UPA620TT-AT [RENESAS]

TRANSISTOR,MOSFET,N-CHANNEL,20V V(BR)DSS,5A I(D),SOT-363VAR;
UPA620TT-AT
型号: UPA620TT-AT
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

TRANSISTOR,MOSFET,N-CHANNEL,20V V(BR)DSS,5A I(D),SOT-363VAR

文件: 总10页 (文件大小:197K)
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Old Company Name in Catalogs and Other Documents  
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology  
Corporation, and Renesas Electronics Corporation took over all the business of both  
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April 1st, 2010  
Renesas Electronics Corporation  
Issued by: Renesas Electronics Corporation (http://www.renesas.com)  
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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
µPA620TT  
N-CHANNEL MOS FIELD EFFECT TRANSISTOR  
FOR SWITCHING  
DESCRIPTION  
PACKAGE DRAWING (Unit: mm)  
The µPA620TT is a switching device which can be driven directly by a  
2.5 V power source.  
2.0±0.2  
This device features a low on-state resistance and excellent switching  
characteristics, and is suitable for applications such as power switch of  
portable machine and so on.  
5
2
4
3
6
1
0~0.05  
FEATURES  
2.5 V drive available  
Low on-state resistance  
0.65  
0.65  
S
RDS(on)1 = 38 mMAX. (VGS = 4.5 V, ID = 2.5 A)  
RDS(on)2 = 39 mMAX. (VGS = 4.0 V, ID = 2.5 A)  
RDS(on)3 = 54 mMAX. (VGS = 2.5 V, ID = 2.5 A)  
MAX. 0.8  
0.05  
S
ORDERING INFORMATION  
PART NUMBER  
PACKAGE  
1,2,5,6: Drain  
3
4
: Gate  
: Source  
µPA620TT  
6 pin WSOF (1620)  
Marking: WA  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC) (TA = 25°C)  
Drain Current (pulse) Note1  
Total Power Dissipation  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT1  
20  
V
V
+0.1  
0.2  
0.05  
0.1  
M
S
±12  
±5.0  
±20  
0.2  
A
EQUIVALENT CIRCUIT  
A
W
W
°C  
Drain  
Total Power Dissipation Note2  
PT2  
1.5  
Channel Temperature  
Tch  
150  
Body  
Diode  
Storage Temperature  
Tstg  
–55 to +150 °C  
Gate  
Gate  
Protection  
Diode  
Notes 1. PW 10 µs, Duty Cycle 1%  
2. Mounted on FR-4 board of 5000 mm2 x 1.1 mm, t 5 sec.  
Source  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. G16111EJ1V0DS00 (1st edition)  
Date Published September 2002 NS CP(K)  
Printed in Japan  
©
2002  
µPA620TT  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 20 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
10  
±10  
µA  
µA  
IGSS  
VGS = ±12 V, VDS = 0 V  
VDS = 10 V, ID = 1.0 mA  
VDS = 10 V, ID = 2.5 A  
VGS = 4.5 V, ID = 2.5 A  
VGS = 4.0 V, ID = 2.5 A  
VGS = 2.5 V, ID = 2.5 A  
VDS = 10 V  
Gate Cut-off Voltage  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
RDS(on)3  
Ciss  
0.5  
3.0  
1.0  
6.0  
30  
1.5  
V
S
Forward Transfer Admittance  
Drain to Source On-state Resistance  
38  
39  
54  
mΩ  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
31  
40  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
450  
130  
90  
Coss  
VGS = 0 V  
Crss  
f = 1.0 MHz  
td(on)  
VDD = 10 V, ID = 2.5 A  
VGS = 4.0 V  
36  
tr  
210  
150  
200  
5.5  
1.0  
2.8  
0.87  
ns  
Turn-off Delay Time  
Fall Time  
td(off)  
RG = 10 Ω  
ns  
tf  
ns  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain Charge  
Body Diode Forward Voltage  
QG  
VDD = 16 V  
nC  
nC  
nC  
V
QGS  
VGS = 4.0 V  
QGD  
ID = 5.0 A  
VF(S-D)  
IF = 5.0 A, VGS = 0 V  
TEST CIRCUIT 1 SWITCHING TIME  
TEST CIRCUIT 2 GATE CHARGE  
D.U.T.  
D.U.T.  
I
G
= 2 mA  
RL  
V
V
GS  
R
L
90%  
V
GS  
Wave Form  
V
GS  
10%  
RG  
