HZS4.7NB1TD-E [RENESAS]
HZS4.7NB1TD-E;
| 型号： | HZS4.7NB1TD-E |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | HZS4.7NB1TD-E |
| 文件： | 总9页 (文件大小：171K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
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April 1010
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Issued by: Renesas Electronics Corporation ()
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HZS-N Series
Silicon Planar Zener Diode for Stabilized Power Supply
REJ03G0185-0300
Rev.3.00
Nov 12, 2007
Features
•
Low leakage, low zener impedance and maximum power dissipation of 400 mW are ideally suited for stabilized
power supply, etc.
•
•
Wide voltage range from 1.88 V through 38.52 V of zener voltage provide flexible application.
Suitable for 5mm-pitch high speed automatic insertion.
Ordering Information
Part No.
Cathode Band
Package N
Package Code
HZS-N Series
Black
M
GRZZ0002ZC-A
Pin Arrangement
2
1
nd
1. Cathode
2. Anode
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 1 of 6
HZS-N Series
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Value
400
Unit
Power dissipation
Pd
mW
°C
Junction temperature
Storage temperature
Tj
200
Tstg
–55 to +175
°C
Electrical Characteristics
(Ta = 25°C)
Zener Voltage
VZ (V)*1
Reverse Current
Test
Dynamic Resistance
Test
Condition
Test
IR (μA)
Max
Condition
VR (V)
0.5
rd (Ω)
Max
Condition
IZ (mA)
5
Type
Grade
B1
B2
B1
B2
B1
B2
B1
B2
B1
B2
B1
B2
B1
B2
B1
B2
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
Min
1.88
2.02
2.12
2.22
2.33
2.43
2.54
2.69
2.85
3.01
3.16
3.32
3.47
3.62
3.77
3.92
4
4.8
4.97
5.12
5.29
5.46
5.64
5.81
5.99
6.16
6.32
6.52
6.70
Max
2.10
2.20
2.30
2.41
2.52
2.63
2.75
2.91
3.07
3.22
3.38
3.53
3
7
4.91
5.03
5.18
5.35
5.52
5.70
5.88
6.06
6.24
6.40
6.59
6.79
6.97
IZ (mA)
HZS2.0N
5
120
100
HZS2.2N
HZS2.4N
HZS2.7N
HZS3.0N
HZS3.3N
HZS3.6N
HZS3.9N
HZS4.3N
5
5
5
5
120
12
5
1.0
1.0
1.0
1.0
100
100
110
120
120
120
120
120
5
5
5
5
5
5
5
5
5
HZS4.7N
HZS5.1N
HZS5.6N
HZS6.2N
HZS6.8N
5
5
5
5
5
5
5
5
5
2
1.0
1.5
2.5
3.0
3.5
100
70
40
30
25
5
5
5
5
5
Note: 1. Tested with pulse (PW = 40 ms)
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 2 of 6
HZS-N Series
(Ta = 25°C)
Dynamic Resistance
Test
Zener Voltage
VZ (V)*1
Reverse Current
Test
Test
Condition
IR (μA)
Max
0.5
Condition
rd (Ω)
Max
25
Condition
IZ (mA)
5
Type
Grade
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B1
B2
B3
B4
B1
B2
B3
B4
B1
B2
B3
B4
Min
Max
7.19
IZ (mA)
VR (V)
HZS7.5N
6.88
5
4.0
7.11
7.41
7.33
7.64
HZS8.2N
HZS9.1N
HZS10N
HZS11N
HZS12N
HZS13N
HZS15N
HZS16N
HZS18N
HZS20N
HZS22N
7.56
7.90
5
5
5
5
5
5
5
5
0.5
0.5
0.2
0.2
0.2
0.2
0.2
0.2
5.0
6.0
7.0
8.0
20
20
20
20
25
25
25
25
30
30
30
5
5
5
5
5
5
5
5
5
5
5
7.82
8.15
8.07
8.41
8.33
8.70
8.61
8.99
8.89
9.29
9.19
9.59
9.48
9.90
9.82
10.30
10.63
10.95
11.26
11.63
11.92
12.30
12.71
13.16
13.62
14.09
14.5
1
8
0.45
21.08
21.65
22.09
22.61
23.12
23.73
24.27
24.81
25.52
26.26
26.95
27.64
10.18
10.50
10.82
11.13
11.50
11.80
12.18
12.59
13.03
13.48
13.95
14.42
14.87
15.33
15.79
16
20.
