HD74HC573 [RENESAS]
Octal Transparent Latches (with 3-state outputs); 八路透明锁存器(带3态输出)![HD74HC573](http://pdffile.icpdf.com/pdf1/p00157/img/icpdf/HD74H_872455_icpdf.jpg)
型号: | HD74HC573 |
厂家: | ![]() |
描述: | Octal Transparent Latches (with 3-state outputs) |
文件: | 总11页 (文件大小:138K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
HD74HC563, HD74HC573
Octal Transparent Latches (with 3-state outputs)
REJ03D0629-0200
(Previous ADE-205-509)
Rev.2.00
Mar 30, 2006
Description
When the latch enable (LE) input is high, the Q outputs of HD74HC563 will follow the inversion of the D inputs and
the Q outputs of HD74HC573 will follow the D inputs. When the latch enable goes low, data at the D inputs will be
retained at the outputs until latch enable returns high again. When a high logic level is applied to the output control
input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of
the storage elements.
Features
•
•
•
•
•
•
High Speed Operation: tpd (Data to Q, Q) = 11 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Ordering Information
Package Code
(Previous Code)
Package
Abbreviation
Taping Abbreviation
(Quantity)
Part Name
Package Type
DILP-20 pin
HD74HC563P
PRDP0020AC-B
(DP-20NEV)
P
—
HD74HC573P
HD74HC563FPEL
HD74HC573FPEL
HD74HC563RPEL
HD74HC573RPEL
PRSP0020DD-B
(FP-20DAV)
SOP-20 pin (JEITA)
SOP-20 pin (JEDEC)
TSSOP-20 pin
FP
RP
T
EL (2,000 pcs/reel)
EL (1,000 pcs/reel)
ELL (2,000 pcs/reel)
PRSP0020DC-A
(FP-20DBV)
PTSP0020JB-A
(TTP-20DAV)
HD74HC573TELL
Note: Please consult the sales office for the above package availability.
Function Table
Inputs
Outputs
Output Control
Latch Enable
Data
H
HD74HC563
HD74HC573
L
L
H
H
L
L
H
H
L
L
L
X
Q0
Z
Q0
Z
H
X
X
Q0 : level of Q before the indicated Steady-sate input conditions were established.
Q0 : complement of Q0 or level of Q before the indicated Steady-state input conditions were established.
Rev.2.00 Mar 30, 2006 page 1 of 10
HD74HC563, HD74HC573
Pin Arrangement
HD74HC563
Output
Control
1
2
20 VCC
19 1Q
18 2Q
17 3Q
16 4Q
OE
D
1D
Q
Q
Q
Q
OE
D
2D 3
Q
Q
Q
Q
OE
D
3D
4D
5D
4
5
6
OE
D
OE
D
15
5Q
OE
D
6D 7
7D 8
8D 9
14 6Q
13 7Q
12 8Q
OE
D
OE
D
Latch
Enable
10
11
GND
(Top view)
HD74HC573
Output
Control
1
2
20 VCC
19 1Q
18 2Q
17 3Q
16 4Q
OE
D
1D
Q
Q
Q
Q
OE
D
2D 3
Q
Q
Q
Q
OE
D
3D
4D
5D
4
5
6
OE
D
OE
D
15
5Q
OE
D
6D 7
7D 8
8D 9
14 6Q
13 7Q
12 8Q
OE
D
OE
D
Latch
Enable
10
11
GND
(Top view)
Rev.2.00 Mar 30, 2006 page 2 of 10
HD74HC563, HD74HC573
Logic Diagram
HD74HC563
D
C
C
1D
Q
Q
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
D
C
C
2D
3D
D
C
C
Q
Q
Q
Q
Q
Q
D
C
C
4D
5D
D
C
C
D
C
C
6D
7D
8D
D
C
C
D
C
C
LE
OC
Rev.2.00 Mar 30, 2006 page 3 of 10
HD74HC563, HD74HC573
HD74HC573
D
C
C
1D
Q
Q
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
D
C
C
2D
3D
D
C
C
Q
Q
Q
Q
Q
Q
D
C
C
4D
5D
D
C
C
D
C
C
6D
7D
8D
D
C
C
D
C
C
LE
OC
Rev.2.00 Mar 30, 2006 page 4 of 10
HD74HC563, HD74HC573
Absolute Maximum Ratings
Item
Supply voltage range
Input / Output voltage
Input / Output diode current
Output current
Symbol
VCC
Ratings
–0.5 to 7.0
–0.5 to VCC +0.5
±20
Unit
V
VIN, VOUT
IIK, IOK
IO
V
mA
mA
mA
mW
°C
±35
VCC, GND current
ICC or IGND
PT
±75
Power dissipation
500
Storage temperature
Tstg
–65 to +150
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Supply voltage
