HM62256BLTM-8SL [RENESAS]

IC,SRAM,32KX8,CMOS,TSSOP,28PIN,PLASTIC;
HM62256BLTM-8SL
型号: HM62256BLTM-8SL
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

IC,SRAM,32KX8,CMOS,TSSOP,28PIN,PLASTIC

静态存储器 光电二极管 内存集成电路
文件: 总11页 (文件大小:70K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HM62256B Series  
32,768-word × 8-bit High Speed CMOS Static RAM  
The Hitachi HM62256B is a CMOS static RAM  
Ordering Information  
organized 32-kword × 8-bit. It realizes higher  
performance and low power consumption by  
employing 0.8 µm Hi-CMOS process technology.  
The device, packaged in 8 × 14 mm TSOP, 8 × 13.4  
mm TSOP with thickness of 1.2 mm, 450-mil SOP  
(foot print pitch width), 600-mil plastic DIP, or  
300-mil plastic DIP, is available for high density  
mounting. It offers low power standby power  
dissipation; therefore, it is suitable for battery back-  
up systems.  
Type No.  
Access time Package  
————————————————————–  
HM62256BLP-7  
HM62256BLP-8  
HM62256BLP-10  
HM62256BLP-12  
70 ns  
600-mil  
85 ns  
28-pin  
100 ns  
120 ns  
plastic DIP  
(DP-28)  
—————————————  
HM62256BLP-7SL  
HM62256BLP-8SL  
HM62256BLP-10SL  
HM62256BLP-12SL  
70 ns  
85 ns  
100 ns  
120 ns  
————————————————————–  
HM62256BLSP-7  
HM62256BLSP-8  
HM62256BLSP-10  
HM62256BLSP-12  
70 ns  
300-mil  
85 ns  
28-pin  
100 ns  
120 ns  
plastic DIP  
(DP-28NA)  
Features  
—————————————  
HM62256BLSP-7SL  
HM62256BLSP-8SL  
HM62256BLSP-10SL 100 ns  
HM62256BLSP-12SL 120 ns  
————————————————————–  
HM62256BLFP-7T  
HM62256BLFP-8T  
HM62256BLFP-10T  
HM62256BLFP-12T  
—————————————  
HM62256BLFP-7SLT 70 ns  
HM62256BLFP-8SLT 85 ns  
HM62256BLFP-10SLT 100 ns  
HM62256BLFP-12SLT 120 ns  
70 ns  
85 ns  
• High speed  
Fast access time: 70/85/100/120 ns (max)  
• Low power  
Standby: 1.5 µW (typ)  
Operation: 25 mW (typ) (f = 1 MHz)  
• Single 5 V supply  
• Completely static memory  
No clock or timing strobe required  
• Equal access and cycle times  
• Common data input and output  
Three state output  
• Directly TTL compatible  
All inputs and outputs  
• Capability of battery back up operation  
70 ns  
85 ns  
100 ns  
120 ns  
450-mil  
28-pin  
plastic SOP  
(FP-28DA)  
————————————————————–  
HM62256BLT-8  
HM62256BLT-10  
HM62256BLT-12  
85 ns  
100 ns  
120 ns  
8 mm × 14 mm  
32-pin TSOP  
(TFP-32DA)  
—————————————  
HM62256BLT-7SL  
70 ns  
HM62256BLT-8SL  
85 ns  
————————————————————–  
HM62256BLTM-8  
—————————————  
HM62256BLTM-7SL  
85 ns  
8 mm × 13.4 mm  
28-pin TSOP  
(TFP-28DA)  
70 ns  
HM62256BLTM-8SL  
85 ns  
————————————————————  
1
HM62256B Series  
HM62256B Series  
Pin Arrangement  
HM62256BLP/BLFP/BLSP Series  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
WE  
A13  
A8  
A14  
A12  
A7  
2
3
4
A6  
5
A9  
A5  
6
A11  
OE  
A10  
CS  
A4  
7
A3  
8
A2  
9
A1  
10  
11  
12  
13  
14  
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
A0  
I/O0  
I/O1  
I/O2  
VSS  
(Top View)  
HM62256BLT Series  
OE  
A10  
CS  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
A11  
NC  
A9  
NC  
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
VSS  
I/O2  
I/O1  
I/O0  
A0  
A8  
A13  
WE  
VCC  
A14  
A12  
A7  
A6  
A5  
NC  
A4  
NC  
A1  
A3  
A2  
(Top View)  
HM62256BLTM Series  
A10  
CS  
OE  
A11  
A9  
22  
23  
24  
25  
26  
27  
28  
1
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
I/O7  
I/O6  
I/O5  
I/O4  
I/O3  
A8  
A13  
WE  
V
CC  
V
A14  
A12  
A7  
SS  
I/O2  
I/O1  
I/O0  
A0  
2
3
A6  
4
A5  
5
A1  
A2  
A4  
6
A3  
7
8
(Top View)  
2
HM62256B Series  
HM62256B Series  
Pin Description  
Symbol  
Function  
Symbol  
Function  
————————————————————  
————————————————————  
OE  
Output enable  
————————————————————  
A0 – A14  
Address  
————————————————————  
NC  
No connection  
I/O0 – I/O7  
Input/output  
————————————————————  
————————————————————  
V
Power supply  
CS  
Chip select  
CC  
————————————————————  
————————————————————  
