PS2561AL1-1Q-A [RENESAS]
NPN-OUTPUT DC-INPUT OPTOCOUPLER,1-CHANNEL,5KV ISOLATION,DIP;型号: | PS2561AL1-1Q-A |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | NPN-OUTPUT DC-INPUT OPTOCOUPLER,1-CHANNEL,5KV ISOLATION,DIP 分离技术 隔离技术 输入元件 输出元件 |
文件: | 总16页 (文件大小:130K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
PHOTOCOUPLER
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
HIGH ISOLATION VOLTAGE
SINGLE TRANSISTOR TYPE
MULTI PHOTOCOUPLER SERIES
−NEPOC Series−
DESCRIPTION
The PS2561A-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon
phototransistor to realize an excellent cost performance.
The PS2561A-1 is in a plastic DIP (Dual In-line Package) and the PS2561AL-1 is lead bending type (Gull-wing) for
surface mount.
The PS2561AL1-1 is lead bending L1 type and the PS2561AL2-1 is lead bending L2 type (Gull-wing).
FEATURES
PIN CONNECTION
•
•
•
Lead-free product : Solder plating specification Sn-Bi
High isolation voltage (BV = 5 000 Vr.m.s.)
Ordering number of taping product: PS2561AL-1-E3, E4, F3, F4
: PS2561AL2-1-E3, E4
(Top View)
4
3
1. Anode
2. Cathode
3. Emitter
4. Collector
2
•
Safety standards
1
•
•
UL, BSI, CSA, NEMKO, DEMKO, SEMKO, FIMKO, approved
DIN EN60747-5-2 (VDE0884 Part2) approved (option)
APPLICATIONS
•
•
•
•
Power supply
Telephone/FAX.
FA/OA equipment
Programmable logic controller
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PN10222EJ02V0DS (2nd edition)
Date Published May 2004 CP(K)
Printed in Japan
The mark shows major revised points.
NEC Compound Semiconductor Devices 2003, 2004
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
PACKAGE DIMENSIONS (UNIT : mm)
DIP Type
Long Creepage Distance
PS2561AL1-1
PS2561A-1
4.6±0.35
4.6±0.35
4
3
4
3
7.62
1
2
1
2
10.16
0 to 15˚ +0.1
0.25–0.05
0.50±0.1
0.25 M
1.25±0.15
0.50±0.10
0.25
+0.1
1.25±0.15
M
0.25
–0.05
0 to 15˚
2.54
2.54
Lead Bending Type
PS2561AL-1
Long Creepage Distance (Gull-Wing)
PS2561AL2-1
4.6±0.35
4.6±0.35
4
3
4
3
1
2
1
2
0.9±0.25
0.25
1.25±0.15
0.25 M
10.16
1.25±0.15
0.25
0.9±0.25
9.60±0.4
+0.2
–0.5
11.8
2.54
M
0.15
2.54
2
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
MARKING EXAMPLE
No. 1 pin
Mark
2561A
N 301
Assembly Lot
N
3
01
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
CTR Rank Code
Solder plating
specification
Made in Japan Made in Taiwan
Package
H
K
New PKG
E
J
Sn-Pb
Sn-Bi
3
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ORDERING INFORMATION (1/2)
Part Number
Package
Packing Style
Safety Standard
Approval
Solder plating Application Part
Specification
Number*1
PS2561A-1
4-pin DIP Magazine case 100 pcs
Standard products
(UL, CSA, BSI,
Sn-Pb
PS2561A-1
PS2561AL-1
PS2561AL1-1
NEMKO, DEMKO,
SEMKO, FIMKO
PS2561AL2-1
PS2561AL-1-E3
PS2561AL-1-E4
PS2561AL2-1-E3
PS2561AL2-1-E4
PS2561AL-1-F3
PS2561AL-1-F4
PS2561A-1-V
Embossed Tape 1 000 pcs/reel approved)
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Magazine case 100 pcs
DIN EN60747-5-2
(VDE0884 Part2)
Approved products
(option)
PS2561AL-1-V
