HS3101 [RENESAS]

High Performance Relative Humidity and Temperature Sensor;
HS3101
型号: HS3101
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

High Performance Relative Humidity and Temperature Sensor

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Datasheet  
HS310x  
High Performance Relative Humidity and Temperature Sensor  
The HS310x series is a highly accurate, fully  
Features  
calibrated relative humidity and temperature sensor.  
The MEMS sensor features a proprietary sensor-  
level protection, ensuring high reliability and long-  
term stability.  
Humidity range: 0% to 100%RH  
Humidity accuracy: ±1.5%RH, typical (HS3101,  
10 to 90%RH, 25°C)  
Hydrophobic membrane, IP67 rating  
14-bit resolution: 0.01%RH, typical  
Integrated calibration and temperature-  
compensation logic provides fully corrected RH and  
temperature values via a standard I2C output. No  
user calibration of the output data is required.  
Independent programmable resolution settings: 8,  
10, 12, 14 bits  
Fast RH response time: 1 second time constant,  
typical (with 1 m/sec air flow), 4 seconds time  
constant, typical (in still air)  
The high accuracy, fast measurement response  
time, and long-term stability combined with the  
small package size makes the HS310x series ideal  
for a wide number of applications ranging from  
portable devices to products designed for harsh  
environments.  
Temperature sensor accuracy: ±0.2°C, typical  
(HS3101, HS3102, -10 to +80°C)  
Low current consumption: 1.0µA average (8-bit  
resolution, 1.8V supply), 24.4µA average (14-bit  
resolution, 3.3V supply), one RH and temperature  
measurement per second  
The HS310x series digital sensor accurately  
measures relative humidity and temperature levels.  
The measured data is internally corrected and  
compensated for accurate operation over a wide  
range of temperature and humidity levels – user  
calibration is not required.  
Excellent stability against aging  
Highly robust protection from harsh environmental  
conditions and mechanical shock  
Very low power consumption  
The HS310x features a hydrophobic membrane  
protecting it from environmental dusts, particles,  
and liquids.  
Applications  
Climate control systems  
Home appliances  
Weather stations  
Industrial automation  
Medical equipment  
Physical Characteristics  
Supply voltage: 2.3V to 5.5V  
Extended supply voltage: 1.8V (-20°C to +125°C)  
Operating temperature: -40°C to +125°C  
3.0 × 2.41 × 0.9 mm DFN-style 6-LGA package  
Product Image  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 1  
© 2021 Renesas Electronics  
HS310x Datasheet  
Contents  
1. Pin Information .............................................................................................................................................. 4  
1.1 Pin Assignments.................................................................................................................................... 4  
1.2 Pin Descriptions..................................................................................................................................... 4  
2. Specifications................................................................................................................................................. 5  
2.1 Absolute Maximum Ratings................................................................................................................... 5  
2.2 Recommended Operating Conditions ................................................................................................... 5  
3. Humidity and Temperature Sensor Performance....................................................................................... 6  
3.1 Humidity Sensor Specifications............................................................................................................. 6  
3.2 Temperature Sensor Specifications ...................................................................................................... 7  
3.3 Sleep Current......................................................................................................................................... 7  
3.4 Humidity Sensor Accuracy Graphs........................................................................................................ 8  
3.5 Temperature Sensor Accuracy Graphs................................................................................................. 9  
4. Sensor Interface........................................................................................................................................... 10  
4.1 I2C Features and Timing...................................................................................................................... 10  
4.2 Sensor Slave Address......................................................................................................................... 10  
4.3 I2C Communication.............................................................................................................................. 11  
4.4 Measurement Mode............................................................................................................................. 11  
4.5 Measurement Requests (MR) ............................................................................................................. 11  
4.6 Data Fetch (DF)................................................................................................................................... 12  
4.7 Status Bits............................................................................................................................................ 13  