V
Ground  
WE  
Write enable  
SS  
————————————————————  
————————————————————  
Block Diagram  
V CC  
V SS  
A12  
A5  
A7  
Memory Matrix  
A6  
Row  
Decoder  
×
512 512  
A8  
A13  
A14  
A4  
A3  
I/O0  
Column I/O  
Input  
Data  
Control  
Column Decoder  
I/O7  
A1 A0 A10 A9 A11  
A2  
Timing Pulse Generator  
Read/Write Control  
CS  
WE  
OE  
3
HM62256B Series  
HM62256B Series  
Function Table  
WE  
CS  
OE  
Mode  
V
current  
I/O pin  
Ref. cycle  
CC  
———————————————————————————————————————————  
X
H
X
Not selected  
I
, I  
High-Z  
SB SB1  
———————————————————————————————————————————  
H
L
H
Output disable  
I
High-Z  
CC  
———————————————————————————————————————————  
H
L
L
Read  
I
Dout  
Read cycle (1)–(3)  
CC  
———————————————————————————————————————————  
L
L
H
Write  
I
Din  
Write cycle (1)  
CC  
———————————————————————————————————————————  
L
L
L
Write  
I
Din  
Write cycle (2)  
CC  
———————————————————————————————————————————  
Note: X: H or L  
Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
———————————————————————————————————————————  
*1  
Power supply voltage  
V
–0.5 to +7.0  
V
CC  
———————————————————————————————————————————  
*1  
2
*3  
+ 0.3  
CC  
Terminal voltage  
V
–0.5* to V  
V
T
———————————————————————————————————————————  
Power dissipation  
P
1.0  
W
T
———————————————————————————————————————————  
Operating temperature  
Topr  
0 to + 70  
°C  
———————————————————————————————————————————  
Storage temperature  
Tstg  
–55 to +125  
°C  
———————————————————————————————————————————  
Storage temperature under bias  
Tbias  
–10 to +85  
°C  
———————————————————————————————————————————  
Note: 1. Relative to V  
SS  
2. V min: –3.0 V for pulse half-width 50 ns  
T
3. Maximum voltage is 7.0 V  
Recommended DC Operating Conditions (Ta = 0 to +70°C)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
———————————————————————————————————————————  
Supply voltage  
V
4.5  
5.0  
5.5  
V
CC  
———————————————————————————————  
V
0
0
0
V
SS  
———————————————————————————————————————————  
Input high (logic 1) voltage  
V
2.2  
V
+0.3  
V
IH  
CC  
———————————————————————————————————————————  
*1  
Input low (logic 0) voltage  
V
–0.5  
0.8  
V
IL  
———————————————————————————————————————————  
Note: 1. V min: –3.0 V for pulse half-width 50 ns  
IL  
4
HM62256B Series  
HM62256B Series  
DC Characteristics (Ta = 0 to +70°C, V = 5 V ±10%, V = 0 V)  
CC  
SS  
Parameter  
Symbol Min  
Typ*1 Max  
Unit  
Test conditions  
——————————————————————————————————————————  
Input leakage current  
|I |  
1
µA  
Vin = V to V  
LI  
SS CC  
——————————————————————————————————————————  
Output leakage current  
|I  
|
1
µA  
CS = V or OE = V or WE = V  
I/O  
LO  
IH IH IL,  
= V to V  
SS CC  
V
——————————————————————————————————————————  
Operating power supply  
current  
I
6
15  
mA  
CS = V others = V /V  
CC  
IL, IH IL  
Iout = 0 mA  
——————————————————————————————————————————  
Average  
HM62256B-7  
I
33  
60  
mA  
min cycle, duty = 100 %, I = 0 mA  
CC1  
I/O  
operating ——————  
—————————  
CS = V others = V /V  
IL, IH IL  
power  
supply  
current  
HM62256B-8  
——————  
HM62256B-10  
——————  
HM62256B-12  
29  
50  
—————————  
26  
50  
—————————  
24  
45  
—————————————————————————————————————  
I
5
15  
mA  
Cycle time = 1 µs, I = 0 mA  
CC2  
I/O  
CS = V  
V
= V , V = 0  
IL, IH CC IL  
——————————————————————————————————————————  
Standby V  
current  
I
0.3  
2
mA  
CS = V  
CC  
SB  
IH  
———————————————————————————————  
I
0.3  
100  
µA  
Vin 0 V,  
SB1  
—————————  
CS > V  
– 0.2 V,  
CC  
0.3*2  
50*2  
——————————————————————————————————————————  
Output low voltage  
V
0.4  
V
I
= 2.1 mA  
OL  
OL  
——————————————————————————————————————————  
Output high voltage  
V
2.4  
V
I
= –1.0 mA  
OH  
OH  
——————————————————————————————————————————  
Notes: 1. Typical values are at V  
= 5.0 V, Ta = +25°C and not guaranteed.  
