HN58X2432SI_05 [RENESAS]

Two-wire serial interface 32k EEPROM (4-kword × 8-bit)/64k EEPROM (8-kword × 8-bit); 两线串行接口32K EEPROM ( 4千字× 8位) / 64K EEPROM ( 8千字× 8位)
HN58X2432SI_05
型号: HN58X2432SI_05
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

Two-wire serial interface 32k EEPROM (4-kword × 8-bit)/64k EEPROM (8-kword × 8-bit)
两线串行接口32K EEPROM ( 4千字× 8位) / 64K EEPROM ( 8千字× 8位)

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总22页 (文件大小:155K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HN58X2432SI/HN58X2464SI  
Two-wire serial interface  
32k EEPROM (4-kword × 8-bit)/64k EEPROM (8-kword × 8-bit)  
REJ03C0135-0200  
Rev.2.00  
Jan.11.2005  
Description  
HN58X2432SI, HN58X2464SI are two-wire serial interface EEPROM (Electrically Erasable and  
Programmable ROM). They realize high speed, low power consumption and a high level of reliability by  
employing advanced MNOS memory technology and CMOS process and low voltage circuitry technology.  
They also have a 32-byte page programming function to make their write operation faster.  
Note: Renesas Technology’s serial EEPROM are authorized for using consumer applications such as  
cellular phone, camcorders, audio equipment. Therefore, please contact Renesas Technology’s  
sales office before using industrial applications such as automotive systems, embedded controllers,  
and meters.  
Features  
Single supply: 1.8 V to 5.5 V  
Two-wire serial interface (I2CTM serial bus*1)  
Clock frequency: 400 kHz  
Power dissipation:  
Standby: 3 µA (max)  
Active (Read): 1 mA (max)  
Active (Write): 3 mA (max)  
Automatic page write: 32-byte/page  
Write cycle time: 10 ms (2.7 V to 5.5 V)/15ms (1.8 V to 2.7 V)  
Endurance: 105 Cycles (Page write mode)  
Data retention: 10 Years  
Rev.2.00, Jan.11.2005, page 1 of 20  
HN58X2432SI/HN58X2464SI  
Small size packages: TSSOP-8pin, SOP-8pin  
Shipping tape and reel  
TSSOP 8-pin: 3,000 IC/reel  
SOP 8-pin: 2,500 IC/reel  
Temperature range: 40 to +85°C  
Lead free products.  
Note: 1. I2C is a trademark of Philips Corporation.  
Ordering Information  
Type No.  
Internal organization Operating voltage Frequency Package  
HN58X2432SFPIE 32k bit (4096 × 8-bit) 1.8 V to 5.5 V  
400 kHz  
150 mil 8-pin plastic SOP  
(FP-8DBV)  
HN58X2464SFPIE 64k bit (8192 × 8-bit)  
Lead free  
HN58X2432STIE  
32k bit (4096 × 8-bit) 1.8 V to 5.5 V  
400 kHz  
8-pin plastic TSSOP  
(TTP-8DAV)  
HN58X2464STIE  
64k bit (8192 × 8-bit)  
Lead free  
Pin Arrangement  
8-pin TSSOP  
8-pin SOP  
1
2
3
4
A0  
A1  
8
7
6
5
VCC  
WP  
A2  
SCL  
SDA  
VSS  
(Top view)  
Rev.2.00, Jan.11.2005, page 2 of 20  
HN58X2432SI/HN58X2464SI  
Pin Description  
Pin name  
A0 to A2  
SCL  
Function  
Device address  
Serial clock input  
Serial data input/output  
Write protect  
SDA  
WP  
VCC  
Power supply  
Ground  
VSS  
Block Diagram  
High voltage generator  
VCC  
VSS  
Memory array  
WP  
A0, A1, A2  
SCL  
Control  
logic  
Y-select & Sense amp.  
Serial-parallel converter  
SDA  
Absolute Maximum Ratings  
Parameter  
Symbol  
VCC  
Value  
Unit  
Supply voltage relative to VSS  
Input voltage relative to VSS  
Operating temperature range*1  
Storage temperature range  
0.6 to +7.0  
0.5*2 to +7.0*3  
40 to +85  
V
Vin  
V
Topr  
Tstg  
°C  
°C  
65 to +125  
Notes: 1. Including electrical characteristics and data retention.  
