ISL32740EIAZ [RENESAS]
Isolated 40Mbps RS-485 PROFIBUS Transceiver;
| 型号： | ISL32740EIAZ |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | Isolated 40Mbps RS-485 PROFIBUS Transceiver |
| 文件： | 总20页 (文件大小：881K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
ISL32740E
Isolated 40Mbps RS-485 PROFIBUS Transceiver
FN8857
Rev.4.00
Nov 30, 2017
The ISL32740E is a galvanically isolated high-speed
differential bus transceiver, designed for bidirectional
data communication on balanced transmission lines. The
device uses Giant Magnetoresistance (GMR) as its
isolation technology.
Features
• 40Mbps data rate
• 2.5kV
isolation/600V
working voltage
RMS
RMS
• 3V to 5V power supplies
• 20ns propagation delay
• 5ns pulse skew
The part is available in a 16 Ld QSOP package offering
unprecedented miniaturization, and in a 16 Ld SOICW
package providing a true 8mm creepage distance.
• 50kV/µs (typical), 30kV/µs (minimum)
common-mode transient immunity
The ISL32740E is PROFIBUS compliant, including the
rigorous PROFIBUS differential output voltage
specifications.
• 15kV ESD protection
A unique ceramic/polymer composite barrier provides
excellent isolation and 44,000 years of barrier life.
• Low EMC footprint
• Thermal shutdown protection
• Temperature ranges available
• -40°C to +85°C (EIBZ)
• -40°C to +125°C (EFBZ)
The device is compatible with 3V as well as 5V input
supplies, allowing an interface to standard
microcontrollers without additional level shifting.
Current limiting and thermal shutdown features protect
against output short circuits and bus contention that may
cause excessive power dissipation. Receiver inputs are a
full fail-safe design, ensuring a logic high R-output if
A/B are floating or shorted.
• Meets or exceeds ANSI RS-485 and
ISO 8482:1987(E)
• PROFIBUS compliant
• 16 Ld QSOP or 0.3” true 8mm 16 Ld SOICW packages
• UL 1577 recognized
Applications
• PROFIBUS-DP and RS-485 networks
• VDE V 0884-10 certified
• Factory automation
Related Literature
• For a full list of related documents, visit our website
• Building environmental control systems
• Industrial/process control networks
• Equipment covered under IEC 61010-1 Edition 3
• ISL32740E product page
ISOLATION
BARRIER
ISOLATION
BARRIER
5V
3.3V
5V
3.3V
100n
100n
100n
100n
1
VDD1
R
16
16
1
VDD1
R
542R
135R
VDD2
VDD2
3
4
5
6
3
4
5
6
12
13
10
12
13
10
A
B
A
120R
RE
RE
B
DE
DE
ISODE
ISODE
D
D
542R
GND1
2,8
GND2
GND2
GND1
2,8
9,15
9,15
ISL32740EIBZ
ISL32740EIBZ
ISOLATION
BARRIER
3.3V
5V
100n
100n
100n
100n
1
16
16
1
VDD1
VDD2
VDD2X
ISORI
ISORO
A
VDD2
VDD2X
ISORI
ISORO
A
VDD1
10
15
12
11
9
10
15
12
11
9
2
4
5
6
2
4
5
6
542R
135R
542R
R
R
RE
DE
D
RE
D
E
D
120R
B
B
13
13
ISODE
GND2
14
ISODE
GND2
14
GND1
3
GND1
3
ISL32740EIAZ
ISL32740EIAZ
Figure 1. Typical PROFIBUS Application
FN8857 Rev.4.00
Nov 30, 2017
Page 1 of 20
ISL32740E
1. Overview
1. Overview
1.1
Typical Operating Circuits
3.3V
5V
3.3V
5V
ISOLATION
BARRIER
ISOLATION
BARRIER
100n
100n
100n
100n
1
10
VDD2X VDD2
ISODE 13
16
1
16
VDD2
VDD1
DE
VDD1
5
6
5
6
DE
ISODE 10
1.09k
127R
1.09k
1.09k
127R
1.09k
A 11
D
A 12
B 13
D
2
4
R
B
9
3
4
R
RE
ISORO 12
ISORI 15
RE
GND1
GND2
14
GND1
2,8
GND2
9,15
3
ISL32740EIAZ
ISL32740EIBZ
Figure 2. Typical Operating Circuits
1.2
Ordering Information
Part Number
(Notes 3, 4)
Temp. Range
(°C)
Package
(RoHS Compliant)
Part Marking
32740EIBZ
Pkg. Dwg. #
M16.3A
M16.3A
M16.15B
ISL32740EIBZ (Note 1)
ISL32740EFBZ (Note 1)
ISL32740EIAZ (Note 2)
ISL32740EVAL1Z
ISL32740EVAL2Z
Notes:
-40 to +85
-40 to +125
-40 to +85
16 Ld SOICW
32740EFBZ
32740EIAZ
16 Ld SOICW
16 Ld QSOP
Evaluation board for ISL32740EIBZ
Evaluation board for ISL32740EIAZ
1. Add “-T” suffix for 1k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications.
2. Add “-T” suffix for 2.5k unit or “-T7A” suffix for 250 unit tape and reel options. Refer to TB347 for details on reel specifications.
3. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements
of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), see the product information page for the ISL32740E. For more information on MSL, see
TB363.
