NP48N055KLE-AY [RENESAS]

TRANSISTOR,MOSFET,N-CHANNEL,55V V(BR)DSS,48A I(D),TO-263AB;
NP48N055KLE-AY
型号: NP48N055KLE-AY
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

TRANSISTOR,MOSFET,N-CHANNEL,55V V(BR)DSS,48A I(D),TO-263AB

文件: 总8页 (文件大小:79K)
中文:  中文翻译
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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
SWITCHING  
N-CHANNEL POWER MOS FET  
DESCRIPTION  
ORDERING INFORMATION  
These products are N-channel MOS Field Effect Transistor  
designed for high current switching applications.  
PART NUMBER  
NP48N055CLE  
NP48N055DLE  
NP48N055ELE  
NP48N055KLE  
PACKAGE  
TO-220AB  
TO-262  
FEATURES  
TO-263 (MP-25ZJ)  
TO-263 (MP-25ZK)  
Channel temperature 175 degree rated  
Super low on-state resistance  
RDS(on)1 = 17 mMAX. (VGS = 10 V, ID = 24 A)  
RDS(on)2 = 21 mMAX. (VGS = 5 V, ID = 24 A)  
Low Ciss: Ciss = 1970 pF TYP.  
Built-in gate protection diode  
(TO-220AB)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC)  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT  
55  
±20  
±48  
±140  
1.8  
V
V
A
Drain Current (pulse) Note1  
A
Total Power Dissipation (TA = 25°C)  
Total Power Dissipation (TC = 25°C)  
Channel Temperature  
W
W
°C  
°C  
A
(TO-262)  
PT  
85  
Tch  
175  
Storage Temperature  
Tstg  
55 to +175  
46/27/10  
Single Avalanche Current Note2  
Single Avalanche Energy Note2  
IAS  
EAS  
2.1/73/100  
mJ  
Notes 1. PW 10 µs, Duty cycle 1%  
(TO-263)  
2. Starting Tch = 25°C, RG = 25 , VGS = 20 0 V (see Figure 4.)  
THERMAL RESISTANCE  
Channel to Case Thermal Resistance  
Channel to Ambient Thermal Resistance  
Rth(ch-C)  
Rth(ch-A)  
1.76  
83.3  
°C/W  
°C/W  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. D14095EJ4V0DS00 (4th edition)  
Date Published December 2002 NS CP(K)  
Printed in Japan  
The mark shows major revised points.  
1999, 2000  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 55 V, VGS = 0 V  
MIN.  
TYP.  
MAX.  
10  
UNIT  
µA  
µA  
V
IGSS  
VGS = ±20 V, VDS = 0 V  
VDS = VGS, ID = 250 µA  
VDS = 10 V, ID = 24 A  
VGS = 10 V, ID = 24 A  
VGS = 5 V, ID = 24 A  
VGS = 4.5 V, ID = 24 A  
±10  
2.5  
Gate to Source Threshold Voltage  
Forward Transfer Admittance  
Drain to Source On-state Resistance  
VGS(th)  
| yfs |  
RDS(on)1  
RDS(on)2  
RDS(on)3  
Ciss  
1.5  
13  
2.0  
25  
S
13  
17  
21  
mΩ  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
16  
18  
24  
Input Capacitance  
VDS = 25 V  
VGS = 0 V  
f = 1 MHz  
1970  
250  
130  
17  
3000  
380  
240  
38  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
Coss  
Crss  
td(on)  
tr  
td(off)  
tf  
VDD = 28 V, ID = 24 A  
VGS = 10 V  
11  
27  
ns  
RG = 1 Ω  
Turn-off Delay Time  
Fall Time  
54  
110  
23  
ns  
9.3  
40  
ns  
Total Gate Charge 1  
Total Gate Charge 2  
Gate to Source Charge  
Gate to Drain Charge  
Body Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
QG1  
VDD = 44 V, VGS = 10 V, ID = 48 A  
60  
nC  
nC  
nC  
nC  
V
QG2  
VDD = 44 V  
VGS = 5 V  
ID = 48 A  
21  
32  
QGS  
7
QGD  
VF(S-D)  
trr  
10  
IF = 48 A, VGS = 0 V  
1.0  
40  
IF = 48 A, VGS = 0 V  
ns  
di/dt = 100 A/µs  
Qrr  
55  
nC  
TEST CIRCUIT 1 AVALANCHE CAPABILITY  
TEST CIRCUIT 2 SWITCHING TIME  
D.U.T.  
