PS9505L3-V [RENESAS]
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER;
| 型号： | PS9505L3-V |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER 栅极驱动 双极性晶体管 输出元件 |
| 文件： | 总22页 (文件大小：315K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Preliminary Data Sheet
PS9505,PS9505L1,PS9505L2,PS9505L3
R08DS0015EJ0100
Rev.1.00
Jan 06, 2012
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 8-PIN DIP PHOTOCOUPLER
DESCRIPTION
The PS9505, PS9505L1, PS9505L2 and PS9505L3 are optically coupled isolators containing a GaAlAs LED on the
input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9505 Series is designed specifically for high common mode transient immunity (CMR), high output current and
high switching speed.
The PS9505 Series is suitable for driving IGBTs and MOS FETs.
The PS9505 Series is in a plastic DIP (Dual In-line Package).
The PS9505L1 is lead bending type for long creepage distance.
The PS9505L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
The PS9505L3 is lead bending type (Gull-wing) for surface mounting.
FEATURES
•
•
•
•
•
•
Long creepage distance (8 mm MIN.: PS9505L1, PS9505L2)
Large peak output current (2.5 A MAX., 2.0 A MIN.)
High speed switching (tPLH, tPHL = 0.25 μs MAX.)
UVLO (Under Voltage Lock Out) protection with hysteresis
High common mode transient immunity (CMH, CML = 25 kV/μs MIN.)
Embossed tape product: PS9505L2-E3: 1 000 pcs/reel
: PS9505L3-E3: 1 000 pcs/reel
PIN CONNECTION
(Top View)
8
1
7
2
6
5
1. NC
2. Anode
3. Cathode
4. NC
5. VEE
6. VO
7. VO
•
•
Pb-Free product
<R>
<R>
8. VCC
3
4
Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
APPLICATIONS
•
•
•
IGBT, Power MOS FET Gate Driver
Industrial inverter
IH (Induction Heating)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 1 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
PACKAGE DIMENSIONS (UNIT: mm)
Chapter Title
DIP Type
PS9505
+0.5
–0.25
9.25
7.62
+0.4
–0.2
1.01
+0.5
6.5
–0.1
0 to 15°
2.54
0.5 0.15
0.25
M
0.84 0.15
Lead Bending Type (Gull-wing) For Surface Mount
PS9505L3
+0.5
–0.25
9.25
8
5
1
4
9.65 0.4
+0.4
–0.2
+0.5
1.01
6.5
–0.1
2.54
0.5 0.15
0.74 0.25
0.25
M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 2 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
Lead Bending Type For Long Creepage Distance
PS9505L1
+0.5
–0.25
9.25
10.16
+0.4
–0.2
+0.5
1.01
6.5
–0.1
0 to 15°
2.54
0.84 0.15
0.5 0.15
0.25
M
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9505L2
+0.5
–0.25
9.25
5
8
1
4
11.8 0.4
+0.4
–0.2
+0.5
–0.1
1.01
6.5
2.54
0.5 0.15
0.9 0.25
0.25
M
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 3 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
PHOTOCOUPLER CONSTRUCTION
Chapter Title
Parameter
PS9505, PS9505L3
PS9505L1, PS9505L2
Air Distance (MIN.)
