ISL3152EIBZ-T [RENESAS]
Large 3V Output Swing, 16.5kV ESD, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceivers;
| 型号： | ISL3152EIBZ-T |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | Large 3V Output Swing, 16.5kV ESD, Full Fail-Safe, 1/8 Unit Load, RS-485/RS-422 Transceivers 驱动 信息通信管理 光电二极管 接口集成电路 驱动器 |
| 文件： | 总34页 (文件大小：1370K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Large 3V Output Swing, 16.5kV ESD, Full Fail-Safe, 1/8 Unit Load,
RS-485/RS-422 Transceivers
FN6363
Rev.4.00
Apr 19, 2018
The ISL315xE family of 5V powered RS-485/RS-422
transceivers features high output drive and high ESD
protection. The devices withstand ±16.5kV IEC61000-4-
2 ESD strikes without latch-up. The large output voltage
of 3.1V typical into a 54Ω load provides high noise
immunity, and enables the drive of up to 8000ft long bus
segments, or eight 120Ω terminations in a star topology.
Features
• High V : 3.1V (Typ) into R = 54Ω
OD
D
• Low bus currents: 125µA constitutes a true 1/8 unit
load
• Allows for up to 512 transceivers on the bus
• ±16.5kV ESD protection on bus I/O pins
• High transient overvoltage tolerance of ±100V
• Full fail-safe outputs for open or shorted inputs
These devices possess less than 125µA bus input
currents, thus constituting a true 1/8 unit load. The high
output drive combined with the low bus input currents
allows for connecting up to 512 transceivers on the same
bus.
• Hot plug capability - driver and receiver outputs
remain high-impedance during power-up and
power-down
The receiver inputs feature a full fail-safe design that
turns the receiver outputs high when the bus inputs are
open or shorted.
• Supported data rates: 115kbps, 1Mbps, 20Mbps
• Low supply current (driver disabled): 550µA
• Ultra-low shutdown current: 70nA
The ISL315xE family includes half and full-duplex
transceivers with active-high driver-enable pins and
active-low receiver enable pins. These transceivers
support data rates of 115kbps, 1Mbps, and 20Mbps.
Their performance is characterized from -40°C to +85°C.
Applications
• Automated utility e-meter reading systems
• High node count systems
Related Literature
For a full list of related documents, visit our website
• PROFIBUS and Fieldbus systems in factory
automation
• ISL3150E, ISL3152E, ISL3153E, ISL3155E,
ISL3156E, and ISL3158E product pages
• Security camera networks
• Lighting, elevator, and HVAC control systems in
building automation
• Industrial process control networks
• Networks with star topology
• Long-haul networks in coal mines and oil rigs
140
130
3
120
110
100
90
80
70
60
50
40
30
20
10
0
6 x 120Ω
Terms
ISL3158E
2
2 x 120Ω
Terms
8 x 120Ω
Terms
1
0
Standard
Transceiver
-1
1 x 120Ω
Term
-2
20Mbps, 150' UTP, Double 120Ω Termination
0
1
1.5
2
3
4
5
-3
Differential Output Voltage (V)
20ns/Div
Figure 1. Typical Driver Output Performance of ISL315xE Transceivers
FN6363 Rev.4.00
Apr 19, 2018
Page 1 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Contents
1.
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
1.2
1.3
1.4
Typical Operating Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.
Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1
2.2
2.3
2.4
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.
4.
5.
Test Circuits and Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Device Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1
5.2
5.3
5.4
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Device Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.
Application Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.1
6.2
6.3
Network Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Transient Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
7.
8.
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FN6363 Rev.4.00
Apr 19, 2018
Page 2 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
1. Overview
1. Overview
1.1
Typical Operating Circuit
5V
5V
100n
100n
8
8
R
B
V
CC
V
10k
(optional)
CC
10k
R
A
B
B
RO
RE
DE
DI
RO
RE
DE
DI
(optional)
R
R
R
R
T
A/Y
B/Z
RL78
MCU
RL78
MCU
B
R
T
(optional)
Y
Z
D
D
R
B
10k
10k
GND
5
10k
10k
GND
5
(optional)
Figure 2. Typical Operating Circuits of Half-Duplex and Full-Duplex Transceivers
1.2
Ordering Information
Tape and Reel
(Units) (Note 1)
Package
(RoHS Compliant)
Part Number (Notes 2, 3)
ISL3150EIBZ
Part Marking
3150EIBZ
3150EIBZ
3150EIBZ
3150Z
Temp. Range (°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
Pkg. Dwg. #
M14.15
M14.15
M14.15
M10.118
M10.118
M10.118
M8.15
-
14 Ld SOIC
14 Ld SOIC
14 Ld SOIC
10 Ld MSOP
10 Ld MSOP
10 Ld MSOP
8 Ld SOIC
ISL3150EIBZ-T
ISL3150EIBZ-T7A
ISL3150EIUZ
2.5k
250
-
ISL3150EIUZ-T
ISL3150EIUZ-T7A
ISL3152EIBZ
3150Z
2.5k
250
-
3150Z
3152EIBZ
3152EIBZ
3152EIBZ
3152EIBZ
ISL3152 EIPZ
3152Z
ISL3152EIBZ-T
ISL3152EIBZ-T7
ISL3152EIBZ-T7A
ISL3152EIPZ
2.5k
1k
8 Ld SOIC
M8.15
8 Ld SOIC
M8.15
250
-
8 Ld SOIC
M8.15
8 Ld PDIP
E8.3
ISL3152EIUZ
-
8 Ld MSOP
8 Ld MSOP
8 Ld MSOP
14 Ld SOIC
10 Ld MSOP
10 Ld MSOP
10 Ld MSOP
8 Ld SOIC
M8.118
M8.118
M8.118
M14.15
M10.118
M10.118
M10.118
M8.15
ISL3152EIUZ-T
ISL3152EIUZ-T7A
ISL3153EIBZ-T
ISL3153EIUZ
3152Z
2.5k
250
2.5k
-
3152Z
3153EIBZ
3153Z
ISL3153EIUZ-T
ISL3153EIUZ-T7A
ISL3155EIBZ
3153Z
2.5k
250
-
3153Z
3155EIBZ
3155EIBZ
3155EIBZ
3155Z
ISL3155EIBZ-T
ISL3155EIBZ-T7A
ISL3155EIUZ
2.5k
250
-
8 Ld SOIC
M8.15
8 Ld SOIC
M8.15
8 Ld MSOP
8 Ld MSOP
14 Ld SOIC
M8.118
M8.118
M14.15
ISL3155EIUZ-T
ISL3156EIBZ
3155Z
2.5k
-
3156EIBZ
FN6363 Rev.4.00
Apr 19, 2018
Page 3 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
1. Overview
Tape and Reel
Package
Part Number (Notes 2, 3)
ISL3156EIBZ-T
ISL3156EIBZ-T7A
ISL3156EIUZ
Part Marking
3156EIBZ
3156EIBZ
3156Z
Temp. Range (°C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
(Units) (Note 1)
(RoHS Compliant)
Pkg. Dwg. #
2.5k
250
-
14 Ld SOIC
14 Ld SOIC
10 Ld MSOP
10 Ld MSOP
10 Ld MSOP
8 Ld SOIC
M14.15
M14.15
M10.118
M10.118
M10.118
M8.15
ISL3156EIUZ-T
ISL3156EIUZ-T7A
ISL3158EIBZ
3156Z
2.5k
250
-
3156Z
3158EIBZ
3158EIBZ
3158EIBZ
3158Z
ISL3158EIBZ-T
ISL3158EIBZ-T7A
ISL3158EIUZ
2.5k
250
-
8 Ld SOIC
M8.15
8 Ld SOIC
M8.15
8 Ld MSOP
8 Ld MSOP
8 Ld MSOP
M8.118
M8.118
M8.118
ISL3158EIUZ-T
ISL3158EIUZ-T7A
Notes:
3158Z
2.5k
250
3158Z
1. Refer to TB347 for details about reel specifications.
2. These Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and
100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see the product information pages for the ISL3150E, ISL3152E, ISL3153E, ISL3155E,
ISL3156E, and ISL3158E. For more information about MSL, see TB363.
