R5F21321DDSP_技术文档

To our customers,

Old Company Name in Catalogs and Other Documents

On April 1^st, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas Electronics Corporation took over all the business of both

companies. Therefore, although the old company name remains in this document, it is a valid

Renesas Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1^st, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation (http://www.renesas.com)

Send any inquiries to http://www.renesas.com/inquiry.

Notice

1.

2.

All information included in this document is current as of the date this document is issued. Such information, however, is

subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please

confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to

additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights

of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights

of Renesas Electronics or others.

3.

4.

You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of

semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,

and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by

you or third parties arising from the use of these circuits, software, or information.

5.

When exporting the products or technology described in this document, you should comply with the applicable export control

laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by

the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and

technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited

under any applicable domestic or foreign laws or regulations.

6.

7.

Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics

does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages

incurred by you resulting from errors in or omissions from the information included herein.

Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as

indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular

application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior

written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for

which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way

liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an

application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written

consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise

expressly specified in a Renesas Electronics data sheets or data books, etc.

“Standard”:

Computers; office equipment; communications equipment; test and measurement equipment; audio and visual

equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-

crime systems; safety equipment; and medical equipment not specifically designed for life support.

“Specific”:

Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or

systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare

intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.

8.

9.

You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,

especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation

characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or

damages arising out of the use of Renesas Electronics products beyond such specified ranges.

Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have

specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,

Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to

guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire

control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because

the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system

manufactured by you.

10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental

compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable

laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS

Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with

applicable laws and regulations.

11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this

document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-

owned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

R8C/32D Group

REJ03B0288-0100

Rev.1.00

Feb 26, 2010

RENESAS MCU

1. Overview

1.1

Features

The R8C/32D Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions

for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of

system components.

1.1.1

Applications

Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 1 of 42

R8C/32D Group

1.Overview

1.1.2

Specifications

Tables 1.1 and 1.2 outline the Specifications for R8C/32D Group.

Table 1.1

Specifications for R8C/32D Group (1)

Item

CPU

Function

Central processing R8C CPU core

Specification

unit

• Number of fundamental instructions: 89

• Minimum instruction execution time:

50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V)

200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V)

• Multiplier: 16 bits × 16 bits → 32 bits

• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits

• Operation mode: Single-chip mode (address space: 1 Mbyte)

Refer to Table 1.3 Product List for R8C/32D Group.

• Power-on reset

Memory ROM, RAM

Power Supply Voltage detection

Voltage

Detection

I/O Ports

circuit

• Voltage detection 3 (detection level of voltage detection 0 and voltage

detection 1 selectable)

Programmable I/O • Input-only: 1 pin

ports

• CMOS I/O ports: 15, selectable pull-up resistor

• High current drive ports: 15

4 circuits: XIN clock oscillation circuit,

Clock

Clock generation

circuits

XCIN clock oscillation circuit (32 kHz)

High-speed on-chip oscillator (with frequency adjustment function),

Low-speed on-chip oscillator,

• Oscillation stop detection: XIN clock oscillation stop detection function

• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16

• Low power consumption modes:

Standard operating mode (high-speed clock, low-speed clock, high-speed

on-chip oscillator, low-speed on-chip oscillator), wait mode, stop mode

Real-time clock (timer RE)

Interrupts

• Number of interrupt vectors: 69

• External Interrupt: 7 (INT × 3, Key input × 4)

• Priority levels: 7 levels

• 14 bits × 1 (with prescaler)

Watchdog Timer

• Reset start selectable

• Low-speed on-chip oscillator for watchdog timer selectable

Timer

Timer RA

Timer RB

8 bits × 1 (with 8-bit prescaler)

Timer mode (period timer), pulse output mode (output level inverted every

period), event counter mode, pulse width measurement mode, pulse period

measurement mode

8 bits × 1 (with 8-bit prescaler)

Timer mode (period timer), programmable waveform generation mode (PWM

output), programmable one-shot generation mode, programmable wait one-

shot generation mode

16 bits × 1 (with 4 capture/compare registers)

Timer mode (input capture function, output compare function), PWM mode

(output 3 pins), PWM2 mode (PWM output pin)

Timer RC

Timer RE

8 bits × 1

Real-time clock mode (count seconds, minutes, hours, days of week)

Serial

Interface

UART0

UART2

Clock synchronous serial I/O/UART

Clock synchronous serial I/O/UART, I²C mode (I²C-bus),

multiprocessor communication function

A/D Converter

Comparator B

10-bit resolution × 4 channels, includes sample and hold function, with sweep

mode

2 circuits

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 2 of 42

R8C/32D Group

1.Overview

Table 1.2

Specifications for R8C/32D Group (2)

Item

Flash Memory

Function

Specification

• Programming and erasure voltage: VCC = 2.7 to 5.5 V

• Programming and erasure endurance: 1,000 times (program ROM)

• Program security: ROM code protect, ID code check

• Debug functions: On-chip debug, on-board flash rewrite function

f(XIN) = 20 MHz (VCC = 2.7 to 5.5 V)

f(XIN) = 5 MHz (VCC = 1.8 to 5.5 V)

Operating Frequency/Supply

Voltage

Current consumption

Typ. 6.5 mA (VCC = 5.0 V, f(XIN) = 20 MHz)

Typ. 3.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz)

Typ. 3.5 µA (VCC = 3.0 V, wait mode (f(XCIN) = 32 kHz))

Typ. 2.0 µA (VCC = 3.0 V, stop mode)

Operating Ambient Temperature

Package

-20 to 85°C (N version)

-40 to 85°C (D version) ⁽¹⁾

20-pin LSSOP

Package code: PLSP0020JB-A (previous code: 20P2F-A)

Note:

1. Specify the D version if D version functions are to be used.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 3 of 42

R8C/32D Group

1.Overview

1.2

Product List

Table 1.3 lists Product List for R8C/32D Group, and Figure 1.1 shows a Part Number, Memory Size, and Package

of R8C/32D Group.

Table 1.3

Product List for R8C/32D Group

Current of Feb. 2010

Part No.

ROM Capacity

4 Kbytes

RAM Capacity

1 Kbyte

Package Type

PLSP0020JB-A

Remarks

N version

R5F21321DNSP

R5F21322DNSP

8 Kbytes

1 Kbyte

R5F21324DNSP

16 Kbytes

4 Kbytes

1 Kbyte

R5F21321DDSP (D)

R5F21322DDSP (D)

R5F21324DDSP (D)

1 Kbyte

D version

8 Kbytes

1 Kbyte

16 Kbytes

1 Kbyte

(D): Under development

Part No. R 5 F 21 32 4 D N SP

Package type:

SP: PLSP0020JB-A (0.65 mm pin-pitch)

Classification

N: Operating ambient temperature -20°C to 85°C

D: Operating ambient temperature -40°C to 85°C

ROM capacity

1: 4 KB

2: 8 KB

4: 16 KB

R8C/32D Group

R8C/3x Series

Memory type

F: Flash memory

Renesas MCU

Renesas semiconductor

Figure 1.1

Part Number, Memory Size, and Package of R8C/32D Group

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 4 of 42

R8C/32D Group

1.Overview

1.3

Block Diagram

Figure 1.2 shows a Block Diagram.

8

3

1

4

Port P1

I/O ports

Peripheral functions

Port P3

Port P4

UART or

clock synchronous serial I/O

Timers

System clock generation

circuit

(8 bits × 2)

Timer RA (8 bits × 1)

Timer RB (8 bits × 1)

Timer RC (16 bits × 1)

Timer RE (8 bits × 1)

XIN-XOUT

High-speed on-chip oscillator

Low-speed on-chip oscillator

XCIN-XCOUT

Watchdog timer

(14 bits)

Low-speed on-chip oscillator

for watchdog timer

A/D converter

Voltage detection circuit

Comparator B

(10 bits × 4 channels)

Memory

R8C CPU core

ROM ⁽¹⁾

R0H

R1H

R0L

R1L

SB

USP

ISP

INTB

PC

FLG

R2

R3

RAM ⁽²⁾

A0

A1

FB

Multiplier

Notes:

1. ROM size varies with MCU type.

2. RAM size varies with MCU type.

Figure 1.2

Block Diagram

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 5 of 42

R8C/32D Group

1.Overview

1.4

Pin Assignment

Figure 1.3 shows Pin Assignment (Top View). Table 1.4 outlines the Pin Name Information by Pin Number.

20

19

18

17

16

15

14

13

12

11

P1_0/AN8/KI0(/TRCIOD)

P4_2/VREF

MODE

1

P1_1/AN9/KI1(/TRCIOA/TRCTRG)

P1_2/AN10/Kl2(/TRCIOB)

P1_3/AN11/Kl3/TRBO(/TRCIOC)

P1_4(/TXD0/TRCCLK)

2

3

RESET

P4_7/XOUT(/XCOUT)

4

5

VSS/AVSS

P1_5(/INT1/RXD0/TRAIO)

P1_6/IVREF1(/CLK0)

6

P4_6/XIN(/XCIN)

7

VCC/AVCC

P1_7/IVCMP1/INT1(/TRAIO)

P4_5/ADTRG/INT0(/RXD2/SCL2)

8

P3_7/TRAO(/RXD2/SCL2/TXD2/SDA2)

P3_5(/CLK2/TRCIOD)

9

P3_4/IVREF3(/RXD2/SCL2/TXD2/SDA2/TRCIOC)

P3_3/IVCMP3/INT3(/CTS2/RTS2/TRCCLK)

10

Notes:

1. Can be assigned to the pin in parentheses by a program.

2. Confirm the pin 1 position on the package by referring to the package dimensions.

Figure 1.3

Pin Assignment (Top View)

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 6 of 42

R8C/32D Group

1.Overview

Table 1.4

Pin Name Information by Pin Number

I/O Pin Functions for Peripheral Modules

Number

Control Pin

Port

A/D Converter,

Comparator B

VREF

Interrupt

Timer

Serial Interface

1

2

3

P4_2

MODE

RESET

4

5

6

7

8

XOUT(/XCOUT)

VSS/AVSS

P4_7

P4_6

P3_7

XIN(/XCIN)

VCC/AVCC

TRAO

(RXD2/SCL2/

TXD2/SDA2)

9

P3_5

P3_4

(TRCIOD)

(TRCIOC)

(CLK2)

10

(RXD2/SCL2/

TXD2/SDA2)

IVREF3

IVCMP3

11

12

13

P3_3

P4_5

P1_7

(TRCCLK)

INT3

INT0

INT1

(CTS2/RTS2)

(RXD2/SCL2)

ADTRG

IVCMP1

(TRAIO)

14

15

P1_6

P1_5

(CLK0)

(RXD0)

IVREF1

(INT1)

16

17

P1_4

P1_3

(TRCCLK)

(TXD0)

TRBO(/TRCIOC)

AN11

AN10

AN9

KI3

KI2

KI1

KI0

18

19

20

P1_2

P1_1

P1_0

(TRCIOB)

(TRCIOA/TRCTRG)

(TRCIOD)

AN8

Note:

1. Can be assigned to the pin in parentheses by a program.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 7 of 42

R8C/32D Group

1.Overview

1.5

Pin Functions

Table 1.5 lists Pin Functions.