Symbol
VCC
Ratings
2 to 6
Unit
V
Conditions
Input / Output voltage
Operating temperature
VIN, VOUT
Ta
0 to VCC
–40 to 85
0 to 1000
0 to 500
0 to 400
V
°C
VCC = 2.0 V
VCC = 4.5 V
Input rise / fall time*1
tr, tf
ns
VCC = 6.0 V
Note: 1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Ta = 25°C
Typ
—
Ta = –40 to+85°C
Item
Symbol VCC (V)
VIH
Unit
Test Conditions
Min
1.5
3.15
4.2
—
Max
—
Min
1.5
3.15
4.2
—
Max
—
Input voltage
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
6.0
V
—
—
—
—
—
—
VIL
—
0.5
1.35
1.8
—
0.5
1.35
1.8
—
V
V
—
—
—
—
—
—
Output voltage
VOH
1.9
4.4
5.9
4.18
5.68
—
2.0
4.5
6.0
—
1.9
4.4
5.9
4.13
5.63
—
Vin = VIH or VIL IOH = –20 µA
—
—
—
—
—
—
IOH = –6 mA
IOH = –7.8 mA
—
—
—
VOL
0.0
0.0
0.0
—
0.1
0.1
0.1
0.26
0.26
±0.5
0.1
0.1
0.1
0.33
0.33
±5.0
V
Vin = VIH or VIL IOL = 20 µA
—
—
—
—
—
—
IOL = 6 mA
—
—
—
IOL = 7.8 mA
Off-state output
current
IOZ
—
—
—
µA Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
6.0
6.0
—
—
—
—
±0.1
—
—
±1.0
µA Vin = VCC or GND
Quiescent supply
current
ICC
4.0
40
µA Vin = VCC or GND, Iout = 0 µA
Rev.2.00 Mar 30, 2006 page 5 of 10
HD74HC563, HD74HC573
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Typ Max
Ta = –40 to +85°C
Item
Propagation delay
time
Symbol VCC (V)
tPLH
tPHL
Unit
Test Conditions
Min
—
—
—
—
—
—
—
—
—
—
—
—
75
15
13
5
Min
—
—
—
—
—
—
—
—
—
—
—
—
90
19
16
5
Max
140
28
24
145
29
25
190
38
33
190
38
33
—
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
—
—
11
—
—
13
—
—
14
—
—
15
—
—
2
110
22
19
115
23
20
150
30
26
150
30
26
—
ns Data to Q
tPLH
tPHL
ns Clock to Q
Output enable
time
tZH
tZL
ns
ns
ns
ns
ns
ns
pF
Output disable
time
tHZ
tLZ
Setup time
Hold time
tsu
—
—
—
—
–1
—
—
4
—
—
th
—
—
5
—
5
—
5
—
5
—
Pulse width
tw
80
16
14
—
—
—
—
—
100
20
17
—
—
—
—
—
—
—
—
—
4
—
—
Output rise/fall
time
tTLH
tTHL
60
12
10
10
75
15
13
10
—
5
Input capacitance
Cin
Test Circuit
VCC
VCC
Output
1 kΩ
OC
OPEN
1Q to 8Q
or
Input
Input
S1
GND
VCC
1Q to 8Q
CL =
50 pF
Pulse Generator
Zout
Ω
= 50
1D to 8D
LE
TEST
S1
OPEN
GND
VCC
Pulse Generator
Zout
tPLH/ tPHL
tZH/ tHZ
tZL / tLZ
Ω
= 50
Note : 1. CL includes probe and jig capacitance.
Rev.2.00 Mar 30, 2006 page 6 of 10
HD74HC563, HD74HC573
Waveforms
•
Waveform – 1
Input D
tr
tf
VCC
0 V
90 %
50 %
90 %
50 %
10 %
10 %
tPLH
tPHL
VOH
90 %
90 %
50 %
10 %
50 %
10 %
Output Q
VOL
tTLH
tTHL
tPLH
tPHL
VOH
90 %
90 %
50 %
10 %
50 %
10 %
Output Q
VOL
tTLH
tTHL
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
•
Waveform – 2
Input D
tr
tf
VCC
90 %
50 %
90 %
50 %
50 %
10 %
10 %
tW
0 V
tsu
th
tW
tsu
th
tf
tr
VCC
0 V
VOH
VOL
90 %
Input LE
50 % 50 %
50 %
50 %
10 %
10 %
tW
tW
tPLH
tPHL
90 %
50 %
90 %
50 %
Output Q
10 %
10 %
tTHL
tPLH
tTLH
tPHL
VOH
90 %
90 %
Output Q
50 %
10 %
50 %
10 %
VOL
tTLH
tTHL
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
Rev.2.00 Mar 30, 2006 page 7 of 10
HD74HC563, HD74HC573
•
Waveform – 3
Input OC
tf
tr
VCC
90 %
50 %
10 %
90 %
50 %
10 %
0 V
tZL
tLZ
VOH
50 %
tZH
Waveform - A
Waveform - B
10 %
90 %
VOL
VOH
tHZ
50 %
VOL
Notes : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
2. Waveform - A is for an output with internal conditions such that the
output is low except when disabled by the output control.