4.8 Accessing the Non-volatile Memory .................................................................................................... 13  
4.9 Setting the Measurement Resolution .................................................................................................. 14  
4.10 Reading the HS310x ID Number......................................................................................................... 15  
5. Calculating Humidity and Temperature Output........................................................................................ 15  
6. Application Circuit....................................................................................................................................... 15  
7. Package Outline Drawings.......................................................................................................................... 16  
8. Soldering Information ................................................................................................................................. 16  
9. PCB Layout Guide ....................................................................................................................................... 17  
10. Storage and Handling.................................................................................................................................. 17  
11. Quality and Reliability ................................................................................................................................. 17  
12. Ordering Information................................................................................................................................... 18  
13. Revision History .......................................................................................................................................... 18  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 2  
HS310x Datasheet  
Figures  
Figure 1. Sleep Current Variation over Temperature, VDD at 3.3V.........................................................................7  
Figure 2. HS3101 RH Accuracy Tolerance at 25°C .................................................................................................8  
Figure 3. HS3101 RH Accuracy over Temperature..................................................................................................8  
Figure 4. HS3102 RH Accuracy Tolerance at 25°C .................................................................................................8  
Figure 5. HS3102 RH Accuracy over Temperature..................................................................................................8  
Figure 6. HS3103 RH Accuracy Tolerance at 25°C .................................................................................................8  
Figure 7. HS3103 RH Accuracy over Temperature..................................................................................................8  
Figure 8. HS3104 RH Accuracy Tolerance at 25°C .................................................................................................9  
Figure 9. HS3104 RH Accuracy over Temperature..................................................................................................9  
Figure 10. HS3101/HS3102 Temperature Sensor Accuracy Tolerance ..................................................................9  
Figure 11. HS3103 Temperature Sensor Accuracy Tolerance ................................................................................9  
Figure 12. HS3104 Temperature Sensor Accuracy Tolerance ................................................................................9  
Figure 13. Timing Diagram .....................................................................................................................................10  
Figure 14. START and STOP Condition Waveform...............................................................................................11  
Figure 15. Measurement Request..........................................................................................................................11  
Figure 16. Data Fetch.............................................................................................................................................12  
Figure 17. Sequence of Commands to Enter Programming Mode ........................................................................13  
Figure 18. Sequence of Commands to Change the Relative Humidity Resolution................................................14  
Figure 19. Recommended Soldering Profile...........................................................................................................16  
Figure 20. Milled PCB Openings for Thermal Isolation ..........................................................................................17  
Tables  
Table 1. I2C Timing Parameters .............................................................................................................................10  
Table 2. Status Bits.................................................................................................................................................13  
Table 3. Non-volatile Memory Registers ................................................................................................................13  
Table 4. Register Values for Different Resolution Settings ....................................................................................14  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 3  
HS310x Datasheet  
1. Pin Information  
1.1  
Pin Assignments  
VC  
3
SDA SCL  
2
1
Pin 1 marker  
on bottom side  
4
5
6
VDD  
NC  
VSS  