Table 1.5

Item

Power supply input VCC, VSS

Pin Functions

Pin Name

I/O Type

Description

−

Apply 1.8 V to 5.5 V to the VCC pin. Apply 0 V to the VSS pin.

Analog power

supply input

AVCC, AVSS

Power supply for the A/D converter.

Connect a capacitor between AVCC and AVSS.

Reset input

MODE

RESET

MODE

XIN

I

Input “L” on this pin resets the MCU.

Connect this pin to VCC via a resistor.

XIN clock input

These pins are provided for XIN clock generation circuit I/O.

Connect a ceramic resonator or a crystal oscillator between

the XIN and XOUT pins ⁽¹⁾. To use an external clock, input it

to the XOUT pin and leave the XIN pin open.

XIN clock output

XCIN clock input

XOUT

XCIN

I/O

I

These pins are provided for XCIN clock generation circuit I/O.

Connect a crystal oscillator between the XCIN and XCOUT

pins ⁽¹⁾. To use an external clock, input it to the XCIN pin and

leave the XCOUT pin open.

XCIN clock output XCOUT

O

INT interrupt input INT0, INT1, INT3

I

INT interrupt input pins.

INT0 is timer RB, and RC input pin.

Key input interrupt

Timer RA

Key input interrupt input pins

KI0 to KI3

TRAIO

I/O

O

I

Timer RA I/O pin

TRAO

Timer RA output pin

Timer RB output pin

External clock input pin

External trigger input pin

Timer RC I/O pins

Timer RB

Timer RC

TRBO

TRCCLK

TRCTRG

I

TRCIOA, TRCIOB,

TRCIOC, TRCIOD

I/O

Serial interface

CLK0, CLK2

RXD0, RXD2

TXD0, TXD2

I/O

Transfer clock I/O pins

Serial data input pins

I

O

I

Serial data output pins

Transmission control input pin

CTS2

O

I/O

I

Reception control output pin

RTS2

SCL2

SDA2

I²C mode clock I/O pin

I²C mode data I/O pin

Reference voltage VREF

input

Reference voltage input pin to A/D converter

A/D converter

AN8 to AN11

I

Analog input pins to A/D converter

A/D external trigger input pin

ADTRG

Comparator B

I/O port

IVCMP1, IVCMP3

IVREF1, IVREF3

I

Comparator B analog voltage input pins

Comparator B reference voltage input pins

P1_0 to P1_7,

P3_3 to P3_5, P3_7,

P4_5 to P4_7

I/O

CMOS I/O ports. Each port has an I/O select direction

register, allowing each pin in the port to be directed for input

or output individually.

Any port set to input can be set to use a pull-up resistor or not

by a program.

All ports can be used as LED drive ports.

Input port

P4_2

I

Input-only port

I: Input

Note:

O: Output

I/O: Input and output

1. Refer to the oscillator manufacturer for oscillation characteristics.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 8 of 42

R8C/32D Group

2. Central Processing Unit (CPU)

Figure 2.1 shows the CPU Registers. The CPU contains 13 registers. R0, R1, R2, R3, A0, A1, and FB configure a

register bank. There are two sets of register bank.

b31

b15

b8b7

b0

R0H (high-order of R0) R0L (low-order of R0)

R1H (high-order of R1) R1L (low-order of R1)

R2

R3

Data registers ⁽¹⁾

R3

A0

Address registers ⁽¹⁾

A1

FB

Frame base register ⁽¹⁾

b19

b15

b0

Interrupt table register

Program counter

INTBH

INTBL

The 4 high order bits of INTB are INTBH and

the 16 low order bits of INTB are INTBL.

b19

PC

b15

b0

User stack pointer

Interrupt stack pointer

Static base register

USP

ISP

SB

b15

b0

Flag register

FLG

b15

b8

b7

IPL

U I O B S Z D C

Carry flag

Debug flag

Zero flag

Sign flag

Register bank select flag

Overflow flag

Interrupt enable flag

Stack pointer select flag

Reserved bit

Processor interrupt priority level

Reserved bit

Note:

1. These registers comprise a register bank. There are two register banks.

Figure 2.1

CPU Registers

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 9 of 42

R8C/32D Group

2. Central Processing Unit (CPU)

2.1

Data Registers (R0, R1, R2, and R3)

R0 is a 16-bit register for transfer, arithmetic, and logic operations. The same applies to R1 to R3. R0 can be split

into high-order bits (R0H) and low-order bits (R0L) to be used separately as 8-bit data registers. R1H and R1L are

analogous to R0H and R0L. R2 can be combined with R0 and used as a 32-bit data register (R2R0). R3R1 is

analogous to R2R0.

2.2

Address Registers (A0 and A1)

A0 is a 16-bit register for address register indirect addressing and address register relative addressing. It is also

used for transfer, arithmetic, and logic operations. A1 is analogous to A0. A1 can be combined with A0 and as a 32-

bit address register (A1A0).

2.3

Frame Base Register (FB)

FB is a 16-bit register for FB relative addressing.

2.4

Interrupt Table Register (INTB)

INTB is a 20-bit register that indicates the starting address of an interrupt vector table.

2.5

Program Counter (PC)

PC is 20 bits wide and indicates the address of the next instruction to be executed.

2.6

User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)

The stack pointers (SP), USP and ISP, are each 16 bits wide. The U flag of FLG is used to switch between

USP and ISP.

2.7

Static Base Register (SB)

SB is a 16-bit register for SB relative addressing.

2.8

Flag Register (FLG)

FLG is an 11-bit register indicating the CPU state.

2.8.1

Carry Flag (C)

The C flag retains carry, borrow, or shift-out bits that have been generated by the arithmetic and logic unit.

2.8.2

Debug Flag (D)

The D flag is for debugging only. Set it to 0.

2.8.3

Zero Flag (Z)

The Z flag is set to 1 when an arithmetic operation results in 0; otherwise to 0.

2.8.4

Sign Flag (S)

The S flag is set to 1 when an arithmetic operation results in a negative value; otherwise to 0.

2.8.5

Register Bank Select Flag (B)

Register bank 0 is selected when the B flag is 0. Register bank 1 is selected when this flag is set to 1.

2.8.6

Overflow Flag (O)

The O flag is set to 1 when an operation results in an overflow; otherwise to 0.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 10 of 42

R8C/32D Group

2. Central Processing Unit (CPU)

2.8.7

Interrupt Enable Flag (I)

The I flag enables maskable interrupts.

Interrupts are disabled when the I flag is set to 0, and are enabled when the I flag is set to 1. The I flag is set to 0

when an interrupt request is acknowledged.

2.8.8

Stack Pointer Select Flag (U)

ISP is selected when the U flag is set to 0; USP is selected when the U flag is set to 1.

The U flag is set to 0 when a hardware interrupt request is acknowledged or the INT instruction of software

interrupt numbers 0 to 31 is executed.

2.8.9

Processor Interrupt Priority Level (IPL)

IPL is 3 bits wide and assigns processor interrupt priority levels from level 0 to level 7.

If a requested interrupt has higher priority than IPL, the interrupt is enabled.

2.8.10 Reserved Bit

If necessary, set to 0. When read, the content is undefined.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 11 of 42

R8C/32D Group

3.Memory

3. Memory

3.1

R8C/32D Group

Figure 3.1 is a Memory Map of R8C/32D Group. The R8C/32D Group has a 1-Mbyte address space from addresses

00000h to FFFFFh. The internal ROM (program ROM) is allocated lower addresses, beginning with address

0FFFFh. For example, a 16-Kbyte internal ROM area is allocated addresses 0C000h to 0FFFFh.

The fixed interrupt vector table is allocated addresses 0FFDCh to 0FFFFh. The starting address of each interrupt

routine is stored here.

The internal RAM is allocated higher addresses, beginning with address 00400h. For example, a 1-Kbyte internal

RAM area is allocated addresses 00400h to 007FFh. The internal RAM is used not only for data storage but also as

a stack area when a subroutine is called or when an interrupt request is acknowledged.

Special function registers (SFRs) are allocated addresses 00000h to 002FFh. Peripheral function control registers

are allocated here. All unallocated spaces within the SFRs are reserved and cannot be accessed by users.

00000h

SFR

(Refer to 4. Special

Function Registers

(SFRs))

002FFh

00400h

Internal RAM

0FFD8h

0FFDCh

0XXXXh

Reserved area

Undefined instruction

Overflow

BRK instruction

Address match

Single step

Watchdog timer, oscillation stop detection, voltage monitor

0YYYYh

0FFFFh

(Reserved)

Internal ROM

(program ROM)

(Reserved)

Reset

0FFFFh

FFFFFh

Note:

1. The blank areas are reserved and cannot be accessed by users.

Internal ROM

Part Number

Internal RAM

Address 0XXXXh

Size

Address 0YYYYh

Size

R5F21321DNSP, R5F21321DDSP

R5F21322DNSP, R5F21322DDSP

R5F21324DNSP, R5F21324DDSP

4 Kbytes

8 Kbytes

16 Kbytes

0F000h

0E000h

0C000h

1 Kbyte

007FFh

Figure 3.1

Memory Map of R8C/32D Group

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 12 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

An SFR (special function register) is a control register for a peripheral function. Tables 4.1 to 4.8 list the special

function registers and Table 4.9 lists the ID Code Areas and Option Function Select Area.