3. Waveform - B is for an output with internal conditions such that the
output is high except when disabled by the output control.
4. The output are measured one at a time with one transition per measurement.
Rev.2.00 Mar 30, 2006 page 8 of 10
HD74HC563, HD74HC573
Package Dimensions
JEITA Package Code
P-DIP20-6.3x24.5-2.54
RENESAS Code
Previous Code
DP-20NEV
MASS[Typ.]
1.26g
PRDP0020AC-B
D
20
11
1
10
b 3
0.89
Z
Dimension in Millimeters
Min Nom Max
7.62
Reference
Symbol
e1
D
E
A
A1
bp
b3
c
24.50 25.40
6.30 7.00
5.08
bp
e
c
0.51
e1
0.40 0.48 0.56
1.30
0.19 0.25 0.31
( Ni/Pd/Au plating )
θ
0° 15°
2.29 2.54 2.79
e
Z
1.27
2.54
L
JEITA Package Code
RENESAS Code
PRSP0020DD-B
Previous Code
FP-20DAV
MASS[Typ.]
0.31g
P-SOP20-5.5x12.6-1.27
*1
D
F
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
20
11
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
10
x
Dimension in Millimeters
Reference
Symbol
*3
e
bp
Z
M
Min Nom Max
D
L1
12.60 13.0
5.50
E
A2
A1
A
bp
b1
c
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
y
L
c1
θ
0° 8°
7.50 7.80 8.00
Detail F
HE
e
x
1.27
0.12
0.15
y
Z
L
L1
0.80
0.50 0.70 0.90
1.15
Rev.2.00 Mar 30, 2006 page 9 of 10
HD74HC563, HD74HC573
JEITA Package Code
RENESAS Code
Previous Code
FP-20DBV
MASS[Typ.]
0.52g
P-SOP20-7.5x12.8-1.27
PRSP0020DC-A
*1
D
F
NOTE)
20
11
1. DIMENSIONS"*1 (Nom)"AND"*2"
@ DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
@ INCLUDE TRIM OFFSET.
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Reference
Symbol
Min Nom Max
1
10
x
D
E
12.80 13.2
7.50
*3
e
bp
Z
M
L1
A2
A1
A
bp
b1
c
0.10 0.20 0.30
2.65
0.34 0.40 0.46
0.20 0.25 0.30
c1
θ
0° 8°
10.00 10.40 10.65
L
y
HE
e
x
1.27
0.12
0.15
Detail F
y
Z
L
L1
0.935
0.40 0.70 1.27
1.45
JEITA Package Code
RENESAS Code
PTSP0020JB-A
Previous Code
TTP-20DAV
MASS[Typ.]
0.07g
P-TSSOP20-4.4x6.5-0.65
*1
D
F
NOTE)
20
11
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
b p
Terminal cross section
( Ni/Pd/Au plating )
Index mark
Dimension in Millimeters
Reference
Symbol
Min Nom Max
1
10
D
E
6.50 6.80
4.40
*3
L 1
e
bp
Z
x
M
A2
A1
A
bp
b1
c
0.03 0.07 0.10
1.10
0.15 0.20 0.25
0.10 0.15 0.20
L
c1
θ
y
0° 8°
6.20 6.40 6.60
Detail F
HE
e
x
0.65
0.13
0.10
y
Z
L
L1
0.65
0.4 0.5 0.6
1.0
Rev.2.00 Mar 30, 2006 page 10 of 10
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0
相关型号:
![](http://pdffile.icpdf.com/pdf1/p00157/img/page/HD74H_872455_files/HD74H_872455_1.jpg)
![](http://pdffile.icpdf.com/pdf1/p00157/img/page/HD74H_872455_files/HD74H_872455_2.jpg)
HD74HC573P-E
HC/UH SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, 6.30 X 24.50 MM, 2.54 MM PITCH, PLASTIC, DIP-20
RENESAS
©2020 ICPDF网 联系我们和版权申明