PS2811-4N [RENESAS]

NPN-OUTPUT DC-INPUT OPTOCOUPLER,4-CHANNEL,2.5KV ISOLATION,SO;
PS2811-4N
型号: PS2811-4N
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

NPN-OUTPUT DC-INPUT OPTOCOUPLER,4-CHANNEL,2.5KV ISOLATION,SO

分离技术 隔离技术 输入元件 输出元件
文件: 总13页 (文件大小:114K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
PHOTOCOUPLER  
PS2811-1,PS2811-4  
LOW INPUT CURRENT, HIGH CTR  
4, 16-PIN SOP PHOTOCOUPLER  
NEPOC Series−  
DESCRIPTION  
The PS2811-1 and PS2811-4 are optically coupled isolators containing a GaAs light emitting diode and an NPN  
silicon phototransistor in a plastic SOP for high density applications.  
The package is an SOP (Small Outline Package) type for high density mounting applications.  
FEATURES  
High current transfer ratio (CTR = 200 % TYP. @ I  
F
= ±1 mA)  
High isolation voltage (BV = 2 500 Vr.m.s.)  
Small and thin package (4, 16-pin SOP, Pin pitch 1.27 mm)  
Ordering number of tape product: PS2811-1-F3, F4, PS2811-4-F3, F4  
Safety standards: PS2811-1, -4  
UL approved: File No. E72422 (S)  
APPLICATIONS  
Programmable logic controllers  
Small power supply  
Hybrid IC  
Modem/FAX  
The information in this document is subject to change without notice. Before using this document, please confirm that  
this is the latest version.  
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices  
representative for availability and additional information.  
Document No. PN10255EJ01V0DS (1st edition)  
(Previous No. P14763EJ2V0DS00)  
Date Published February 2003 CP(K)  
Printed in Japan  
The mark shows major revised points.  
NEC Compound Semiconductor Devices 2000, 2003  
PS2811-1,PS2811-4  
PACKAGE DIMENSIONS (UNIT: mm)  
PS2811-1  
PS2811-4  
TOP VIEW  
16151413121110 9  
2.7±0.3  
10.3±0.3  
TOP VIEW  
4 3  
1. Annode  
2. Cathode  
3. Emitter  
4. Collector  
1 2 3 4 5 6 7 8  
1. 3. 5. 7. Annode  
2. 4. 6. 8. Cathode  
9. 11. 13. 15. Emitter  
10. 12. 14. 16. Collector  
1 2  
7.0±0.3  
4.4  
7.0±0.3  
4.4  
0.5±0.3  
+0.10  
–0.05  
0.5±0.3  
M
0.40  
0.12  
1.27  
1.27  
0.4±0.1  
M
0.12  
MARKING  
PS2811-1  
PS2811-4  
Country Assembled  
Type Number  
Assembly Lot  
11  
PS2811-4  
N 003  
Assembly Lot  
003  
No. 1 pin  
Mark  
Last number of type No. : 11  
N 0 03  
0 03  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
Week Assembled  
Year Assembled  
(Last 1 Digit)  
CTR Rank Code  
2
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
ORDERING INFORMATION  
Application Part  
Number*1  
Part Number  
PS2811-1  
Package  
Packing Style  
4-pin SOP  
50 pcs (Tape 50 pcs cut)  
PS2811-1  
PS2811-1-F3  
PS2811-1-F4  
PS2811-4  
Embossed Tape 3 500 pcs/reel  
16-pin SOP  
Magazine Case 45 pcs  
PS2811-4  
PS2811-4-F3  
PS2811-4-F4  
Embossed Tape 2 500 pcs/reel  
*1 For the application of the Safety Standard, following part number should be used.  
3
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)  
Ratings  
Parameter  
Symbol  
Unit  
PS2811-1  
PS2811-4  
Diode  
Forward Current (DC)  
Reverse Voltage  
IF  
VR  
50  
6
mA  
V
Power Dissipation Derating  
Power Dissipation  
PD/°C  
PD  
0.6  
60  
0.7  
70  
mW/°C  
mW/ch  
A
Peak Forward Current*1  
IFP  
1.0  
Transistor Collector to Emitter Voltage  
Emitter to Collector Voltage  
Collector Current  
VCEO  
VECO  
IC  
40  
V
5
40  
V
mA/ch  
mW/°C  
mW/ch  
Vr.m.s.  