1.2  
Pin Descriptions  
Pin Number  
Name  
SCL  
SDA  
VC  
Type  
Description  
1
2
3
4
5
6
Serial clock  
Serial data  
In/out  
In/out  
Connect a 0.1µF decoupling capacitor from VC to ground  
Supply voltage  
Do not connect  
Ground  
VDD  
NC[1]  
VSS  
In  
In  
1. NC stands for not connected / no connection required / not bonded.  
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Apr 14, 2021  
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HS310x Datasheet  
2. Specifications  
2.1  
Absolute Maximum Ratings  
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause  
permanent damage to the device. Functional operation of the HS310x at absolute maximum ratings is not  
implied. Exposure to absolute maximum rating conditions might affect device reliability.  
Symbol  
Parameter  
Analog Supply Voltage  
Conditions  
Minimum  
-0.3  
Maximum  
6.0  
Unit  
V
Storage Temperature Range  
°C  
-55  
150  
2.2  
Recommended Operating Conditions  
Important note: The HS310x series sensors are optimized to perform best in the more common temperature and  
humidity ranges of 10°C to 50°C and 20% RH to 80% RH, respectively. If operated outside of these conditions  
for extended periods, especially at high humidity levels, the sensors may exhibit an offset. In most cases, this  
offset is temporary and will gradually disappear once the sensor is returned to normal temperature and humidity  
conditions. The amount of the shift and the duration of the offset vary depending on the duration of exposure and  
the severity of the relative humidity and temperature conditions. The time needed for the offset to disappear can  
also be decreased by using the procedures described in Soldering Information and Storage and Handling.  
Parameter  
Condition  
Minimum  
Typical  
Maximum  
Unit  
Operating Supply Voltage  
3.3  
5.5  
V
Extended Operating Supply Voltage Operating temperature from -20 to 125°C  
Operating Humidity Range  
1.8  
0
5.5  
100  
125  
1
V
%RH  
°C  
Operating Temperature Range  
-40  
Sleep Current  
-40 to 85°C  
0.6  
1
Sleep Mode  
µA  
-40 to 125°C  
3
8-bit resolution  
10-bit resolution  
12-bit resolution  
14-bit resolution  
1.0  
2.0  
1.5  
1.7  
2.8  
7.1  
24.4  
2.6  
One RH + temperature  
measurement/second  
Average Current1  
µA  
5.5  
7.0  
20.1  
24.4  
0.10  
0.55  
1.31  
4.50  
16.90  
Wake-up  
8-bit resolution  
10-bit resolution  
12-bit resolution  
14-bit resolution  
Humidity or temperature  
including the digital  
compensation  
Measurement Time  
ms  
1. Minimum, typical, and maximum average currents are provided at 1.8V, 3.3V, and 5.5V VDD respectively.  
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Apr 14, 2021  
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HS310x Datasheet  
3. Humidity and Temperature Sensor Performance  
3.1  
Humidity Sensor Specifications  
Humidity Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V  
Parameter  
Operating Range  
Condition  
Minimum  
Typical  
Maximum  
100  
Unit  
0
%RH  
HS3101  
HS3102  
HS3103  
HS3104  
8-bit  
±1.5  
±1.8  
±2.5  
±3.5  
0.7  
±1.8  
10% to 90%RH  
20% to 80%RH  
±2.0  
Accuracy[ 1]  
Resolution  
%RH  
±3.5  
±4.5  
1.0  
%RH  
14-bit  
0.01  
0.015  
±1.0  
Hysteresis  
%RH  
%RH  
Noise in Humidity (RMS)  
14-bit  
0.014  
±0.15  
HS3101  
HS3102  
HS3103  
HS3104  
10% to 90%RH  
20% to 80%RH  
Non-Linearity from Response Curve  
±0.25  
%RH  
Long-Term Stability  
±0.1  
4.0  
±0.25  
6.0  
%RH/Yr  
sec  
20% to 80% RH Still Air  
3.0  
Response Time Constant[ 2 ] (τH)  
1. Monotonic increases from 10 to 90%RH after sensor has been stabilized at 50%RH.  
2. Initial value to 63% of total variation.  
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HS310x Datasheet  
3.2  
Temperature Sensor Specifications  
Temperature Sensor Specification, TA = +25°C, VDD = 2.3V to 5.5V  
Parameter  
Operating Range  
Condition  
Minimum  
Typical  
Maximum  
Unit  
-40  
125  
°C  
HS3101  
HS3102  
HS3103  
HS3104  
8- bit  
-10°C to 80°C  
±0.2  
±0.3  
Accuracy  
°C  
±0.25  
±0.3  
0.9  
±0.35  
±0.5  
1.5  
0°C to 70°C  
0.6  
0.01  
2..0  
Resolution  
°C  
14-bit  
0.015  
0.025  
Sec.  
Response Time Constant[ 1] (τT)  
Long-Term Stability  
0.02  
0.1  
°C/Yr  
°C/V  
°C/V  
VDD ≥ 2.8V  
0.03  
1.25  
Supply Voltage Dependency[ 2]  
1.8V < VDD < 2.8V  
2.25  
1. Response time depends on system thermal mass and air flow.  
2. Temperature accuracy can be optimized for specified supply voltages upon request.  
3.3  
Sleep Current  
The sleep current of the HS310x series depends on the operating temperature, as shown in the following figure.  
Note that there is no significant dependence of the sleep current on the supply voltage.  
Figure 1. Sleep Current Variation over Temperature, VDD at 3.3V  
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Apr 14, 2021  
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HS310x Datasheet  
3.4  
Humidity Sensor Accuracy Graphs  
The typical and maximum relative humidity sensor accuracy tolerances are shown in the following figures.  
90  
±2.0 ±2.5  
±3.0  
±2.0  
70  
50  
30  
10  
±1.5  
±2.0  
±2.0  
0
10  
20  
40  
30  
50  
60  
70  
Temperature (°C)  
Figure 2. HS3101 RH Accuracy Tolerance at 25°C  
Figure 3. HS3101 RH Accuracy over Temperature  
90  
±2.5  
±3.0  
70  
50  
30  
10  
±1.8  
±2.5  
±2.5  
0
10  
20  
40  
30  
50  
60  
70  
Temperature (°C)  
Figure 4. HS3102 RH Accuracy Tolerance at 25°C  
Figure 5. HS3102 RH Accuracy over Temperature  
Figure 6. HS3103 RH Accuracy Tolerance at 25°C  
Figure 7. HS3103 RH Accuracy over Temperature  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 8  
 