(1)

Table 4.1

SFR Information (1)

Address

0000h

0001h

0002h

0003h

0004h

0005h

0006h

0007h

0008h

0009h

000Ah

000Bh

000Ch

000Dh

000Eh

000Fh

0010h

0011h

0012h

0013h

0014h

0015h

0016h

0017h

0018h

0019h

001Ah

001Bh

001Ch

Register

Symbol

After Reset

Processor Mode Register 0

Processor Mode Register 1

PM0

PM1

CM0

CM1

00h

System Clock Control Register 0

System Clock Control Register 1

Module Standby Control Register

System Clock Control Register 3

Protect Register

00101000b

00100000b

00h

MSTCR

CM3

00h

PRCR

RSTFR

OCD

(2)

Reset Source Determination Register

Oscillation Stop Detection Register

Watchdog Timer Reset Register

Watchdog Timer Start Register

Watchdog Timer Control Register

0XXXXXXXb

00000100b

XXh

WDTR

WDTS

WDTC

XXh

00111111b

High-Speed On-Chip Oscillator Control Register 7

FRA7

When shipping

Count Source Protection Mode Register

CSPR

00h

(3)

10000000b

001Dh

001Eh

001Fh

0020h

0021h

0022h

0023h

0024h

0025h

0026h

0027h

0028h

0029h

002Ah

002Bh

002Ch

002Dh

002Eh

002Fh

0030h

0031h

0032h

0033h

0034h

High-Speed On-Chip Oscillator Control Register 0

High-Speed On-Chip Oscillator Control Register 1

High-Speed On-Chip Oscillator Control Register 2

On-Chip Reference Voltage Control Register

FRA0

FRA1

00h

When shipping

FRA2

OCVREFCR

00h

Clock Prescaler Reset Flag

CPSRF

FRA4

FRA5

FRA6

00h

High-Speed On-Chip Oscillator Control Register 4

High-Speed On-Chip Oscillator Control Register 5

High-Speed On-Chip Oscillator Control Register 6

When Shipping

High-Speed On-Chip Oscillator Control Register 3

Voltage Monitor Circuit Control Register

Voltage Monitor Circuit Edge Select Register

FRA3

CMPA

VCAC

When shipping

00h

Voltage Detect Register 1

Voltage Detect Register 2

VCA1

VCA2

00001000b

(4)

00h

(5)

00100000b

0035h

0036h

0037h

0038h

Voltage Detection 1 Level Select Register

Voltage Monitor 0 Circuit Control Register

Voltage Monitor 1 Circuit Control Register

VD1LS

VW0C

VW1C

00000111b

(4)

1100X010b

(5)

1100X011b

10001010b

0039h

X: Undefined

Notes:

1. The blank areas are reserved and cannot be accessed by users.

2. The CWR bit in the RSTFR register is set to 0 after power-on and voltage monitor 0 reset. Hardware reset, software reset, or watchdog timer

reset does not affect this bit.

3. The CSPROINI bit in the OFS register is set to 0.

4. The LVDAS bit in the OFS register is set to 1.

5. The LVDAS bit in the OFS register is set to 0.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 13 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.2

SFR Information (2)

Address

003Ah

003Bh

003Ch

003Dh

003Eh

003Fh

0040h

0041h

0042h

0043h

0044h

0045h

0046h

0047h

0048h

0049h

004Ah

004Bh

004Ch

004Dh

004Eh

004Fh

0050h

0051h

0052h

0053h

0054h

0055h

0056h

0057h

0058h

0059h

005Ah

005Bh

005Ch

005Dh

005Eh

005Fh

0060h

0061h

0062h

0063h

0064h

0065h

0066h

0067h

0068h

0069h

006Ah

006Bh

006Ch

006Dh

006Eh

006Fh

0070h

0071h

0072h

0073h

0074h

0075h

0076h

0077h

0078h

0079h

007Ah

007Bh

007Ch

007Dh

007Eh

007Fh

Register

Symbol

After Reset

10000010b

Voltage Monitor 2 Circuit Control Register

VW2C

Flash Memory Ready Interrupt Control Register

FMRDYIC

XXXXX000b

Timer RC Interrupt Control Register

TRCIC

Timer RE Interrupt Control Register

TREIC

S2TIC

S2RIC

KUPIC

ADIC

XXXXX000b

UART2 Transmit Interrupt Control Register

UART2 Receive Interrupt Control Register

Key Input Interrupt Control Register

A/D Conversion Interrupt Control Register

UART0 Transmit Interrupt Control Register

UART0 Receive Interrupt Control Register

S0TIC

S0RIC

XXXXX000b

Timer RA Interrupt Control Register

TRAIC

XXXXX000b

Timer RB Interrupt Control Register

INT1 Interrupt Control Register

INT3 Interrupt Control Register

TRBIC

INT1IC

INT3IC

XXXXX000b

XX00X000b

INT0 Interrupt Control Register

INT0IC

XX00X000b

XXXXX000b

UART2 Bus Collision Detection Interrupt Control Register

U2BCNIC

Voltage Monitor 1 Interrupt Control Register

Voltage Monitor 2 Interrupt Control Register

VCMP1IC

VCMP2IC

XXXXX000b

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 14 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.3

SFR Information (3)

Address

0080h

0081h

0082h

0083h

0084h

0085h

0086h

0087h

0088h

0089h

008Ah

008Bh

008Ch

008Dh

008Eh

008Fh

0090h

0091h

0092h

0093h

0094h

0095h

0096h

0097h

0098h

0099h

009Ah

009Bh

009Ch

009Dh

009Eh

009Fh

00A0h

00A1h

00A2h

00A3h

00A4h

00A5h

00A6h

00A7h

00A8h

00A9h

00AAh

00ABh

00ACh

00ADh

00AEh

00AFh

00B0h

00B1h

00B2h

00B3h

00B4h

00B5h

00B6h

00B7h

00B8h

00B9h

00BAh

00BBh

00BCh

00BDh

00BEh

00BFh

Register

Symbol

After Reset

UART0 Transmit / Receive Mode Register

UART0 Bit Rate Register

U0MR

00h

XXh

U0BRG

U0TB

UART0 Transmit Buffer Register

UART0 Transmit / Receive Control Register 0

UART0 Transmit / Receive Control Register 1

UART0 Receive Buffer Register

U0C0

U0C1

U0RB

00001000b

00000010b

XXh

UART2 Transmit / Receive Mode Register

UART2 Bit Rate Register

U2MR

U2BRG

U2TB

00h

XXh

UART2 Transmit Buffer Register

XXh

UART2 Transmit / Receive Control Register 0

UART2 Transmit / Receive Control Register 1

UART2 Receive Buffer Register

U2C0

U2C1

U2RB

00001000b

00000010b

XXh

UART2 Digital Filter Function Select Register

URXDF

00h

UART2 Special Mode Register 5

UART2 Special Mode Register 4

UART2 Special Mode Register 3

UART2 Special Mode Register 2

UART2 Special Mode Register

U2SMR5

U2SMR4

U2SMR3

U2SMR2

U2SMR

00h

000X0X0Xb

X0000000b

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 15 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.4

SFR Information (4)

Address

Register

Symbol

After Reset

00C0h

00C1h

00C2h

00C3h

00C4h

00C5h

00C6h

00C7h

00C8h

00C9h

00CAh

00CBh

00CCh

00CDh

00CEh

00CFh

00D0h

00D1h

00D2h

00D3h

00D4h

00D5h

00D6h

00D7h

00D8h

00D9h

00DAh

00DBh

00DCh

00DDh

00DEh

00DFh

00E0h

00E1h

00E2h

00E3h

00E4h

00E5h

00E6h

00E7h

00E8h

00E9h

00EAh

00EBh

00ECh

00EDh

00EEh

00EFh

00F0h

00F1h

00F2h

00F3h

00F4h

00F5h

00F6h

00F7h

00F8h

00F9h

00FAh

00FBh

00FCh

00FDh

00FEh

00FFh

A/D Register 0

A/D Register 1

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

XXh

000000XXb

XXh

000000XXb

XXh

A/D Register 2

A/D Register 3

A/D Register 4

A/D Register 5

A/D Register 6

A/D Register 7

000000XXb

XXh

000000XXb

XXh

000000XXb

XXh

000000XXb

XXh

000000XXb

XXh

000000XXb

A/D Mode Register

ADMOD

ADINSEL

ADCON0

ADCON1

00h

11000000b

00h

A/D Input Select Register

A/D Control Register 0

A/D Control Register 1

00h

Port P1 Register

P1

XXh

00h

XXh

Port P1 Direction Register

Port P3 Register

PD1

P3

Port P3 Direction Register

Port P4 Register

PD3

P4

00h

XXh

Port P4 Direction Register

PD4

00h

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 16 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.5

SFR Information (5)

