HCTS30K/SAMPLE [RENESAS]
HCT SERIES, 8-INPUT NAND GATE, CDFP14;
| 型号： | HCTS30K/SAMPLE |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | HCT SERIES, 8-INPUT NAND GATE, CDFP14 CD 输入元件 逻辑集成电路 |
| 文件： | 总9页 (文件大小：236K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
HCTS30MS
Radiation Hardened
8-Input NAND Gate
August 1995
Features
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T14
TOP VIEW
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
2
• SEP Effective LET No Upsets: >100 MEV-cm /mg
-9
A
B
1
2
3
4
5
6
7
14 VCC
13 NC
• Single Event Upset (SEU) Immunity < 2 x 10 Errors/
Bit-Day (Typ)
12
• Dose Rate Survivability: >1 x 10 RAD (Si)/s
C
12 H
10
• Dose Rate Upset >10 RAD (Si)/s 20ns Pulse
D
11 G
E
10 NC
• Latch-Up Free Under Any Conditions
o
o
F
9
8
NC
Y
• Military Temperature Range: -55 C to +125 C
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
GND
• LSTTL Input Compatibility
- VIL = 0.8V Max
14 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP3-F14
TOP VIEW
- VIH = VCC/2 Min
• Input Current Levels Ii ≤ 5µA at VOL, VOH
A
B
1
2
3
4
5
6
7
14
13
12
VCC
NC
H
Description
C
The Intersil HCTS30MS is a Radiation Hardened 8-Input
NAND Gate. A high on all input forces the output to a low
state.
D
11
10
G
E
NC
NC
Y
F
9
8
The HCTS30MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
GND
Ordering Information
PART NUMBER
HCTS30DMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
PACKAGE
14 Lead SBDIP
HCTS30KMSR
14 Lead Ceramic Flatpack
14 Lead SBDIP
HCTS30D/Sample
HCTS30K/Sample
HCTS30HMSR
+25oC
Sample
14 Lead Ceramic Flatpack
Die
+25oC
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Spec Number 518639
FN3056.1
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
440
HCTS30MS
Functional Diagram
A
B
C
D
Y
E
F
G
H
TRUTH TABLE
INPUTS
OUTPUTS
A
L
B
X
L
C
X
X
L
D
X
X
X
L
E
X
X
X
X
L
F
X
X
X
X
X
L
G
X
X
X
X
X
X
L
H
X
X
X
X
X
X
X
L
Y
H
H
H
H
H
H
H
H
L
X
X
X
X
X
X
X
H
X
X
X
X
X
X
H
X
X
X
X
X
H
X
X
X
X
H
X
X
X
H
X
X
H
X
H
H
NOTE: L = Logic Level Low, H = Logic level High, X = Don’t Care
Spec Number 518639
441
Specifications HCTS30MS
Absolute Maximum Ratings
Reliability Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG). . . . . . . . . . . -65oC to +150oC
Lead Temperature (Soldering 10sec). . . . . . . . . . . . . . . . . . +265oC
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance
θJA
θJC
SBDIP Package. . . . . . . . . . . . . . . . . . . .
74oC/W
24oC/W
30oC/W
Ceramic Flatpack Package . . . . . . . . . . . 116oC/W
Maximum Package Power Dissipation at +125oC Ambient
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.43W
If device power exceeds package dissipation capability, provide
heat sinking or derate linearly at the following rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.5mW/oC
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.6mW/oC
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation..
