IS9-705RH-T [RENESAS]
1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDFP8, DFP-8;
| 型号： | IS9-705RH-T |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDFP8, DFP-8 光电二极管 |
| 文件： | 总2页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Radiation Hardened Power-Up/Down
Microprocessor Reset Circuit
IS-705RH
Features
• Electrically Screened to SMD #5962-00538
• QML Qualified per MIL-PRF-38535 Requirements
• Radiation Hardness
- Total Dose . . . . . . . . . . . . . 100 krad(Si) (Min)
- Single Event Latch-up . . . . . . >90MeV/mg/cm
The Radiation Hardened IS-705RH
is a monolithic device that
monitors the power supply voltage
used by satellite control units and
provides a reset output pulse
TM
2
during power-up and power-down. The reset threshold
is 4.65V (Typ) and the reset pulse width is set at 200ms
(Typ). A watchdog circuit is incorporated for easy
interfacing with microprocessors and controllers. If the
watchdog input has not been toggled within a preset
1.6s (Typ) time period, an output signal is generated,
which can be used as an interrupt. The power function
input (PFI) may be used to monitor other voltage levels.
The circuit has a 1.25V (Typ) threshold and provides a
PFO output when low voltage is detected. An active-low
manual reset input is also provided for direct control of
the reset function.
• Precision 4.65V Voltage Monitor
• Supply Voltage Range . . . . . . . . . 4.75V to 5.5V
• RESET Valid at V
CC
= 1.2V
• Low Supply Current . . . . . . . . . . . . .420µA (Typ)
• 200ms (Typ) RESET Pulse Width
Applications
• Flight Computers
• Controllers
• Critical Microprocessor Power Monitoring
• Reliable Replacement of Discrete Solutions
Constructed with the Intersil UHF2X-CMOS process,
these devices have been specifically designed to provide
highly reliable performance in harsh radiation
environments. This process has been tested for single
event latch-up and has demonstrated an immunity to
90MeV/mg/cm .
Pin Configuration
2
IS-705RH
(8 LD FLATPACK)
TOP VIEW
Specifications for Rad Hard QML devices are
controlled by the Defense Supply Center in
Columbus (DSCC). The SMD numbers listed here
must be used when ordering.
MR
1
2
3
4
8
7
6
5
WDO
RESET
WDI
V
CC
Detailed Electrical Specifications for these
devices are contained in SMD 5962-00538. A
“hot-link” is provided on our homepage for
downloading.
GND
PFI
PFO
http://www.dscc.dla.mil/downloads/milspec/s
md/00538.pdf
Ordering Information
ORDERING
NUMBER
INTERNAL
MKT. NUMBER
PART
MARKING
TEMP. RANGE
PACKAGE
(Pb-Free)
(°C)
5962R0053801V9A
IS0-705RH/SAMPLE
IS0-705RH-Q
-55 to +125
-55 to +125
-55 to +125
DIE
IS0-705RH/SAMPLE
IS9-705RH-8
DIE SAMPLE
5962R0053801QXC
(Note)
Q 5962R00 53801QXC
Q 5962R00 53801VXC
IS9- 705RH /PROTO
8 Ld Flatpack, Solder SL
5962R0053801VXC
(Note)
IS9-705RH-Q
-55 to +125
-55 to +125
8 Ld Flatpack, Solder SL
8 Ld Flatpack, Solder SL
IS9-705RH/PROTO
(Note)
IS9-705RH/PROTO
NOTE: These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant
and compatible with both SnPb and Pb-free soldering operations.
March 23, 2010
FN4703.6
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007, 2010. All Rights Reserved
1
Star*Power™ is a trademark of Intersil Americas Inc.
IS-705RH
Die Characteristics
DIE DIMENSIONS:
Process:
1500μmx1830µm (59milsx72mils)
UHF2X-CMOS, Junction Isolation
Thickness: 483µm ±25.4μm (19mils ±1mil)
Backside Finish:
INTERFACE MATERIALS
Glassivation
Silicon
ASSEMBLY RELATED INFORMATION
Substrate Potential:
Type: Nitride (Si N ) over Silox (SiO )
3 4
2
Nitride Thickness: 4.0kÅ ±1.0kÅ
Silox Thickness: 12.0kÅ ±4.0kÅ
Unbiased
(May be left floating or connected to GND.)
Top Metallization
ADDITIONAL INFORMATION
Worst Case Current Density:
Top Metal 3: TiAlCu
Thickness: 0.8µm ±0.02µm
Metal 1 and 2: TiAlCu
5
2
<2.0 x 10 A/cm
Thickness: 0.4µm ±0.01µm
Metallization Mask Layout
IS-705RH
MR (1)
WDO (8)
VCC (2)
RESET (7)
WDI (6)
GND (3)
PFI (4)
PFO (5)
NOTE: Octagonal trim pads should be left unconnected.
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications
at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN4703.6
March 23, 2010
2
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