CC  
2. This characteristics is guaranteed only for L-SL version.  
*1  
Capacitance (Ta = 25°C, f = 1.0 MHz)  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Test conditions  
——————————————————————————————————————————  
Input capacitance  
Cin  
8
pF  
Vin = 0 V  
——————————————————————————————————————————  
Input/output capacitance  
C
10  
pF  
V
= 0 V  
I/O  
I/O  
——————————————————————————————————————————  
Note: 1. This parameter is sampled and not 100% tested.  
5
HM62256B Series  
HM62256B Series  
AC Characteristics (Ta = 0 to +70°C, V = 5 V ± 10%, unless otherwise noted.)  
CC  
Test Conditions  
• Input pulse levels: 0.8 V to 2.4 V  
• Input and output timing reference level: 1.5 V  
• Input rise and fall times: 5 ns  
• Output load: 1 TTL Gate + CL (100 pF)  
(Including scope & jig)  
Read Cycle  
HM62256B-7 HM62256B-8 HM62256B-10 HM62256B-12  
———— ———— ———— —————  
Symbol Min Max Min Max Min Max Min Max Unit Notes  
Parameter  
———————————————————————————————————————————  
Read cycle time  
t
70  
85  
100  
120  
ns  
RC  
———————————————————————————————————————————  
Address access time  
t
70  
85  
100  
120  
ns  
AA  
———————————————————————————————————————————  
Chip select access time  
t
70  
85  
100  
120  
ns  
ACS  
———————————————————————————————————————————  
Output enable to output valid  
t
40  
45  
50  
60  
ns  
OE  
———————————————————————————————————————————  
Chip selection to output in low-Z  
t
10  
10  
10  
10  
ns  
2
CLZ  
———————————————————————————————————————————  
Output enable to output in low-Z  
t
5
5
5
5
ns  
2
OLZ  
———————————————————————————————————————————  
Chip deselection to output in high-Z  
t
0
25  
0
30  
0
35  
0
40  
ns  
1, 2  
CHZ  
———————————————————————————————————————————  
Output disable to output in high-Z  
t
0
25  
0
30  
0
35  
0
40  
ns  
1, 2  
OHZ  
———————————————————————————————————————————  
Output hold from address change  
t
5
5
10  
10  
ns  
OH  
———————————————————————————————————————————  
Read Timing Waveform (1)*3  
t RC  
Address  
tAA  
tACS  
CS  
*2  
t CLZ  
tOH  
t OE  
*2  
OLZ  
t
OE  
*1, *2  
*1, *2  
tOHZ  
tCHZ  
Dout  
Valid Data  
6
HM62256B Series  
HM62256B Series  
Read Timing Waveform (2)*3 *4 *6  
t
RC  
Address  
t
OH  
t
t
OH  
AA  
Dout  
Valid Data  
Read Timing Waveform (3)*3 *5 *6  
CS  
t
*1, *2  
ACS  
t
CHZ  
*2  
t
CLZ  
Valid Data  
Dout  
Notes: 1. t  
and t  
defined as the time at which the outputs achieve the open circuit conditions and  
CHZ  
OHZ  
are not referred to output voltage levels.  