Table 1. Key Differences of Device Features
Part Number
ISL3150E
ISL3152E
ISL3153E
ISL3155E
ISL3156E
ISL3158E
Duplex
Full
Data Rate (Mbps) Rise/Fall Time (ns) Tx/Rx Skew (ns)
Bus ESD (kV)
Pin Count
0.115
0.115
1
1100
1100
150
150
8
12/4
12/4
±10
±16
±10
±16
±10
±16
10, 14
Half
Full
8
10, 14
8
3/4
Half
Full
1
3/4
20
0.2/2.5
0.2/2.5
10, 14
8
Half
20
8
FN6363 Rev.4.00
Apr 19, 2018
Page 4 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
1. Overview
1.3
Pin Configurations
ISL3152E, ISL3155E, ISL3158E
(8 Ld MSOP, 8 Ld SOIC, 8 Ld PDIP)
Top View
ISL3150E, ISL3153E, ISL3156E
(10 Ld MSOP)
ISL3150E, ISL3153E, ISL3156E
(14 Ld SOIC)
Top View
Top View
RO
RE
DE
DI
1
2
3
4
R
8
7
6
5
V
V
CC
RO
RE
1
2
3
4
5
R
10
9
V
CC
NC
RO
1
2
3
4
5
6
7
14
CC
B/Z
A
B
Z
R
13 NC
A/Y
DE
8
RE
12
11
10
9
A
D
GND
DI
D
7
DE
B
GND
6
Y
DI
D
Z
GND
GND
Y
8
NC
1.4
Pin Descriptions
8 Ld
SOIC
10 Ld
MSOP
14 Ld
SOIC
Pin
Name
Function
1
2
3
4
1
2
3
4
5
RO
RE
DE
DI
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low. RO is Fail-safe
High if A and B are unconnected (open) or shorted.
2
3
4
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is
high.
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They
are high impedance when DE is low.
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces
output Y high and output Z low.
5
6
5
–
6, 7
–
GND
A/Y
Ground connection.
Non-inverting receiver input and non-inverting driver output. Pin is an input if DE = 0; pin is
an output if DE = 1.
7
–
–
B/Z
Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output
if DE = 1.
–
–
–
–
8
–
6
7
9
10
Y
Z
Non-inverting driver output.
Inverting driver output.
8
11
B
Inverting receiver input.
9
12
A
Non-inverting receiver input.
System power supply input (4.5V to 5.5V).
No connection.
10
–
–
VCC
NC
1, 8, 13
FN6363 Rev.4.00
Apr 19, 2018
Page 5 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2. Specifications
2. Specifications
2.1
Absolute Maximum Ratings
Parameter (Note 4)
Minimum
Maximum
Unit
V
VCC to Ground
7
VCC + 0.3
13
Input Voltages at DI, DE, RE
-0.3
-9
V
Bus I/O Voltages at A/Y, B/Z, A, B, Y, Z
V
Transient Pulse Voltages through 100Ω at A/Y, B/Z, A, B, Y, Z (Note 5)
±100
V
RO
-0.3
VCC + 0.3
Continuous
V
Short Circuit Duration at Y, Z
ESD Rating
See “Electrical Specifications” on page 8.
Note:
4. Absolute Maximum ratings mean the device will not be damaged if operated under these conditions. It does not guarantee
performance.
5. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may
adversely impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
Thermal Resistance (Typical, Note 6)
θJA (°C/W)
105
8 Ld SOIC
8 Ld MSOP, PDIP
10 Ld MSOP
14 Ld SOIC
Notes:
140
130
130
6. θJA is measured with the component mounted on a high-effective thermal conductivity test board in free air. See TB379 for
details.
Parameter
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
Pb-Free Reflow Profile (Note 7)
Note:
Minimum
Maximum
+150
Unit
°C
-65
+150
°C
See TB493
7. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder
processing applications.
2.3
Recommended Operating Conditions
Parameter
Minimum
Maximum
5.5
Unit
V
Supply Voltage
4.5
-40
-7
Temperature Range
+85
°C
V
Bus Pin Common-Mode Voltage Range
+12
FN6363 Rev.4.00
Apr 19, 2018
Page 6 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2. Specifications
2.4
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 8). Boldface limits
apply across the operating temperature range, -40°C to +85°C.
Temp
(°C)
Min
Parameter
Symbol
Test Conditions
(Note 16) Typ Max (Note 16) Unit
DC Characteristics
Driver Differential Output
Voltage (No load)
VOD1
Full
-
-
VCC
V
Driver Differential Output
Voltage (Loaded)
VOD2
RL = 100Ω (RS-422) (Figure 3)
RL = 54Ω (RS-485) (Figure 3)
Full
Full
+25
2.8
2.4
-
3.6
3.1
-
VCC
-
V
V
V
RL = 15Ω (Eight 120Ω terminations)
(Note 17)
1.65
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 4)
RL = 54Ω or 100Ω (Figure 3)
Full
Full
2.4
3
-
V
V
Change in Magnitude of
Driver Differential Output
Voltage
ΔVOD
-
0.01
0.2
Driver Common-Mode Output
Voltage
VOC
RL = 54Ω or 100Ω (Figure 3)
RL = 54Ω or 100Ω (Figure 3)
Full
Full
-
-
-
3.15
0.2
V
V
Change in Magnitude of
Driver Common-Mode Output
Voltage
ΔVOC
0.01
Logic Input High Voltage
Logic Input Low Voltage
DI Input Hysteresis Voltage
Logic Input Current
VIH
VIL
DE, DI, RE
DE, DI, RE
Full
Full
+25
Full
Full
Full
Full
Full
2
-
-
-
-
0.8
-
V
V
VHYS
IIN1
-
100
-
mV
µA
µA
µA
µA
µA
DE, DI, RE
-2
-
2
Input Current (A, B, A/Y, B/Z)
IIN2
DE = 0V, VCC = 0V VIN = 12V
or 5.5V
70
55
1
125
-
V
IN = -7V
-75
-
Output Leakage Current
(Y, Z) (Full Duplex Versions
Only)
IIN3
RE = 0V, DE = 0V, VIN = 12V
CC = 0V or 5.5V
40
-
V
VIN = -7V
-40
-9
Output Leakage Current
(Y, Z) in Shutdown Mode (Full
Duplex)
IIN4
RE = VCC, DE = 0V, VIN = 12V
CC = 0V or 5.5V
Full
Full
-
1
20
µA
µA
V
VIN = -7V
-20
-9
-
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V ≤ VY or VZ ≤ 12V
(Note 10)
Full
Full
+25
-
-200
-
-
±250
-50
-
mA
mV
mV
Receiver Differential
Threshold Voltage
VTH
-7V ≤ VCM ≤ 12V
-90
20
Receiver Input Hysteresis
ΔVTH
VCM = 0V
Receiver Output High Voltage
Receiver Output Low Voltage
Receiver Output Low Current
VOH
VOL
IOL
IO = -8mA, VID = -50mV
IO = -8mA, VID = -200mV
VO = 1V, VID = -200mV
0.4V ≤ VO ≤ 2.4V
Full
Full
Full
Full
VCC - 1.2 4.3
-
0.4
-
V
V
-
0.25
28
20
-1
mA
µA
Three-State (High
Impedance) Receiver Output
Current
IOZR
0.03
1
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
96
160
-
kΩ
FN6363 Rev.4.00
Apr 19, 2018
Page 7 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 8). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Temp
(°C)
Min
Parameter
Symbol
Test Conditions
0V ≤ VO ≤ VCC
(Note 16) Typ Max (Note 16) Unit
Receiver Short-Circuit
Current
IOSR
Full
±7
65
±85
mA
Supply Current
No-Load Supply Current
(Note 9)
ICC
Half duplex versions, DE = VCC, RE = X,
DI = 0V or VCC
Full
Full
-
-
650
550
800
700
µA
µA
All versions, DE = 0V, RE = 0V, or full
duplex versions, DE = VCC, RE = X.