 
 
 
 
 
 
HS310x Datasheet  
Figure 8. HS3104 RH Accuracy Tolerance at 25°C  
Figure 9. HS3104 RH Accuracy over Temperature  
3.5  
Temperature Sensor Accuracy Graphs  
The typical and maximum temperature sensor accuracy tolerances are shown in the following figures.  
Figure 10. HS3101/HS3102 Temperature Sensor  
Accuracy Tolerance  
Figure 11. HS3103 Temperature Sensor Accuracy  
Tolerance  
Figure 12. HS3104 Temperature Sensor Accuracy  
Tolerance  
X0116303 Rev.1.1  
Apr 14, 2021  
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HS310x Datasheet  
4. Sensor Interface  
The HS310x series sensor uses a digital I2C-compatible communication protocol. To accommodate multiple  
devices, the protocol uses two bi-directional open-drain lines: the Serial Data Line (SDA) and the Serial Clock  
Line (SCL). Pull-up resistors to VDD are required. Several slave devices can share the bus; however, only one  
master device can be present on the line.  
4.1  
I2C Features and Timing  
The HS310x series sensor operates as a slave device on the I2C bus with support for 100kHz and 400kHz bit  
rates. Each transmission is initiated when the master sends a 0 START bit (S), and the transmission is  
terminated when the master sends a 1 STOP bit (P). These bits are only transmitted while the SCL line is HIGH.  
SDA  
tSUDAT  
tHDSTA  
tBUS  
tLOW  
SCL  
tHDSTA  
tHDDAT  
tHIGH  
tSUSTA  
tSUSTO  
Figure 13. Timing Diagram  
Table 1. I2C Timing Parameters  
Parameter  
Symbol  
fSCL  
Minimum  
Typical  
Maximum  
400  
Unit  
SCL Clock Frequency[1]  
20  
0.1  
0.6  
0.6  
0.1  
0
kHz  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
START Condition Hold Time Relative to SCL Edge  
Minimum SCL Clock LOW Width[b]  
tHDSTA  
tLOW  
Minimum SCL Clock HIGH Width[b]  
tHIGH  
START Condition Setup Time Relative to SCL Edge  
Data Hold Time on SDA Relative to SCL Edge  
Data Setup Time on SDA Relative to SCL Edge  
STOP Condition Setup Time on SCL  
tSUSTA  
tHDDAT  
tSUDAT  
tSUSTO  
tBUS  
0.5  
0.1  
0.1  
1
Bus Free Time Between STOP Condition and START Condition  
1. The minimum frequency of 20kHz applies to test only; no minimum under normal operations.  
2. Combined LOW and HIGH widths must equal or exceed the minimum SCL period.  
4.2  
Sensor Slave Address  
The HS310x series default I2C address is 44HEX. The device will respond only to this 7-bit address. For more  
information, see the following section.  
Custom I2C address can be provided upon request.  
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Apr 14, 2021  
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HS310x Datasheet  
4.3  
I2C Communication  
The sensor transmission is initiated when the master sends a 0 START bit (S). The transmission is terminated  
when the master sends a 1 STOP bit (P). These bits are only transmitted while the SCL line is HIGH (see the  
following figure for waveforms).  
Once the START condition has been set, the SCL line is toggled at the prescribed data rate, clocking  
subsequent data transfers. Data on the SDA line is always sampled on the rising edge of the SCL line and must  
remain stable while SCL is HIGH to prevent false START or STOP conditions.  
START Condition  
STOP Condition  
SCL  
SCL  
START  
STOP  
SDA  
SDA  
Figure 14. START and STOP Condition Waveform  
After the START bit, the master device sends the 7-bit slave address (see section 4.2) to the HS310x, followed  
by the read/write bit, which indicates the transfer direction of any subsequent data. This bit is set to 1 to indicate  
a read from slave to master, or set to 0 to indicate a write from master to slave.  
All transfers consist of 8 bits and a response bit: 0 for Acknowledge (ACK) or 1 for Not Acknowledge (NACK).  
After the ACK is received, another data byte can be transferred or the communication can be stopped with a  
STOP bit.  
4.4  
Measurement Mode  
The HS310x is factory-programmed to operate in Sleep Mode. In Sleep Mode, the sensor waits for commands  
from the master before taking measurements. The digital core only performs conversions when it receives a  
Measurement Request command (MR); otherwise, it is always powered down.  