Table 1. Key Differences Between Family of Parts
V
(V)
V
(V)
Data Rate
(Mbps)
Isolation Voltage
(kV
DD1
DD2
Part Number
ISL32704E
Full/Half Duplex
)
RMS
Half
Full
Half
Half
3.0 – 5.5
3.0 – 5.5
3.0 – 5.5
3.0 – 5.5
4.5 – 5.5
4.5 – 5.5
4.5 – 5.5
4.5 – 5.5
4
4
2.5
2.5
2.5
6
ISL32705E
ISL32740E
ISL32741E
40
40
FN8857 Rev.4.00
Nov 30, 2017
Page 2 of 20
ISL32740E
1. Overview
1.3
Pin Configurations
ISL32740E
(16 Ld SOICW)
Top View
ISL32740E
(16 Ld QSOP)
Top View
VDD1
R
1
2
3
4
5
6
7
8
16 VDD2
VDD1
GND1
R
1
2
3
4
5
6
7
8
16 VDD2
15 GND2
14 NC
15 ISORI
14 GND2
13 ISODE
12 ISORO
11 A
GND1
RE
RE
13 B
DE
12 A
DE
D
11 NC
D
NC
10 ISODE
NC
NC
10 VDD2X
GND1
9 GND2
9
B
DE
D
ISODE
D
ISODE
DE
B
A
B
A
R
R
ISORO
ISORI
RE
RE
1.4
Truth Tables
Transmitting
Inputs
Outputs
RE
X
DE
1
D
1
ISODE
B
0
A
1
1
0
0
1
X
1
0
1
0
0
0
X
X
High-Z
High-Z*
High-Z
High-Z*
1
0
Receiving
Inputs
Output
RE
0
DE
0
A-B
≥ -0.05V
RO
1
V
AB
0
0
-0.05 > V > -0.2V
Undetermined
AB
0
0
V
≤ -0.2V
0
AB
0
0
Inputs Open/Shorted
1
1
1
X
X
High-Z
High-Z*
1
0
Note: *Transceiver shutdown mode
FN8857 Rev.4.00
Nov 30, 2017
Page 3 of 20
ISL32740E
1. Overview
1.5
Pin Descriptions
Pin Number
16 Ld 16 Ld
SOICW QSOP Name
Pin
Function
1
3
1
2
VDD1 Input power supply.
R
Receiver output: If A-B ≥-50mV, R is high; If A-B ≤-200mV, R is low; R = High if A and B are unconnected
(floating) or shorted, or connected to a terminated bus that is not driven.
2, 8
4
3
4
GND1 Input power supply ground return. Pin 2 is internally connected to Pin 8 (for SOIC package).
RE
Receiver output enable. R is enabled when RE is low; R is high impedance when RE is high. If the Rx
enable function is not required, connect RE directly to GND1.
5
6
5
6
DE
Driver output enable. The driver outputs, A and B, are enabled by bringing DE high. They are high
impedance when DE is low. If the Tx enable function is not required, connect DE to VDD1 through a 1kΩ
or greater resistor.
D
Driver input. A low on D forces output A low and output B high. Similarly, a high on D forces output A high
and output B low.
7, 11, 14
12
7, 8
11
NC
A
No internal connection.
±15kV IEC61000 ESD protected RS-485/RS422 level, noninverting receiver input if DE = 0 and
noninverting driver output if DE = 1.
13
9
B
±15kV IEC61000 ESD protected RS-485/RS422 level, inverting receiver input if DE = 0 and inverting
driver output if DE = 1.
-
10
12
15
14
13
VDD2X Transceiver power supply. Connect to VDD2 (Pin 16).
-
-
ISORO Isolated receiver output. This pin must be connected to Pin 15.
ISORI Isolated receiver input. This pin must be connected to Pin 12.
GND2 Output power supply ground return. Dual ground pins are connected internally.
9, 15
10
ISODE Isolated DE output for use in PROFIBUS applications where the state of the isolated drive enable node
needs to be monitored.
16
16
VDD2 Output power supply.
FN8857 Rev.4.00
Nov 30, 2017
Page 4 of 20
ISL32740E
2. Specifications
2. Specifications
2.1
Absolute Maximum Ratings
Parameter (Note 5)
Minimum
-0.5
Maximum
Unit
Supply Voltages (Note 8)
VDD1 to GND1
VDD2 to GND2
Input Voltages D, DE, RE
Input/Output Voltages
A, B
+7
7
V
V
V
-0.5
VDD1 + 0.5
-9
+13
V
V
V
R
-0.5
VDD1 + 1
Short-Circuit Duration A, B
ESD Rating
Continuous
See “Electrical Specifications” table on page 7
Note:
5. Absolute Maximum specifications mean the device will not be damaged if operated under these conditions. It does not
guarantee performance.
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may
adversely impact product reliability and result in failures not covered by warranty.
2.2
Thermal Information
Thermal Resistance (Typical)
(°C/W)
43
(°C/W)
20
JA
JC
16 Ld SOICW Package (Notes 6, 7)
16 Ld QSOP Package (Notes 6, 7)
Notes:
77
41
6. is measured in free air with the component soldered to a double-sided board.