Address

0100h

0101h

0102h

0103h

0104h

0105h

0106h

0107h

0108h

0109h

010Ah

010Bh

010Ch

010Dh

010Eh

010Fh

0110h

0111h

0112h

0113h

0114h

0115h

0116h

0117h

0118h

0119h

011Ah

011Bh

011Ch

011Dh

011Eh

011Fh

0120h

0121h

0122h

0123h

0124h

0125h

0126h

0127h

0128h

0129h

012Ah

012Bh

012Ch

012Dh

012Eh

012Fh

0130h

0131h

0132h

0133h

0134h

0135h

0136h

0137h

0138h

0139h

013Ah

013Bh

013Ch

013Dh

013Eh

013Fh

Register

Symbol

TRACR

After Reset

Timer RA Control Register

Timer RA I/O Control Register

Timer RA Mode Register

Timer RA Prescaler Register

Timer RA Register

00h

FFh

TRAIOC

TRAMR

TRAPRE

TRA

Timer RB Control Register

TRBCR

TRBOCR

TRBIOC

TRBMR

TRBPRE

TRBSC

TRBPR

00h

FFh

Timer RB One-Shot Control Register

Timer RB I/O Control Register

Timer RB Mode Register

Timer RB Prescaler Register

Timer RB Secondary Register

Timer RB Primary Register

Timer RE Second Data Register

Timer RE Minute Data Register

Timer RE Hour Data Register

Timer RE Day of Week Data Register

Timer RE Control Register 1

TRESEC

TREMIN

TREHR

00h

TREWK

TRECR1

TRECR2

TRECSR

Timer RE Control Register 2

Timer RE Count Source Select Register

00001000b

Timer RC Mode Register

TRCMR

TRCCR1

TRCIER

TRCSR

TRCIOR0

TRCIOR1

TRC

01001000b

00h

Timer RC Control Register 1

Timer RC Interrupt Enable Register

Timer RC Status Register

01110000b

10001000b

00h

Timer RC I/O Control Register 0

Timer RC I/O Control Register 1

Timer RC Counter

00h

Timer RC General Register A

Timer RC General Register B

Timer RC General Register C

Timer RC General Register D

TRCGRA

TRCGRB

TRCGRC

TRCGRD

FFh

Timer RC Control Register 2

TRCCR2

TRCDF

00011000b

00h

Timer RC Digital Filter Function Select Register

Timer RC Output Master Enable Register

Timer RC Trigger Control Register

TRCOER

TRCADCR

01111111b

00h

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 17 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.6

SFR Information (6)

Address

0140h

0141h

0142h

0143h

0144h

0145h

0146h

0147h

0148h

0149h

014Ah

014Bh

014Ch

014Dh

014Eh

014Fh

0150h

0151h

0152h

0153h

0154h

0155h

0156h

0157h

0158h

0159h

015Ah

015Bh

015Ch

015Dh

015Eh

015Fh

0160h

0161h

0162h

0163h

0164h

0165h

0166h

0167h

0168h

0169h

016Ah

016Bh

016Ch

016Dh

016Eh

016Fh

0170h

0171h

0172h

0173h

0174h

0175h

0176h

0177h

0178h

0179h

017Ah

017Bh

017Ch

017Dh

017Eh

017Fh

Register

Symbol

After Reset

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 18 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.7

SFR Information (7)

Address

0180h

0181h

0182h

0183h

0184h

0185h

0186h

0187h

0188h

0189h

018Ah

018Bh

018Ch

018Dh

018Eh

018Fh

0190h

0191h

0192h

0193h

0194h

0195h

0196h

0197h

0198h

0199h

019Ah

019Bh

019Ch

019Dh

019Eh

019Fh

01A0h

01A1h

01A2h

01A3h

01A4h

01A5h

01A6h

01A7h

01A8h

01A9h

01AAh

01ABh

01ACh

01ADh

01AEh

01AFh

01B0h

01B1h

01B2h

01B3h

01B4h

01B5h

01B6h

01B7h

01B8h

01B9h

01BAh

01BBh

01BCh

01BDh

01BEh

01BFh

Register

Symbol

TRASR

After Reset

Timer RA Pin Select Register

Timer RC Pin Select Register

Timer RC Pin Select Register 0

Timer RC Pin Select Register 1

00h

TRBRCSR

TRCPSR0

TRCPSR1

UART0 Pin Select Register

U0SR

00h

UART2 Pin Select Register 0

UART2 Pin Select Register 1

U2SR0

U2SR1

00h

INT Interrupt Input Pin Select Register

I/O Function Pin Select Register

INTSR

PINSR

00h

Flash Memory Status Register

FST

10000X00b

Flash Memory Control Register 0

Flash Memory Control Register 1

Flash Memory Control Register 2

FMR0

FMR1

FMR2

00h

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 19 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

(1)

Table 4.8

SFR Information (8)

Address

01C0h

01C1h

01C2h

01C3h

01C4h

01C5h

01C6h

01C7h

01C8h

01C9h

01CAh

01CBh

01CCh

01CDh

01CEh

01CFh

01D0h

01D1h

01D2h

01D3h

01D4h

01D5h

01D6h

01D7h

01D8h

01D9h

01DAh

01DBh

01DCh

01DDh

01DEh

01DFh

01E0h

01E1h

01E2h

01E3h

01E4h

01E5h

01E6h

01E7h

01E8h

01E9h

01EAh

01EBh

01ECh

01EDh

01EEh

01EFh

01F0h

01F1h

01F2h

01F3h

01F4h

01F5h

01F6h

01F7h

01F8h

01F9h

01FAh

01FBh

01FCh

01FDh

01FEh

01FFh

Register

Symbol

RMAD0

After Reset

Address Match Interrupt Register 0

XXh

0000XXXXb

00h

XXh

Address Match Interrupt Enable Register

Address Match Interrupt Register 1

AIER

RMAD1

XXh

0000XXXXb

Pull-Up Control Register 0

Pull-Up Control Register 1

PUR0

PUR1

00h

Port P1 Drive Capacity Control Register

P1DRR

00h

Drive Capacity Control Register 0

Drive Capacity Control Register 1

DRR0

DRR1

00h

Input Threshold Control Register 0

Input Threshold Control Register 1

VLT0

VLT1

00h

Comparator B Control Register 0

External Input Enable Register 0

INT Input Filter Select Register 0

Key Input Enable Register 0

INTCMP

INTEN

INTF

00h

KIEN

X: Undefined

Note:

1. The blank areas are reserved and cannot be accessed by users.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 20 of 42

R8C/32D Group

4. Special Function Registers (SFRs)

Table 4.9

Address

ID Code Areas and Option Function Select Area

Area Name

Symbol

After Reset

(Note 1)

:

FFDBh

Option Function Select Register 2

OFS2

:

FFDFh

ID1

(Note 2)

(Note 1)

:

FFE3h

ID2

:

FFEBh

ID3

:

FFEFh

ID4

:

FFF3h

ID5

:

FFF7h

ID6

:

FFFBh

:

FFFFh

ID7

Option Function Select Register

OFS

Notes:

1. The option function select area is allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.

Do not write additions to the option function select area. If the block including the option function select area is erased, the option function select

area is set to FFh.

When blank products are shipped, the option function select area is set to FFh. It is set to the written value after written by the user.

When factory-programming products are shipped, the value of the option function select area is the value programmed by the user.

2. The ID code areas are allocated in the flash memory, not in the SFRs. Set appropriate values as ROM data by a program.

Do not write additions to the ID code areas. If the block including the ID code areas is erased, the ID code areas are set to FFh.

When blank products are shipped, the ID code areas are set to FFh. They are set to the written value after written by the user.

When factory-programming products are shipped, the value of the ID code areas is the value programmed by the user.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 21 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.1

Absolute Maximum Ratings

Symbol

Parameter

Supply voltage

Condition

Rated Value

−0.3 to 6.5

Unit

V

VCC/AVCC

VI

Input voltage

−0.3 to VCC + 0.3

500

V

VO

Pd

Output voltage

V

Power dissipation

−40°C ≤ Topr ≤ 85°C

mW

°C

Topr

Operating ambient temperature

−20 to 85 (N version) /

−40 to 85 (D version)

Tstg

Storage temperature

−65 to 150

°C

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 22 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.2

Recommended Operating Conditions

Standard

Unit

Symbol

Parameter

Conditions

Min.

1.8

−

Typ.

Max.

VCC/AVCC Supply voltage

−

0

5.5

V

VSS/AVSS Supply voltage

−

VIH

Input “H” voltage Other than CMOS input

0.8

V

CC

−

VCC

0.2 VCC

V

CMOS

input

Inputlevel Input level selection 4.0 V ≤ VCC ≤ 5.5 V 0.5 VCC

switching : 0.35 VCC

−

V

2.7 V ≤ VCC < 4.0 V 0.55 VCC

−

V

function

(I/O port)

1.8 V ≤ VCC < 2.7 V 0.65 VCC

−

V

Input level selection 4.0 V ≤ VCC ≤ 5.5 V 0.65 VCC

−

V

: 0.5 VCC

2.7 V ≤ VCC < 4.0 V 0.7

1.8 V ≤ VCC < 2.7 V 0.8

VCC

CC

−

V

−

V

Input level selection 4.0 V ≤ VCC ≤ 5.5 V 0.85 VCC

: 0.7 VCC

−

V

2.7 V ≤ VCC < 4.0 V 0.85 VCC

−

V

1.8 V ≤ VCC < 2.7 V 0.85 VCC

−

V

External clock input (XOUT)

1.2

0

−

32

−

V

VIL

Input “L” voltage Other than CMOS input

−

V

CMOS

input

Inputlevel Input level selection 4.0 V ≤ VCC ≤ 5.5 V

switching : 0.35 VCC

function

−

V

2.7 V ≤ VCC < 4.0 V

1.8 V ≤ VCC < 2.7 V

−

0.2

0.4

0.3

0.2

VCC

V

−

V

(I/O port)

Input level selection 4.0 V ≤ VCC ≤ 5.5 V

−

V

: 0.5 VCC

2.7 V ≤ VCC < 4.0 V

−

V

1.8 V ≤ VCC < 2.7 V

−

V

Input level selection 4.0 V ≤ VCC ≤ 5.5 V

: 0.7 VCC

−

0.55 VCC

0.45 VCC

0.35 VCC

0.4

−160

−80

−10

−40

−5

V

2.7 V ≤ VCC < 4.0 V

−

V

1.8 V ≤ VCC < 2.7 V

−

V

External clock input (XOUT)

IOH(sum) Peak sum output “H” current Sum of all pins IOH(peak)

Average sum output “H” current Sum of all pins IOH(avg)

−

V

−

mA

MHz

kHz

MHz

IOH(sum)

−

IOH(peak) Peak output “H” current

Drive capacity Low

Drive capacity High

Drive capacity Low

Drive capacity High

−

IOH(avg)

Average output “H” current

−

−20

160

80

IOL(sum)

Peak sum output “L” current Sum of all pins IOL(peak)