PS2561AL1-1-V
PS2561AL2-1-V
PS2561AL-1-V-E3
PS2561AL-1-V-E4
PS2561AL2-1-V-E3
PS2561AL2-1-V-E4
PS2561AL-1-V-F3
PS2561AL-1-V-F4
PS2561A-1-A
Embossed Tape 1 000 pcs/reel
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
Magazine case 100 pcs
Standard products
(UL, CSA, BSI,
Sn-Bi
PS2561AL-1-A
PS2561AL1-1-A
PS2561AL2-1-A
PS2561AL-1-E3-A
PS2561AL-1-E4-A
PS2561AL2-1-E3-A
PS2561AL2-1-E4-A
PS2561AL-1-F3-A
PS2561AL-1-F4-A
NEMKO, DEMKO,
SEMKO, FIMKO
Embossed Tape 1 000 pcs/reel approved)
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
4
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ORDERING INFORMATION (2/2)
Part Number
Package
Packing Style
Safety Standard
Approval
Solder plating Application Part
Specification
Number*1
PS2561A-1-V-A
4-pin DIP Magazine case 100 pcs
DIN EN60747-5-2
(VDE0884 Part2)
Approved products
(option)
Sn-Bi
PS2561A-1
PS2561AL-1-V-A
PS2561AL1-1-V-A
PS2561AL2-1-V-A
PS2561AL-1-V-E3-A
PS2561AL-1-V-E4-A
PS2561AL2-1-V-E3-A
PS2561AL2-1-V-E4-A
PS2561AL-1-V-F3-A
PS2561AL-1-V-F4-A
Embossed Tape 1 000 pcs/reel
Embossed Tape 1 000 pcs/reel
Embossed Tape 2 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
5
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
VR
Ratings
Unit
V
Diode
Reverse Voltage
6
Forward Current (DC)
Power Dissipation Derating
Power Dissipation
IF
30
mA
∆PD/°C
PD
1.5
mW/°C
mW
A
150
Peak Forward Current*1
IFP
0.5
Transistor Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
VCEO
VECO
IC
70
V
5
30
V
mA
Power Dissipation Delay
Power Dissipation
∆PC/°C
PC
1.5
mW/°C
mW
Vr.m.s.
°C
150
Isolation Voltage*2
BV
5 000
Operating Ambient Temperature
Storage Temperature
TA
−55 to +100
−55 to +150
Tstg
°C
*1 PW = 100 µs, Duty Cycle = 1%
*2 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output
6
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Parameter
Symbol
VF
Conditions
MIN.
TYP.
1.2
MAX.
1.4
5
Unit
V
Diode
Forward Voltage
Reverse Current
Terminal Capacitance
IF = 10 mA
VR = 5 V
IR
µA
pF
nA
Ct
V = 0 V, f = 1.0 MHz
VCE = 70 V, IF = 0 mA
10
Transistor Collector to Emitter Dark
Current
ICEO
100
300
0.3
Coupled
Current Transfer Ratio
(IC/IF)*1
CTR
IF = 5 mA, VCE = 5 V
IF = 10 mA, IC = 2 mA
50
%
V
Collector Saturation
Voltage
VCE (sat)
0.13
Isolation Resistance
Isolation Capacitance
Rise Time*2
RI-O
CI-O
tr
VI-O = 1.0 kVDC
1011
Ω
V = 0 V, f = 1.0 MHz
0.4
5
pF
µs
VCC = 10 V, IC = 2 mA, RL = 100 Ω
Fall Time*2
tf
7
*1 CTR rank
N :
H :
50 to 300 (%)
80 to 160 (%)
Q : 100 to 200 (%)
W : 130 to 260 (%)
*2 Test circuit for switching time
Pulse Input
V
CC
PW = 100
µ
s
Duty Cycle = 1/10
I
F
V
OUT
50 Ω
RL
= 100 Ω
7
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
TRANSISTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
DIODE POWER DISSIPATION vs.
AMBIENT TEMPERATURE
200
150
100
50
200
150
100
50
1.5 mW/˚C
1.5 mW/˚C
0
25
50
75
100
(˚C)
125
0
25
50
75
100
(˚C)
125
Ambient Temperature T
A
Ambient Temperature T
A
COLLECTOR CURRENT vs.
COLLECTOR TO EMITTER VOLTAGE
FORWARD CURRENT vs.