20.76
21.22
21.68
22.26
22.75
23.29
23.81
24.26
24.97
25.63
26.29
11
12
13
15
17
HZS24N
HZS27N
5
5
0.2
0.2
19
21
35
45
5
5
Note: 1. Tested with pulse (PW = 40 ms)
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 3 of 6
HZS-N Series
(Ta = 25°C)
Dynamic Resistance
Test
Zener Voltage
VZ (V)*1
Reverse Current
Test
Test
Condition
IR (μA)
Condition
VR (V)
rd (Ω)
Condition
IZ (mA)
5
Type
Grade
B1
B2
B3
B4
B1
B2
B3
B4
B1
B2
B3
B4
B1
B2
B3
B4
Min
Max
IZ (mA)
Max
Max
HZS30N
26.99
27.70
28.36
29.02
29.68
30.32
30.90
31.49
32.14
32.79
33.40
34.01
34.68
35.36
36.00
36.63
28.39
29.13
29.82
30.51
31.22
31.88
32.50
33.11
33.79
34.49
35.13
35.77
36.47
37.19
37.85
38.52
5
0.2
23
25
27
55
65
75
85
HZS33N
HZS36N
HZS39N
5
5
5
0.2
0.2
0.2
5
5
5
Notes: 1. Tested with pulse (PW = 40 ms).
2. Part No. is as follows: HZS2.0NB1, HZS2.0NB2, •••
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 4 of 6
HZS-N Series
Main Characteristic
10
8
6
4
2
0
0
4
8
12
16
Zener Voltag
Fig.1 Zener cu
20
40
0.10
500
400
300
200
100
0
l
%/°C
0.08
2.5 mm
3 mm
0.06
0.04
Printed circuit board
100 180 1.6t mm
Material: paper phenol
×
×
0.02
0
l
= 5 mm
0
0
−0.02
−0.04
−0.06
−0.08
−0.10
−10
−20
−30
−40
−50
l
=
10 mm
(Publication value)
0
5
10 15 20 25 30 35 40
0
50
Ambient Temperature Ta (°C)
Fig.3 Power Dissipation vs. Ambient Temperature
100
150
200
Zener Voltage VZ (V)
Fig.2 Temperature Coefficient vs. Zener voltage
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 5 of 6
HZS-N Series
Package Dimensions
Package Name
MHD
JEITA Package Code
⎯
RENESAS Code
GRZZ0002ZC-A
Previous Code
MHD / MHDV
MASS[Typ.]
0.084g
L
E
L
Dimension in Millimeters
Reference
Symbol
Min
-
-
-
Nom
0.4
2.0
-
Max
-
-
2.4
-
φb
φD
E
L
26.0
-
REJ03G0185-0300 Rev.3.00 Nov 12, 2007
Page 6 of 6
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Notes:
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes
warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property
rights or any other rights of Renesas or any third party with respect to the information in this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,
but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass
destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws
and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this
document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,
please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be
disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a
result of errors or omissions in the information included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability
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have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and cts in any of the foregoing
applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated coployees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, g, operating supply voltage range,
movement power voltage range, heat radiation characteristics, installation and other no liability for malfunctions or damages
arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its productuch as the occurrence of failure at a certain
rate and malfunctions under certain use conditions. Please be sure to implemssibility of physical injury, and injury or damage
caused by fire in the event of the failure of a Renesas product, such as safeg but not limited to redundancy, fire control and
malfunction prevention, appropriate treatment for aging degradation or an, since the evaluation of microcomputer software
alone is very difficult, please evaluate the safety of the final products or
11. In case Renesas products listed in this document are detached from are attached or affixed, the risk of accident such as
swallowing by infants and small children is very high. You should iproducts may not be easily detached from your products.
Renesas shall have no liability for damages arising out of such d
12. This document may not be reproduced or duplicated, in any foapproval from Renesas.
13. Please contact a Renesas sales office if you have any queshis document, Renesas semiconductor products, or if you have
any other inquiries.
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http://www.renesas.com
Refer to "http://www.renesas.coiled information.
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