DI = 0V or VCC
Shutdown Supply Current
ISHDN
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.07
3
µA
ESD Performance
RS-485 Pins (A, Y, B, Z, A/Y,
B/Z)
IEC61000-4-2,
Air-Gap Discharge
Method
Half duplex
Full duplex
+25
+25
-
-
±16.5
±10
-
-
kV
kV
IEC61000-4-2, Contact Discharge
Method
+25
+25
+25
+25
-
-
-
-
±9
±16.5
±7
-
-
-
-
kV
kV
kV
V
Human Body Model, from bus pins to
GND
All Pins
Human Body Model, per MIL-STD-883
Method 3015
Machine Model
400
Driver Switching Characteristics (115kbps Versions; ISL3150E, ISL3152E)
Driver Differential Output
Delay
t
PLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
Full
Full
500
-
970
12
1300
50
ns
ns
ns
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
RDIFF = 54Ω, CL = 100pF (Figure 5)
CD = 820pF (Figure 7, Note 18)
Driver Differential Rise or
Fall Time
tR, tF
700
1100
1600
Maximum Data Rate
fMAX
tZH
Full
Full
115
2000
300
-
kbps
ns
Driver Enable to Output High
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 11)
-
600
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 11)
Full
Full
Full
-
-
-
130
50
500
65
ns
ns
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF,
SW = GND (Figure 6)
35
60
Time to Shutdown
tSHDN
(Note 13)
Full
Full
60
160
-
600
ns
ns
Driver Enable from Shutdown tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
to Output High (Figure 6, Notes 13, 14)
-
250
Driver Enable from Shutdown tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
to Output Low (Figure 6, Notes 13, 14)
Full
Full
-
-
250
ns
ns
Driver Switching Characteristics (1Mbps Versions; ISL3153E, ISL3155E)
Driver Differential Output
Delay
t
PLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
150
270
400
FN6363 Rev.4.00
Apr 19, 2018
Page 8 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 8). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Temp
(°C)
Min
Parameter
Symbol
Test Conditions
(Note 16) Typ Max (Note 16) Unit
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
-
3
10
ns
Driver Differential Rise or
Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
150
325
450
ns
Maximum Data Rate
fMAX
tZH
CD = 820pF (Figure 7, Note 18)
Full
Full
1
8
-
Mbps
ns
Driver Enable to Output High
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 11)
-
110
200
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 11)
Full
Full
Full
-
-
-
60
50
35
200
65
ns
ns
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 6)
60
Time to Shutdown
tSHDN
(Note 13)
Full
Full
60
160
-
600
250
ns
ns
Driver Enable from Shutdown tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
to Output High (Figure 6, Notes 13, 14)
-
Driver Enable from Shutdown tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
to Output Low (Figure 6, Notes 13, 14)
Full
-
-
250
ns
Driver Switching Characteristics (20Mbps Versions; ISL3156E, ISL3158E)
Driver Differential Output
Delay
t
PLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 5)
Full
Full
Full
-
-
-
21
0.2
12
30
3
ns
ns
ns
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 5)
RDIFF = 54Ω, CL = 100pF (Figure 5)
CD = 470pF (Figure 7, Note 18)
Driver Differential Rise or Fall
Time
tR, tF
16
Maximum Data Rate
fMAX
tZH
Full
Full
20
55
30
-
Mbps
ns
Driver Enable to Output High
RL = 500Ω, CL = 100pF, SW = GND
(Figure 6, Note 11)
-
45
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 6, Note 11)
Full
Full
Full
-
-
-
28
50
38
45
65
60
ns
ns
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 6)
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 6)
Time to Shutdown
tSHDN
(Note 13)
Full
Full
60
160
-
600
200
ns
ns
Driver Enable from Shutdown tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND
to Output High (Figure 6, Notes 13, 14)
-
Driver Enable from Shutdown tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC
to Output Low (Figure 6, Notes 13, 14)
Full
-
-
200
ns
Receiver Switching Characteristics (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)
Maximum Data Rate
fMAX
tPLH
(Figure 8, Note 18)
(Figure 8)
Full
Full
1
12
-
Mbps
ns
Receiver Input to Output
Delay
,
-
100
150
tPHL
Receiver Skew | tPLH - tPHL
|
tSKD
(Figure 8)
Full
-
4
10
ns
FN6363 Rev.4.00
Apr 19, 2018
Page 9 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
2. Specifications
Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V, TA = +25°C (Note 8). Boldface limits
apply across the operating temperature range, -40°C to +85°C. (Continued)
Temp
(°C)
Min
Parameter
Symbol
Test Conditions
(Note 16) Typ Max (Note 16) Unit
Receiver Enable to Output
Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Note 12)
Full
Full
Full
Full
-
-
-
-
9
7
8
8
20
20
15
15
ns
ns
ns
ns
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Note 12)
Receiver Disable from Output
Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9)
Receiver Disable from Output
High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9)
Time to Shutdown
tSHDN
(Note 13)
Full
Full
60
160
-
600
200
ns
ns
Receiver Enable from
Shutdown to Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Notes 13, 15)
-
Receiver Enable from
Shutdown to Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Notes 13, 15)
Full
-
-
200
ns
Receiver Switching Characteristics (20Mbps Versions; ISL3156E, ISL3158E)
Maximum Data Rate
fMAX
tPLH
tPHL
tSKD
tZL
(Figure 8, Note 18)
(Figure 8)
Full
Full
20
30
33
-
Mbps
ns
Receiver Input to Output
Delay
,
-
45
Receiver Skew | tPLH - tPHL
|
(Figure 8)
Full
Full
-
-
2.5
8
5
ns
ns
Receiver Enable to Output
Low
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9, Note 12)
15
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9, Note 12)
Full
Full
Full
-
-
-
7
8
8
15
15
15
ns
ns
ns
Receiver Disable from Output
Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9)
Receiver Disable from Output
High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9)
Time to Shutdown
tSHDN
(Note 13)
Full
Full
60
160
-
600
200
ns
ns
Receiver Enable from
Shutdown to Output High
tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND
(Figure 9), (Notes 13, 15)
-
Receiver Enable from
Shutdown to Output Low
tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 9), (Notes 13, 15)
Full
-
-
200
ns
Notes:
8. All currents in to device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground
unless otherwise specified.
9. Supply current specification is valid for loaded drivers when DE = 0V.
10. Applies to peak current. See “Performance Curves” beginning on page 14 for more information.
11. Keep RE = 0 to prevent the device from entering SHDN.
12. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
13. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts are
guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered
shutdown. See “Low Current Shutdown Mode” on page 20.
14. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
15. Set the RE signal high time >600ns to ensure that the device enters SHDN.
16. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by
characterization and are not production tested.