FORWARD VOLTAGE
100
50
25
20
15
10
5
T
A
= +100˚C
+60˚C
I = 10 mA
F
+25˚C
10
5
0˚C
–25˚C
–55˚C
I
I
F
F
= 5 mA
1
0.5
= 2 mA
= 1 mA
0.1
I
F
0.05
0
2
4
6
8
10
0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Forward Voltage V
F
(V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK
CURRENT vs. AMBIENT TEMPERATURE
COLLECTOR CURRENT vs.
COLLECTOR SATURATION VOLTAGE
10 000
10
IF = 10mA
I
F
= 5mA
= 2mA
1 000
100
10
I
F
V
CE = 70 V
1
V
CE = 24 V
I
F
= 1mA
1
0.1
0
0.2
0.4
0.6
0.8
1.0
0
25
50
75
100
Ambient Temperature T
A
(˚C)
Collector Saturation Voltage VCE(sat) (V)
Remark
The graphs indicate nominal characteristics.
8
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
NORMALIZED CURRENT TRANSFER
RATIO vs. AMBIENT TEMPERATURE
CURRENT TRANSFER RATIO vs.
FORWARD CURRENT
300
250
200
150
100
50
1.4
V
n = 2
CE = 5 V,
1.2
1.0
0.8
0.6
0.4
0.2
Sample A
B
Normalized to 1.0
at T = 25˚C,
A
I
F
= 5 mA, VCE = 5 V
CTR:130%
CTR:270%
0
0
–
50
–25
0
25
50
75
100
0.01
0.1
1
10
100
Ambient Temperature T
A
(˚C)
Forward Current I
F
(mA)
SWITCHING TIME vs.
LOAD RESISTANCE
SWITCHING TIME vs.
LOAD RESISTANCE
1 000
100
10
100
10
I
C
= 2 mA, VCC = 10 V,
I
F
= 5 mA, VCC = 5 V,
CTR = 216%
CTR = 216%
t
t
f
t
t
f
r
µ
µ
s
t
d
t
s
1
t
r
t
d
0.1
10
1
1
10
Load Resistance R
100
100
1 000
(Ω)
10 000
Load Resistance R
L
L
(kΩ)
FREQUENCY RESPONSE
LONG TERM CTR DEGRADATION
5
0
5
1.2
1.0
0.8
0.6
0.4
0.2
I = 5 mA (TYP.)
F
–
T
A
= 25˚C
= 60˚C
100 Ω
–
–
–
–
10
15
20
25
300 Ω
T
A
R = 1 kΩ
L
I
V
F
= 5 mA,
CE = 5 V
0
0.1
1
10
Frequency f (kHz)
100
1 000
10
102
103
Time (Hr)
104
105
Remark The graphs indicate nominal characteristics.
9
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
TAPING SPECIFICATIONS (UNIT : mm)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
4.5 MAX.
φ
1.5–0
1.55±0.1
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561AL-1-E3
PS2561AL-1-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
φ13.0±0.2
R 1.0
φ
φ
φ21.0±0.8
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
Packing: 1 000 pcs/reel
10
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
+0.1
4.5 MAX.
φ
1.5–0
1.55±0.1
4.0±0.1
5.3±0.1
8.0±0.1
0.4
Tape Direction
PS2561AL-1-F3
PS2561AL-1-F4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
R 1.0
φ
φ
φ
21.0±0.8
17.5±1.0
21.5±1.0
15.9 to 19.4
Outer edge of
flange
Packing: 2 000 pcs/reel
11
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
4.4±0.2
1.55±0.1
0.38
2.05±0.1
6.6±0.2
12.0±0.1
Tape Direction
PS2561AL2-1-E3
PS2561AL2-1-E4
Outline and Dimensions (Reel)
2.0±0.5
2.0±0.5
13.0±0.2
φ
φ
R 1.0
φ
φ
21.0±0.8
25.5±1.0
29.5±1.0
23.9 to 27.4
Outer edge of
flange
Packing: 1 000 pcs/reel
12
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120±30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260˚C MAX.
220˚C
to 60 s
180˚C
120˚C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
• Peak temperature (lead part temperature)
• Time (each pins)
350°C or below
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
13
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. Protect against static electricity when handling.
2. Avoid storage at a high temperature and high humidity.
14
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
•
The information in this document is current as of May, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
15
Data Sheet PN10222EJ02V0DS
PS2561A-1,PS2561AL-1,PS2561AL1-1,PS2561AL2-1
This product uses gallium arsenide (GaAs).
Caution GaAs Products
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0401
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