4.5  
Measurement Requests (MR)  
The MR command is required to wake up the HS310x from its Sleep Mode. Initiate the Measurement Request by  
sending the 7-bit slave address followed by an eighth bit = 0 (WRITE).  
A measurement cycle consists of a humidity and temperature conversion followed by the digital signal processor  
(DSP) correction calculations. At the end of a measurement cycle, the digital output register will be updated  
before powering down.  
The output is always scaled to 14 bits. The order of the bits is big-endian.  
S
1
0
0
0
1
0
0
W A  
(0)  
S
Wait for  
Device Slave Address [6:0]  
Slave ACK  
Start Condition  
Stop Condition  
Acknowledge (ACK)  
Slave Address Bit  
(MSB first)  
Read/Write  
(Example: Write = 0)  
S
S
A
W
Figure 15. Measurement Request  
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Apr 14, 2021  
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HS310x Datasheet  
4.6  
Data Fetch (DF)  
At the end of a measurement cycle, valid data can be fetched. The status bits of the DF results can be used to  
detect if the data is valid or stale (see Status Bits); otherwise, wait for the measurements to complete before  
performing the DF.  
The DF command starts with the 7-bit slave address followed by an eighth bit = 1 (READ). The HS310x as a  
slave sends an acknowledge (ACK) indicating success.  
The number of data bytes returned by the HS310x is determined by when the master sends the NACK and  
STOP condition. The full 14 bits of the humidity data are fetched in the first two bytes. The two MSBs of the first  
byte are the status bits.  
The 14 bits of temperature data follow the humidity data. The last two bits (LSBs) of the fourth data byte are  
undetermined and should be masked off. In the event that the temperature data is not needed, the read can be  
terminated by sending a NACK after the second byte.  
Alternatively, if only 8-bit resolution is desired for the temperature output, the read can be terminated after the  
third byte by issuing a NACK followed by a stop bit. The measurement time depends on the configured sensor  
resolution. The following table lists examples when the resolutions for the relative humidity and temperature  
measurements are the same. For different relative humidity and temperature resolution settings, the  
measurement times in 3 should be used, along with the 0.1ms wake-up time.  
For example, an 8-bit relative humidity measurement and a 12-bit temperature measurement results in a total  
measurement time of:  
0.1 ms + 0.55 ms + 4.5 ms = 5.15 ms.  
RH+T measurement times (including wake-up time) at different resolution settings.  
Resolution[1]  
(bits)  
Measurement  
Time (ms)  
8
1.20  
2.72  
10  
12  
14  
9.10  
33.90  
1Same resolutions are assumed for both relative humidity and temperature.  
S
1
0
0
0
1
0
0
R
(1)  
A 15 14 13 12 11 10 9 8 A 7 6 5 4 3 2 1 0 N S  
Device Slave Address [6:0]  
Humidity Data [13:8]  
Humidity Data [7:0]  
Wait for  
Slave ACK  
Master ACK  
Master ACK  
Master NACK  
S
1
0
0
0
1
0
0
R
(1)  
A 15 14 13 12 11 10  
9
8
A
7
6 5 4 3 2 1 0 A 15 14 13 12 11 10 9 8 A 7 6 5 4 3 2 1 0 N S  
Device Slave Address [6:0]  
Humidity Data [13:8]  
Acknowledge (ACK)  
Humidity Data [7:0]  
Temp. Data [15:8]  
Temp. Data [7:2] Mask [1:0]  
Start Condition  
Stop Condition  
Not Acknowledge  
(NACK)  
Read/Write  
(Read = 1)  
S
S
A
2
N
R
Slave Address Bit (MSB first)  
Command or Data Bit (Example: Bit 2)  
Status Bit  
Figure 16. Data Fetch  
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HS310x Datasheet  
4.7  
Status Bits  
The status bits are used to indicate the current state of the fetched data. The two MSBs of the humidity data byte  
are the status bits (see the following table).  
Table 2. Status Bits  
Status Bits  
00B  
Definition  
Valid Data: Data that has not been fetched since the last measurement cycle.  
01B  
Stale Data: Data that has already been fetched since the last measurement cycle.  
Note: If a data fetch is performed before or during the first measurement after power-on reset, then the stale status will  
be returned but this data is actually invalid since the first measurement has not been completed.  