JA
7. For , the “case temp” location is the center of the package top side.
JC
Parameter
Maximum Junction Temperature (Plastic Package)
Maximum Storage Temperature Range
Maximum Power Dissipation
Minimum
-55
Maximum
Unit
°C
+150
+150
800
-55
°C
mW
Pb-Free Reflow Profile
see TB493
2.3
Recommended Operation Conditions
Parameter
Supply Voltages
Minimum
Maximum
Unit
V
V
3.0
4.5
5.5
5.5
V
V
DD1
DD2
High-Level Digital Input Voltage, V
IH
V
V
= 3.3V
= 5.0V
2.4
3.0
0
V
V
V
V
V
DD1
DD1
DD1
DD1
Low-Level Digital Input Voltage, V
0.8
IL
FN8857 Rev.4.00
Nov 30, 2017
Page 5 of 20
ISL32740E
2. Specifications
Parameter
Minimum
Maximum
Unit
V
Differential Input Voltage (Note 9), V
-7
12
60
ID
High-Level Output Current (Driver), I
mA
mA
mA
mA
°C
OH
High-Level Digital Output Current (Receiver), I
8
OH
Low-Level Output Current (Driver), I
-60
OL
Low-Level Digital Output Current (Receiver), I
Junction Temperature, T
-8
OL
-40
-40
-40
+110
+85
J
Ambient Operating Temperature, T
ISL32740EIBZ, ISL32740EIAZ
ISL32740EFBZ
°C
A
+125
DC Stable
Digital Input Signal Rise and Fall Times, t , t
IR IF
2.4
Electrical Specifications
Test conditions: T
min
to T
, V
= V
= 4.5V to 5.5V; unless otherwise stated. (Note 8)
DD2
max DD1
Typ
Parameter
DC Characteristics
Driver Line Output Voltage (V , V )
Symbol
Test Conditions
Min
(Note 12) Max Unit
V
No load
No load
-
-
V
V
A
B
O
DD2
DD2
(Note 8)
Driver Differential Output Voltage (Note 9)
Driver Differential Output Voltage (Note 9)
V
-
-
V
V
V
V
V
OD1
OD2
OD3
V
V
R
R
= 54Ω
= 60Ω
2.1
1.9
2.8
2.7
L
L
DD2
-
Driver Differential Output Voltage
(Notes 9, 13)
Change in Magnitude of Differential
Output Voltage (Note 14)
V
R
= 54Ω or 100Ω
-
0.01
0.20
V
OD
L
Driver Common-Mode Output Voltage
V
R
R
= 54Ω or 100Ω
= 54Ω or 100Ω
-
-
-
3
V
V
OC
L
L
Change in Magnitude of Driver
V
0.01
0.20
OC
Common-Mode Output Voltage (Note 14)
Bus Input Current (A, B) (Notes 11, 15)
I
DE = 0V
V
V
= 12V
= -7V
-
220
µA
µA
µA
µA
IN2
IN
-160
IN
High-Level Input Current (DI, DE, RE)
Low-Level Input Current (DI, DE, RE)
Absolute Short-Circuit Output Current
Supply Current
I
V = 3.5V
-
-
-
10
-
IH
I
I
V = 0.4V
-10
IL
I
I
DE = V
, -7V ≤ V or V ≤ 12V
-
-
±250 mA
OS
DD1
A
B
I
V
V
= 5V
-
4
3
-
6
4
mA
mA
mV
mV
mV
pF
V
DD1
DD1
DD1
= 3.3V
-
Positive-Going Input Threshold Voltage
Negative-Going Input Threshold Voltage
Receiver Input Hysteresis
V
-7V ≤ V
-7V ≤ V
≤ 12V
≤ 12V
-
-50
-
TH+
CM
CM
V
-200
-
TH-
V
V
= 0V
CM
-
-
28
9
-
-
HYS
Differential Bus Input Capacitance
Receiver Output High Voltage
Receiver Output Low Voltage
High impedance Output Current
Receiver Input Resistance
C
12
-
D
V
I
I
= -20µA, V = -50mV
ID
V
- 0.2
CC
OH
O
O
V
= +20µA, V = -200mV
ID
-
-1
54
-
-
0.2
1
V
OL
I
0.4V ≤ V ≤ (V
DD2
- 0.5)
-
µA
kΩ
mA
OZ
O
R
-7V ≤ V
≤ 12V
80
5
-
IN
CM
Supply Current
I
DE = V
, no load
16
DD2
DD1
FN8857 Rev.4.00
Nov 30, 2017
Page 6 of 20
ISL32740E
2. Specifications
Test conditions: T
to T
, V
= V
= 4.5V to 5.5V; unless otherwise stated. (Note 8) (Continued)
DD2
min
max DD1
Typ
(Note 12) Max Unit
Parameter
ESD Performance
Symbol
Test Conditions
Min
RS-485 Bus Pins (A, B)
IEC61000-4-2, air-gap discharge to GND2
IEC61000-4-2, contact discharge to GND2
-
-
-
±15
±8
-
-
-
kV
kV
kV
Human Body Model discharge (HBM) to
GND2
±16.5
All Pins (R, RE, D, DE)
Human Body Model discharge (HBM) to
GND1
-
±2
-
kV
Switching Characteristics
V
= 5V, V
= 5V
DD2
DD1
Data Rate
DR
R
= 54Ω, C = 50pF
40
-
-
-
Mbps
ns
L
L
Propagation Delay (Notes 9, 16)
Pulse Skew (Notes 9, 17)
t
V
= -1.5V to 1.5V, C = 15pF
20
1
30
5
PD
(P)
O
O
L
t
V
= -1.5V to 1.5V, C = 15pF
-
ns
SK
L
Skew Limit (Note 10)
t
(LIM)
R
= 54Ω, C = 50pF
L
-
2
10
30
30
30
30
-
ns
SK
L
Output Enable Time to High Level