17. See Figure 11 on page 14 for more information and for performance over temperature.
18. Limits established by characterization and are not production tested.
FN6363 Rev.4.00
Apr 19, 2018
Page 10 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Test Circuits and Waveforms
3. Test Circuits and Waveforms
V
CC
Y
Z
V
V
OH
OL
R /2
L
Y
Z
DE
DI
V
0V or 3V
D
OD
R /2
L
V
OC
V
OC
V
OC
Figure 3. Measurement of Driver Differential Output Voltage with Differential Load
V
CC
375
Y
Z
DE
DI
V
OD
R = 60
L
0V or 3V
D
V
-7V to +12V
CM
375
Figure 4. Measurement of Driver Differential Output Voltage with Common-Mode Load
3V
DI
50%
50%
1.5V
PHL
V
C = 100pF
L
CC
0V
t
t
PLH
Y
Z
DE
Z
Y
V
OH
DI
V
R
C
D
OD
DIFF
V
OL
= 100pF
L
Skew = |t
- t
|
PLH PHL
+V
OD
90%
10%
90%
10%
V
OD
(Y - Z)
-V
OD
t
R
t
F
Figure 5. Measurement of Driver Propagation Delay and Differential Transition Times
FN6363 Rev.4.00
Apr 19, 2018
Page 11 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Test Circuits and Waveforms
V
CC
Y
Z
500
DI
SW
D
3V
DE
DE
C
L
1.5V
ZH
1.5V
0V
t
ZH(SHDN)
t
t
HZ
V
OH
V
OH
- 0.5V
Y, Z
2.3V
2.3V
CL
(pF)
Parameter
tHZ
Output
Y/Z
RE
X
DI
1/0 GND
0/1 VCC
1/0 GND
0/1 VCC
1/0 GND
0/1 VCC
SW
0V
15
15
t
ZL(SHDN)
t
ZL
t
LZ
tLZ
Y/Z
X
V
CC
tZH
Y/Z
0 (Note 11)
0 (Note 11)
1 (Note 14)
1 (Note 14)
100
100
100
100
Y, Z
V
OL
tZL
Y/Z
VOL + 0.5V
tZH(SHDN)
tZL(SHDN)
Y/Z
Y/Z
Figure 6. Measurement of Driver Enable and Disable Times
V
CC
3V
DI
Y
DE
0V
0V
DI
V
OD
C
D
60
D
Z
+V
OD
Y, Z
-V
OD
Figure 7. Measurement of Driver Data Rate
+1.5V
A
B
A
0V
0V
RO
-1.5V
R
t
t
PHL
PLH
15pF
RE
V
CC
RO
1.5V
1.5V
0V
Figure 8. Measurement of Receiver Propagation Delay and Data Rate
FN6363 Rev.4.00
Apr 19, 2018
Page 12 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
3. Test Circuits and Waveforms
V
CC
A
B
1k
RO
3V
SW
R
RE
1.5V
ZH
1.5V
15pF
RE
0V
t
ZH(SHDN)
t
t
HZ
V
OH
V
OH
- 0.5V
RO
1.5V
Parameter
tHZ
DE
A
SW
0V
0
0
0
0
0
0
+1.5V
-1.5V
+1.5V
-1.5V
+1.5V
-1.5V
GND
VCC
t
ZL(SHDN)
t
ZL
t
LZ
tLZ
VCC
tZH (Note 12)
tZL (Note 12)
GND
VCC
RO
1.5V
V
OL
V
OL
+ 0.5V
tZH(SHDN) (Note 15)
tZL(SHDN) (Note 15)
GND
VCC
Figure 9. Measurement of Receiver Enable and Disable Times
FN6363 Rev.4.00
Apr 19, 2018
Page 13 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4. Performance Curves
4. Performance Curves
VCC = 5V, TA = +25°C; Unless otherwise specified
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
54Ω
V
OH
T
A
= 25oC
15Ω
T
= +85oC
A
V
OL
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
Driver Output Current – I (mA)
Driver Output Current – I (mA)
O
O
Figure 10. Driver Output High and Low Voltages vs
Output Current
Figure 11. Driver Differential Output Voltage vs Output
Current
5.0
3.7
3.6
Figure 4 Test Circuit
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
VA
R
DIFF
= 100Ω
3.5
3.4
3.3
3.2
3.1
3.0
2.9
VOD
VOC
VB
R
= 54Ω
60
DIFF
-8 -6 -4 -2
0
2
4
6
8
10 12
-40
-20
0
20
40
80
100
Temperature (oC)
Common-Mode Voltage – V
(V)
CM
Figure 12. Driver Output Voltages vs Common-Mode
Voltage
Figure 13. Driver Differential Output Voltage vs
Temperature
70
3.5
D, DE = VCC
o
R
= 54Ω
+
V
25 C
D
60
50
40
30
20
10
0
OL,
3.0
2.5
2.0
1.5
1.0
0.5
0
o
+
V
85 C
OL,
o
+
V
25 C
OH,
o
+
V
85 C
OH,
0
1
2
3
4
5
0
1
2
3
4
5
Supply Voltage – V (V)
CC
Supply Voltage – V (V)
CC
Figure 15. Receiver Output Voltage vs Output Current
Figure 14. Driver Output Voltage vs Supply Voltage
FN6363 Rev.4.00
Apr 19, 2018
Page 14 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4. Performance Curves
VCC = 5V, TA = +25°C; Unless otherwise specified (Continued)
70
60
50
RL = 54Ω, CL = 100pF
DI
RO
DE, RE = V
5V/Div
1V/Div
CC
40
R
D
L
= 54Ω
30
20
10
0
C
= 100pF
B/Z
A/Y
0
10 20 30 40 50 60 70 80 90 100 110 120
Data Rate (kbps)
Time: 1μs/Div
Figure 16. Supply Current vs Data Rate
(ISL3150E, ISL3152E)
Figure 17. Waveforms (ISL3150E, ISL3152E)
70
60
50
40
30
20
10
0
RL = 54Ω, CL = 100pF
DI
RO
DE, RE = V
CC
5V/Div
R
= 54Ω
D
L
C
= 100pF
B/Z
1V/Div
A/Y
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Data Rate (Mbps)
Time: 400ns/Div
Figure 18. Supply Current vs Data Rate
(ISL3153E, ISL3155E)
Figure 19. Waveforms (ISL3153E, ISL3155E)
100
90
80
70
60
50
40
30
20
10
0
RL = 54Ω, CL = 100pF
DI
RO
5V/Div
DE, RE = V
CC
R
= 54Ω
D
L
C
= 100pF
B/Z
1V/Div
A/Y
0
2
4
6
8
10 12 14 16 18 20
Time: 20ns/Div
Data Rate (Mbps)
Figure 21. Waveforms (ISL3156E, ISL3158E)
Figure 20. Supply Current vs Data Rate
(ISL3156E, ISL3158E)
FN6363 Rev.4.00
Apr 19, 2018
Page 15 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
4. Performance Curves
VCC = 5V, TA = +25°C; Unless otherwise specified (Continued)
1010
1005
1000
995
990
985
980
975
970
965
960
12
11
10
9
8
tPLH
7
6
tPHL
5
4
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (oC)
Temperature (oC)
Figure 22. Differential Rise/Fall Times vs Temperature
(ISL3150E, ISL3152E)
Figure 23. Differential Propagation Delay vs
Temperature (ISL3150E, ISL3152E)
290
288
286
284
3.25
3.00
2.75
2.50
2.25
2.00
1.75
1.50
1.25
282
tPLH
280
278
tPHL
276
274
272
270
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (oC)
Temperature (oC)
Figure 24. Differential Rise/Fall Times vs Temperature
(ISL3153E, ISL3155E)
Figure 25. Differential Propagation Delay vs
Temperature (ISL3153E, ISL3155E)
0.26
23.0
22.5
22.0
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
tPLH
21.5
21.0
tPHL
20.5
20.0
19.5
19.0
18.5
18.0
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (oC)
Temperature (oC)
Figure 27. Differential Propagation Delay vs
Temperature (ISL3156E, ISL3158E)
Figure 26. Differential Rise/Fall Times vs Temperature
(ISL3156E, ISL3158E)
FN6363 Rev.4.00
Apr 19, 2018
Page 16 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
5. Device Description
5. Device Description
5.1
Overview
The ISL3150E, ISL3153E, and ISL3156E are full-duplex RS-485 transceivers, and the ISL3152E, ISL3155E, and
ISL3158E are half-duplex RS-485 transceivers. All transceivers feature a large output signal swing that is 60%
higher than standard compliant transceivers. The devices are available in three speed grades suitable for data
transmission up to 115kbps, 1Mbps, and 20Mbps.
Each transceiver has an active-high driver enable and an active-low receiver enable function. A shutdown current
as low as 70nA can be accomplished by disabling both the driver and receiver for more than 600ns.