7 mm
7 mm
8 mm
8 mm
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
0.4 mm
0.4 mm
FUNCTIONAL DIAGRAM
8
7
6
(Tr. 1)
(Tr. 2)
2
3
5
SHIELD
Input
H
LED
ON
Tr. 1
ON
Tr. 2
Output
OFF
ON
H
L
OFF
OFF
L
<R>
MARKING EXAMPLE
No. 1 pin
Mark
Company Initial
Type Number
Assembly Lot
R
9505
NT131
31
N T 1
Week Assembled
Year Assembled
(Last 1 Digit)
In-house Code
Rank Code
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 4 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
ORDERING INFORMATION
Chapter Title
<R>
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application Part
Number*1
PS9505
PS9505-AX
Pb-Free
50 Magazine Cases
Standard
PS9505
PS9505L1
PS9505L1-AX
(Ni/Pd/Au)
products
PS9505L1
PS9505L2
PS9505L3
PS9505L2
PS9505L3
PS9505
PS9505L2
PS9505L2-AX
(UL, CSA, SEMKO
approved)
PS9505L3
PS9505L3-AX
PS9505L2-E3
PS9505L3-E3
PS9505-V
PS9505L2-E3-AX
PS9505L3-E3-AX
PS9505-V-AX
Embossed Tape
1 000 pcs/reel
50 Magazine Cases
DIN EN60747-5-2
(VDE0884 Part2)
approved
PS9505L1-V
PS9505L2-V
PS9505L3-V
PS9505L2-V-E3
PS9505L3-V-E3
PS9505L1-V-AX
PS9505L2-V-AX
PS9505L3-V-AX
PS9505L2-V-E3-AX
PS9505L3-V-E3-AX
PS9505L1
PS9505L2
PS9505L3
PS9505L2
PS9505L3
(Option)
Embossed Tape
1 000 pcs/reel
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
IF
Ratings
25
Unit
mA
A
Diode
Forward Current
Peak Transient Forward
IF (TRAN)
1.0
Current (Pulse Width < 1 μs)
Reverse Voltage
VR
5
V
A
High Level Peak Output
Current *1
IOH (PEAK)
2.5
Detector
Low Level Peak Output
Current *1
IOL (PEAK)
2.5
A
Supply Voltage
Output Voltage
(VCC - VEE)
0 to 35
0 to VCC
250
V
V
VO
PC
BV
PT
f
Power Dissipation *2
mW
Vr.m.s.
mW
kHz
°C
Isolation Voltage *3
5 000
Total Power Dissipation *4
Operating Frequency*5
Operating Ambient Temperature
Storage Temperature
300
50
TA
Tstg
−40 to +110
−55 to +125
°C
*1 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*2 Reduced to 4.8 mW/°C at TA = 70°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
*4 Reduced to 5.4 mW/°C at TA = 70°C or more.
*5 IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs)
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 5 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Symbol
(VCC - VEE)
IF (ON)
MIN.
15
TYP.
10
MAX.
30
Unit
V
Forward Current (ON)
7
16
mA
V
Forward Voltage (OFF)
VF (OFF)
TA
−2
0.8
Operating Ambient Temperature
−40
110
°C
<R>
ELECTRICAL CHARACTERISTICS
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Symbol
VF
Conditions
IF = 10 mA, TA = 25°C
MIN.
1.2
TYP.*1
1.56
MAX.
1.8
Unit
V
Diode
Forward Voltage
Reverse Current
Input Capacitance
IR
VR = 3 V, TA = 25°C
f = 1 MHz, VF = 0 V, TA = 25°C
VO = (VCC − 4 V) *2
10
μA
pF
A
CIN
30
Detector High Level Output Current
IOH
0.5
2.0
0.5
2.0
2.0
VO = (VCC − 15 V) *3
VO = (VEE + 2.5 V) *2
VO = (VEE + 15 V) *3
IO = −100 mA *4
Low Level Output Current
IOL
2.0
A
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
UVLO Threshold
VOH
VOL
VCC − 3.0 VCC − 1.5
V
V
IO = 100 mA
0.1
1.4
1.3
0.5
3.0
ICCH
VO = open, IF = 10 mA
VO = open, VF = 0 to +0.8 V
VO > 5 V, IF = 10 mA
mA
mA
V
ICCL
3.0
VUVLO+
VUVLO−
10.8
9.5
12.3
11.0
1.3
13.4
12.5
UVLO Hysteresis
UVLOHYS VO > 5 V, IF = 10 mA
0.4
V
Coupled Threshold Input Current
IFLH
IO = 0 mA, VO > 5 V
2.0
5.0
mA
(L → H)
Threshold Input Voltage
VFHL
IO = 0 mA, VO < 5 V
0.8
V
(H → L)
*1 Typical values at TA = 25°C.
*2 Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
*3 Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*4 VOH is measured with the DC load current in this testing (Maximum pulse width = 2 ms, Maximum duty cycle =
20%).
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 6 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
SWITCHING CHARACTERISTICS
Chapter Title
<R>
(VEE = GND, unless otherwise specified and refer to RECOMMENDED OPERATING CONDITIONS)
Parameter
Symbol
tPLH
Conditions
MIN.
TYP.*1
0.07
MAX.