Output Enable Time to Low Level
t
C
C
C
C
= 15pF
= 15pF
= 15pF
= 15pF
-
15
15
15
15
50
ns
PZH
L
t
-
ns
PZL
L
Output Disable Time from High Level
Output Disable Time from Low Level
Common-Mode Transient Immunity
t
-
ns
PHZ
L
t
-
ns
PLZ
L
CMTI
V
= 1500 V , t
DC TRANSIENT
= 25ns
30
kV/µs
CM
V
= 3.3V, V
= 5V
DD2
DD1
Data Rate
DR
R
= 54Ω, C = 50pF
40
-
-
-
Mbps
ns
L
L
Propagation Delay (Notes 9, 3)
Pulse Skew (Notes 9, 4)
t
V
= -1.5V to 1.5V, C = 15pF
25
2
35
5
PD
(P)
O
O
L
t
V
= -1.5V to 1.5V, C = 15pF
-
ns
SK
L
Skew Limit (Note 10)
t
(LIM)
R
= 54Ω, C = 50pF
L
-
4
10
30
30
30
30
-
ns
SK
L
Output Enable Time to High Level
Output Enable Time to Low Level
Output Disable Time from High Level
Output Disable Time from Low Level
Common-Mode Transient Immunity
t
C
C
C
C
= 15pF
= 15pF
= 15pF
= 15pF
-
17
17
17
17
50
ns
PZH
L
t
-
ns
PZL
L
t
-
ns
PHZ
L
t
-
ns
PLZ
L
CMTI
V
= 1500 V , t
DC TRANSIENT
= 25ns
30
kV/µs
CM
Notes: (apply to both driver and receiver sections)
8. All voltages on the isolator primary side are with respect to GND1. All line voltages and common-mode voltages on the isolator
secondary or bus side are with respect to GND2.
9. Differential I/O voltage is measured at the noninverting bus Terminal A with respect to the inverting Terminal B.
10. Skew limit is the maximum propagation delay difference between any two devices at +25°C.
11. The power-off measurement in ANSI Standard EIA/TIA-422-B applies to disabled outputs only and is not applied to combined
inputs and outputs.
12. All typical values are at V
, V
= 5V or V
= 3.3V and T = +25°C.
DD1 A
DD1 DD2
13. -7V < V
< 12V; 4.5 < V < 5.5V.
CM
and V
DD
are the changes in magnitude of V
14. V
and V
respectively, that occur when the input is changed from one
OD
OD
OC
OD
logic state to the other.
15. This applies for both power-on and power-off; refer to ANSI standard RS-485 for the exact condition. The EIA/TIA-422 -B limit
does not apply for a combined driver and receiver terminal.
16. Includes 10ns read enable time. Maximum propagation delay is 25ns after read assertion.
17. Pulse skew is defined as |t
- t | of each channel.
PLH PHL
FN8857 Rev.4.00
Nov 30, 2017
Page 7 of 20
ISL32740E
2. Specifications
2.5
Insulation Specifications
Parameter
Symbol
Test Conditions
Per IEC 60601
Min
Typ
8.3
-
Max
Unit
mm
mm
µm
Ω
Creepage Distance (external)
SOICW
QSOP
8.03
-
-
-
-
-
-
-
-
-
-
3.2
Total Barrier Thickness (internal)
Barrier Resistance
-
13
14
R
C
500V
-
>10
IO
IO
Barrier Capacitance
f = 1MHz
-
7
pF
Leakage Current
240V
, 60Hz
-
0.2
µA
RMS
Per IEC 60112
At maximum operating temperature
RMS
RMS
RMS
Comparative Tracking Index
CTI
≥600
1000
1500
-
-
V
V
High Voltage Endurance (Maximum
Barrier Voltage for Indefinite Life)
V
-
-
IO
V
DC
Barrier Life
100°C, 1000V
energy
, 60% CL activation
44000
Years
RMS
2.6
Magnetic Field Immunity
Parameter (Note 18)
= 5V, V = 5V
Symbol
Test Conditions
Min
Typ
Max
Unit
V
DD1
DD2
Power Frequency Magnetic Immunity
Pulse Magnetic Field Immunity
H
50Hz/60Hz
t = 8µs
P
-
-
-
-
3500
4500
4500
2.5
-
-
-
-
A/m
A/m
A/m
A/m
PF
H
PM
Damped Oscillatory Magnetic Field
H
0.1Hz to 1MHz
OSC
Cross-Axis Immunity Multiplier
(Note 19)
K
X
V
= 3.3V, V
= 5V
DD2
DD1
Power Frequency Magnetic Immunity
Pulse Magnetic Field Immunity
H
50Hz/60Hz
-
-
-
-
1500
2000
2000
2.5
-
-
-
-
A/m
A/m
A/m
A/m
PF
H
t = 8µs
P
PM
Damped Oscillatory Magnetic Field
H
0.1Hz to1MHz
OSC
Cross-Axis Immunity Multiplier
(Note 19)
K
X
Notes:
18. The relevant test and measurement methods are given in the “Electromagnetic Compatibility” on page 10.
19. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than “pin-to-pin”
see (“Electromagnetic Compatibility” on page 10).