2. Vin (min): 3.0 V for pulse width 50 ns.  
3. Should not exceed VCC + 1.0 V.  
Rev.2.00, Jan.11.2005, page 3 of 20  
HN58X2432SI/HN58X2464SI  
DC Operating Conditions  
Parameter  
Symbol  
VCC  
Min  
Typ  
0
Max  
Unit  
V
Supply voltage  
1.8  
5.5  
VSS  
0
0
V
Input high voltage  
Input low voltage  
VIH  
VCC × 0.7  
–0.3*1  
40  
VCC + 1.0  
VCC × 0.3  
+85  
V
VIL  
V
Operating temperature  
Topr  
°C  
Note: 1. VIL (min): 1.0 V for pulse width 50 ns.  
DC Characteristics (Ta = 40 to +85°C, VCC = 1.8 V to 5.5 V)  
Parameter  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Input leakage current  
ILI  
2.0  
µA  
VCC = 5.5 V, Vin = 0 to 5.5 V  
(SCL, SDA)  
ILI  
20  
µA  
VCC = 5.5 V, Vin = 0 to 5.5 V  
(A0 to A2, WP)  
Output leakage current  
Standby VCC current  
Read VCC current  
ILO  
1.0  
2.0  
3.0  
1.0  
3.0  
0.4  
µA  
µA  
mA  
mA  
V
VCC = 5.5 V, Vout = 0 to 5.5 V  
Vin = VSS or VCC  
ISB  
ICC1  
ICC2  
VOL2  
VCC = 5.5 V, Read at 400 kHz  
VCC = 5.5 V, Write at 400 kHz  
Write VCC current  
Output low voltage  
VCC = 4.5 to 5.5 V, IOL = 1.6 mA  
VCC = 2.7 to 4.5 V, IOL = 0.8 mA  
VCC = 1.8 to 2.7 V, IOL = 0.4 mA  
VOL1  
0.2  
V
VCC = 1.8 to 2.7 V, IOL = 0.2 mA  
Capacitance (Ta = +25°C, f = 1 MHz)  
Test  
Parameter  
Symbol Min  
Typ  
Max  
6.0  
Unit  
pF  
conditions  
Input capacitance (A0 to A2, SCL, WP) Cin*1  
Vin = 0 V  
1
Output capacitance (SDA)  
CI/O  
*
6.0  
pF  
Vout = 0 V  
Note: 1. This parameter is sampled and not 100% tested.  
Rev.2.00, Jan.11.2005, page 4 of 20  
HN58X2432SI/HN58X2464SI  
AC Characteristics (Ta = 40 to +85°C, VCC = 1.8 to 5.5 V)  
Test Conditions  
Input pules levels:  
VIL = 0.2 × VCC  
VIH = 0.8 × VCC  
Input rise and fall time: 20 ns  
Input and output timing reference levels: 0.5 × VCC  
Output load: TTL Gate + 100 pF  
Parameter  
Symbol Min  
Typ  
Max  
400  
Unit  
kHz  
ns  
ns  
ns  
Notes  
Clock frequency  
fSCL  
Clock pulse width low  
Clock pulse width high  
Noise suppression time  
Access time  
tLOW  
tHIGH  
tI  
1200  
600  
50  
900  
1
tAA  
100  
1200  
600  
600  
10  
ns  
Bus free time for next mode  
Start hold time  
tBUF  
tHD.STA  
tSU.STA  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Start setup time  
Data in hold time  
VCC = 3.0 V to 5.5 V tHD.DAT  
VCC = 1.8 V to 3.0 V tHD.DAT  
20  
Data in setup time  
Input rise time  
tSU.DAT  
100  
tR  
300  
300  
1
1
Input fall time  
tF  
ns  
Stop setup time  
tSU.STO  
600  
50  
ns  
ns  
ns  
ns  
ms  
ms  
Data out hold time  
Write protect hold time  
Write protect setup time  
Write cycle time  
tDH  
tHD.WP  
1200  
0
tSU.WP  
VCC = 2.7 V to 5.5 V tWC  
VCC = 1.8 V to 2.7 V tWC  
10  
15  
2
2
Notes: 1. This parameter is sampled and not 100% tested.  
2. tWC is the time from a stop condition to the end of internally controlled write cycle.  
