POUT = +4dBm/Tone  
5MHz Tone Spacing  
Evaluation Kit traces and connector losses are de-embedded  
6
Rev O May 11, 2018  
Typical Performance Characteristics  
Figure 3. Gain vs Frequency  
Figure 4. Reverse Isolation vs Frequency  
25  
20  
15  
10  
5
-20  
-25  
-30  
-35  
-40  
-45  
-50  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
Frequency (GHz)  
Frequency (GHz)  
Figure 5. Input Return Loss vs Frequency  
Figure 6. Output Return Loss vs Frequency  
0
0
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
-5  
-10  
-15  
-20  
-25  
-30  
-5  
-10  
-15  
-20  
-25  
-30  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
Frequency (GHz)  
Frequency (GHz)  
Figure 7. Gain vs Frequency  
Figure 8. Stability vs Frequency  
23  
22  
21  
20  
19  
18  
17  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
16  
15  
0.5  
0.0  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
2.2  
2.4  
2.6  
2.8  
3.0  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
Frequency (GHz)  
Frequency (GHz)  
7
Rev O May 11, 2018  
Typical Performance Characteristics  
Figure 9.  
Output IP3 versus Frequency  
Figure 10. Output P1dB versus Frequency  
50  
48  
46  
44  
42  
40  
38  
36  
34  
32  
30  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6  
1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6  
Frequency (GHz)  
Frequency (GHz)  
Figure 11. Second Harmonic versus Frequency  
Figure 12. Third Harmonic versus Frequency  
-30  
-30  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
+4.75 V / -40 C  
+5.00 V / -40 C  
+5.25 V / -40 C  
+4.75 V / +25 C  
+5.00 V / +25 C  
+5.25 V / +25 C  
+4.75 V / +105 C  
+5.00 V / +105 C  
+5.25 V / +105 C  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
-85  
-90  
-35  
-40  
-45  
-50  
-55  
-60  
-65  
-70  
-75  
-80  
-85  
-90  
1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6  
1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6  
Frequency (GHz)  
Frequency (GHz)  
Figure 13. Noise Figure versus Frequency  
Figure 14. Standby Switching Speed  
8.0  
7.5  
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
20  
15  
10  
5
STBY OFF to ON  
STBY ON to OFF  
0
-5  
RF Power is calculated by  
20 log (Envelope of RF Voltage).  
Voltage dynamic range limits power  
dynamic range to about 30 dB.  
-10  
-15  
-20  
-25  
-30  
+4.75 V / -45 C  
+5.00 V / -45 C  
+5.25 V / -45 C  
+4.75 V / +20 C  
+5.00 V / +20 C  
+5.25 V / +20 C  
+4.75 V / +100 C  
+5.00 V / +100 C  
+5.25 V / +100 C  
1.0  
0.5  
0.0  
0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2  
-20  
0
20  
40  
60  
80  
100 120 140 160 180  
Frequency (GHz)  
Time (ns)  
8
Rev O May 11, 2018  
Evaluation Kit Picture  
Note: The evaluation board is used for multiple devices.  
Figure 15. Top View  
Figure 16. Bottom View  
9
Rev O May 11, 2018  
Evaluation Kit / Applications Circuit  
Figure 17. Electrical Schematic  
10  
Rev O May 11, 2018  
Table 6.  
Bill of Material (BOM)  
Part Reference  
QTY  
Description  
Manufacturer Part #  
Manufacturer  
C1  
C4  
C7  
C8  
C9  
2
2
1
1
1
1
1
1
1
3
1
1
3
1
1
2.2pF ±0.1, 50V, C0G Ceramic Capacitor (0402)  
4.0pF ±0.1, 50V, C0G Ceramic Capacitor (0402)  
2pF ±0.1pF, 50V, C0G Ceramic Capacitor (0402)  
1000pF ±5%, 50V, C0G Ceramic Capacitor (0402)  
0.1µF ±10%, 16V, X7R Ceramic Capacitor (0402)  
10µF ±20%, 16V, X6S Ceramic Capacitor (0603)  
1.87kΩ ±1%, 1/10W, Resistor (0402)  
5.11kΩ ±1%, 1/10W, Resistor (0402)  
1kΩ ±1%, 1/10W, Resistor (0402)  
GRM1555C1H2N20J  
GRM1555C1H470J  
GRM1555C1H2R0B  
GRM1555C1H102J  
GRM155R71C104K  
GRM188C81C106M  
ERJ-2RKF2001X  
ERJ-2RKF3401X  
ERJ-2RKF1001X  
ERJ-2GE0R00X  
961102-6404-AR  
961103-6404-AR  
142-0701-851  
Murata  
Murata  
Murata  
Murata  
Murata  
C10  
Murata  
R1  
Panasonic  
Panasonic  
Panasonic  
Panasonic  
3M  
R2  
R3  
C3, C6, R4  
J4  
0Ω Resistors (0402)  
CONN HEADER VERT SGL 2 X 1 POS GOLD  
CONN HEADER VERT SGL 3 X 1 POS GOLD  
Edge Launch SMA (0.375 inch pitch ground, tab)  
AMP  
J5  
3M  
J1, J2, J3  
U1  
Emerson Johnson  
IDT  
F1421NLGK  
Printed Circuit Board  
F1420 EVKit REV 1  
IDT  
C2, C5  
DNP  
11  
Rev O May 11, 2018  
Evaluation Kit Operation  
Power Supply Setup  
Set up a power supply in the voltage range of 3.0V to 5.25V with the power supply output disabled. The voltage can be applied via one of the  
following connections (see Figure 18):  
.
.
J3 connector  
J4 header connection (GND is the pin farthest away from the J4 label)  
Figure 18. Power Supply Connections  
Standby (STBY) Pin  
The Evaluation Board has the ability to control the F1421 for standby operation. The logic voltage is applied to the J5 header connection as  
shown in Figure 19.  
To place the amplifier in the active mode (on) use one of these options:  
.
.
.
Make no connections on J5  
Apply a logic LOW signal to STBY (pin 2 of J5 or the middle pin).  
Make a connection between pin 3 (GND) and pin 2 (STBY, the middle pin) of J5.  
To place the amplifier in the standby mode (off), use one of these options:  
.
.
Apply a logic HIGH signal to the STBY (pin 2 of J5 or the middle pin).  
Make a connection between pin 1 (VCC) and pin 2 (STBY, the middle pin) of J5.  
Figure 19. Standby Pin Connection  
12  
Rev O May 11, 2018  
 