0.25
0.25
0.1
Unit
μs
Propagation Delay Time (L → H)
Propagation Delay Time (H → L)
Pulse Width Distortion (PWD)
Rg = 10 Ω, Cg = 10 nF, f = 10 kHz,
Duty Cycle = 50%*2, IF = 10 mA
tPHL
0.10
μs
|tPHL−tPLH|
tPHL−tPLH
0.03
μs
Propagation Delay Time (Difference
Between Any Two Products)
−0.1
0.1
μs
Rise Time
tr
tf
50
50
ns
ns
Fall Time
UVLO (Turn On Delay)
UVLO (Turn Off Delay)
tUVLO ON VO > 5 V, IF = 10 mA
tUVLO OFF VO < 5 V, IF = 10 mA
0.8
0.6
μs
μs
Common Mode Transient Immunity at
High Level Output
|CMH|
TA = 25°C, IF = 10 to 16 mA, VCC = 30 V,
VO (MIN.) = 26 V, VCM = 1.5 kV
25
25
kV/μs
Common Mode Transient Immunity at
Low Level Output
|CML|
TA = 25°C, IF = 0 mA, VCC = 30 V,
VO (MAX.) = 1 V, VCM = 1.5 kV
kV/μs
*1 Typical values at TA = 25°C.
*2 This load condition is equivalent to the IGBT load at 1 200 V/75 A.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 7 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
TEST CIRCUIT
Chapter Title
Fig. 1 IOH Test Circuit
Fig. 2 IOL Test Circuit
1
2
8
7
6
5
1
2
8
0.1μF
0.1μF
7
6
5
IOL
4 V
VCC = 15 to 30 V
3
4
3
4
2.5 V
I =
F
V
CC
=
7 to 16 mA
IOH
15 to 30 V
SHIELD
SHIELD
Fig. 3 VOH Test Circuit
Fig. 4 VOL Test Circuit
1
2
8
7
1
2
8
0.1μF
7
6
5
0.1μF
VOH
VCC = 15 to 30 V
6
5
3
4
3
VOL
V
CC
=
IF =
7 to 16 mA
15 to 30 V
100 mA
100 mA
4
SHIELD
SHIELD
Fig. 5 IFLH Test Circuit
Fig. 6 UVLO Test Circuit
1
2
8
7
1
2
8
7
0.1
μF
0.1
μF
IF = 10 mA
VCC
IF
6
5
6
5
3
4
3
4
V
CC
=
VO
> 5 V
VO
> 5 V
15 to 30 V
SHIELD
SHIELD
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 8 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
<R>
Fig. 7 tPLH, tPHL, t
r
, tf Test Circuit and Wave Forms
1
2
8
7
6
5
I
F
0.1μF
tr
tf
I = 10 mA
F
V
CC = 15 to 30 V
500 Ω
90%
50%
10%
VO
3
4
10 kHz
10 Ω
10 nF
50% DUTY
CYCLE
V
OUT
tPLH
tPHL
SHIELD
Fig. 8 CMR Test Circuit and Wave Forms
<R>
1
2
8
7
6
5
V
CM
IF
A
B
V
Δ
CM
δ
δ
V
t
0.1μF
=
t
VCC = 30 V
VO
3
4
0 V
Δ
t
V
OH
V
O
26 V
(Switch A: I
F
= 10 to 16 mA)
= 0 mA)
SHIELD
1 V
V
O
VOL
(Switch B: I
F
VCM = 1.5 kV
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 9 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
<R>
TYPICAL CHARACTERISTICS (TA = 25°C, unless otherwise specified)
DETECTOR POWER DISSIPATION
vs. AMBIENT TEMPERATURE
TOTAL POWER DISSIPATION
vs. AMBIENT TEMPERATURE
350
300
250
200
150
100
50
300
250
200
150
100
50
100
(°C)
0
20
40
60
80
100
(°C)
120
0
20
40
60
80
120
2.4
5
Ambient Temperature T
A
Ambient Temperature T
A
FORWARD CURRENT vs.
FORWARD VOLTAGE
THRESHOLD INPUT CURRENT vs.
AMBIENT TEMPERATURE
100
10
5.0
4.0
3.0
2.0
1.0
0
V
V
V
CC = 30 V,
EE = GND,
O
> 5 V
T
A
= +100°C
+85°C
+50°C
+25°C
0°C
1.0
0.1
−40°C
0.01
1.0
1.2
1.4
1.6
1.8
2.0
(V)
2.2
−40 −20
0
20
40
60
80 100
Forward Voltage V
F
Ambient Temperature T (°C)
A
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. HIGH LEVEL OUTPUT CURRENT
OUTPUT VOLTAGE vs.