L
D.U.T.  
V
V
GS  
R
L
RG  
= 25 Ω  
90%  
90%  
V
GS  
Wave Form  
V
GS  
10%  
0
R
G
PG.  
GS = 20 0 V  
PG.  
50 Ω  
V
DD  
V
DD  
V
DS  
90%  
V
DS  
V
0
GS  
BVDSS  
10% 10%  
V
DS  
Wave Form  
0
I
AS  
V
DS  
τ
I
D
t
d(on)  
t
r
t
d(off)  
tf  
V
DD  
t
on  
toff  
τ = 1  
µ
s
Duty Cycle 1%  
Starting Tch  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
= 2 mA  
I
G
RL  
PG.  
50 Ω  
V
DD  
2
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
TYPICAL CHARACTERISTICS (TA = 25°C)  
Figure2. TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
Figure1. DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
140  
120  
100  
80  
100  
80  
60  
40  
20  
0
60  
40  
20  
0
0
25 50 75 100 125 150 175 200  
0
25 50 75 100 125 150 175 200  
- Case Temperature - ˚C  
T
C
TC - Case Temperature - ˚C  
Figure3. FORWARD BIAS SAFE OPERATING AREA  
Figure4. SINGLE AVALANCHE ENERGY  
DERATING FACTOR  
1000  
100  
10  
120  
100  
80  
60  
40  
20  
0
100 mJ  
73 mJ  
I
D(pulse)  
I
D(DC)  
DC  
I
AS = 10 A  
27 A  
46 A  
1
Single pulse  
= 25˚C  
2.1 mJ  
50  
T
C
0.1  
0.1  
25  
75  
100  
125  
150  
175  
1
10  
100  
V
DS - Drain to Source Voltage - V  
Starting Tch - Starting Channel Temperature - ˚C  
Figure5. TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
R
th(ch-A) = 83.3˚C/W  
th(ch-C) = 1.76˚C/W  
R
1
0.1  
0.01  
Single pulse  
100 1000  
10  
µ
100  
µ
1 m  
10 m  
100 m  
1
10  
PW - Pulse Width - s  
3
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
Figure6. FORWARD TRANSFER CHARACTERISTICS  
Figure7. DRAIN CURRENT vs.  
DRAIN TO SOURCE VOLTAGE  
1000  
140  
120  
100  
80  
Pulsed  
Pulsed  
V
GS = 10 V  
100  
5 V  
T
A
= 40˚C  
25˚C  
10  
1
60  
4.5 V  
75˚C  
150˚C  
175˚C  
40  
20  
0
0.1  
1.0  
2.0  
3.0  
4.0  
0
1
2
5
6
3
4
VDS - Drain to Source Voltage - V  
V
GS - Gate to Source Voltage - V  
Figure8. FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
Figure9. DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
100  
40  
V
DS = 10 V  
Pulsed  
Pulsed  
35  
10  
30  
25  
T
A
= 175˚C  
75˚C  
25˚C  
1
ID = 24 A  
20  
15  
10  
5
40˚C  
0.1  
0.01  
0
0.01  
0.1  
1
10  
100  
0
5
10  
15  
20  
ID - Drain Current - A  
VGS - Gate to Source Voltage - V  
Figure11. GATE TO SOURCE THRESHOLD VOLTAGE vs.  