FN8857 Rev.4.00
Nov 30, 2017
Page 8 of 20
ISL32740E
3. Safety and Approvals
3. Safety and Approvals
3.1
VDE V 0884-10
Basic Isolation; VDE File Number 5016933-4880-0001/229067
• Working voltage (V ) 600V (848V ); Basic insulation, Pollution degree 2
IORM PK
RMS
• Transient overvoltage (V
) 4000V
PK
IOTM
• Each part tested at 1590V for 1s, 5pC partial discharge limit
PK
• Samples tested at 4000V for 60s, then 1358V for 10s with 5pC partial discharge limit
PK
PK
Symbol
Safety-limiting Values
Value
180
270
54
Unit
°C
T
P
Safety Rating Ambient Temperature
Safety Rating Power (+180°C)
S
mW
mA
S
I
Supply Current Safety Rating (total of supplies)
S
3.2
UL 1577
Component Recognition Program File Number: E483309
• Working voltage (V ) 600V (848V ); basic insulation, pollution degree 2
IORM PK
RMS
• Transient overvoltage (V
) 4000V
IOTM
• Each part tested at 3000V
PK
(4243V ) for 1s
RMS
• Each lot of samples tested at 2500V
PK
(3536V ) for 60s
RMS
PK
FN8857 Rev.4.00
Nov 30, 2017
Page 9 of 20
ISL32740E
4. Electromagnetic Compatibility
4. Electromagnetic Compatibility
The ISL32740E is fully compliant with generic EMC standards EN50081, EN50082-1, and the umbrella line-voltage
standard for Information Technology Equipment (ITE) EN61000. The isolator’s Wheatstone bridge configuration and
differential magnetic field signaling ensure excellent EMC performance against all relevant standards. Compliance
tests have been conducted in the following categories:
Table 2. Compliance Test Categories
EN50081-1
EN50082-2
EN50204
Residential, Commercial, and
Light Industrial:
Industrial Environment
EN61000-4-2 (ESD)
Radiated field from digital
telephones
Methods EN55022, EN55014
EN61000-4-3 (Electromagnetic Field Immunity)
EN61000-4-4 (EFT)
EN61000-4-6 (RFI Immunity)
EN61000-4-8 (Power Frequency Magnetic Field immunity)
EN61000-4-9 (Pulsed Magnetic Field)
EN61000-4-10 (Damped Oscillatory Magnetic Field)
Immunity to external magnetic fields is even higher if the field direction
is “end-to-end” rather than “pin-to-pin” as shown on the right.
FN8857 Rev.4.00
Nov 30, 2017
Page 10 of 20
ISL32740E
5. Application Information
5. Application Information
The ISL32740E is an isolated PROFIBUS transceiver specifically designed for PROFIBUS-DP applications.
5.1
PROFIBUS
This transceiver uses a differential input receiver for maximum noise immunity and common-mode rejection.
PROFIBUS (Process Field Bus) is specified in IEC61158 as a standard for field bus communication in automation
technology. Two versions of PROFIBUS exist: PROFIBUS - PA for Process Automation and PROFIBUS-DP for
Decentralized Peripherals. The most commonly used version, PROFIBUS-DP, is a protocol for deterministic
communication between PROFIBUS masters and their remote I/O slaves.
While the physical layer of PROFIBUS-DP is based on RS-485 with its differential signaling scheme, significant
differences between the two physical layers exist with regard to cable type, bus termination, and minimum bus
voltage, to name just a few parameters.
Table 3. Main Differences Between RS-485 and PROFIBUS-DP
Parameter
RS-485
Unshielded twisted pair
120Ω
PROFIBUS-DP
Shielded twisted pair
150Ω
Cable Type
Characteristic Impedance
Minimum Driver Output Voltage
Transceiver Input Capacitance
External Fail-safe Biasing
1.5V
2.1V
10 to 15pF
10pF
Customer configurable
Always at both cable ends
(none, at single or both cable ends)
Resistor Values
Customer configurable
Fixed
5.2
Galvanic Isolation
To enable PROFIBUS transceivers operating over a wider common-mode voltage range than specified in RS-485
(7V to +12V), modern transceiver designs incorporate galvanic digital isolators with the transceiver circuitry. Here
the ISL32740E uses a Giant Magnetoresistance (GMR) isolation. Figure 3 shows the principle operation of a single
channel GMR isolator.
EXTERNAL B-FIELD
V
DD2
INTERNAL
B-FIELD
GMR1
GMR3
GMR2
IN
OUT
GMR4
GND2
Figure 3. Single Channel GMR Isolator
The input signal is buffered and drives a primary coil, which creates a magnetic field that changes the resistance of
the GMR resistors 1 to 4. GMR1 to GMR4 form a Wheatstone bridge in order to create a bridge output voltage that
reacts only to magnetic field changes from the primary coil. Large external magnetic fields however, are treated as
common-mode fields, and are therefore suppressed by the bridge configuration. The bridge output is fed into a
comparator with an output signal identical in phase and shape to the input signal.