Average sum output “L” current Sum of all pins IOL(avg)

−

IOL(peak) Peak output “L” current

Drive capacity Low

Drive capacity High

Drive capacity Low

Drive capacity High

−

10

−

40

IOL(avg)

f(XIN)

Average output “L” current

−

5

−

20

XIN clock input oscillation frequency

2.7 V ≤ VCC ≤ 5.5 V

1.8 V ≤ VCC < 2.7 V

1.8 V ≤ VCC ≤ 5.5 V

2.7 V ≤ VCC ≤ 5.5 V

1.8 V ≤ VCC < 2.7 V

2.7 V ≤ VCC ≤ 5.5 V

1.8 V ≤ VCC < 2.7 V

2.7 V ≤ VCC ≤ 5.5 V

1.8 V ≤ VCC < 2.7 V

−

20

−

5

f(XCIN)

XCIN clock input oscillation frequency

When used as the count source for timer RC

32.768

−

50

(3)

fOCO40M

40

fOCO-F fOCO-F frequency

−

20

−

5

−

System clock frequency

CPU clock frequency

−

20

−

5

f(BCLK)

−

20

−

5

Notes:

1. VCC = 1.8 to 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.

2. The average output current indicates the average value of current measured during 100 ms.

3. fOCO40M can be used as the count source for timer RC in the range of VCC = 2.7 V to 5.5V.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 23 of 42

R8C/32D Group

5. Electrical Characteristics

P1

P3

P4

30pF

Figure 5.1

Ports P1, P3, P4 Timing Measurement Circuit

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 24 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.3

A/D Converter Characteristics

Standard

Unit

Symbol

Parameter

Conditions

Min.

Typ.

Max.

10

3

−

Resolution

Vref = AVCC

Vref = AVCC = 5.0 V

−

Bit

LSB

MHz

kΩ

Absolute accuracy

10-bit mode

8-bit mode

AN8 to AN11 input

−

Vref = AVCC = 3.3 V

Vref = AVCC = 3.0 V

Vref = AVCC = 2.2 V

Vref = AVCC = 5.0 V

Vref = AVCC = 3.3 V

Vref = AVCC = 3.0 V

Vref = AVCC = 2.2 V

−

5

−

5

−

5

−

2

−

2

−

2

−

2

4.0 V ≤ Vref = AVCC ≤ 5.5 V ⁽²⁾

3.2 V ≤ Vref = AVCC ≤ 5.5 V ⁽²⁾

2.7 V ≤ Vref = AVCC ≤ 5.5 V ⁽²⁾

2.2 V ≤ Vref = AVCC ≤ 5.5 V ⁽²⁾

φAD

A/D conversion clock

2

−

20

16

10

5

2

−

2

−

2

−

Tolerance level impedance

Conversion time

−

3

−

tCONV

10-bit mode Vref = AVCC = 5.0 V, φAD = 20 MHz

2.15

0.75

−

µs

8-bit mode

Vref = AVCC = 5.0 V, φAD = 20 MHz

φAD = 20 MHz

−

µs

tSAMP

IVref

Vref

Sampling time

−

µs

Vref current

VCC = 5 V, XIN = f1 = φAD = 20 MHz

45

−

µA

Reference voltage

Analog input voltage ⁽³⁾

2.2

0

AVCC

Vref

1.49

V

VIA

−

V

OCVREF On-chip reference voltage

2 MHz ≤ φAD ≤ 4 MHz

1.19

1.34

V

Notes:

1. VCC/AVCC = Vref = 2.2 to 5.5 V, VSS = 0 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise

specified.

2. The A/D conversion result will be undefined in wait mode, stop mode, when the flash memory stops, and in low-current-

consumption mode. Do not perform A/D conversion in these states or transition to these states during A/D conversion.

3. When the analog input voltage is over the reference voltage, the A/D conversion result will be 3FFh in 10-bit mode and FFh in

8-bit mode.

Table 5.4

Comparator B Electrical Characteristics

Standard

Symbol

Vref

Parameter

Condition

Unit

Min.

0

Typ.

−

Max.

VCC − 1.4

VCC + 0.3

100

IVREF1, IVREF3 input reference voltage

IVCMP1, IVCMP3 input voltage

Offset

V

VI

−0.3

−

5

mV

µs

µA

Comparator output delay time ⁽²⁾

Comparator operating current

td

VI = Vref 100 mV

VCC = 5.0 V

−

0.1

17.5

−

ICMP

−

Notes:

1. VCC = 2.7 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.

2. When the digital filter is disabled.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 25 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.5

Flash Memory (Program ROM) Electrical Characteristics

Standard

Unit

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Program/erase endurance ⁽²⁾

Byte program time

1,000 ⁽³⁾

−

times

µs

−

80

0.3

−

500

−

Block erase time

s

td(SR-SUS)

Time delay from suspend request until

suspend

5 + CPU clock

× 3 cycles

ms

−

Interval from erase start/restart until

following suspend request

0

−

µs

Time from suspend until erase restart

30 + CPU clock

× 1 cycle

td(CMDRST-

READY)

Time from when command is forcibly

stopped until reading is enabled

30+CPUclock

× 1 cycle

−

Program, erase voltage

Read voltage

2.7

1.8

0

−

5.5

60

−

V

Program, erase temperature

Data hold time ⁽⁷⁾

°C

Ambient temperature = 55°C

20

year

Notes:

1. VCC = 2.7 to 5.5 V at Topr = 0 to 60°C, unless otherwise specified.

2. Definition of programming/erasure endurance

The programming and erasure endurance is defined on a per-block basis.

If the programming and erasure endurance is n (n = 1,000), each block can be erased n times. For example, if 1,024 1-byte

writes are performed to different addresses in block A, a 1 Kbyte block, and then the block is erased, the

programming/erasure endurance still stands at one.

However, the same address must not be programmed more than once per erase operation (overwriting prohibited).

3. Endurance to guarantee all electrical characteristics after program and erase. (1 to Min. value can be guaranteed).

4. In a system that executes multiple programming operations, the actual erasure count can be reduced by writing to sequential

addresses in turn so that as much of the block as possible is used up before performing an erase operation. For example,

when programming groups of 16 bytes, the effective number of rewrites can be minimized by programming up to 128 groups

before erasing them all in one operation. It is also advisable to retain data on the erasure endurance of each block and limit

the number of erase operations to a certain number.

5. If an error occurs during block erase, attempt to execute the clear status register command, then execute the block erase

command at least three times until the erase error does not occur.

6. Customers desiring program/erase failure rate information should contact their Renesas technical support representative.

7. The data hold time includes time that the power supply is off or the clock is not supplied.

Suspend request

(FMR21 bit)

FST7 bit

FST6 bit

Clock-dependent

time

Fixed time

Access restart

td(SR-SUS)

FST6, FST7: Bit in FST register

FMR21: Bit in FMR2 register

Figure 5.2

Time delay until Suspend

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 26 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.6

Voltage Detection 0 Circuit Electrical Characteristics

Standard

Unit

Symbol

Parameter

Condition

Min.

1.80

2.15

2.70

3.55

−

Typ.

1.90

2.35

2.85

3.80

6

Max.

2.05

2.50

3.05

4.05

150

Voltage detection level Vdet0_0 ⁽²⁾

Voltage detection level Vdet0_1 ⁽²⁾

Voltage detection level Vdet0_2 ⁽²⁾

Voltage detection level Vdet0_3 ⁽²⁾

Voltage detection 0 circuit response time ⁽⁴⁾

Vdet0

V

−

At the falling of VCC from 5 V

to (Vdet0_0 − 0.1) V

µs

−

Voltage detection circuit self power consumption

Waiting time until voltage detection circuit

operation starts ⁽³⁾

VCA25 = 1, VCC = 5.0 V

−

1.5

−

µA

µs

td(E-A)

−

100

Notes:

1. The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).

2. Select the voltage detection level with bits VDSEL0 and VDSEL1 in the OFS register.

3. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA25 bit in the VCA2

register to 0.

4. Time until the voltage monitor 0 reset is generated after the voltage passes Vdet0.

Table 5.7

Voltage Detection 1 Circuit Electrical Characteristics

Standard

Typ.

2.20

2.35

2.50

2.65

2.80

2.95

3.10

3.25

3.40

3.55

3.70

3.85

4.00

4.15

4.30

4.45

0.07

Symbol

Parameter

Condition

Unit

Min.

2.00

2.15

2.30

2.45

2.60

2.75

2.85

3.00

3.15

3.30

3.45

3.60

3.75

3.90

4.05

4.20

−

Max.

2.40

2.55

2.70

2.85

3.00

3.15

3.40

3.55

3.70

3.85

4.00

4.15

4.30

4.45

4.60

4.75

−

Voltage detection level Vdet1_0 ⁽²⁾

Voltage detection level Vdet1_1 ⁽²⁾

Voltage detection level Vdet1_2 ⁽²⁾

Voltage detection level Vdet1_3 ⁽²⁾

Voltage detection level Vdet1_4 ⁽²⁾

Voltage detection level Vdet1_5 ⁽²⁾

Voltage detection level Vdet1_6 ⁽²⁾

Voltage detection level Vdet1_7 ⁽²⁾

Voltage detection level Vdet1_8 ⁽²⁾

Voltage detection level Vdet1_9 ⁽²⁾

Voltage detection level Vdet1_A ⁽²⁾

Voltage detection level Vdet1_B ⁽²⁾

Voltage detection level Vdet1_C ⁽²⁾

Voltage detection level Vdet1_D ⁽²⁾

Voltage detection level Vdet1_E ⁽²⁾

Voltage detection level Vdet1_F ⁽²⁾

Vdet1

At the falling of VCC

V

−

Hysteresis width at the rising of Vcc in voltage

detection 1 circuit

Vdet1_0 to Vdet1_5

selected

Vdet1_6 to Vdet1_F

selected

−

0.10

60

−

V

Voltage detection 1 circuit response time ⁽³⁾

At the falling of Vcc from 5 V

150

µs

to (Vdet1_0

− 0.1) V

−

Voltage detection circuit self power consumption

Waiting time until voltage detection circuit operation

starts ⁽⁴⁾

VCA26 = 1, VCC = 5.0 V

−

1.7

−

µA

µs

td(E-A)

−

100

Notes:

1. The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).

2. Select the voltage detection level with bits VD1S0 to VD1S3 in the VD1LS register.

3. Time until the voltage monitor 1 interrupt request is generated after the voltage passes Vdet1.

4. Necessary time until the voltage detection circuit operates when setting to 1 again after setting the VCA26 bit in the VCA2

register to 0.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 27 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.8

Voltage Detection 2 Circuit Electrical Characteristics

Standard

Unit

Symbol

Parameter

Condition

Min.