FORWARD CURRENT
35
30
25
20
15
10
5
0
V
V
CC = 30 V,
EE = GND
V
V
CC = 30 V,
EE = GND,
= 10 mA
IF
−40°C
−2
−4
−6
−8
T
A
= +110°C
+25°C
0
1
2
3
4
0
0.5
1.0
1.5
2.0
2.5
Forward Current I (mA)
F
High Level Output Current IOH (A)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 10 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. FORWARD CURRENT
LOW LEVEL OUTPUT VOLTAGE vs.
LOW LEVEL OUTPUT CURRENT
8
250
200
150
100
50
V
R
CC = 30 V, VEE = GND,
= 10 Ω, C = 10 nF,
f = 10 kHz, Duty cycle = 50%
V
V
CC = 30 V,
EE = GND,
= 0 mA
g
g
I
F
T
A
= +110°C
6
4
2
+25°C
tPHL
t
PLH
−40°C
PWD
10
Forward Current I
0
0
0.5
1
1.5
2
2.5
30
50
6
8
12
14
(mA)
16
18
Low Level Output Current IOL (A)
F
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. SUPPLY VOLTAGE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD CAPACITANCE
250
200
150
100
50
250
200
150
100
50
V
R
EE = GND, I
= 10 Ω, C
F
= 10 mA,
= 10 nF,
V
CC = 30 V, VEE = GND,
= 10 mA, R = 10 Ω,
f = 10 kHz, Duty cycle = 50%
g
g
I
F
g
f = 10 kHz, Duty cycle = 50%
t
PHL
PLH
t
t
PHL
PLH
t
PWD
PWD
0
0
10
15
20
25
30
40
50
20
Supply Voltage VCC (V)
Load Capacitance C
g
(nF)
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. LOAD RESISTANCE
PROPAGATION DELAY TIME,
PULSE WIDTH DISTORTION
vs. AMBIENT TEMPERATURE
250
200
150
100
50
250
V
I
CC = 30 V, VEE = GND,
= 10 mA, C = 10 nF,
f = 10 kHz, Duty cycle = 50%
V
CC = 30 V, VEE = GND,
= 10 mA,
F
g
IF
R
g
= 10 Ω, C
g
= 10 nF,
200
150
100
50
f = 10 kHz, Duty cycle = 50%
t
PHL
PLH
t
PHL
PLH
t
t
PWD
PWD
0
0
0
10
20
30
40
40
60
80 100
(°C)
−40 −20
0
20
Load Resistance R
g
(Ω)
Ambient Temperature T
A
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 11 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
SUPPLY CURRENT vs.
AMBIENT TEMPERATURE
SUPPLY CURRENT vs.
SUPPLY VOLTAGE
2.0
2.0
1.5
1.0
0.5
V
V
EE = GND,
= OPEN
V
V
V
CC = 30 V,
EE = GND,
= OPEN
O
O
1.5
1.0
0.5
I
CCH (I = 10 mA)
F
I
I
CCH (I
F
= 10 mA)
= 0 mA)
I
CCL (I
F
= 0 mA)
CCL (I
F
−40 20
0
20
40
60
80
(°C)
100
15
20
25
30
Ambient Temperature T
A
Supply Voltage VCC (V)
HIGH LEVEL OUTPUT VOLTAGE – SUPPLY
VOLTAGE vs. AMBIENT TEMPERATURE
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
0.0
0.30
0.25
0.20
0.15
0.10
0.05
0.00
V
CC = 30 V, VEE = GND,
V
CC = 30 V, VEE = GND,
= 10 mA, I = 100 mA
IF
= 10 mA, I
O
= –100 mA
I
F
O
−0.5
−1.0
−1.5
−2.0
−2.5
−3.0
−40 −20
0
20
40
60
80 100
−40 −20
0
20
40
60
80 100
(°C)
Ambient Temperature T
A
(°C)
Ambient Temperature T
A
HIGH LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
LOW LEVEL OUTPUT CURRENT vs.