CHANNEL TEMPERATURE  
Figure10. DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
3.0  
40  
30  
20  
10  
0
V
DS = VGS  
Pulsed  
I
D
= 250 A  
µ
2.5  
2.0  
1.5  
1.0  
V
GS = 4.5 V  
5 V  
10 V  
0.5  
0
50  
0
50  
100  
150  
1
10  
100  
1000  
T
ch - Channel Temperature - ˚C  
I
D
- Drain Current - A  
4
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
Figure13. SOURCE TO DRAIN DIODE  
Figure12. DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
FORWARD VOLTAGE  
1000  
100  
Pulsed  
45  
40  
35  
30  
25  
20  
15  
10  
5
Pulsed  
V
GS = 4.5 V  
5 V  
VGS = 10 V  
10 V  
10  
1
0 V  
I
D
= 24 A  
150  
ch - Channel Temperature - ˚C  
0.1  
0
0
0.5  
1.0  
1.5  
50  
0
50  
100  
V
SD - Source to Drain Voltage - V  
T
Figure14. CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
Figure15. SWITCHING CHARACTERISTICS  
1000  
100  
10000  
1000  
100  
V
GS = 0 V  
f = 1 MHz  
t
f
C
iss  
t
d(off)  
t
d(on)  
C
oss  
rss  
t
r
10  
1
C
0.1  
1
10  
100  
10  
0.1  
1
10  
100  
ID - Drain Current - A  
V
DS - Drain to Source Voltage - V  
Figure16. REVERSE RECOVERY TIME vs.  
DRAIN CURRENT  
Figure17. DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
16  
14  
12  
10  
8
80  
70  
60  
50  
40  
30  
20  
10  
0
1000  
100  
di/dt = 100 A/  
µ
s
V
GS = 0 V  
V
DD = 44 V  
28 V  
11 V  
V
GS  
6
10  
1
4
V
DS  
2
I = 48 A  
D
0
0.1  
1
10  
100  
0
10  
20  
30  
40  
I
F
- Drain Current - A  
Q
G
- Gate Charge - nC  
5
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
PACKAGE DRAWINGS (Unit: mm)  
1) TO-220AB (MP-25)  
2) TO-262 (MP-25 Fin Cut)  
4.8 MAX.  
1.3±0.2  
10.6 MAX.  
10.0 TYP.  
4.8 MAX.  
1.3±0.2  
φ
3.6±0.2  
10 TYP.  
4
1
2
3
4
1
2 3  
1.3±0.2  
1.3±0.2  
2.8±0.2  
0.5±0.2  
0.75±0.3  
2.54 TYP.  
2.54 TYP.  
0.75±0.1  
2.54 TYP.  
0.5±0.2  
1. Gate  
2. Drain  
3. Source  
4. Fin (Drain)  
2.8±0.2  
1. Gate  
2. Drain  
3. Source  
2.54 TYP.  
4. Fin (Drain)  
3) TO-263 (MP-25ZJ)  
4) TO-263 (MP-25ZK)  
4.8 MAX.  
10.0±0.3  
4.45±0.2  
10 TYP.  
4
1.3±0.2  
No plating  
7.88 MIN.  
1.3±0.2  
4
0.025 to  
0.25  
1
2
3
1.4±0.2  
0.7±0.2  
0.5±0.2  
0.75±0.2  
2.54 TYP.  
2.54 TYP.  
2.54  
0.25  
1
2
3
1. Gate  
2. Drain  
3. Source  
1. Gate  
2. Drain  
4. Fin (Drain)  
3. Source  
4. Fin (Drain)  
EQUIVALENT CIRCUIT  
Remark The diode connected between the gate and source of the  
transistor serves as a protector against ESD. When this device  
actually used, an additional protection circuit is externally  
required if a voltage exceeding the rated voltage may be  
applied to this device.  
Drain  
Body  
Diode  
Gate  
Gate  
Protection  
Diode  
Source  
6
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
[MEMO]  
7
Data Sheet D14095EJ4V0DS  
NP48N055CLE,NP48N055DLE,NP48N055ELE,NP48N055KLE  
The information in this document is current as of December, 2002. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data  
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not  
all products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
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responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by  
customers or third parties arising from the use of these circuits, software and information.  
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M8E 02. 11-1  

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