3.70

−

Typ.

4.00

0.10

Max.

4.30

−

Vdet2

Voltage detection level Vdet2_0

At the falling of VCC

V

−

Hysteresis width at the rising of Vcc in voltage detection

2 circuit

Voltage detection 2 circuit response time ⁽²⁾

−

At the falling of Vcc from

5 V to (Vdet2_0 − 0.1) V

−

20

150

µs

−

Voltage detection circuit self power consumption

Waiting time until voltage detection circuit operation

starts ⁽³⁾

VCA27 = 1, VCC = 5.0 V

−

1.7

−

µA

µs

td(E-A)

−

100

Notes:

1. The measurement condition is VCC = 1.8 V to 5.5 V and Topr = −20 to 85°C (N version) / −40 to 85°C (D version).

2. Time until the voltage monitor 2 interrupt request is generated after the voltage passes Vdet2.

3. Necessary time until the voltage detection circuit operates after setting to 1 again after setting the VCA27 bit in the VCA2

register to 0.

(2)

Table 5.9

Power-on Reset Circuit

Standard

Symbol

Parameter

Condition

Unit

Min.

0

Typ.

Max.

(1)

trth

External power VCC rise gradient

−

50000 mV/msec

Notes:

1. The measurement condition is Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.

2. To use the power-on reset function, enable voltage monitor 0 reset by setting the LVDAS bit in the OFS register to 0.

(1)

Vdet0

(1)

Vdet0

trth

External

Power VCC

0.5 V

(2)

Voltage detection 0

circuit response time

tw(por)

Internal

reset signal

1

× 32

fOCO-S

Notes:

1. Vdet0 indicates the voltage detection level of the voltage detection 0 circuit. Refer to 6. Voltage Detection

Circuit of Hardware Manual (REJ09B0528) for details.

2. tw(por) indicates the duration the external power VCC must be held below the valid voltage (0.5 V) to enable

a power-on reset. When turning on the power after it falls with voltage monitor 0 reset disabled, maintain

tw(por) for 1 ms or more.

Figure 5.3

Power-on Reset Circuit Electrical Characteristics

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 28 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.10

High-speed On-Chip Oscillator Circuit Electrical Characteristics

Standard

Typ.

Symbol

Parameter

Condition

Unit

Min.

38.4

Max.

41.6

−

High-speed on-chip oscillator frequency after

reset

VCC = 1.8 V to 5.5 V

40

MHz

−20°C ≤ Topr ≤ 85°C

VCC = 1.8 V to 5.5 V

38.0

35.389

35.020

30.72

30.40

40

42.0

MHz

−40°C ≤ Topr ≤ 85°C

High-speed on-chip oscillator frequency when

the FRA4 register correction value is written into −20°C ≤ Topr ≤ 85°C

the FRA1 register and the FRA5 register

VCC = 1.8 V to 5.5 V

36.864 38.338 MHz

36.864 38.707 MHz

VCC = 1.8 V to 5.5 V

correction value into the FRA3 register ⁽³⁾

−40°C ≤ Topr ≤ 85°C

High-speed on-chip oscillator frequency when

VCC = 1.8 V to 5.5 V

32

33.28

33.60

MHz

the FRA6 register correction value is written into −20°C ≤ Topr ≤ 85°C

the FRA1 register and the FRA7 register

correction value into the FRA3 register

VCC = 1.8 V to 5.5 V

−40°C ≤ Topr ≤ 85°C

−

Oscillation stability time

VCC = 5.0 V, Topr = 25°C

−

0.5

3

ms

Self power consumption at oscillation

400

−

µA

Notes:

1. VCC = 1.8 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.

2. This indicates the precision error for the oscillation frequency of the high-speed on-chip oscillator.

3. This enables the setting errors of bit rates such as 9600 bps and 38400 bps to be 0% when the serial interface is used in

UART mode.

Table 5.11

Low-speed On-Chip Oscillator Circuit Electrical Characteristics

Standard

Typ.

125

Symbol

fOCO-S

Parameter

Condition

Unit

Min.

60

−

Max.

250

100

−

Low-speed on-chip oscillator frequency

Oscillation stability time

kHz

µs

−

VCC = 5.0 V, Topr = 25°C

30

Self power consumption at oscillation

−

2

µA

Note:

1. VCC = 1.8 to 5.5 V, Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.

Table 5.12

Power Supply Circuit Timing Characteristics

Standard

Symbol

Parameter

Condition

Unit

Min.

Typ.

Max.

2000

td(P-R)

Time for internal power supply stabilization during

power-on ⁽²⁾

−

µs

Notes:

1. The measurement condition is VCC = 1.8 to 5.5 V and Topr = 25°C.

2. Waiting time until the internal power supply generation circuit stabilizes during power-on.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 29 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.13

Electrical Characteristics (1) [4.2 V ≤ Vcc ≤ 5.5 V]

Standard

Unit

Symbol

Parameter

Condition

Min.

Typ.

Max.

VCC

2.0

0.5

−

VOH

Output “H” Other than XOUT

voltage

Drive capacity High VCC = 5 V IOH = −20 mA VCC − 2.0

−

V

Drive capacity Low VCC = 5 V IOH = −5 mA

VCC = 5V IOH = −200 µA

VCC − 2.0

−

XOUT

1.0

−

VOL

Output “L” Other than XOUT

voltage

Drive capacity High VCC = 5 V IOL = 20 mA

Drive capacity Low VCC = 5 V IOL = 5 mA

−

XOUT

VCC = 5V

IOL = 200 µA

−

VT+-VT-

Hysteresis

0.1

1.2

INT0, INT1, INT3,

KI0, KI1, KI2, KI3,

TRAIO, TRBO,

TRCIOA, TRCIOB,

TRCIOC, TRCIOD,

TRCTRG,

TRCCLK, ADTRG,

RXD0, RXD2,

CLK0, CLK2

0.1

1.2

−

V

RESET

IIH

IIL

Input “H” current

Input “L” current

VI = 5 V, VCC = 5.0 V

VI = 0 V, VCC = 5.0 V

−

5.0

−5.0

100

−

µA

RPULLUP Pull-up resistance

25

−

50

0.3

kΩ

MΩ

RfXIN

Feedback XIN

resistance

RfXCIN

Feedback XCIN

resistance

−

8

−

MΩ

VRAM

Note:

RAM hold voltage

During stop mode

1.8

−

V

1. 4.2 V ≤ VCC ≤ 5.5 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 20 MHz, unless otherwise specified.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 30 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.14

Electrical Characteristics (2) [3.3 V ≤ Vcc ≤ 5.5 V]

(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)

Standard

Symbol

Parameter

Condition

Unit

mA

Min.

−

Typ.

6.5

Max.

15

XIN = 20 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

No division

ICC

Power supply

current

High-speed

clock mode

(VCC = 3.3 to 5.5 V)

Single-chip mode,

output pins are

open, other pins

are VSS

XIN = 16 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

No division

−

5.3

3.6

3.0

2.2

1.5

7.0

3.0

1

12.5

−

mA

XIN = 10 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

No division

XIN = 20 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

−

XIN = 16 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

−

XIN = 10 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

−

XIN clock off

High-speed

on-chip

oscillator mode

15

−

High-speed on-chip oscillator on fOCO-F = 20 MHz

Low-speed on-chip oscillator on = 125 kHz

No division

XIN clock off

High-speed on-chip oscillator on fOCO-F = 20 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

XIN clock off

−

High-speed on-chip oscillator on fOCO-F = 4 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-16

MSTTRC = 1

XIN clock off

Low-speed

on-chip

−

90

85

400

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8, FMR27 = 1, VCA20 = 0

oscillator mode

Low-speed

clock mode

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

FMR27 = 1, VCA20 = 0

XIN clock off

−

47

15

4

−

100

90

−

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

Program operation on RAM

Flash memory off, FMSTP = 1, VCA20 = 0

XIN clock off

Wait mode

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock operation

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

XIN clock off

3.5

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz (peripheral clock off)

While a WAIT instruction is executed

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

XIN clock off, Topr = 25°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

Stop mode

−

2.0

5.0

µA

XIN clock off, Topr = 85°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

−

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 31 of 42

R8C/32D Group

5. Electrical Characteristics

Timing Requirements

(Unless Otherwise Specified: VCC = 5 V, VSS = 0 V at Topr = 25°C)

Table 5.15

External Clock Input (XOUT, XCIN)

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(XOUT)

XOUT input cycle time

XOUT input “H” width

XOUT input “L” width

XCIN input cycle time

XCIN input “H” width

XCIN input “L” width

50

24

14

7

−

ns

µs

tWH(XOUT)

tWL(XOUT)

tc(XCIN)

tWH(XCIN)

tWL(XCIN)

7

VCC = 5 V

tC(XOUT), tC(XCIN)

tWH(XOUT),

tWH(XCIN)

External Clock Input

tWL(XOUT), tWL(XCIN)

Figure 5.4

External Clock Input Timing Diagram when VCC = 5 V

Table 5.16

TRAIO Input

Standard

Max.

Symbol

Parameter

Unit

Min.