2. This parameter is sampled and not 100 % tested.  
3. WE is high for read cycle.  
4. Device is continuously selected, CS = V  
IL  
5. Address must be valid prior to or coincident with CS transition Low.  
6. OE = V  
IL  
7
HM62256B Series  
HM62256B Series  
Write Cycle  
HM62256B-7 HM62256B-8 HM62256B-10 HM62256B-12  
———— ————– ————– ————–  
Symbol Min Max Min Max Min Max Min Max  
Parameter  
Unit Notes  
——————————————————————————————————————————  
Write cycle time  
t
70  
85  
100  
120  
ns  
WC  
——————————————————————————————————————————  
Chip selection to  
t
60  
75  
80  
85  
ns  
2
CW  
end of write  
——————————————————————————————————————————  
Address setup time  
t
0
0
0
0
ns  
3
AS  
——————————————————————————————————————————  
Address valid to  
t
60  
75  
80  
85  
ns  
AW  
end of write  
——————————————————————————————————————————  
Write pulse width  
t
50  
55  
60  
70  
ns  
1, 12  
WP  
——————————————————————————————————————————  
Write recovery time  
t
0
0
0
0
ns  
4
WR  
——————————————————————————————————————————  
WE to output in high-Z  
t
0
25  
0
30  
0
35  
0
40  
ns  
10, 11  
WHZ  
——————————————————————————————————————————  
Data to write time overlap  
t
30  
35  
40  
50  
ns  
DW  
——————————————————————————————————————————  
Data hold from write time  
t
0
0
0
0
ns  
DH  
——————————————————————————————————————————  
Output active from  
t
5
5
5
5
ns  
10  
OW  
end of write  
——————————————————————————————————————————  
Output disable to output t  
0
25  
0
30  
0
35  
0
40  
ns  
10, 11  
OHZ  
in high-Z  
——————————————————————————————————————————  
8
HM62256B Series  
HM62256B Series  
Write Timing Waveform (1) (OE Clock)  
tWC  
Address  
*4  
tAW  
tWR  
OE  
CS  
*2  
tCW  
*6  
*1  
*3  
tWP  
tAS  
WE  
*5, *10  
tOHZ  
Dout  
Din  
tDW  
tDH  
Valid Data  
9
HM62256B Series  
HM62256B Series  
12  
Write Timing Waveform (2) (OE Low Fixed)*  
tWC  
Address  
*4  
tWR  
*2  
tCW  
CS  
*6  
tAW  
*1, *12  
tWP  
tOH  
*3  
WE  
tAS  
*10  
*5, *10  
tWHZ  
tOW  
*8  
*7  
Dout  
Din  
tDW  
tDH  
*9  
Valid Data  
Notes: 1. A write occurs during the overlap(t ) of a low CS and a low WE. A write begins at the later  
WP  
transition of CS going low or WE going low. A write ends at the earlier transition of CS going  
high or WE going high. t  
is measured from the beginning of write to the end of write.  
WP  
2.  
3.  
4.  
t
t
t
is measured from CS going low to the end of write.  
is measured from the address valid to the beginning of write.  
CW  
AS  
is measured from the earlier of WE or CS going high to the end of write cycle.  
WR  
5. During this period, I/O pins are in the output state so that the input signals of the opposite  
phase to the outputs must not be applied.  
6. If the CS low transition occurs simultaneously with the WE low transition or after the WE  
transition, the outputs remain in a high impedance state.  
7. Dout is the same phase of the write data of this write cycle.  
8. Dout is the read data of next address.  
9. If CS is low during this period, I/O pins are in the output state. Therefore, the input signals of  
the opposite phase to the output must not be applied to them.  
10. This parameter is sampled and not 100% tested.  
11. t  
and t  
are defined as the time at which the outputs achieve the open circuit conditions  
OHZ  
WHZ  
and are not referred to output voltage levels.  
12. In the write cycle with OE low fixed, t must satisfy the following equation to avoid a problem  
WP  
of data bus contention, t  
t  
max + t  
min.  
WP  
WHZ  
DW  
10  
HM62256B Series  
HM62256B Series  
Low V Data Retention Characteristics (Ta = 0 to +70°C)  
CC  
1
Parameter  
Symbol Min  
Typ* Max  
Unit  
Test conditions  
———————————————————————————————————————————  
V
for data retention  
V
2.0  
5.5  
V
CS > V  
–0.2 V,  
CC  
DR  
CC  
Vin > 0 V*5  
———————————————————————————————————————————  
Data retention current  
I
0.2  
—————————————  
0.2 µA  
10*3  
30*2  
µA  
V
= 3.0 V, Vin > 0 V*5  
CCDR  
CC  
CS > V  
–0.2 V,  
CC  
———————————————————————————————————————————  
Chip deselect to data retention time  
t
0
ns  
See retention waveform  
CDR  
————————————————————————————————  
*4  
Operation recovery time  
t
t
ns  
R
RC  
———————————————————————————————————————————  
Low V  
Data Retention Timing Waveform  
CC  
Data retention mode  
VCC  
4.5 V  
tR  
tCDR  
2.4 V  
VDR  
CS  
0 V  
CS VCC – 0.2 V  
Notes: 1. Typical values are at V  
= 3.0 V, Ta = 25°C and not guaranteed.  
CC  
2. 10 µA max at Ta = 0 to + 40˚C.  
3. 3 µA max at Ta = 0 to + 40˚C. (only for L-SL version)  
4. t  
= read cycle time.  
RC  
5. CS controls address buffer, WE buffer, OE buffer, and Din buffer. If CS controls data retention  
mode, Vin levels (address, WE, OE, I/O) can be in the high impedance state.  
11  

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