5.2
Functional Block Diagram
V
V
CC
CC
A
RO
RE
DE
DI
R
RO
RE
DE
DI
R
B
B/Z
A/Y
Y
Z
D
D
GND
GND
Figure 28. Block Diagram
Figure 29. Block Diagram
ISL3150E, ISL3153E, ISL3156E
ISL3152E, ISL3155E, ISL3158E
5.3
5.3.1
Operating Modes
Driver Operation
A logic high at the driver enable pin, DE, activates the driver and causes the differential driver outputs, Y and Z,
to follow the logic states at the data input, DI.
A logic high at DI causes Y to turn high and Z to turn low. In this case, the differential output voltage, defined
as V = V – V , is positive. A logic low at DI reverses the output states reverse, turning Y low and Z high,
OD
Y
Z
thus making V negative.
OD
A logic low at DE disables the driver, making Y and Z high-impedance. In this condition the logic state at DI is
irrelevant. To ensure the driver remains disabled after device power-up, it is recommended to connect DE
through a 1kΩ to 10kΩ pull-down resistor to ground.
Table 2. Driver Truth Table
Inputs
Outputs
RE
X
DE
H
H
L
DI
H
L
Y
H
L
Z
L
Function
Actively drives bus high
X
H
Z
Actively drives bus low
L
X
X
Z
Driver disabled, outputs high-impedance
H
L
Z*
Z*
Shutdown mode: driver and receiver disabled for
more than 600ns
Note:* See Shutdown mode explanation in “Low Current Shutdown Mode” on page 20.
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5. Device Description
5.3.2
Receiver Operation
A logic low at the receiver enable pin, RE, activates the receiver and causes its output, RO, to follow the bus
voltage at the differential receiver inputs, A and B. Here, the bus voltage is defined as V = V - V .
AB
A
B
For V ≥ -0.05V, RO turns high, and for V ≤ -0.2V, RO turns low. For input voltages between -50mV and
AB
AB
-200mV, the state of RO is undetermined, and thus could be high or low.
A logic high at RE disables the receiver, making RO high-impedance. In this condition the polarity and
magnitude of the input voltage is irrelevant. To ensure the receiver output remains high when the receiver is
disabled, it is recommended to connect RO, using a 1kΩ to 10kΩ pull-up resistor to V
.
CC
To enable the receiver to immediately monitor the bus traffic after device power-up, connect RE through a 1kΩ
to 10kΩ pull-down resistor to ground.
Table 3. Receiver Truth Table
Inputs
Outputs
RE
L
DE
X
A – B
RO
Function
VAB ≥ -0.05V
H
RO is data-driven high
L
X
-0.05V > VAB > -0.2V
Undetermined Actively drives bus low
L
X
V
AB ≤ -0.2V
L
H
Z
RO is data-driven low
RO is failsafe-high
L
X
Inputs Open/Shorted
H
H
H
L
X
X
Receiver disabled, RO is high-impedance
Z*
Shutdown mode: driver and receiver disabled for more than
600ns
Note:* See Shutdown mode explanation in “Low Current Shutdown Mode” on page 20.
5.4
5.4.1
Device Features
Large Output Signal Swing
The ISL315xE family has a 60% larger differential output voltage swing than standard RS-485 transceivers. It
delivers a minimum V of 2.4V across a 54Ω differential load, or 1.65V across a 15Ω differential load.
OD
Figure 30 shows that the V at 54Ω is more than 50% higher than that of a standard transceiver.
OD
188Ω
140
130
120
110
100
90
T
= +25oC
15Ω
A
Y
Z
375Ω
DI
3V
60Ω
D
ISL315xE
375Ω
188Ω
54Ω
V
-7V to +12V
CM
80
Std.
XCVR
70
60
50
40
R
(Ω)
1UL
(Ω)
1/8UL # Devices
(Ω)
CM
Device
# UL
30
on Bus
20
Std. RS-485
ISL315xE
375
12k
12k
32
64
96k
256
10
0.84
1.65
3.1
3
0
188
96k
512
0
1
2
4
5
Differential Output Voltage – V (V)
OD
Figure 30. V-I Characteristic of ISL315xE vs Standard
RS-485 Transceiver
Figure 31. Unit Load and Transceiver Drive of ISL315xE
vs Standard RS-485 Transceiver
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5. Device Description
Figure 31 compares the maximum number of unit loads and bus transceivers when choosing an ISL315xE over
a standard transceiver. The RS-485 standard specifies a minimum total common-mode load resistance of
R
= 375Ω between each signal conductor and ground. Because one unit load (1UL) is equivalent to 12kΩ,
CM
the total common-mode resistance of 375Ω yields 12kΩ/375Ω = 32 ULs.
For an ISL315xE transceiver however, R can be as small as 188Ω, resulting in a total common-mode load of
CM
12kΩ/188Ω = 64 ULs. This means the driver of an ISL315xE transceiver can drive up to 64 x 1UL transceivers
or 512 x 1/8UL transceivers.
The advantages of such superior drive capability are:
• Up to 900mV higher noise immunity (2.4V vs 1.5V V
)
OD
• Up to twice the maximum cable length of standard transceivers (~8000ft vs 4000ft)
• The design of star configurations or other multi-terminated nonstandard network topologies
5.4.2
Driver Overload Protection
The RS-485 specification requires drivers to survive worst case bus contentions undamaged. The ISL315xE
transceivers meet this requirement through driver output short circuit current limits and on-chip thermal
shutdown circuitry.
The driver output stages incorporate short-circuit current limiters that ensure that the output current never
exceeds the RS-485 specification, even at the common-mode voltage range extremes.
In the event of a major short-circuit conditions, the devices also include a thermal shutdown feature that
disables the drivers whenever the temperature becomes excessive. This eliminates the power dissipation,
allowing the die to cool. The drivers automatically re-enable after the die temperature drops about 15°C. If the
contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. The receivers stay
operational during thermal shutdown.
5.4.3
Full-Failsafe Receiver
The differential receivers of the ISL315xE family are full-failsafe, meaning their outputs turn logic high when:
• The receiver inputs are open (floating) due to a faulty bus node connector
• The receiver inputs are shorted due to an insulation break of the bus cable
• The receiver input voltage is close to 0V due to a terminated bus not being actively driven
Full-failsafe switching is accomplished by offsetting the maximum receiver input threshold to -50mV.
Figure 32 shows that, in addition to the threshold offset, the receiver also has an input hysteresis, ΔV , of
TH
20mV. The combination of offset and hysteresis allows the receiver to maintain its output high, even in the
presence of 140mV differential noise, without the need for external failsafe biasing resistors.
P-P
+V
AB
RO = High
0V
V
= 140mV
n-(P-P)
-50mV
V
NTH
= 20mV
Undetermined
RO = Low
-200mV
-V
AB
Figure 32. Full-Failsafe Performance with High Noise Immunity
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5. Device Description
5.4.4
Low Current Shutdown Mode
The ISL315xE transceivers use a fraction of the power required by their bipolar counterparts, but also include a
shutdown feature that reduces the already low quiescent I to a 70nA trickle. These devices enter shutdown
CC
whenever the receiver and the driver are simultaneously disabled (RE = V and DE = GND) for a period of at
CC
least 600ns. Disabling both the driver and the receiver for less than 60ns guarantees that the transceiver will not
enter shutdown.
Note that driver and receiver enable times increase when the transceiver enables from shutdown. Refer to
Notes 10 to 14 at the end of “Electrical Specifications” on page 10.
5.4.5
Hot Plug Function
When the equipment powers up, there is a period of time where the controller driving the RS-485 enable lines is
unable to ensure that the driver and receiver outputs are kept disabled. If the equipment is connected to the bus,
a driver activating prematurely during power-up may crash the bus. To avoid this scenario, the ISL315xE
devices incorporate a Hot Plug function. During power-up and power-down, the Hot Plug function disables the
driver and receiver outputs regardless of the states of DE and RE. When V reaches ~3.4V, the enable pins are
CC
released. This gives the controller the chance to stabilize and drive the RS-485 enable lines to the proper states.