Rev.2.00, Jan.11.2005, page 5 of 20  
HN58X2432SI/HN58X2464SI  
Timing Waveforms  
Bus Timing  
1/fSCL  
tLOW  
tR  
tF  
tHIGH  
SCL  
tSU.STA  
tHD.DAT  
tSU.DAT  
tHD.STA  
tSU.STO  
SDA  
(in)  
tBUF  
tAA  
tDH  
SDA  
(out)  
tSU.WP  
tHD.WP  
WP  
Write Cycle Timing  
Stop condition  
Start condition  
SCL  
SDA  
D0 in  
Write data  
tWC  
(Internally controlled)  
ACK  
(Address (n))  
Rev.2.00, Jan.11.2005, page 6 of 20  
HN58X2432SI/HN58X2464SI  
Pin Function  
Serial Clock (SCL)  
The SCL pin is used to control serial input/output data timing. The SCL input is used to positive edge  
clock data into EEPROM device and negative edge clock data out of each device. Maximum clock rate is  
400 kHz.  
Serial Input/Output Data (SDA)  
The SDA pin is bidirectional for serial data transfer. The SDA pin needs to be pulled up by resistor as that  
pin is open-drain driven structure. Use proper resistor value for your system by considering VOL, IOL and  
the SDA pin capacitance. Except for a start condition and a stop condition which will be discussed later,  
the SDA transition needs to be completed during the SCL low period.  
Data Validity (SDA data change timing waveform)  
SCL  
SDA  
Data  
Data  
change  
change  
Note:  
High-to-low and low-to-high change of SDA should be done during SCL low period.  
Rev.2.00, Jan.11.2005, page 7 of 20  
HN58X2432SI/HN58X2464SI  
Device Address (A0, A1, A2)  
Eight devices can be wired for one common data bus line as maximum. Device address pins are used to  
distinguish each device and device address pins should be connected to VCC or VSS. When device address  
code provided from SDA pin matches corresponding hard-wired device address pins A0 to A2, that one  
device can be activated. These pins are internally pulled-down to VSS. The device read these pins as Low  
if unconnected.  
Pin Connections for A0 to A2  
Pin connection  
Max connect  
Memory size number  
A2  
×*1  
×*1  
A1  
×*1  
×*1  
A0  
×*1  
×*1  
Notes  
32k bit  
64k bit  
8
8
Notes: 1. × = Don’t care (Open is also approval).  
Write Protect (WP)  
When the Write Protect pin (WP) is high, the write protection feature is enabled and operates as shown in  
the following table. When the WP is low, write operation for all memory arrays are allowed. WP pin  
should be fixed high or low status from start condition input to stop condition input. When left  
unconnected, write operation for all memory arrays are allowed because the WP pin is internally pulled  
down to VSS. The read operation is always activated irrespective of the WP pin status.  
Write Protect Area  
WP pin status  
Write protect area  
All memory  
VIH  
VIL  
Normal read/write operation  
Rev.2.00, Jan.11.2005, page 8 of 20  
HN58X2432SI/HN58X2464SI  
Functional Description  
Start Condition  
A high-to-low transition of the SDA with the SCL high is needed in order to start read, write operation  
(See start condition and stop condition).  
Stop Condition  
A low-to-high transition of the SDA with the SCL high is a stop condition. The stand-by operation starts  
after a read sequence by a stop condition. In the case of write operation, a stop condition terminates the  
write data inputs and place the device in a internally-timed write cycle to the memories. After the  
internally-timed write cycle which is specified as tWC, the device enters a standby mode (See write cycle  
timing).  
Start Condition and Stop Condition  
SCL  
SDA  
(in)  
Start condition  
Stop condition  
Rev.2.00, Jan.11.2005, page 9 of 20  
HN58X2432SI/HN58X2464SI  
Acknowledge  
All addresses and data words are serially transmitted to and from in 8-bit words. The receiver sends a zero  
to acknowledge that it has received each word. This happens during ninth clock cycle. The transmitter  
keeps bus open to receive acknowledgment from the receiver at the ninth clock. In the write operation,  
EEPROM sends a zero to acknowledge after receiving every 8-bit words. In the read operation, EEPROM  
sends a zero to acknowledge after receiving the device address word. After sending read data, the  
EEPROM waits acknowledgment by keeping bus open. If the EEPROM receives zero as an acknowledge,  
it sends read data of next address. If the EEPROM receives acknowledgment "1" (no acknowledgment)  
and a following stop condition, it stops the read operation and enters a stand-by mode. If the EEPROM  
receives neither acknowledgment "0" nor a stop condition, the EEPROM keeps bus open without sending  
read data.  