 
Power-On Procedure  
Set up the voltage supplies and Evaluation Board as described in the "Power Supply Setup" section with the "Standby Pin” set for logic LOW.  
.
.
Enable the power supply.  
The STBY pin now can now be exercised.  
Power-Off Procedure  
.
Set the STBY pin to logic LOW.  
.
Disable the power supply.  
Application Information  
The F1421 has been optimized for use in high-performance RF applications from 1.7GHz to 2.2GHz.  
Standby Mode (STBY)  
The F1421 has a standby pin which allows the amplifier to be turned off to decrease overall power requirements. The pin uses simple logic  
levels and is compatible with both JEDEC 1.8V and JEDEC 3.3V logic. Table 7 lists the amplifier state for the logic. An internal pull-down resistor  
causes the amplifier to default to the on state.  
Table 7.  
Standby Truth Table  
STBY (pin 8)  
Condition  
LOW or Open  
HIGH  
Amplifier On  
Amplifier Off  
RSET and RDSET  
The F1421 has been optimized for gain and intermodulation products by adjusting the bias resistors RSET and RDSET. For the optimized  
setting, RSET (R1) is 1.87and RDSET (R2) is 5.11kΩ.  
Power Supplies  
The power supply pin should be bypassed with external capacitors to minimize noise and fast transients. Supply noise can degrade the noise  
figure, and fast transients can trigger ESD clamps and cause them to fail. Supply voltage changes or transients should have a slew rate less  
than 1V/20µs.  
13  
Rev O May 11, 2018  
 
Control Pin Interface  
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit  
at the input of each control pin is recommended. This applies to control pin 8 (STBY). Note the recommended resistor and capacitor values do  
not necessarily match the EVKit BOM for the case of poor control signal integrity.  
Figure 20. Control Pin Interface for Signal Integrity  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
EPAD  
Control Circuit  
4.7 kohm  
STBY  
2pF  
Digital Pin Voltage and Resistance Values  
Table 8 provides the open-circuit DC voltage referenced to ground and resistance value for the control pin listed.  
Table 8.  
Digital Pin Voltages and Resistance  
Open Circuit  
DC Voltage  
Pin  
Name  
Internal Connection  
8
STBY  
0V  
580kΩ resistor to ground  
14  
Rev O May 11, 2018  
 
Package Drawings  
The package outline drawings are appended at the end of this document and are accessible from the link below. The package information is  
the most current data available.  
https://www.idt.com/document/psc/nlnlg24p1-package-outline-40-x-40-mm-body-05-mm-pitch-qfn-epad-size-245-x-245-mm  
Ordering Information  
Orderable Part Number  
Package  
MSL Rating  
Carrier Type  
Temperature  
F1421NLGK  
F1421NLGK8  
F1421EVBI  
4mm x 4mm x 0.9mm 24-pin QFN  
4mm x 4mm x 0.9mm 24-pin QFN  
Evaluation Board  
1
1
Tray  
Reel  
-40° to +105°C  
-40° to +105°C  
Marking Diagram  
Line 1 and 2 are the part number.  
Line 3 “ZA” is for die version.  
IDTF14  
21NLGK  
ZA721FTG  
Line 3 “721” is one digit for the year and week that the part was assembled.  
Line 3 “FTG” denotes the production process.  
15  
Rev O May 11, 2018  
Revision History  
Revision  
Revision Date  
Description of Change  
O
May 11, 2018  
Initial Release.  
IMPORTANT NOTICE AND DISCLAIMER  
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL  
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING  
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