AMBIENT TEMPERATURE
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
CC = 30 V, VEE = GND,
= 10 mA, VCC–V = 4 V
VCC = 30 V, VEE = GND,
I
F
O
IF
= 10 mA, V
O
= 2.5 V
−40 −20
0
20
40
60
80 100
(°C)
−40 −20
0
20
40
60
80 100
Ambient Temperature T
A
Ambient Temperature T
A
(°C)
Remark The graphs indicate nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 12 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
14
12
10
8
UVLOHYS
6
4
V
UVLO+
V
UVLO−
(12.3 V)
(11.0 V)
2
0
0
5
10
15
20
Supply Voltage VCC – VEE (V)
Remark The graph indicates nominal characteristics.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 13 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
TAPING SPECIFICATIONS (UNIT: mm)
Chapter Title
Outline and Dimensions (Tape)
2.0 0.1
4.0 0.1
+0.1
4.5 MAX.
1.5
–0
4.1 0.1
0.3 0.05
2.05 0.05
10.7 0.1
12.0 0.1
Tape Direction
PS9505L2-E3
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
R 1.0
21.0 0.8
25.5 1.0
29.5 1.0
23.9 to 27.4
Outer edge of
flange
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 14 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
Outline and Dimensions (Tape)
2.0 0.1
4.0 0.1
+0.1
1.5
–0
5.3 MAX.
10.3 0.1
4.75 0.1
0.35 0.05
1.55 0.1
12.0 0.1
Tape Direction
PS9505L3-E3
Outline and Dimensions (Reel)
2.0 0.5
2.0 0.5
13.0 0.2
R 1.0
21.0 0.8
17.5 1.0
21.5 1.0
15.9 to 19.4
Outer edge of
flange
Packing: 1 000 pcs/reel
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 15 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
<R>
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
D
A
Part Number
PS9505L2
Lead Bending
A
B
C
D
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
2.54
2.54
1.7
2.2
lead bending type (Gull-wing)
for surface mount
9.0
1.7
2.0
PS9505L3
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 16 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
NOTES ON HANDLING
Chapter Title
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
260°C or below (package surface temperature)
10 seconds or less
• Time of peak reflow temperature
• Time of temperature higher than 220°C
60 seconds or less
• Time to preheat temperature from 120 to 180°C 120 30 s
• Number of reflows
• Flux
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120 30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
260°C or below (molten solder temperature)
10 seconds or less
• Preheating conditions
• Number of times
• Flux
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content
of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
• Flux
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 17 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
<R>
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pins 1, 4 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
*1 NC: Non-Connection (No Connection)
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 18 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
<R>
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Spec.
Unit
Climatic test class (IEC 60068-1/DIN EN 60068-1)
40/110/21
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.6 × UIORM, Pd < 5 pC
UIORM
Upr
1 130
1 808
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr
2 119
Vpeak
Vpeak
Upr = 1.875 × UIORM, Pd < 5 pC
Highest permissible overvoltage
UTR
8 000
2
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
Material group (DIN EN 60664-1 VDE0110 Part 1)
Storage temperature range
CTI
175
III a
Tstg
TA
–55 to +125
–40 to +110
°C
°C
Operating temperature range
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
Ris MIN.
Ris MIN.
1012
1011
Ω
Ω
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Tsi
Isi
175
400
700
°C
mA
mW
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
Psi
VIO = 500 V dc at TA = Tsi
Ris MIN.
109
Ω
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 19 of 20
PS9505,PS9505L1,PS9505L2,PS9505L3
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
Caution GaAs Products
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0015EJ0100 Rev.1.00
Jan 06, 2012
Page 20 of 20
Revision History
PS9505,PS9505L1,PS9505L2,PS9505L3 Data Sheet
Description
Summary
Rev.
Date
Page
0.01
1.00
May 12, 2010
Jan 06, 2012
−
First Edition issued
Throughout Preliminary Data Sheet -> Data Sheet
Throughout Safety standards approved
p.1
p.4
p.5
p.6
p.7
p.9
Addition of Pb-Free product
Modification of MARKING EXAMPLE
Addition of ORDERING INFORMATION
Modification of ELECTRICAL CHARACTERISTICS
Modification of SWITCHING CHARACTERISTICS
Modification of TEST CIRCUIT
pp.10 to 13 Addition of TYPICAL CHARACTERISTICS
p.16
p.18
p.19
Modification of RECOMMENDED MOUNT PAD DIMENSIONS
Modification of USAGE CAUTIONS 2. (2)
Addition of SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
All trademarks and registered trademarks are the property of their respective owners.
C - 1
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