Acknowledge Timing Waveform  
1
2
8
9
SCL  
SDA IN  
Acknowledge  
out  
SDA OUT  
Rev.2.00, Jan.11.2005, page 10 of 20  
HN58X2432SI/HN58X2464SI  
Device Addressing  
The EEPROM device requires an 8-bit device address word following a start condition to enable the chip  
for a read or a write operation. The device address word consists of 4-bit device code, 3-bit device address  
code and 1-bit read/write(R/W) code. The most significant 4-bit of the device address word are used to  
distinguish device type and this EEPROM uses “1010” fixed code. The device address word is followed  
by the 3-bit device address code in the order of A2, A1, A0. The device address code selects one device  
out of all devices which are connected to the bus. This means that the device is selected if the inputted 3-  
bit device address code is equal to the corresponding hard-wired A2-A0 pin status. The eighth bit of the  
device address word is the read/write(R/W) bit. A write operation is initiated if this bit is low and a read  
operation is initiated if this bit is high. Upon a compare of the device address word, the EEPROM enters  
the read or write operation after outputting the zero as an acknowledge. The EEPROM turns to a stand-by  
state if the device code is not “1010” or device address code doesn’t coincide with status of the correspond  
hard-wired device address pins A0 to A2.  
Device Address Word  
Device address word (8-bit)  
Device code (fixed)  
Device address code*1  
A2 A1  
R/W code*2  
32k, 64k  
1
0
1
0
A0  
R/W  
Notes: 1. A2 to A0 are device address and a10 to a8 are memory address.  
2. R/W=“1” is read and R/W = “0” is write.  
Rev.2.00, Jan.11.2005, page 11 of 20  
HN58X2432SI/HN58X2464SI  
Write Operations  
Byte Write:  
A write operation requires an 8-bit device address word with R/W = “0”. Then the EEPROM sends  
acknowledgment "0" at the ninth clock cycle. After these, the 32kbit and 64kbit EEPROMs receive 2  
sequence 8-bit memory address words. Upon receipt of this memory address, the EEPROM outputs  
acknowledgment "0" and receives a following 8-bit write data. After receipt of write data, the EEPROM  
outputs acknowledgment "0". If the EEPROM receives a stop condition, the EEPROM enters an  
internally-timed write cycle and terminates receipt of SCL, SDA inputs until completion of the write cycle.  
The EEPROM returns to a standby mode after completion of the write cycle.  
Byte Write Operation  
Device  
address  
1st Memory  
address (n)  
2nd Memory  
address (n)  
Write data (n)  
W
1 0 1 0  
32k to 64k  
Start  
ACK  
R/W  
ACK  
ACK  
Stop  
Notes: 1. Don‘t care bits for 32k and 64k.  
2. Don‘t care bit for 32k.  
Rev.2.00, Jan.11.2005, page 12 of 20  
HN58X2432SI/HN58X2464SI  
Page Write:  
The EEPROM is capable of the page write operation which allows any number of bytes up to 32 bytes to  
be written in a single write cycle. The page write is the same sequence as the byte write except for  
inputting the more write data. The page write is initiated by a start condition, device address word,  
memory address(n) and write data(Dn) with every ninth bit acknowledgment. The EEPROM enters the  
page write operation if the EEPROM receives more write data(Dn+1) instead of receiving a stop condition.  
The a0 to a4 address bits are automatically incremented upon receiving write data(Dn+1). The EEPROM  
can continue to receive write data up to 32 bytes. If the a0 to a4 address bits reaches the last address of the  
page, the a0 to a4 address bits will roll over to the first address of the same page and previous write data  
will be overwritten. Upon receiving a stop condition, the EEPROM stops receiving write data and enters  
internally-timed write cycle.  
Page Write Operation  
Device  
address  
1st Memory  
address (n)  
2nd Memory  
address (n)  
Write data (n)  
ACK  
Write data (n+m)  
32k to  
64k  
W
1 0 1 0  
ACK  
R/W  
ACK  
ACK  
ACK  
Stop  
Start  
Notes: 1. Don‘t care bits for 32k and 64k.  
2. Don‘t care bit for 32k.  
Rev.2.00, Jan.11.2005, page 13 of 20  
HN58X2432SI/HN58X2464SI  
Acknowledge Polling:  
Acknowledge polling feature is used to show if the EEPROM is in a internally-timed write cycle or not.  