°C  
Power Dissipation Derating  
Power Dissipation  
PC/°C  
PC  
1.2  
120  
Isolation Voltage*2  
BV  
2 500  
Operating Ambient Temperature  
Storage Temperature  
TA  
55 to +100  
55 to +150  
Tstg  
°C  
*1 PW = 100 µs, Duty Cycle = 1 %  
*2 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output  
4
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
ELECTRICAL CHARACTERISTICS (TA = 25 °C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
1.15  
MAX.  
1.4  
5
Unit  
V
Diode  
Forward Voltage  
Reverse Current  
Terminal Capacitance  
IF = 5 mA  
VR = 5 V  
IR  
µA  
pF  
nA  
Ct  
V = 0 V, f = 1 MHz  
15  
Transistor Collector to Emitter Dark  
Current  
ICEO  
IF = 0 mA, VCE = 40 V  
100  
400  
0.3  
Coupled  
Current Transfer Ratio  
(IC/IF) *1  
CTR  
IF = 1 mA, VCE = 5 V  
100  
1011  
200  
%
Collector Saturation Voltage  
Isolation Resistance  
Isolation Capacitance  
Rise Time*2  
VCE (sat)  
RI-O  
CI-O  
tr  
IF = 1 mA, IC = 0.2 mA  
VI-O = 1 kVDC  
V
V = 0 V, f = 1 MHz  
0.4  
4
pF  
µs  
VCC = 5 V, IC = 2 mA, RL = 100 Ω  
Fall Time*2  
tf  
5
*1 CTR rank  
PS2811-1  
N : 100 to 400 (%)  
K : 200 to 400 (%)  
L : 150 to 300 (%)  
M: 100 to 200 (%)  
PS2811-4  
N : 100 to 400 (%)  
*2 Test circuit for switching time  
Pulse Input  
V
V
CC  
PW = 100 µs  
Duty cycle = 1/10  
I
F
In monitor  
OUT  
50 Ω  
RL = 100 Ω  
5
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)  
DIODE POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
TRANSISTOR POWER DISSIPATION  
vs. AMBIENT TEMPERATURE  
80  
60  
40  
20  
140  
120  
100  
80  
PS2811-4  
0.7 mW/˚C  
PS2811-1  
60  
0.6 mW/˚C  
40  
20  
0
25  
Ambient Temperature T  
50  
75  
100  
0
25  
Ambient Temperature T  
50  
75  
100  
( ˚C)  
125  
A
(˚C)  
A
FORWARD CURRENT vs.  
FORWARD VOLTAGE  
COLLECTOR CURRENT vs.  
COLLECTOR TO EMITTER VOLTAGE  
25  
20  
15  
10  
5
100  
10  
1
I
F
= 20 mA  
10 mA  
T
A
= +100 ˚C  
+60 ˚C  
5 mA  
+25 ˚C  
0 ˚C  
–25 ˚C  
–50 ˚C  
2 mA  
0.1  
1 mA  
0.5 mA  
0.01  
0.0  
0.5  
1.0  
1.5  
(V)  
2.0  
0
2
4
6
8
10  
Forward Voltage V  
F
Collector to Emitter Voltage VCE (V)  
COLLECTOR CURRENT vs.  
COLLECTOR SATURATION VOLTAGE  
COLLECTOR TO EMITTER DARK  
CURRENT vs. AMBIENT TEMPERATURE  
10 000  
100  
10 mA  
5 mA  
2 mA  
1 000  
100  
10  
V
CE = 20 V  
40 V  
1 mA  
1
I
F
= 0.5mA  
10  
1
0.1  
0.0  
–25  
0
25  
50  
75  
100  
0.2  
0.4  
0.6  
0.8  
1.0  
Ambient Temperature T  
A
(˚C)  
Collector Saturation Voltage VCE(sat) (V)  
6
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
CURRENT TRANSFER RATIO vs.  
FORWARD CURRENT  
NORMALIZED CURRENT TRANSFER  
RATIO vs. AMBIENT TEMPERATURE  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
500  
400  
300  
200  
V
n = 2  
CE = 5 V,  
Sample A  
B
Normalized to 1.0  
100  
0
at T  
A
= 25 ˚C,  
I
F
= 1 mA, VCE = 5 V  
–50  
–25  
0
25  
50  
75  
(˚C)  
100  
0.1  
1
10  
(mA)  
100  
Ambient Temperature T  
A
Forward Current I  
F
SWITCHING TIME vs.  
LOAD RESISTANCE  
SWITCHING TIME vs.  