5.4.6
High ESD Protection
The bus pins of the ISL315xE transceivers have on-chip ESD protection against ±16.5kV HBM, and ±9kV
contact and ±16.5kV air-discharge according to IEC61000-4-2. The difference between the HBM and IEC ESD
ratings lies in the test severity, as both standards aim for different application environments.
HBM ESD ratings are component level ratings, used in semiconductor manufacturing in which component
handling can cause ESD damage to a single device. Because component handling is performed in a controlled
ESD environment, the ESD stress upon a component is drastically reduced. These factors make the HBM test
the less severe ESD test.
IEC ESD ratings are system level ratings. These are required in the uncontrolled field environment, where for
example, a charged end user can subject handheld equipment to ESD levels of more than 40kV by touching
connector pins when plugging or unplugging cables.
The main differences between the HBM and the IEC 61000-4-2 standards are the number of strikes applied
during testing and the generator models (Figure 33), which create differences in the waveforms’ rise times and
peak currents (Figure 34).
1M
1.5k
30
25
20
15
10
5
V
Test
= 8kV
50M
330Ω
IEC61000-4-2
HV-DC
Generator
100pF
150pF
DUT
HBM
0
0
50 100 150 200 250 300 350 400 450 500
Time (ns)
Human-Body-Model
IEC61000-4-2 Model
Figure 34. Difference in Rise-time and Charge Currents
between HBM and IEC ESD Transients
Figure 33. Generator Models for HBM and IEC ESD Tests
The IEC model has 50% higher charge capacitance (C ) and 78% lower discharge resistance (R ) than the
S
D
HBM model, thus producing shorter transient rise times and higher discharge currents. The ESD ratings of the
ISL315xE transceivers exceed test level 4 of the IEC61000-4-2 standard, which significantly increases
equipment robustness.
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6. Application Information
6. Application Information
6.1
Network Design
Designing a reliable RS-485 network requires the consideration of a variety of factors that ultimately determine the
network performance. These include network topology, cable type, data rate and/or cable length, stub length,
distance between network nodes, and line termination.
The main difference between network designs is dictated by their modes of data exchange between bus nodes,
which can be half-duplex or full-duplex (Figures 35 and 36).
A
B
Y
Z
Receive
R
R
RO
RE
DE
DI
R
R
RO
RE
DE
DI
RO
RE
DE
DI
R
Master
D
D
Slave
R
DI
T
T
A/Y
A/Y
DE
RE
RO
R
T
R
T
Y
Z
A
B
Transmit
B/Z
B/Z
R
T
D
D
A/Y
B/Z
A
B
Y
Z
Slave
R
R
D
D
RO RE DE DI
RO RE DE DI
Figure 35. Half-Duplex Bus
Figure 36. Full-Duplex Bus
Half-duplex networks use only a single signal-pair of cables between one master node and multiple slave nodes,
which allows the nodes to either transmit or receive data, but never both at the same time. Its reduced cabling effort
makes these networks well suited for covering long distances of up to several thousands of feet. To maintain high
signal integrity, the applied data rates range from as low as 9.6kbps up to 115kbps. This requires transceivers with
long driver output transition times, typically in the range of microseconds, to ensure low EMI in the presence of
large cable inductances.
To prevent signal reflections of the bus lines, each cable end must be terminated with a resistor, R , whose value
T
should match the characteristic cable impedance, Z .
0
Full-duplex networks, on the other hand, aim for high data throughput. These networks use two signal-pairs to
support the simultaneous transmitting and receiving of data. The signal pair denoted as the transmit path connects
the driver output of the master node to the receiver inputs of multiple slave nodes. The other pair connects the
driver outputs of the slave nodes with the receiver input of the master node.
Because the data flow in the transmit path is unidirectional, the transmit path requires only one termination at the
remote cable end, opposite the master node. Data flow in the receive path, however, is bidirectional, thus requiring
line termination at both cable ends. Commonly, high data throughput also calls for higher data rates in the 1Mbps to
10Mbps range. As cable losses increase with frequency, most full-duplex networks are limited to shorter bus cable
lengths of a few hundred feet to maintain signal integrity.
The following sections discuss the aforementioned parameters that impact network performance. This discussion
applies to both half-and full-duplex network designs.
6.1.1
Cable Type
RS-485 networks use differential signaling over Unshielded Twisted Pair (UTP) cable. The conductors of a
twisted pair are equally exposed to external noise. They pick up noise and other electromagnetically induced
voltages as common-mode signals, which are effectively rejected by the differential receivers.
For best performance use industrial RS-485 cables, which are of the sheathed, shielded, twisted pair type,
(STP), with a characteristic impedance of 120Ω and conductor sizes of 22 to 24 AWG (equivalent to diameters
of 0.65mm and 0.51mm, respectively). They are available in single, two, and four signal-pair versions to
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6. Application Information
accommodate the design of half- and full-duplex systems. Figure 37 shows the cross section and cable
parameters of a typical UTP cable.
Aluminum Foil
Polyester Tape
Polyethylene
Foam High Density
PVC Jacket
Cable: Belden 3105A
22 AWG
Type: 1-pair, 22AWG PLCT/CM
Tinned Copper
Impedance: 120Ω
DC Resistance: 14.7mΩ/ft
Capacitance: 11pF/ft
Tinned Copper
Braid
22 AWG
Tinned Copper
Drain Wire
Velocity: 78% (1.3ns/ft)
Figure 37. Single Pair STP Cable for RS-485 Applications
6.1.2
Cable Length vs Data Rate
RS-485 and RS-422 are intended for network lengths up to 4000ft, but the maximum system data rate decreases
as the transmission length increases. Devices operating at 20Mbps are limited to lengths less than 100ft, while
the 115kbps versions can operate at full data rates with lengths of several 1000ft. Note that ISL315xE
transceivers can cover almost twice the distance of standard compliant RS-485 transceivers.
10000
1000
100
10000
1000
100
ISL315xE
Transceivers
ISL315xE
Transceivers
Standard RS-485
Transceivers
Standard RS-485
Transceivers
10
10
10k 100k
1M
10M 100M
10k 100k
1M
10M 100M
Data Rate (bps)
Data Rate (bps)
Figure 38. Data Rate vs Cable Length Guidelines in Feet and Meters
6.1.3
Topologies and Stub Lengths
RS-485 recommends its nodes to be networked in daisy-chain or backbone topology. In these topologies the
participating drivers, receivers, and transceivers connect to a main cable trunk through “short” stubs. A stub
being the actual electrical link between transceiver and cable trunk.
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6. Application Information
D
D
R
R
D
D
R
R
A
B
A
B
Stub
Stub
A1
B1 B2
A2
A1
B1 B2
A2
Figure 39. Stub Lengths in Daisy Chain (left) and Backbone (right) Topologies
Because daisy chaining brings the cable trunk much closer to the transceiver bus terminals than a backbone
design, the stub lengths between the two topologies can differ significantly. To prevent the bus from being
overloaded by line terminations, stubs are never terminated. A stub therefore, represents a piece of
unterminated transmission line. To eliminate signal reflections on the stub line, a rule of thumb is to keep its
propagation delay below 1/5 of the driver output rise time, which leads to the maximum stub length of:
t
r
5
(EQ. 1)
---
L
= v c
Stub
where
• c is the speed of light (m/s)
• v is the signal velocity in the cable, expressed as a factor of c
• t is the rise time of the driver output (ns)
r
Applying Equation 1 to the ISL315xE transceivers assuming a velocity of 78%, results in the maximum stub
lengths associated with the corresponding transceivers, as shown in Table 4.
Table 4. Stub Length as Function of Driver Rise Time
Device
Data Rate (Mbps)
Rise Time (ns)
Maximum Stub Length
168ft (51m)
ISL3150E, ISL3152E
ISL3153E, ISL3155E
ISL3156E, ISL3158E
0.115
1
1100
150
8
23ft (7m)
20
1.2ft (0.36m)
Table 4 proves that transceivers with long driver rise times are well suited for applications requiring long stub
lengths and low radiated emission in the presence of increased stub inductance.