Operating Conditions
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at 4.5V VCC (tr, tf) . . . . . . . 100ns/V Max
Operating Temperature Range (TA). . . . . . . . . . . . -55oC to +125oC
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
GROUP
A SUB-
LIMITS
(NOTE 1)
PARAMETER
SYMBOL
CONDITIONS
GROUPS
TEMPERATURE
+25oC
MIN
MAX
UNITS
µA
Quiescent Current
ICC
VCC = 5.5V,
VIN = VCC or GND
1
2, 3
1
-
-
10
+125oC, -55oC
+25oC
200
µA
Output Current
(Sink)
IOL
IOH
VOL
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
4.8
4.0
-4.8
-4.0
-
-
-
mA
mA
mA
mA
V
2, 3
1
+125oC, -55oC
+25oC
Output Current
(Source)
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
-
2, 3
1, 2, 3
+125oC, -55oC
+25oC, +125oC, -55oC
-
Output Voltage Low
VCC = 4.5V, VIH = 2.25V,
0.1
IOL = 50µA, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOL = 50µA, VIL = 0.8V
1, 2, 3
1, 2, 3
1, 2, 3
+25oC, +125oC, -55oC
+25oC, +125oC, -55oC
+25oC, +125oC, -55oC
-
0.1
V
V
V
Output Voltage High
VOH
VCC = 4.5V, VIH = 2.25V,
IOH = -50µA, VIL = 0.8V
VCC
-0.1
-
-
VCC = 5.5V, VIH = 2.75V,
IOH = -50µA, VIL = 0.8V
VCC
-0.1
Input Leakage
Current
IIN
FN
VCC = 5.5V, VIN = VCC or
GND
1
+25oC
-
-
-
±0.5
±5.0
-
µA
µA
-
2, 3
+125oC, -55oC
Noise Immunity
Functional Test
VCC = 4.5V, VIH = 2.25V,
VIL = 0.8V (Note 2)
7, 8A, 8B
+25oC, +125oC, -55oC
NOTES:
1. All voltages reference to device GND.
2. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
Spec Number 518639
442
Specifications HCTS30MS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
GROUP
LIMITS
(NOTES 1, 2)
A SUB-
PARAMETER
SYMBOL
CONDITIONS
GROUPS
TEMPERATURE
+25oC
MIN
MAX
22
UNITS
ns
Input to Output
TPHL
VCC = 4.5V
9
2
2
2
2
10, 11
9
+125oC, -55oC
+25oC
23
ns
TPLH
VCC = 4.5V
22
ns
10, 11
+125oC, -55oC
25
ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V.
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER
SYMBOL
CONDITIONS
NOTES
TEMPERATURE
+25oC
MIN
MAX
105
225
10
UNITS
pF
Capacitance Power
Dissipation
CPD
VCC = 5.0V, f = 1MHz
1
1
1
1
1
1
-
-
-
-
-
-
+125oC, -55oC
+25oC
pF
Input Capacitance
CIN
VCC = 5.0V, f = 1MHz
VCC = 4.5V
pF
+125oC
10
pF
Output Transition
Time
TTHL
TTLH
+25oC
15
ns
+125oC
22
ns
NOTE:
1. The parameters listed in Table 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly
tested. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
200K RAD
LIMITS
(NOTES 1, 2)
PARAMETER
Quiescent Current
Output Current (Sink)
SYMBOL
ICC
CONDITIONS
TEMPERATURE
+25oC
MIN
-
MAX
0.2
-
UNITS
mA
VCC = 5.5V, VIN = VCC or GND
IOL
VCC = 4.5V, VIN = VCC or GND,
VOUT = 0.4V
+25oC
4.0
mA
Output Current
(Source)
IOH
VOL
VOH
IIN
VCC = 4.5V, VIN = VCC or GND,
VOUT = VCC -0.4V
+25oC
+25oC
+25oC
+25oC
-4.0
-
-
0.1
-
mA
V
Output Voltage Low
Output Voltage High
Input Leakage Current
VCC = 4.5V and 5.5V,
VIH = VCC/2, VIL = 0.8V, IOL = 50µA
VCC = 4.5V and 5.5V,
VIH = VCC/2, VIL = 0.8V, IOH = -50µA
VCC
-0.1
V
VCC = 5.5V, VIN = VCC or GND
-
±5
µA
Spec Number 518639
443
Specifications HCTS30MS
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued)
200K RAD
LIMITS
(NOTES 1, 2)
PARAMETER
SYMBOL
CONDITIONS
TEMPERATURE
MIN
MAX
UNITS
Noise Immunity
Functional Test
FN
VCC = 4.5V, VIH = 2.25V, VIL = 0.8V,
(Note 3)
+25oC
-
-
-
Input to Output
TPHL
TPLH
VCC = 4.5V
VCC = 4.5V
+25oC
+25oC
2
2
23
25
ns
ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = 3V.
3. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC)
GROUP B
PARAMETER
SUBGROUP
DELTA LIMIT
ICC
5
5
3µA
IOL/IOH
-15% of 0 Hour
TABLE 6. APPLICABLE SUBGROUPS
GROUP A SUBGROUPS
CONFORMANCE GROUPS
METHOD
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
100%/5004
Sample/5005
Sample/5005
Sample/5005
Sample/5005
READ AND RECORD
ICC, IOL/H
Initial Test (Preburn-In)
1, 7, 9
1, 7, 9
Interim Test I (Postburn-In)
Interim Test II (Postburn-In)
PDA
ICC, IOL/H
ICC, IOL/H
1, 7, 9
1, 7, 9, Deltas
1, 7, 9
Interim Test III (Postburn-In)
PDA
ICC, IOL/H
1, 7, 9, Deltas
2, 3, 8A, 8B, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11
1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas
1, 7, 9
Final Test
Group A (Note 1)
Group B
Subgroup B-5
Subgroup B-6
Subgroups 1, 2, 3, 9, 10, 11
Group D
NOTE:
1, 7, 9
1. Alternate group A inspection in accordance with Method 5005 of MIL-STD-883 may be exercised.
Spec Number 518639
444
Specifications HCTS30MS
TABLE 7. TOTAL DOSE IRRADIATION
TEST
READ AND RECORD
CONFORMANCE
GROUPS
METHOD
PRE RAD
POST RAD
PRE RAD
1, 9
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
Table 4 (Note 1)
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS
OSCILLATOR
OPEN
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
8, 9, 10, 13 1 - 5, 6, 7, 11, 12
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
8, 9, 10, 13
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
9, 10, 13
NOTES:
GROUND
1/2 VCC = 3V ± 0.5V
VCC = 6V ± 0.5V
50kHz
25kHz
-
14
1 - 5, 6, 11, 12, 14
14
-
-
-
-
7
-
-
7
8
1 - 5, 6, 11, 12
1. Each pin except VCC and GND will have a resistor of 10KΩ ± 5% for static burn-in
2. Each pin except VCC and GND will have a resistor of 1KΩ ± 5% for dynamic burn-in
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V ± 0.5V
1, 2, 3, 4, 5, 6, 11, 12, 14
8, 9, 10, 13
7
NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number 518639
445
HCTS30MS
Intersil Space Level Product Flow - ‘MS’
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Static Burn-In 2, Condition A or B, 24 hrs. min.,
o
+125 C min., Method 1015
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 1, Method 5004 (Notes 1and 2)
o
100% Dynamic Burn-In, Condition D, 240 hrs., +125 C or
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
Equivalent, Method 1015
100% Interim Electrical Test 3 (T3)
100% Delta Calculation (T0-T3)
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% PIND, Method 2020, Condition A
100% External Visual
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
100% Data Package Generation (Note 5)
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 24 hrs. min.,
o
+125 C min., Method 1015
NOTES:
1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.
2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number
446
HCTS30MS
AC Load Circuit
AC Timing Diagrams
DUT
TEST
POINT
VIH
INPUT
VS
CL
RL
VIL
TPLH
TPHL
VOH
VOL
VOH
VOL
CL = 50pF
VS
OUTPUT
RL = 500Ω
TTLH
TTHL
80%
80%
20%
20%
OUTPUT
AC VOLTAGE LEVELS
PARAMETER
VCC
HCTS
4.50
3.00
1.30
0
UNITS
V
V
V
V
V
VIH
VS
VIL
GND
0
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Spec Number 518639
447
HCTS30MS
Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO
2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
5
2
<2.0 x 10 A/cm
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS30MS
A
(1)
VCC
(14)
NC
(13)
B (2)
(12) H
(11) G
C (3)
(10) NC
D (4)
E (5)
(9) NC
(6)
F
(7)
GND
(8)
Y
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS30 is TA14428A.
Spec Number 518639
448
相关型号：
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