100

40

tc(TRAIO)

TRAIO input cycle time

TRAIO input “H” width

TRAIO input “L” width

−

ns

tWH(TRAIO)

tWL(TRAIO)

40

tC(TRAIO)

VCC = 5 V

tWH(TRAIO)

TRAIO input

tWL(TRAIO)

Figure 5.5

TRAIO Input Timing Diagram when VCC = 5 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 32 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.17

Serial Interface

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(CK)

CLKi input cycle time

CLKi input “H” width

CLKi input “L” width

TXDi output delay time

TXDi hold time

200

100

−

ns

tW(CKH)

tW(CKL)

td(C-Q)

th(C-Q)

tsu(D-C)

th(C-D)

−

50

−

0

RXDi input setup time

RXDi input hold time

50

90

−

i = 0, 2

VCC = 5 V

tC(CK)

tW(CKH)

CLKi

tW(CKL)

th(C-Q)

TXDi

RXDi

td(C-Q)

tsu(D-C)

th(C-D)

i = 0, 2

Figure 5.6

Serial Interface Timing Diagram when VCC = 5 V

Table 5.18

External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)

Standard

Symbol

Parameter

Unit

Min.

Max.

250 ⁽¹⁾

250 ⁽²⁾

tW(INH)

tW(INL)

−

ns

INTi input “H” width, KIi input “H” width

INTi input “L” width, KIi input “L” width

−

Notes:

1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

VCC = 5 V

INTi input

(i = 0, 1, 3)

tW(INL)

KIi input

(i = 0 to 3)

tW(INH)

Figure 5.7

Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 5 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 33 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.19

Electrical Characteristics (3) [2.7 V ≤ Vcc < 4.2 V]

Standard

Unit

Symbol

Parameter

Output “H” voltage Other than XOUT

Condition

Min.

Typ.

Max.

VCC

0.5

−

VOH

Drive capacity High IOH = −5 mA

Drive capacity Low IOH = −1 mA

IOH = −200 µA

VCC − 0.5

−

V

VCC − 0.5

−

XOUT

1.0

−

VOL

Output “L” voltage

Hysteresis

Other than XOUT

Drive capacity High IOL = 5 mA

Drive capacity Low IOL = 1 mA

IOL = 200 µA

−

XOUT

−

VT+-VT-

VCC = 3.0 V

0.1

0.4

INT0, INT1, INT3,

KI0, KI1, KI2, KI3,

TRAIO, TRBO,

TRCIOA, TRCIOB,

TRCIOC, TRCIOD,

TRCTRG, TRCCLK,

ADTRG,

RXD0, RXD2,

CLK0, CLK2

VCC = 3.0 V

0.1

0.5

−

V

RESET

IIH

IIL

Input “H” current

Input “L” current

VI = 3 V, VCC = 3.0 V

VI = 0 V, VCC = 3.0 V

−

4.0

−4.0

168

−

µA

kΩ

MΩ

V

RPULLUP Pull-up resistance

42

−

84

0.3

8

RfXIN

Feedback resistance XIN

Feedback resistance XCIN

RAM hold voltage

RfXCIN

VRAM

−

During stop mode

1.8

−

Note:

1. 2.7 V ≤ VCC < 4.2 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 10 MHz, unless otherwise specified.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 34 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.20

Electrical Characteristics (4) [2.7 V ≤ Vcc < 3.3 V]

(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)

Standard

Symbol

Parameter

Condition

Unit

mA

Min.

Typ.

3.5

Max.

10

ICC

Power supply current High-speed

XIN = 10 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

No division

−

(VCC = 2.7 to 3.3 V)

Single-chip mode,

output pins are open,

other pins are VSS

clock mode

XIN = 10 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

−

1.5

7.0

3.0

4.0

1.5

1

7.5

15

−

mA

High-speed

on-chip

oscillator mode

XIN clock off

High-speed on-chip oscillator on fOCO-F = 20 MHz

Low-speed on-chip oscillator on = 125 kHz

No division

XIN clock off

High-speed on-chip oscillator on fOCO-F = 20 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

XIN clock off

−

High-speed on-chip oscillator on fOCO-F = 10 MHz

Low-speed on-chip oscillator on = 125 kHz

No division

XIN clock off

−

High-speed on-chip oscillator on fOCO-F = 10 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

XIN clock off

−

High-speed on-chip oscillator on fOCO-F = 4 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-16

MSTTRC = 1

Low-speed

on-chip

XIN clock off

−

90

80

390

400

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8, FMR27 = 1, VCA20 = 0

oscillator mode

Low-speed

clock mode

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

FMR27 = 1, VCA20 = 0

XIN clock off

−

40

−

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

Program operation on RAM

Flash memory off, FMSTP = 1, VCA20 = 0

Wait mode

XIN clock off

−

15

4

90

80

−

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock operation

VCA27 = VCA26 = VCA25 = 0, VCA20 = 1

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0, VCA20 = 1

XIN clock off

3.5

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz (peripheral

clock off)

While a WAIT instruction is executed

VCA27 = VCA26 = VCA25 = 0, VCA20 = 1

Stop mode

XIN clock off, Topr = 25°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

−

2.0

5.0

µA

XIN clock off, Topr = 85°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

−

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 35 of 42

R8C/32D Group

5. Electrical Characteristics

Timing requirements

(Unless Otherwise Specified: VCC = 3 V, VSS = 0 V at Topr = 25°C)

Table 5.21

External Clock Input (XOUT, XCIN)

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(XOUT)

XOUT input cycle time

XOUT input “H” width

XOUT input “L” width

XCIN input cycle time

XCIN input “H” width

XCIN input “L” width

50

24

14

7

−

ns

µs

tWH(XOUT)

tWL(XOUT)

tc(XCIN)

tWH(XCIN)

tWL(XCIN)

7

tC(XOUT), tC(XCIN)

VCC = 3 V

tWH(XOUT),

tWH(XCIN)

External Clock Input

tWL(XOUT), tWL(XCIN)

Figure 5.8

External Clock Input Timing Diagram when VCC = 3 V

Table 5.22

TRAIO Input

Standard

Symbol

Parameter

Unit

Min.

300

120

Max.

tc(TRAIO)

TRAIO input cycle time

TRAIO input “H” width

TRAIO input “L” width

−

ns

tWH(TRAIO)

tWL(TRAIO)

VCC = 3 V

tC(TRAIO)

tWH(TRAIO)

TRAIO input

tWL(TRAIO)

Figure 5.9

TRAIO Input Timing Diagram when VCC = 3 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 36 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.23

Serial Interface

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(CK)

CLKi input cycle time

CLKi input “H” width

CLKi Input “L” width

TXDi output delay time

TXDi hold time

300

150

−

ns

tW(CKH)

tW(CKL)

td(C-Q)

th(C-Q)

tsu(D-C)

th(C-D)

−

80

−

0

RXDi input setup time

RXDi input hold time

70

90

−

i = 0, 2

tC(CK)

VCC = 3 V

tW(CKH)

CLKi

tW(CKL)

th(C-Q)

TXDi

RXDi

td(C-Q)

tsu(D-C)

th(C-D)

i = 0, 2

Figure 5.10

Serial Interface Timing Diagram when VCC = 3 V

Table 5.24

External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)

Standard

Symbol

Parameter

Unit

Min.

Max.

380 ⁽¹⁾

380 ⁽²⁾

tW(INH)

tW(INL)

−

ns

INTi input “H” width, KIi input “H” width

INTi input “L” width, KIi input “L” width

−

Notes:

1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

VCC = 3 V

INTi input

(i = 0, 1, 3)

tW(INL)

KIi input

(i = 0 to 3)

tW(INH)

Figure 5.11

Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 3 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 37 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.25

Electrical Characteristics (5) [1.8 V ≤ Vcc < 2.7 V]

Standard

Unit

Symbol

Parameter

Output “H” voltage Other than XOUT

Condition

Min.

Typ.

Max.

VCC

0.5

−

VOH

Drive capacity High IOH = −2 mA

Drive capacity Low IOH = −1 mA

IOH = −200 µA

VCC − 0.5

−

V

VCC − 0.5

−

XOUT

1.0

−

VOL

Output “L” voltage

Hysteresis

Other than XOUT

Drive capacity High IOL = 2 mA

Drive capacity Low IOL = 1 mA

IOL = 200 µA

−

XOUT

−

VT+-VT-

0.05

0.2

INT0, INT1, INT3,

KI0, KI1, KI2, KI3,

TRAIO, TRBO,

TRCIOA, TRCIOB,

TRCIOC, TRCIOD,

TRCTRG,

TRCCLK,

ADTRG,

RXD0, RXD2,

CLK0, CLK2

0.05

0.20

−

V

RESET

IIH

IIL

Input “H” current

Input “L” current

VI = 2.2 V, VCC = 2.2 V

VI = 0 V, VCC = 2.2 V

−

4.0

−4.0

300

−

µA

kΩ

MΩ

V

RPULLUP Pull-up resistance

70

−

140

0.3

8

RfXIN

Feedback resistance XIN

Feedback resistance XCIN

RAM hold voltage

RfXCIN

VRAM

−

During stop mode

1.8

−

Note:

1. 1.8 V ≤ VCC < 2.7 V at Topr = −20 to 85°C (N version) / −40 to 85°C (D version), f(XIN) = 5 MHz, unless otherwise specified.

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 38 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.26

Electrical Characteristics (6) [1.8 V ≤ Vcc < 2.7 V]

(Topr = −20 to 85°C (N version) / −40 to 85°C (D version), unless otherwise specified.)

Standard

Symbol

Parameter

Condition

Unit

mA

Min.

Typ.

2.2

Max.