4.8  
Accessing the Non-volatile Memory  
The HS310x series non-volatile memory stores its measurement resolution setting and its ID number. To change  
the sensor resolution or read the ID number, the master must place the HS310x into programming mode while  
the chip is powering up. The following figure shows the sequence of commands needed to enter the  
programming mode, which must be sent within 10ms after applying power to the sensor. The master must send  
the I2C address and a Write bit followed by the command 0xA0|0x00|0x00.  
Figure 17. Sequence of Commands to Enter Programming Mode  
This command takes 120µs to process, after which the master has access to the non-volatile memory registers  
listed in the following table. All of these registers are 16 bits wide.  
To return to normal sensor operation and perform measurements, the master must send the I2C address and a  
Write bit, followed by the command: 0x80|0x00|0x00.  
Table 3. Non-volatile Memory Registers  
Address  
0x06  
Register Description  
Humidity Sensor Resolution – Read Register (bits [11:10])  
Humidity Sensor Resolution – Write Register (bits [11:10])  
Temperature Sensor Resolution – Read Register (bits [11:10])  
Temperature Sensor Resolution – Write Register (bits [11:10])  
Read Sensor ID – Upper 2 bytes  
0x46  
0x11  
0x51  
0x1E  
0x1F  
Read Sensor ID – Lower 2 bytes  
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HS310x Datasheet  
4.9  
Setting the Measurement Resolution  
The HS310x series relative humidity and temperature measurement resolutions can be set independently to 8,  
10, 12, or 14 bits by writing to the non-volatile memory, and are initially set to 14 bits by default. The procedure  
to set the humidity sensor resolution is illustrated in the following figure. The relative humidity and temperature  
resolution can be read in registers 0x06 and 0x11, respectively, or written in registers 0x46 or 0x51. The  
resolution information is stored in bits [11:10] of these registers, as listed in the following table. All of the other  
bits in these registers must be left unchanged. As such, before writing new resolution settings, the contents of  
the read registers must be read, and only bits [11:10] can be changed in the write registers. Once bits [11:10] are  
changed to set the desired resolution, the entire register must be written back to the HS310x sensor.  
Figure 18. Sequence of Commands to Change the Relative Humidity Resolution  
Table 4. Register Values for Different Resolution Settings  
Resolution Register  
Bits [11:10]  
Resolution  
(bits)  
00B  
01B  
10B  
11B  
8
10  
12  
14  
The sensor non-volatile memory requires 120µs to load the data into the registers after step 1, and requires  
14ms to write the data after step 4. Failure to comply with these processing times may result in data corruption  
and introduce errors in sensor measurements. The procedure to change the temperature sensor resolution is the  
same as that depicted in Figure 18, except the register address in Step 1 must be set to 0x11 and the register  
address in Step 4 will be 0x51.  
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HS310x Datasheet  
4.10 Reading the HS310x ID Number  
The sensor ID is a 32-bit number, and can be read in a similar fashion as illustrated in steps 1 and 2 of  
Figure 18, using the appropriate register address values. The ID number is stored in two registers, with the  
upper and lower 16 bits stored in register addresses 0x1E and 0x1F, respectively.  
5. Calculating Humidity and Temperature Output  
The entire output of the HS310x is 4 bytes. The relative humidity (in percent) and the temperature (in degrees  
Celsius) are calculated using Equation 1 and Equation 2, respectively.  
Humidity [13 : 0]  
(EQ) 1  
(EQ) 2  
Humidity [%RH] =  
100  
2
14 1  
Temperature [15 : 2]  
Temperature [ oC] =  
165 40  
2
14 1  
6. Application Circuit  
VDD  
RP  
RP  
1 SCL  
VSS 6  
2 SDA  
3 VC  
NC 5  
VDD 4  
0.1µF  
0.1µF  
RP = Pull-up resistor (2.2kΩ typical)  
Figure 17. HS310x Application Circuit (Top View)  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 15  
 