6.1.4
Minimum Distance between Nodes
The electrical characteristics of the RS-485 bus are primarily defined by the distributed inductance and
capacitance along the bus cable and printed circuit board traces. Adding capacitance to the bus in the form of
transceivers and connectors lowers the line impedance and causes impedance mismatches at the loaded bus
section.
Input signals arriving at these mismatches are partially reflected back to the signal source, distorting the driver
output signal. Ensuring a valid receiver input voltage during the first signal transition from a driver output
Z
0.4Z
anywhere on the bus, requires the bus impedance at the mismatches to be
or
load
nom
0.4 x 120Ω = 48Ω. This can be achieved by maintaining a minimum distance between bus nodes of:
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6. Application Information
C
L
5.25 C
-----------------------
D
(EQ. 2)
min
C
where
• C is the lumped load capacitance
L
• C is the distributed cable or PCB trace capacitance per unit length.
C
Figure 40 shows the relationship for the minimum node spacing as a function of C and C graphically. Load
C
L
capacitance includes contributions from the line circuit bus pins, connector contacts, printed circuit board
traces, protection devices, and any other physical connections to the trunk line as long as the distance from the
bus to the transceiver, known as the stub, is electrically short.
Putting some values to the individual capacitance contributions: 5V transceivers typically possess a capacitance
of 7pF, while 3V transceivers have about twice that capacitance at 16pF. Board traces add about 1.3 to 2pF/in
depending upon their construction.
Connector and suppression device capacitance can vary widely. Media distributed capacitance ranges from
11pF/ft for low capacitance, unshielded, twisted-pair cable up to 22pF/ft for backplanes.
20
C
L
(pF)
100
60
40
20
10
16
12
8
4
0
40
50
60
70
80
Distributed Cable Capacitance – C (pF)
C
Figure 40. Minimum Distance between Bus Nodes as Function of Cable and Load Capacitance
6.1.5
Failsafe Biasing Termination
As mentioned in “Full-Failsafe Receiver” on page 19, the ISL315xE transceivers are full-failsafe and capable of
tolerating up to 140mV of differential noise on a passive bus without needing external failsafe biasing.
P-P
However, in harsh industrial environments, such as the factor floors in industrial automation, the differential
noise can reach levels of more than 1V . In this case external failsafe biasing at the network’s line
P-P
terminations is strongly recommended. Here the termination resistors R connect through the biasing resistors
T
R to the supply rails V and GND.
B
CC
Short data links (<100m) only require a single failsafe termination at one cable end, while the other end is
terminated with the cable characteristic impedance Z (Figure 41, left circuit).
0
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6. Application Information
V
V
S
V
S
S
R
R
R
R
R
B
B
B
T
L<100m
V
L>100m
V
AB
Z
0
Z
0
R
R
T1
R
T2
AB
T
R
B
R
B
B
Figure 41. Failsafe Biasing of Short (<100m) and Long (>100m) Data Links
The corresponding resistor values are calculated with Equations 3 to 5.
V
V
+ 1
AB
S
(EQ. 3)
(EQ. 4)
--------------------------------
R
=
B
0.036
R
120
B
---------------------------
R
=
T2
R
– 60
B
(EQ. 5)
R
= 120
T1
Longer data links (>100m) require two identical failsafe basing networks, one at each cable end, to minimize
the differential voltage drop along the bus (Figure 41, right circuit). Their resistor values are calculated using
Equations 6 and 7:
2V V
+ 1
AB
(EQ. 6)
S
------------------------------------
R
R
=
=
B
0.036
R
120
(EQ. 7)
B
---------------------------
– 60
T
R
B
Note that Equations 3 to 7 apply to the multi-driver applications of half- and full-duplex networks. For single
driver applications, the values of R and R are calculated using Equations 8 and 9.
B
T
V
S
V
S
DE
DI
R
R
R
B
Z
0
D
V
AB
T
B
RO
R
R
RO
Figure 42. Failsafe Biasing of a Single-Driver Network
V
S
(EQ. 8)
(EQ. 9)
-----------
R
R
= 60
B
V
AB
R
120
B
---------------------------
=
T
R
– 60
B
For more details on failsafe biasing refer to TB509.
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6. Application Information
6.2
Transient Protection
Although the ISL315xE transceivers have on-chip transient protection circuitry against Electrostatic Discharge
(ESD), they are vulnerable to bursts of Electrical Fast Transients (EFT) and surge transients. Surge transients can
be caused by lightning strikes or the switching of power systems including load changes and short circuits. Their
energy content is up to 8 million times higher than that of ESD transients and thus, requires the addition of external
transient protection.
Because standard RS-485 transceivers have asymmetric stand-off voltages of -9V and +14V, external protection
requires a bidirectional Transient Voltage Suppressor (TVS) with asymmetric breakdown voltages. The only device
satisfying this requirement is the 400W TVS, SM712.
The SM712 operates across the asymmetrical common-mode voltage range from -7V to +12V. The device protects
transceivers against ESD, EFT, and surge transients up to the following levels:
• IEC61000-4-2 (ESD) +15kV (air), +8kV (contact)
• IEC61000-4-4 (EFT) 40A (5/50ns)
• IEC61000-4-5 (Lightning) 12A (8/20μs)
Because the transceiver’s ESD cells and the SM712 have a similar switching characteristics, series resistors (R )
S
are used to prevent the two protection schemes from interacting with one another.
These resistors can be carbon composite or pulse-proof thick-film resistors which should be inserted between the
TVS and the transceiver bus terminals to limit the bus currents into the transceiver during a surge event. Their value
should be less than 20Ω to minimize the attenuation of the bus voltage during normal operation. Figure 43 shows
the schematic of a 1kV surge protection example for the ISL3152E and its bill of materials.
V
S
100n
8
V
CC
Name
XCVR
TVS
Function
Order No.
ISL3152EIBZ
SM712.TCT
Vendor
Renesas
Semtech
1
2
3
4
RO
RE
DE
DI
R
R
S
S
5V, 115kbps transceiver
B/Z
A/Y
7
6
B
A
400W (8,20μs),
bidirectional TVS
RS
10Ω, 0.2W, pulse-proof CRCW0603-HP
thick-film resistor e3 series
Vishay
1
2
GND
5
XCVR
TVS
3
Figure 43. IEC61000-4-5 Level 2 (1kV) Surge Protection and Associated Bill of Materials
For more information on transient protection, refer to AN1976, AN1977, AN1978, and AN1979.
6.3
Layout Guidelines
Because ESD and EFT transients have a wide frequency bandwidth from approximately 3MHz to 3GHz,
high-frequency layout techniques must be applied during PCB design.
• For your PCB design to be successful, start with the design of the protection circuit in mind.
• Place the protection circuitry close to the bus connector to prevent noise transients from penetrating your board.
• Use V and ground planes to provide low-inductance. Note that high-frequency currents follow the path of least
CC
inductance and not the path of least impedance.
• Design the protection components into the direction of the signal path. Do not force the transient currents to divert
from the signal path to reach the protection device.
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6. Application Information
• Apply 100nF to 220nF bypass capacitors as close as possible to the V pins of the transceiver, UART, and
CC
controller ICs on the board.
• Use at least two vias for V and ground connections of bypass capacitors and protection devices to minimize the
CC
effective via-inductance.
• Use 1kΩ to 10kΩ pull-up/down resistors for the transceiver enable lines to limit noise currents into these lines
during transient events.
• Insert pulse-proof resistors into the A and B bus lines if the TVS clamping voltage is higher than the specified
maximum voltage of the transceiver bus terminals. These resistors limit the residual clamping current into the
transceiver and prevent it from latching up.
6.3.1
Layout Example
= VCC Vias
RPU
= Ground Vias
RPU
CB
ISL3152E
RS
1
2
R
8
7
6
5
VCC
B
RE
DE
D
to Bus
Connector
MCU
3
4
A
GND
TVS
RPD
RS
Figure 44. ISL3152E Layout Example
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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
7. Revision History
7. Revision History
Rev.