FN8857 Rev.4.00
Nov 30, 2017
Page 11 of 20
ISL32740E
5. Application Information
5.3
GMR Resistor in Detail
Figure 4 shows a GMR resistor consisting of ferromagnetic alloy layers B1 and B2 sandwiched around an ultra
thin, nonmagnetic conducting middle layer A, typically copper. The GMR structure is designed so that in the
absence of a magnetic field, the magnetic moments in B1 and B2 face opposite directions, thus causing heavy
electron scattering across layer A, which drastically increases its resistance for current C. When a magnetic field D
is applied, the magnetic moments in B1 and B2 are aligned and electron scattering is reduced. This lowers the
resistance of layer A and current C increases.
HIGH
LOW
RESISTANCE
RESISTANCE
B1
A
B1
A
C
C
C
C
B2
B2
D
APPLIED
MAGNETIC FIELD
Figure 4. Multilayer GMR Resistor
5.4
Low Emissions
Because GMR isolators do not use complex encoding schemes, such as RF carriers or high-frequency clocks, and
do not include power transfer coils or transformers, their radiated emission spectrum is practically undetectable.
60
50
40
30
20
10
0
FCC-B < 1GHz 3m
EN55022 < 1GHz 3m
LABORATORY NOISE FLOOR
QP-MEASUREMENTS
10MHz
100MHz
1GHz
Figure 5. Undetectable Emissions of GMR Isolators
5.5
Low EMI Susceptibility
Because GMR isolators have no pulse trains or carriers to interfere with, they also have very low EMI susceptibility.
For the list of compliance tests conducted on GMR isolators refer to “Electromagnetic Compatibility” on page 10.
5.6
Receiver (Rx) Features
This transceiver uses a differential input receiver for maximum noise immunity and common-mode rejection. Input
sensitivity is ±200mV, as required by the RS-422 and RS-485 specifications. Receiver inputs function with
common-mode voltages as great as 7V outside the power supplies (for example, +12V and -7V), making them ideal
for long networks, or industrial environments, where induced voltages are a realistic concern.
The receiver input resistance of 54kΩ surpasses the RS-422 specification of 4kΩ and is about five times the
RS-485 “Unit Load” (UL) requirement of 12kΩ minimum. Thus, the ISL32740E is known as a “one-fifth UL”
transceiver, and there can be up to 160 devices on the RS-485 bus while still complying with the RS-485 loading
specification.
FN8857 Rev.4.00
Nov 30, 2017
Page 12 of 20
ISL32740E
5. Application Information
The receiver is a “full fail-safe” version that ensures a high-level receiver output if the receiver inputs are
unconnected (floating), shorted together, or connected to a terminated bus with all the transmitters disabled
(terminated/undriven).
Rx outputs deliver large low state currents (typically >30mA) at V = 1V.
OL
Receivers easily meet the 40Mbps data rate supported by the driver, and the receiver output is tri-statable using the
active low RE input.
5.7
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device that delivers at least 2.1V across a 54Ω load
(RS-485/PROFIBUS), and at least 2.6V across a 100Ω load (RS-422) even with V = 4.5V. The drivers feature
CC
low propagation delay skew to maximize bit width and to minimize EMI.
Outputs of the drivers are not slew rate limited, so faster output transition times allow data rates of at least 40Mbps.
Driver outputs are tri-statable through the active high DE input.
5.7.1
High V
Improves Noise Immunity and Flexibility
OD
The ISL32740E driver design delivers larger differential output voltages (V ) than the RS-485 standard
OD
requires, or than most RS-485 transmitters can deliver. The minimum ±2.1V V
ensures at least ±600mV
OD
transmitters.
more noise immunity than networks built using standard 1.5V V
OD
Another advantage of the large V
is the ability to drive more than two bus terminations, which allows for
OD
using the ISL32740E in “star” and other multi-terminated, “nonstandard” network topologies.
5.8
Built-In Driver Overload Protection
As stated previously, the RS-485 specification requires that drivers survive worst case bus contentions undamaged.
These transmitters meet this requirement through driver output short-circuit current limits, and on-chip thermal
shutdown circuitry.
The driver output stages incorporate short-circuit current limiting circuitry, which ensures that the output current
never exceeds the RS-485 specification, even at the common-mode voltage range extremes. In the event of a major
short-circuit condition, the device includes a thermal shutdown feature that disables the drivers whenever the die
temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops about 15°C. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown.
5.9
Dynamic Power Consumption
The isolator within the ISL32740E achieves its low power consumption from the way it transmits data across the
barrier. By detecting the edge transitions of the input logic signal and converting these to narrow current pulses, a
magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the
bridge causes the output comparator to switch following the input signal. Because the current pulses are narrow,
about 2.5ns, the power consumption is independent of the mark-to-space ratio and solely depends on frequency.
Table 4. Supply Current Increase with Data Rate
Data Rate
(Mbps)
I
I
DD2
DD1
(mA)
0.15
1.5
3
(mA)
0.15
1.5
3
1
10
20
40
6
6
FN8857 Rev.4.00
Nov 30, 2017
Page 13 of 20
ISL32740E
5. Application Information
5.10 Power Supply Decoupling
Both supplies, V
and V
, must be bypassed with 100nF ceramic capacitors. The capacitors should be placed
DD1
DD2
as close as possible to the supply pins for proper operation.