LOAD RESISTANCE  
100  
10  
1 000  
I = 2 mA,  
C
t
f
I = 1 mA,  
F
VCC = 5 V,  
VCC = 5 V,  
CTR = 200 %  
CTR = 200 %  
100  
µ
ts  
µ
t
f
t
r
tr  
10  
td  
td  
1
1
ts  
0.1  
100  
0.1  
10  
10 k  
1k  
10 k  
(kΩ)  
100 k  
100  
Load Resistance R  
1 k  
L
(kΩ)  
Load Resistance R  
L
FREQUENCY RESPONSE  
LONG TERM CTR DEGRADATION  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
I = 1 mA  
F
0
–5  
100 Ω  
300 Ω  
TA  
= 25 ˚C  
60 ˚C  
R = 1 kΩ  
L
–10  
–15  
–20  
–25  
0
102  
103  
104  
105  
106  
0.1  
1
10  
100  
1 000  
10  
Frequency f (kHz)  
Time (Hr)  
Remark The graphs indicate nominal characteristics.  
7
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
TAPING SPECIFICATIONS (UNIT: mm)  
Outline and Dimensions (Tape)  
2.0±0.1  
+0.1  
1.5  
–0  
4.0±0.1  
φ
2.8 MAX.  
0.3  
1.55±0.1  
4.0±0.1  
2.3±0.1  
2.85±0.1  
Tape Direction  
PS2811-1-F3  
PS2811-1-F4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
φ
R 1.0  
φ
φ21.0±0.8  
17.5±1.0  
21.5±1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 3 500 pcs/reel  
8
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
Outline and Dimensions (Tape)  
2.0±0.1  
4.0±0.1  
+0.1  
–0  
2.8 MAX.  
φ1.5  
0.3  
8.3±0.1  
1.55±0.1  
12.0±0.1  
2.3±0.1  
Tape Direction  
PS2811-4-F3  
PS2811-4-F4  
Outline and Dimensions (Reel)  
2.0±0.5  
2.0±0.5  
13.0±0.2  
φ
φ
R 1.0  
φ
φ21.0±0.8  
17.5±1.0  
21.5±1.0  
15.9 to 19.4  
Outer edge of  
flange  
Packing: 2 500 pcs/reel  
9
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
NOTES ON HANDLING  
1. Recommended soldering conditions  
(1) Infrared reflow soldering  
• Peak reflow temperature  
260°C or below (package surface temperature)  
• Time of peak reflow temperature  
• Time of temperature higher than 220°C  
10 seconds or less  
60 seconds or less  
• Time to preheat temperature from 120 to 180°C 120±30 s  
• Number of reflows  
• Flux  
Three  
Rosin flux containing small amount of chlorine (The flux with a  
maximum chlorine content of 0.2 Wt% is recommended.)  
Recommended Temperature Profile of Infrared Reflow  
(heating)  
to 10 s  
260˚C MAX.  
220˚C  
to 60 s  
180˚C  
120˚C  
120±30 s  
(preheating)  
Time (s)  
(2) Wave soldering  
• Temperature  
• Time  
260°C or below (molten solder temperature)  
10 seconds or less  
• Preheating conditions  
• Number of times  
• Flux  
120°C or below (package surface temperature)  
One (Allowed to be dipped in solder including plastic mold portion.)  
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine  
content of 0.2 Wt% is recommended.)  
(3) Cautions  
• Fluxes  
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.  
2. Cautions regarding noise  
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between  
collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute  
maximum ratings.  
10  
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
USAGE CAUTIONS  
1. Protect against static electricity when handling.  
2. Avoid storage at a high temperature and high humidity.  
11  
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
The information in this document is current as of February, 2003. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
12  
Data Sheet PN10255EJ01V0DS  
PS2811-1,PS2811-4  
SAFETY INFORMATION ON THIS PRODUCT  
The product contains gallium arsenide, GaAs.  
Caution GaAs Products  
GaAs vapor and powder are hazardous to human health if inhaled or ingested.  
• Do not destroy or burn the product.  
• Do not cut or cleave off any part of the product.  
• Do not crush or chemically dissolve the product.  
• Do not put the product in the mouth.  
Follow related laws and ordinances for disposal. The product should be excluded from general  
industrial waste or household garbage.  
For further information, please contact  
NEC Compound Semiconductor Devices, Ltd.  
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 E-mail: salesinfo@csd-nec.com  
NEC Compound Semiconductor Devices Hong Kong Limited  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
TEL: +852-3107-7303  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-558-2120  
FAX: +82-2-558-5209  
http://www.ee.nec.de/  
TEL: +49-211-6503-01 FAX: +49-211-6503-487  
FAX: +852-3107-7309  
NEC Electronics (Europe) GmbH  
California Eastern Laboratories, Inc.  
http://www.cel.com/  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
0302  

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