Date
Description
4.00
Apr 19, 2018
Updated to the latest Renesas formatting.
Updated title.
Updated Application and Features bullets.
Updated Table 1.
Updated Ordering Information table by adding all available parts, updating Note 1, and removing Notes 2
through 5.
Updated Pin Descriptions.
Updated Figures 1 through 9.
Updated Recommended Operating Conditions - Supply Voltage.
Added Device Description sections.
Rewrote the Application Information sections.
Added the following Typical Performance curves:
-Driver Output High and Low Voltages vs Output Current
-Driver Output Voltages vs Common-Mode Voltage
-Driver Output Voltage vs Supply Voltage
-Supply Current vs Data Rate for all three data rate versions
3.00
Aug 23, 2017 Updated the Receiving Truth Table.
Updated header/footer.
Updated the POD M8.118 from revision 2 to revision 4. Changes since revision 2:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
-Corrected lead width dimension in side view 1 from “0.25 - 0.036” to “0.25 - 0.36”.
Updated the POD M10.118 from revision 0 to revision 1. Changes since revision 0:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
Updated the POD M14.15 from revision 0 to revision 1. Changes since revision 0:
-Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
Updated the POD M8.15 from revision 1 to revision 4. Changes since revision 1:
-Changed Note 1 “1982” to “1994”
-In the Typical Recommended Land pattern, changed the following:
2.41 (0.095) to 2.20 (0.087)
0.76 (0.030) to 0.60 (0.023)
0.20 to 5.20 (0.205)
Updated to new format by adding land pattern and moving dimensions from the table to the drawing.
2.00
Jun 30 2009
Converted to new Intersil template. Rev. 2 changes are as follows:
Page 1 – Introduction was reworded to fit graphs. Features section by listing only key features.
Added performance graphs.
Page – 2 Updated Ordering Information by numbering all notes and referencing them on each part.
Added MSL Note as new standard with linked parts to device info page. Updated Pinout name to Pin
Configurations with Pin Descriptions following on page 3.
Page 5 – Added Boldface limit verbiage in Electrical specifications table and added bold formatting for Min
and Max over-temperature limits.
Page 17 – Added Revision History and Products information with all links included.
1.00
0.00
0.00
Jan 17 2008
Added 8 Ld PDIP to ordering information, POD, and Thermal resistance. Applied Intersil Standards as
follows: Updated ordering information with Notes for tape and reel reference, Pb-free PDIP and lead finish.
Added Pb-free reflow link and Pb-free note to Thermal Information. Added E8.3 POD.
Feb 20, 2007 Cosmetic edit to the ISL315xE data sheet, no rev, no date change, no formal review. Removed both
commas in this sentence in the first paragraph: “Each driver output, and receiver input, is protected against
±16.5kV ESD strikes without latch-up.”
Dec 14, 2006 Initial release
FN6363 Rev.4.00
Apr 19, 2018
Page 28 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8. Package Outline Drawings
For the most recent package outline drawing, see M8.15.
8. Package Outline Drawings
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
AREA
6.20 (0.244)
5.80 (0.228)
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
8°
0°
1
2
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
1
8
SEATING PLANE
0.60 (0.023)
1.27 (0.050)
1.75 (0.069)
5.00 (0.197)
4.80 (0.189)
2
3
7
6
1.35 (0.053)
-C-
4
5
0.25(0.010)
0.10(0.004)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
5.20(0.205)
SIDE VIEW “A
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6363 Rev.4.00
Apr 19, 2018
Page 29 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8. Package Outline Drawings
M8.118
For the most recent package outline drawing, see M8.118.
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
DETAIL "X"
D
8
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
B
0.65 BSC
GAUGE
TOP VIEW
PLANE
0.25
3°±3°
0.55 ± 0.15
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.10 C
0.25 - 0.36
0.10 ± 0.05
0.08
C A-B D
M
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
(0.65)
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
(0.40)
(1.40)
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
TYPICAL RECOMMENDED LAND PATTERN
FN6363 Rev.4.00
Apr 19, 2018
Page 30 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8. Package Outline Drawings
M10.118
For the most recent package outline drawing, see M10.118.
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 4/12
5
3.0±0.05
A
DETAIL "X"
D
10
1.10 MAX
SIDE VIEW 2
0.09 - 0.20
4.9±0.15
3.0±0.05
5
0.95 REF
PIN# 1 ID
1
2
0.50 BSC
B
GAUGE
TOP VIEW
PLANE
0.25
3°±3°
0.55 ± 0.15
0.85±010
H
DETAIL "X"
C
SEATING PLANE
0.10 C
0.18 - 0.27
0.10 ± 0.05
0.08
C A-B D
M
SIDE VIEW 1
(5.80)
NOTES:
(4.40)
(3.00)
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-BA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
(0.50)
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
(0.29)
(1.40)
TYPICAL RECOMMENDED LAND PATTERN
FN6363 Rev.4.00
Apr 19, 2018
Page 31 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8. Package Outline Drawings
M14.15
For the most recent package outline drawing, see M14.15.
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
4
0.10 C A-B 2X
8.65
A
3
6
DETAIL"A"
0.22±0.03
D
14
8
6.0
3.9
4
0.10 C D 2X
0.20 C 2X
7
PIN NO.1
ID MARK
(0.35) x 45°
4° ± 4°
5
0.31-0.51
0.25M C A-B D
B
3
6
TOP VIEW
0.10 C
H
1.75 MAX
1.25 MIN
0.25
GAUGE PLANE
SEATING PLANE
C
0.10-0.25
1.27
0.10 C
SIDE VIEW
DETAIL "A"
(1.27)
(0.6)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
(5.40)
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
(1.50)
7. Reference to JEDEC MS-012-AB.
TYPICAL RECOMMENDED LAND PATTERN
FN6363 Rev.4.00
Apr 19, 2018
Page 32 of 34
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
8. Package Outline Drawings
Dual-In-Line Plastic Packages (PDIP)
For the most recent package outline drawing, see E8.3.
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INCHES
MILLIMETERS
INDEX
AREA
1
2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.355
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
9.01
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.400
-
4.95
0.558
1.77
0.355
10.16
-
-
A2
A
-C-
-
SEATING
PLANE
B1
C
8, 10
L
C
L
-
D1
B1
eA
A
1
D1
e
D
5
eC
C
B
D1
E
5
eB
0.010 (0.25) M
C A B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
English and Metric dimensions, the inch dimensions control.
eA
eB
L
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
-
0.430
0.150
-
10.92
3.81
7
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated
N
8
8
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
eA
6. E and
are measured with the leads constrained to be per-
-C-
pendicular to datum
.
7. eB and eC are measured at the lead tips with the leads uncon-
strained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
FN6363 Rev.4.00
Apr 19, 2018
Page 33 of 34
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or other intellectual property rights of third parties, by or
arising from the use of Renesas Electronics products or technical information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application
examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any and all liability for any losses or damages incurred by
you or third parties arising from such alteration, modification, copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for each Renesas Electronics product depends on the
product’s quality grade, as indicated below.
"Standard":
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products are
not intended or authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause
serious property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims any and all
liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or
other Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for Handling and Using Semiconductor Devices” in the
reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such specified
ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific characteristics, such as the occurrence of failure at a
certain rate and malfunctions under certain use conditions. Unless designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury, injury
or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult
and impractical, you are responsible for evaluating the safety of the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. You are responsible for carefully and
sufficiently investigating applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance with applicable
laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws
or regulations. You shall comply with any applicable export control laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or transfers the product to a third party, to notify such third
party in advance of the contents and conditions set forth in this document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
http://www.renesas.com
Renesas Electronics America Inc.
1001 Murphy Ranch Road, Milpitas, CA 95035, U.S.A.
Tel: +1-408-432-8888, Fax: +1-408-434-5351
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-651-700, Fax: +44-1628-651-804
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
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Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
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80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
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Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
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No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
© 2018 Renesas Electronics Corporation. All rights reserved.
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