5.11 DC Correctness
The ISL32740E incorporates a patented refresh circuit to maintain the correct output state with respect to data input.
At power-up, the bus outputs follow the truth tables on page 3. The DE input should be held low during power-up to
prevent false drive data pulses on the bus.
5.12 Data Rate, Cables, and Terminations
Twisted pair is the cable of choice for RS-485, RS-422, and PROFIBUS networks. Twisted pair cables tend to pick
up noise and other electromagnetically induced voltages as common-mode signals, which are effectively rejected
by the differential receivers in these ICs.
According to guidelines in the RS-422 and PROFIBUS specifications, networks operating at data rates in excess of
3Mbps should be limited to cable lengths of 100m (328 ft) or less and the PROFIBUS specification recommends
that the more expensive “Type A” (22AWG) cable be used. The ISL32740E’s large differential output swing, fast
transition times, and high drive-current output stages allow operation even at 40Mbps over standard Cat 5 cables in
excess of 100m (328 ft).
The ISL324740E can also be used at slower data rates over longer cables, but there are some limitations. The Rx is
optimized for high-speed operation, so its output may glitch if the Rx input differential transition times are too
slow. Keeping the transition times below 500ns, (which equates to the Tx driving a 1000ft (305m) Cat 5 cable)
yields excellent performance across the full operating temperature range.
To minimize reflections, proper termination is imperative when using this high data rate transceiver. In point-to-
point, or point-to-multipoint (single driver on bus) networks, the main cable should be terminated in its
characteristic impedance (typically 100Ω for Cat 5, 120Ω for RS-485, and 150Ω for Type A) at the end farthest
from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short
as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting transceivers to the main cable should be kept as short as possible.
PROFIBUS specifies line termination with fail-safe biasing networks of fixed resistor values at both cable ends.
VS
VS
RB
RT
RB
RB
RT
RB
390R
220R
390R
220R
390R
390R
Figure 6. Line Termination for PROFIBUS-DP
For isolated data links meeting the requirements of EIA-485, the resistor values for the fail-safe biasing network
can be calculated using (EQ. 1) through (EQ. 4).
For data links longer than 100m (330ft) apply fail-safe biasing at both cable ends to compensate for the attenuation
of the bus fail-safe voltage caused by the voltage divider action of the cable’s DC resistance and the remote fail-
safe biasing network. Use (EQ. 1) to calculate the bias resistors, R , and (EQ. 2) to determine the termination
B
resistors, R .
T
V
Z
0
2
S
----------- ------
R
(EQ. 1)
B
V
AB
FN8857 Rev.4.00
Nov 30, 2017
Page 14 of 20
ISL32740E
5. Application Information
2R Z
B
0
------------------------
=
R
(EQ. 2)
T
2R – Z
B
0
where:
• R is the value of the biasing resistors
B
• R is the value of the termination resistors
T
• V is the minimum transceiver supply voltage
S
• V is the minimum bus voltage during bus idling
AB
• Z is the characteristic cable impedance of 120Ω
0
VS1
VS2
RB
RT
RB
RB
RT
RB
1.09k
127R
1.09k
1.09k
127R
1.09k
GND2
GND1
Figure 7. Dual Fail-Safe Biasing for Long Data Links
For data links shorter than 100m, use a single fail-safe biasing network. Match the termination resistor value at the
cable end without fail-safe biasing with the characteristic cable impedance: R = Z . Then calculate R using
T1
0
B
(EQ. 3) and R using (EQ. 4).
T2
V
Z
0
4
S
----------- ------
R
(EQ. 3)
(EQ. 4)
B
V
AB
2R Z
B
0
------------------------
R
=
T2
2R – Z
B
0
V
S
R
542R
135R
542R
B
R
120R
R
T1
T2
R
B
Figure 8. Single Fail-Safe Biasing for Short Data Links
Note that the resistor values in Figures 7 and 8 have been calculated for V = 4.5V, V = 0.25V, and Z = 120Ω.
S
AB
0
FN8857 Rev.4.00
Nov 30, 2017
Page 15 of 20
ISL32740E
5. Application Information
5.13 Transient Protection
Protecting the ISL32740E against transients exceeding the device’s transient immunity requires the addition of an
external TVS. For this purpose, Semtech’s RClamp0512TQ was chosen due to its high transient protection levels,
low junction capacitance, and small form factor.
Table 5. RCLAMP0512 TVS Features
Parameter
Symbol
Value
±30
±30
±4
Unit
kV
ESD (IEC61000-4-2)
Air
V
V
ESD
Contact
kV
ESD
EFT (IEC61000-4-4)
Surge (IEC61000-4-5)
Junction Capacitance
Form Factor
V
kV
EFT
V
±1.3
3
kV
SURGE
C
pF
J
-
1 x 0.6
mm
The TVS is implemented between the bus lines and isolated ground (GND2).
Because transient voltages on the bus lines are referenced to Earth potential, also known as Protective Earth (PE), a
high-voltage capacitor (C ) is inserted between GND2 and PE, providing a low-impedance path for high-
HV
frequency transients.
Note that the connection from the PE point on the isolated side to the PE point on the non-isolated side (Earth) is
usually made using the metal chassis of the equipment, or through a short, thick wire of low-inductance.