 
 
HS310x Datasheet  
7. Package Outline Drawings  
The package outline drawings are located at the end of this document and are accessible from the Renesas  
website. The package information is the most current data available and is subject to change without revision of  
this document.  
8. Soldering Information  
This section discusses soldering considerations for the HS310x. When a relative humidity sensor is exposed to  
the high heat associated with the soldering process, the sensor element tends to dry out. To avoid an offset in  
the relative humidity readings, the sensor element must be rehydrated after the soldering process. Care must  
also be taken when selecting the temperatures and durations involved in the soldering process to avoid  
irreversibly damaging the sensor element.  
The recommended soldering profile for a lead-free (RoHS-compliant) process is shown below.  
Figure 19. Recommended Soldering Profile  
It is important to ensure this temperature profile is measured at the sensor itself. Measuring the profile at a larger  
component with a higher thermal mass means the temperature at the small sensor will be higher than expected.  
For manual soldering, the contact time must be limited to 5 seconds with a maximum iron temperature of 350°C.  
In either case, a board wash after soldering is not recommended. Therefore, if a solder paste is used, it is  
strongly recommended that a “no-clean” solder paste is used to avoid the need to wash the PCB.  
After soldering, the recommended rehydration conditions are either:  
A relative humidity of 75% RH at room temperature for at least 12 hours  
A relative humidity of 40% to 50% RH at room temperature for 3 to 5 days  
Otherwise, in the relative humidity readings, there may be an initial offset that will slowly disappear as the sensor  
is exposed to ambient conditions.  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 16  
 
 
 