This feature is initiated by the stop condition after inputting write data. This requires the 8-bit device  
address word following the start condition during a internally-timed write cycle. Acknowledge polling will  
operate when the R/W code = “0”. Acknowledgment “1” (no acknowledgment) shows the EEPROM is in  
a internally-timed write cycle and acknowledgment “0” shows that the internally-timed write cycle has  
completed. See Write Cycle Polling using ACK.  
Write Cycle Polling Using ACK  
Send  
write command  
Send  
stop condition  
to initiate write cycle  
Send  
start condition  
Send  
device address word  
with R/W = 0  
No  
No  
ACK  
returned  
Yes  
Next operation is  
addressing the memory  
Yes  
Send  
Send  
Send  
memory address  
start condition  
stop condition  
Send  
stop condition  
Proceed random address  
read operation  
Proceed write operation  
Rev.2.00, Jan.11.2005, page 14 of 20  
HN58X2432SI/HN58X2464SI  
Read Operation  
There are three read operations: current address read, random read, and sequential read. Read operations  
are initiated the same way as write operations with the exception of R/W = “1”.  
Current Address Read:  
The internal address counter maintains the last address accessed during the last read or write operation,  
with incremented by one. Current address read accesses the address kept by the internal address counter.  
After receiving a start condition and the device address word(R/W is “1”), the EEPROM outputs the 8-bit  
current address data from the most significant bit following acknowledgment “0”. If the EEPROM  
receives acknowledgment “1” (no acknowledgment) and a following stop condition, the EEPROM stops  
the read operation and is turned to a standby state. In case the EEPROM has accessed the last address of  
the last page at previous read operation, the current address will roll over and returns to zero address. In  
case the EEPROM has accessed the last address of the page at previous write operation, the current address  
will roll over within page addressing and returns to the first address in the same page. The current address  
is valid while power is on. The current address after power on will be indefinite. The random read  
operation described below is necessary to define the memory address.  
Current Address Read Operation  
Device  
address  
Read data (n+1)  
ACK No ACK  
32k to 64k  
Start  
1 0 1 0  
R
Stop  
R/W  
Rev.2.00, Jan.11.2005, page 15 of 20  
HN58X2432SI/HN58X2464SI  
Random Read:  
This is a read operation with defined read address. A random read requires a dummy write to set read  
address. The EEPROM receives a start condition, device address word(R/W=0) and memory address (2 ×  
8-bit) sequentially. The EEPROM outputs acknowledgment “0” after receiving memory address then  
enters a current address read with receiving a start condition. The EEPROM outputs the read data of the  
address which was defined in the dummy write operation. After receiving acknowledgment “1”(no  
acknowledgment) and a following stop condition, the EEPROM stops the random read operation and  
returns to a standby state.  
Random Read Operation  
Device  
address  
1st Memory  
address (n)  
2nd Memory  
address (n)  
Device  
address  
Read data (n)  
No ACK  
@@@  
# # #  
32k to  
64k  
W
R
1 0 1 0  
1 0 1 0  
R/W  
ACK  
ACK  
R/W  
ACK  
Start  
ACK  
Start  
Stop  
Dummy write  
Currect address read  
Notes: 1. Don‘t care bits for 32k and 64k.  
2. Don‘t care bit for 32k.  
3. 2nd device address code (#) should be same as 1st (@).  
Rev.2.00, Jan.11.2005, page 16 of 20  
HN58X2432SI/HN58X2464SI  
Sequential Read:  
Sequential reads are initiated by either a current address read or a random read. If the EEPROM receives  
acknowledgment “0” after 8-bit read data, the read address is incremented and the next 8-bit read data are  
coming out. This operation can be continued as long as the EEPROM receives acknowledgment “0”. The  
address will roll over and returns address zero if it reaches the last address of the last page. The sequential  
read can be continued after roll over. The sequential read is terminated if the EEPROM receives  
acknowledgment “1” (no acknowledgment) and a following stop condition.  
Sequential Read Operation  
Device  
address  
Read data (n) Read data (n+1) Read data (n+2) Read data (n+m)  
32k to  
64k  
R
1 0 1 0  
ACK  
ACK  
R/W  
ACK  
ACK  
No ACK  
Stop  
Start  
Rev.2.00, Jan.11.2005, page 17 of 20  
HN58X2432SI/HN58X2464SI  
Notes  
Data Protection at VCC On/Off  
When VCC is turned on or off, noise on the SCL and SDA inputs generated by external circuits (CPU, etc)  
may act as a trigger and turn the EEPROM to unintentional program mode. To prevent this unintentional  
programming, this EEPROM has a power on reset function. Be careful of the notices described below in  
order for the power on reset function to operate correctly.  