A high-voltage resistor (R ) is added in parallel to C
HV HV
to prevent the build-up of static charges on floating
grounds (GND2) and cable shields (typically used in PROFIBUS). The bill of materials for the circuit in Figure 9 is
listed in Table 6 on page 16.
V
S-ISO
V
S
A
B
A
MCU/
UART
ISL32740E
B
Shield
TVS
GND
PE
C
HV
R
HV
PE
Non-isolated Ground
Isolated Ground, Floating RS-485 Common
Protective Earth Ground, Equipment Safety Ground
Figure 9. Transient Protection for ISL32740E
Table 6. BOM for Circuit in Figure 9
Name
Function
Order No.
Vendor
TVS
170W (8, 20µs) 2-LINE PROTECTOR RCLAMP0512TQ
SEMTECH
NOVACAP
C
R
4.7nF, 2kV, 10% CAPACITOR
1MΩ, 2kV, 5% RESISTOR
1812B472K202NT
HVC12061M0JT3
HV
TT-ELECTRONICS
HV
FN8857 Rev.4.00
Nov 30, 2017
Page 16 of 20
ISL32740E
6. Revision History
6. Revision History
Rev.
4.00
3.00
Date
Description
Nov 30, 2017
Oct 2, 2017
Updated certification file number for VDE.
Updated thermal resistance values for the QSOP package. Changed from “92” to “77” and from
JA JC
“37” to “41”.
2.00
1.00
Aug 24, 2017
Jul 6, 2017
Updated Table 1 on page 2.
Updated receiving truth table.
Applied new formatting standards.
Updated Title.
Added ISL32740EIAZ and ISL32740EFBZ information throughout document.
Updated Note 1.
Updated Pin descriptions for Pins A, B, GND2, ISODE, and VDD2.
Updated thermal resistance for the SOICW package. Changed from “60” to “43” and from “12” to
JA JC
“20”.
Updated Total Barrier Thickness (internal) spec removed minimum and changed typical from “16” to “13”.
Updated “Magnetic Field Immunity” on page 8, removed all MIN values.
Updated POD M16.3A to the latest revision. Changes are as follows:
-Revised the land pattern.
0.00
Feb 28, 2017
Initial release
FN8857 Rev.4.00
Nov 30, 2017
Page 17 of 20
ISL32740E
7. Package Outline Drawings
For the most recent package outline drawing, see M16.3A.
7. Package Outline Drawings
M16.3A
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOICW)
Rev 1, 6/17
1
3
10.08
10.49
0.3
0.5
SEE DETAIL "X"
16
9
0.18
0.25
7.42
7.59
10.00
10.64
6.60
7.11
PIN #1
I.D. MARK
2
3
0.85
1.10
1
8
1.24
1.30
0.2
0.3
TOP VIEW
END VIEW
0.05
2.34
2.67
H
C
2.0
2.5
GAUGE
PLANE
SEATING
PLANE
0.25
0.1
0.3
0.3
0.5
5
0.1 MIN
0.40
0.10
C
0° TO 8°
0.3 MAX
1.30
0.1 M
C
B A
SIDE VIEW
DETAIL X
(1.7)
NOTES:
20. Dimension does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 per side.
21. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
(9.75)
22. Dimensions are measured at datum plane H.
23. Dimensioning and tolerancing per ASME Y14.5M-1994.
24. Dimension does not include dambar protrusion.
25. Dimension in ( ) are for reference only.
26. Pin spacing is a BASIC dimension; tolerances do not accumulate.
27. Dimensions are in mm.
(0.51)
(1.27)
TYPICAL RECOMMENDED LAND PATTERN
FN8857 Rev.4.00
Nov 30, 2017
Page 18 of 20
ISL32740E
7. Package Outline Drawings
For the most recent package outline drawing, see M16.15B.
M16.15B
16 LEAD QUARTER-SIZE SMALL OUTLINE PLASTIC PACKAGE (QSOP)
Rev 0, 9/16
A
1
3
4.77
5.00
16
9
SEE DETAIL "X"
5.8
6.2
3.8
4.0
3
2
PIN #1
I.D. MARK
45° NOM
1
8
0.635
0.20
0.25
B
TOP VIEW
END VIEW
0.05
1.00 REF
H
1.52
1.75
C
1.27
1.42
GAUGE
PLANE
SEATING
PLANE
0.25
0.10
0.25
0.2
0.3
0.10 MIN
0.25 MAX
5
0.10
C
0° TO 8°
0.50
0.75
0.10 M C B A
SIDE VIEW
(0.38)
DETAIL X
(1.53)
NOTES:
1. Dimension does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
(5.30)
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion.
6. Dimension in ( ) are for reference only.
7. Pin spacing is a BASIC dimension; tolerances do not accumulate.
8. Dimensions are in mm.
(0.635)
TYPICAL RECOMMENDED LAND PATTERN
FN8857 Rev.4.00
Nov 30, 2017
Page 19 of 20
ISL32740E
8. About Intersil
8. About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The
company's products address some of the largest markets within the industrial and infrastructure, mobile computing and
high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective
product information page found at www.intersil.com.
For a listing of definitions and abbreviations of common terms used in our documents, visit:
www.intersil.com/glossary.
You can report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support.
© Copyright Intersil Americas LLC 2017. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice,
provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned
to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no
responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8857 Rev.4.00
Nov 30, 2017
Page 20 of 20
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