ICC

Power supply current High-speed

XIN = 5 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

No division

−

(VCC = 1.8 to 2.7 V)

Single-chip mode,

output pins are open,

other pins are VSS

clock mode

XIN = 5 MHz (square wave)

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

−

0.8

2.5

1.7

1

−

10

−

mA

High-speed

on-chip

XIN clock off

High-speed on-chip oscillator on fOCO-F = 5 MHz

Low-speed on-chip oscillator on = 125 kHz

No division

oscillator

mode

XIN clock off

High-speed on-chip oscillator on fOCO-F = 5 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8

XIN clock off

−

High-speed on-chip oscillator on fOCO-F = 4 MHz

Low-speed on-chip oscillator on = 125 kHz

Divide-by-16

MSTTRC = 1

Low-speed on- XIN clock off

chip oscillator

mode

−

90

80

300

350

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

Divide-by-8, FMR27 = 1, VCA20 = 0

Low-speed

clock mode

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

FMR27 = 1, VCA20 = 0

XIN clock off

−

40

15

4

−

90

80

−

µA

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz

No division

Program operation on RAM

Flash memory off, FMSTP = 1, VCA20 = 0

Wait mode

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock operation

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

XIN clock off

High-speed on-chip oscillator off

Low-speed on-chip oscillator on = 125 kHz

While a WAIT instruction is executed

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

XIN clock off

3.5

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

XCIN clock oscillator on = 32 kHz (peripheral

clock off)

While a WAIT instruction is executed

VCA27 = VCA26 = VCA25 = 0

VCA20 = 1

Stop mode

XIN clock off, Topr = 25°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

−

2.0

5.0

5

µA

XIN clock off, Topr = 85°C

High-speed on-chip oscillator off

Low-speed on-chip oscillator off

CM10 = 1

−

Peripheral clock off

VCA27 = VCA26 = VCA25 = 0

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 39 of 42

R8C/32D Group

5. Electrical Characteristics

Timing requirements

(Unless Otherwise Specified: VCC = 2.2 V, VSS = 0 V at Topr = 25°C)

Table 5.27

External Clock Input (XOUT, XCIN)

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(XOUT)

XOUT input cycle time

XOUT input “H” width

XOUT input “L” width

XCIN input cycle time

XCIN input “H” width

XCIN input “L” width

200

90

14

7

−

ns

µs

tWH(XOUT)

tWL(XOUT)

tc(XCIN)

tWH(XCIN)

tWL(XCIN)

7

tC(XOUT), tC(XCIN)

VCC = 2.2 V

tWH(XOUT),

tWH(XCIN)

External Clock Input

tWL(XOUT), tWL(XCIN)

Figure 5.12

External Clock Input Timing Diagram when VCC = 2.2 V

Table 5.28

TRAIO Input

Standard

Max.

Symbol

Parameter

Unit

Min.

500

200

tc(TRAIO)

TRAIO input cycle time

TRAIO input “H” width

TRAIO input “L” width

−

ns

tWH(TRAIO)

tWL(TRAIO)

tC(TRAIO)

VCC = 2.2 V

tWH(TRAIO)

TRAIO input

tWL(TRAIO)

Figure 5.13

TRAIO Input Timing Diagram when VCC = 2.2 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 40 of 42

R8C/32D Group

5. Electrical Characteristics

Table 5.29

Serial Interface

Standard

Unit

Symbol

Parameter

Min.

Max.

tc(CK)

CLKi input cycle time

CLKi input “H” width

CLKi input “L” width

TXDi output delay time

TXDi hold time

800

400

−

ns

tW(CKH)

tW(CKL)

td(C-Q)

th(C-Q)

tsu(D-C)

th(C-D)

−

200

−

0

RXDi input setup time

RXDi input hold time

150

90

−

i = 0, 2

VCC = 2.2 V

tC(CK)

tW(CKH)

CLKi

tW(CKL)

th(C-Q)

TXDi

RXDi

td(C-Q)

tsu(D-C)

th(C-D)

i = 0, 2

Figure 5.14

Serial Interface Timing Diagram when VCC = 2.2 V

Table 5.30

External Interrupt INTi (i = 0, 1, 3) Input, Key Input Interrupt KIi (i = 0 to 3)

Standard

Symbol

Parameter

Unit

Min.

Max.

1000 ⁽¹⁾

1000 ⁽²⁾

tW(INH)

tW(INL)

−

ns

INTi input “H” width, KIi input “H” width

INTi input “L” width, KIi input “L” width

−

Notes:

1. When selecting the digital filter by the INTi input filter select bit, use an INTi input HIGH width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

2. When selecting the digital filter by the INTi input filter select bit, use an INTi input LOW width of either (1/digital filter clock

frequency × 3) or the minimum value of standard, whichever is greater.

VCC = 2.2 V

INTi input

(i = 0, 1, 3)

tW(INL)

KIi input

(i = 0 to 3)

tW(INH)

Figure 5.15

Input Timing for External Interrupt INTi and Key Input Interrupt KIi when Vcc = 2.2 V

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 41 of 42

R8C/32D Group

Package Dimensions

Diagrams showing the latest package dimensions and mounting information are available in the “Packages” section of

the Renesas Technology website.

JEITA Package Code

RENESAS Code

PLSP0020JB-A

Previous Code

20P2F-A

MASS[Typ.]

0.1g

P-LSSOP20-4.4x6.5-0.65

11

20

NOTE)

1. DIMENSIONS "*1" AND "*2"

F

DO NOT INCLUDE MOLD FLASH.

2. DIMENSION "*3" DOES NOT

INCLUDE TRIM OFFSET.

1

10

Index mark

c

A₂

A₁

Dimension in Millimeters

Reference

Symbol

*2

D

Min Nom Max

D

E

6.4 6.5 6.6

4.3 4.4 4.5

1.15

A₂

A

1.45

0.1 0.2

A₁

b_p

c

*3

0

0.17 0.22 0.32

b_p

e

Detail F

y

0.2

10°

0.13 0.15

0°

H_E

e

6.2 6.4 6.6

0.53 0.65 0.77

0.10

y

L

0.3 0.5 0.7

REJ03B0288-0100 Rev.1.00 Feb 26, 2010

Page 42 of 42

REVISION HISTORY

R8C/32D Group Datasheet

Description

Summary

Rev.

Date

Page

–

Feb. 26, 2008

First Edition issued

0.01

1.00

Feb. 26, 2010 All pages “Preliminary”, “Under development” deleted

Table 1.3 revised

22 to 41 “5. Electrical Characteristics” added

4

All trademarks and registered trademarks are the property of their respective owners.

C - 1

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Notes:

1. This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use. Renesas neither makes

warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property

rights or any other rights of Renesas or any third party with respect to the information in this document.

2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document, including,

but not limited to, product data, diagrams, charts, programs, algorithms, and application circuit examples.

3. You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass

destruction or for the purpose of any other military use. When exporting the products or technology described herein, you should follow the applicable export control laws

and regulations, and procedures required by such laws and regulations.

4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and application circuit examples, is current as of the date this

document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas products listed in this document,

please confirm the latest product information with a Renesas sales office. Also, please pay regular and careful attention to additional and different information to be

disclosed by Renesas such as that disclosed through our website. (http://www.renesas.com )

5. Renesas has used reasonable care in compiling the information included in this document, but Renesas assumes no liability whatsoever for any damages incurred as a

result of errors or omissions in the information included in this document.

6. When using or otherwise relying on the information in this document, you should evaluate the information in light of the total system before deciding about the applicability

of such information to the intended application. Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any particular

application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products.

7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas products are not designed, manufactured or tested for applications

or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality

and reliability such as safety systems, or equipment or systems for transportation and traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or

undersea communication transmission. If you are considering the use of our products for such purposes, please contact a Renesas sales office beforehand. Renesas shall

have no liability for damages arising out of the uses set forth above.

8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:

(1) artificial life support devices or systems

(2) surgical implantations

(3) healthcare intervention (e.g., excision, administration of medication, etc.)

(4) any other purposes that pose a direct threat to human life

Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to use Renesas products in any of the foregoing

applications shall indemnify and hold harmless Renesas Technology Corp., its affiliated companies and their officers, directors, and employees against any and all

damages arising out of such applications.

9. You should use the products described herein within the range specified by Renesas, especially with respect to the maximum rating, operating supply voltage range,

movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or damages

arising out of the use of Renesas products beyond such specified ranges.

10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific characteristics such as the occurrence of failure at a certain

rate and malfunctions under certain use conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and injury or damage

caused by fire in the event of the failure of a Renesas product, such as safety design for hardware and software including but not limited to redundancy, fire control and

malfunction prevention, appropriate treatment for aging degradation or any other applicable measures. Among others, since the evaluation of microcomputer software

alone is very difficult, please evaluate the safety of the final products or system manufactured by you.

11. In case Renesas products listed in this document are detached from the products to which the Renesas products are attached or affixed, the risk of accident such as

swallowing by infants and small children is very high. You should implement safety measures so that Renesas products may not be easily detached from your products.

Renesas shall have no liability for damages arising out of such detachment.

12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written approval from Renesas.

13. Please contact a Renesas sales office if you have any questions regarding the information contained in this document, Renesas semiconductor products, or if you have

any other inquiries.

RENESAS SALES OFFICES

http://www.renesas.com

Refer to "http://www.renesas.com/en/network" for the latest and detailed information.

Renesas Technology America, Inc.

450 Holger Way, San Jose, CA 95134-1368, U.S.A

Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501

Renesas Technology Europe Limited

Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.

Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900

Renesas Technology (Shanghai) Co., Ltd.

Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120

Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7858/7898

Renesas Technology Hong Kong Ltd.

7th Floor, North Tower, World Finance Centre, Harbour City, Canton Road, Tsimshatsui, Kowloon, Hong Kong

Tel: <852> 2265-6688, Fax: <852> 2377-3473

Renesas Technology Taiwan Co., Ltd.

10th Floor, No.99, Fushing North Road, Taipei, Taiwan

Tel: <886> (2) 2715-2888, Fax: <886> (2) 3518-3399

Renesas Technology Singapore Pte. Ltd.

1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001

Renesas Technology Korea Co., Ltd.

Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea

Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145

Renesas Technology Malaysia Sdn. Bhd

Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia

Tel: <603> 7955-9390, Fax: <603> 7955-9510

Colophon .7.2


型号：	R5F21321DDSP
厂家：	RENESAS TECHNOLOGY CORP
描述：	RENESAS MCU 瑞萨MCU 微控制器和处理器外围集成电路光电二极管时钟
文件：	总46页 (文件大小：507K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

R5F21321DDSP [RENESAS]

相关型号：

R5F21321DDSP#U0

R5F21321DDSP#W4

R5F21321DNSP

R5F21321DNSP#U0

R5F21321MDSP

R5F21321MNSP

R5F21322ADFP

R5F21322ADSP

R5F21322ANFP

R5F21322ANSP

R5F21322CDSP

R5F21322CNSP