0
PG.  
V
DD  
50  
PG.  
V
DD  
DS  
90%  
90%  
V
0
GS  
V
DS  
10% 10%  
V
DS  
Wave Form  
0
τ
t
d(on)  
t
r
t
d(off)  
tf  
τ = 1µs  
t
on  
toff  
Duty Cycle 1%  
2
Data Sheet G16111EJ1V0DS  
µPA620TT  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
AMBIENT TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
1.6  
1.4  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
Mounted on FR-4 board of  
5000 mm2 x 1.1 mm, t 5 sec.  
0
25  
50  
75  
100 125 150 175  
0
25  
50  
75  
100 125 150 175  
TA - Ambient Temperature - °C  
TA - Ambient Temperature - °C  
FORWARD BIAS SAFE OPERATING AREA  
RDS(on) Limited  
100  
10  
(VGS = 4.5 V)  
ID(pulse)  
PW = 1 ms  
ID(DC)  
1
10 ms  
100 ms  
0.1  
0.01  
5 s  
Single pulse  
Mounted on FR-4 board of  
5000 mm2 x 1.1 mm  
0.1  
1
10  
100  
VDS - Drain to Source Voltage - V  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
Single pulse  
Mounted on FR-4 board of  
5000 mm2 x 1.1 mm  
1
1 m  
10 m  
100 m  
1
10  
100  
1000  
PW - Pulse Width - s  
3
Data Sheet G16111EJ1V0DS  
µPA620TT  
DRAIN CURRENT vs.  
FORWARD TRANSFER CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
20  
15  
10  
5
10  
1
VDS = 10 V  
Pulsed  
Pulsed  
VGS = 4.5 V  
4.0 V  
0.1  
TA = 125°C  
75°C  
25°C  
25°C  
0.01  
0.001  
0.0001  
2.5 V  
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8  
VDS - Drain to Source Voltage - V  
0
0.5  
1
1.5  
2
2.5  
VGS - Gate to Source Voltage - V  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
1.4  
1.2  
1
100  
10  
VDS = 10 V  
Pulsed  
VDS = 10 V  
ID = 1.0 mA  
TA = 25°C  
25°C  
1
75°C  
125°C  
0.8  
0.6  
0.4  
0.1  
0.01  
-50  
0
50  
100  
150  
0.01  
0.1  
1
10  
ID - Drain Current - A  
Tch - Channel Temperature - °C  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
80  
80  
Pulsed  
D
I
= 2.5 A  
Pulsed  
GS  
V
= 2.5 V  
4.0 V  
4.5 V  
60  
40  
20  
0
60  
40  
ID = 2.5 A  
20  
0
-50  
0
50  
100  
150  
0
2
4
6
8
10  
12  
Tch - Channel Temperature - °C  
VGS - Gate to Source Voltage - V  
4
Data Sheet G16111EJ1V0DS  
µPA620TT  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
80  
80  
VGS = 4.5 V  
Pulsed  
VGS = 4.0 V  
Pulsed  
TA = 125°C  
TA = 125°C  
60  
60  
75°C  
25°C  
75°C  
25°C  
25°C  
25°C  
40  
20  
0
40  
20  
0
0.01  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
ID - Drain Current - A  
ID - Drain Current - A  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
SWITCHING CHARACTERISTICS  
80  
1000  
100  
10  
VDD = 10 V  
VGS = 4.0 V  
VGS = 2.5 V  
Pulsed  
TA = 125°C  
75°C  
tr  
RG = 10  
60  
40  
20  
0
25°C  
25°C  
tf  
td(off)  
td(on)  
0.01  
0.1  
1
10  
100  
0.1  
1
10  
ID - Drain Current - A  
ID - Drain Current - A  
CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE  
SOURCE TO DRAIN DIODE FORWARD VOLTAGE  
1000  
100  
Pulsed  
Ciss  
10  
VGS = 0 V  
1
100  
Coss  
Crss  
0.1  
VGS = 0 V  
f = 1.0 MHz  
0.01  
10  
0.4  
0.6  
0.8  
1
1.2  
1.4  
0.1  
1
10  
100  
VF(S-D) - Source to Drain Voltage - V  
VDS - Drain to Source Voltage - V  
5
Data Sheet G16111EJ1V0DS  
µPA620TT  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
6
ID = 5.0 A  
5
VDD = 4.0 V  
4
10 V  
16 V  
3
2
1
0
0
1
2
3
4
5
6
QG - Gate Charge - nC  
6
Data Sheet G16111EJ1V0DS  
µPA620TT  
[MEMO]  
7
Data Sheet G16111EJ1V0DS  
µPA620TT  
The information in this document is current as of September, 2002. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4  

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