HS310x Datasheet  
9. PCB Layout Guide  
When designing the PCB, undesired heat transfer paths to the HS310x series must be minimized. Excessive  
heat from other components on the PCB will result in inaccurate temperature and relative humidity  
measurements. As such, solid metal planes for power supplies should be avoided in the vicinity of the sensor  
since these will act as thermal conductors. To further reduce the heat transfer from other components on the  
board, openings can be milled into the PCB as shown in the following figure.  
Figure 20. Milled PCB Openings for Thermal Isolation  
10. Storage and Handling  
Renesas recommends that once the sensors are removed from their original packaging, store them in metal-in  
antistatic bags.  
Avoid using polyethylene antistatic bags as they may affect sensor accuracy.  
The nominal storage conditions are 10 to 50°C and humidity levels within 20% to 60%RH. If stored outside of  
these conditions for extended periods of time, the sensor readings may exhibit an offset. The sensor can be  
reconditioned and brought back to its calibration state by applying the following procedure:  
1. Bake at a temperature of 100°C with a humidity < 10%RH for 10 to 12 hours.  
2. Rehydrate the sensor at a humidity of 75%RH and a temperature between 20 to 30°C for 12 to 14 hours.  
11. Quality and Reliability  
The HS310x series is available as a qualified product for consumer and industrial market applications. All data  
specified parameters are guaranteed if not stated otherwise.  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 17  
 
 
 
 
HS310x Datasheet  
12. Ordering Information  
Part Number  
Description and Package  
Carrier Type  
Temp. Range  
HS3101  
Digital Relative Humidity and Temperature Sensor.  
Reel  
-40°C to +125°C  
±1.5%RH (Typical), 3.0 × 2.41 × 0.9mm, 6-LGA (LHG6D1)  
HS3102  
HS3103  
HS3104  
Digital Relative Humidity and Temperature Sensor.  
Reel  
Reel  
Reel  
-40°C to +125°C  
-40°C to +125°C  
-40°C to +125°C  
±1.8%RH (Typical), 3.0 × 2.41 × 0.9mm, 6-LGA (LHG6D1)  
Digital Relative Humidity and Temperature Sensor.  
±2.5%RH (Typical), 3.0 × 2.41 × 0.9mm, 6-LGA (LHG6D1)  
Digital Relative Humidity and Temperature Sensor.  
±3.5%RH (Typical), 3.0 × 2.41 × 0.9mm, 6-LGA (LHG6D1)  
13. Revision History  
Revision  
1.1  
Date  
Description  
Apr 14, 2021  
Mar 10, 2021  
Added operating humidity range in “Recommended Operating Conditions”  
Initial release.  
1.0  
X0116303 Rev.1.1  
Apr 14, 2021  
Page 18  
 
 
6-LGA Package Outline Drawing  
3.0 x 2.41 x 0.9 mm Body, 1.0mm Pitch  
LHV6D1, PSC-4844-01, Rev 00, Page 1  
1
2
3
6
5
4
© Renesas Electronics Corporation  
6-LGA Package Outline Drawing  
3.0 x 2.41 x 0.9 mm Body, 1.0mm Pitch  
LHV6D1, PSC-4844-01, Rev 00, Page 2  
6
5
4
1
2
3
Package Revision History  
Description  
Date Created Rev No.  
Feb 27, 2020 Rev 00 Initial Release  
© Renesas Electronics Corporation  
IMPORTANT NOTICE AND DISCLAIMER  
RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL  
SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING  
REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND  
OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED,  
INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A  
PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.  
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible  
for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3)  
ensuring your application meets applicable standards, and any other safety, security, or other requirements. These  
resources are subject to change without notice. Renesas grants you permission to use these resources only for  
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prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property.  
Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims,  
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to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources  
expands or otherwise alters any applicable warranties or warranty disclaimers for these products.  
(Rev.1.0 Mar 2020)  
Corporate Headquarters  
Contact Information  
TOYOSU FORESIA, 3-2-24 Toyosu,  
Koto-ku, Tokyo 135-0061, Japan  
www.renesas.com  
For further information on a product, technology, the most  
up-to-date version of a document, or your nearest sales  
office, please visit:  
www.renesas.com/contact/  
Trademarks  
Renesas and the Renesas logo are trademarks of Renesas  
Electronics Corporation. All trademarks and registered  
trademarks are the property of their respective owners.  
© 2020 Renesas Electronics Corporation. All rights reserved.  

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