SCL and SDA should be fixed to VCC or VSS during VCC on/off. Low to high or high to low transition  
during VCC on/off may cause the trigger for the unintentional programming.  
VCC should be turned off after the EEPROM is placed in a standby state.  
V
CC should be turned on from the ground level(VSS) in order for the EEPROM not to enter the  
unintentional programming mode.  
VCC turn on speed should be longer than 10 µs.  
Write/Erase Endurance and Data Retention Time  
The endurance is 105 cycles in case of page programming and 104 cycles in case of byte programming (1%  
cumulative failure rate). The data retention time is more than 10 years when a device is page-programmed  
less than 104 cycles.  
Noise Suppression Time  
This EEPROM have a noise suppression function at SCL and SDA inputs, that cut noise of width less than  
50 ns. Be careful not to allow noise of width more than 50 ns.  
Rev.2.00, Jan.11.2005, page 18 of 20  
HN58X2432SI/HN58X2464SI  
Package Dimensions  
HN58X2432SFPIE/HN58X2464SFPIE (FP-8DBV)  
Unit: mm  
4.89  
5.15 Max  
5
8
1
4
6.02 ± 0.18  
1.06  
0.69 Max  
0˚ – 8˚  
+ 0.289  
1.27  
*0.40 ± 0.05  
0.60  
– 0.194  
0.10  
M
0.25  
Package Code  
JEDEC  
FP-8DBV  
JEITA  
*Pd Plating  
Mass (reference value)  
0.08 g  
Rev.2.00, Jan.11.2005, page 19 of 20  
HN58X2432SI/HN58X2464SI  
HN58X2432STIE/HN58X2464STIE (TTP-8DAV)  
Unit: mm  
3.00  
3.30 Max  
8
5
1
4
0.65  
1.00  
*0.20 ± 0.05  
0.13 M  
6.40 ± 0.20  
0.805 Max  
0.10  
0˚ – 8˚  
0.50 ± 0.10  
Package Code  
JEDEC  
TTP-8DAV  
JEITA  
Mass (reference value)  
0.034 g  
*Pd Plating  
Rev.2.00, Jan.11.2005, page 20 of 20  
Revision History  
HN58X2432SI/HN58X2464SI Data Sheet  
Rev. Date  
Contents of Modification  
Page Description  
0.0  
Mar. 17, 2003  
Initial issue  
1.00 Oct. 27, 2003  
2
Change format issued by Renesas Technology Corp.  
Deletion of Preliminary  
Ordering Information  
Addition of HN58X2432SFPIE, HN58X2464SFPIE, HN58X2432STIE,  
HN58X2464STIE, HN58X2432SNIE, HN58X2464SNIE  
Package Dimensions  
19  
FP-8DB to FP-8DB, FP-8DBV  
TTP-8DA to TTP-8DA, TTP-8DAV  
TNP-8DA to TNP-8DA, TNP-8DAV  
2.00 Jan.11.2005  
2
Deletion of package : SON (TNP-8DA, TNP-8DAV)  
Ordering Information  
Deletion of HN58X2432SFPI, HN58X2464SFPI, HN58X2432STI,  
HN58X2464STI  
Pin Function  
8
Pin Connections for A0 to A2  
VCC/VSS to ×  
19-20 Package Dimensions  
Deletion of FP-8DB, TTP-8DA  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,  
(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life  
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and  
cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
RENESAS SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
Renesas Technology America, Inc.  
450 Holger Way, San Jose, CA 95134-1368, U.S.A  
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501  
Renesas Technology Europe Limited  
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.  
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900  
Renesas Technology Hong Kong Ltd.  
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong  
Tel: <852> 2265-6688, Fax: <852> 2730-6071  
Renesas Technology Taiwan Co., Ltd.  
10th Floor, No.99, Fushing North Road, Taipei, Taiwan  
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999  
Renesas Technology (Shanghai) Co., Ltd.  
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China  
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952  
Renesas Technology Singapore Pte. Ltd.  
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632  
Tel: <65> 6213-0200, Fax: <65> 6278-8001  
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.  
Colophon 2.0  

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