RKP405KS#P1 [RENESAS]
RKP405KS#P1;
| 型号： | RKP405KS#P1 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | RKP405KS#P1 |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RKP405KS
Composite Pin Diode for Antenna Switching
REJ03G1543-0100
Rev.1.00
Apr 20, 2007
Features
•
•
•
•
An optimal solution for antenna switching in mobile phones.
Low capacitance. (C = 0.35 pF max)
Low forward resistance. (rf = 1.3 Ω max @IF = 10 mA, f = 100 MHz)
Thin outline of diode array with four same kind of elements (MFP12) is suitable for surface mount design.
Ordering Information
Part No.
Laser Mark
Package Name
Package Code
RKP405KS
P3
MFP12
PUSF0012ZA-A
Pin Arrangement
12
11 10
9
8
7
12
11 10
9
8
7
2
3
4
5
6
2
3
4
5
6
HVL142AM Series
REJ03G1543-0100 Rev.1.00 Apr 20, 2007
Page 1 of 4
RKP405KS
Absolute Maximum Ratings
(Ta = 25°C)
Unit
Item
Symbol
Value
30
Reverse voltage
VR
V
mA
mW
°C
Forward current
IF
100
Power dissipation
Junction temperature
Storage temperature
Note: Per one device
Pd *
Tj
100
125
Tstg
−55 to +125
°C
Electrical Characteristics (HVL142AM Series)
(Ta = 25°C)
Test Condition
VR = 30 V
Item
Symbol
Min
—
Typ
—
Max
100
1.0
Unit
nA
V
Reverse current
Forward voltage
Capacitance
IR
VF
C
—
—
IF = 10 mA
—
—
0.35
1.3
pF
Ω
VR = 1 V, f = 1 MHz
IF = 10 mA, f = 100 MHz
Forward resistance
ESD-Capability *1
rf
—
—
—
100
—
—
V
C = 200 pF, R = 0 Ω, Both forward
and reverse direction 1 pulse.
Notes: 1. Failure criterion ; IR > 100 nA at VR = 30 V
2. For MFP12 package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip
part is considered as unquestioned. Please kindly consider soldering nature.
REJ03G1543-0100 Rev.1.00 Apr 20, 2007
Page 2 of 4
RKP405KS
Main Characteristic (HVL142AM Series)
10−2
10−7
10−8
10−4
10−9
10−6
10−10
10−11
10−12
10−13
10−8
10−10
10−12
0
0.2
0.4
0.6
0.8
1.0
0
10
20
30
40
50
Forward voltage VF (V)
Reverse voltage VR (V)
Fig.1 Forward current vs. Forward voltage
Fig.2 Reverse current vs. Reverse voltage
103
f = 1MHz
f = 100MHz
102
10
101
1.0
100
0.1
0.1
10−1
1.0
10
10−4
10−3
Forward current IF (A)
Fig.4 Forward resistance vs. Forward current
10−2
10−1
Reverse voltage VR (V)
Fig.3 Capacitance vs. Reverse voltage
REJ03G1543-0100 Rev.1.00 Apr 20, 2007
Page 3 of 4
RKP405KS
Package Dimensions
Package Name
MFP12
JEITA Package Code
RENESAS Code
PUSF0012ZA-A
Previous Code
MFP12V
MASS[Typ.]
0.004g
D
c
L
p
H
E
E
L
e
b
e
e
Dimension in Millimeters
Reference
Symbol
A
2
Min
0
Nom
-
Max
0.05
0.50
0.23
0.16
2.80
1.30
-
A1
A
1
0.44
0.13
0.10
2.60
1.10
-
0.47
0.18
0.13
2.70
1.20
0.43
1.40
0.10
0.23
0.28
1.1
A2
b
e
1
c
D
E
e
1.30
0.05
0.18
-
1.50
0.15
0.28
-
HE
L
l
1
b
2
Lp
b2
e1
Pattern of terminal position areas
-
-
-
0.25
-
l1
REJ03G1543-0100 Rev.1.00 Apr 20, 2007
Page 4 of 4
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Notes:
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1.
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All information included in this document is current as of the date this document is issued. Such information, however, is
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8.
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You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
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