UPC1093T-2-E2 [RENESAS]
1-OUTPUT TWO TERM VOLTAGE REFERENCE, PSSO3, PLASTIC, SOT-89, 3 PIN;
| 型号： | UPC1093T-2-E2 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | 1-OUTPUT TWO TERM VOLTAGE REFERENCE, PSSO3, PLASTIC, SOT-89, 3 PIN 输出元件 |
| 文件： | 总18页 (文件大小：203K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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April 1st, 2010
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1093
ADJUSTABLE PRECISION SHUNT REGULATORS
DESCRIPTION
The µPC1093 are adjustable precision shunt regulators with guaranteed thermal stability. The output voltage can
be set to any value between reference voltage (2.495 V) and 36 V by two external resistors.
These ICs can apply to error amplifier of switching regulators.
FEATURES
•
•
•
•
High Accuracy
VREF = 2.495 V ± 2 %
Low Temperature Coefficient
∆VREF/∆T ≤ 100 ppm/°C
Adjustable Output Voltage by two External Resistors VREF ≤ VO ≤ 36 V
Low Dynamic Impedance | ZKA | = 0.1 ΩTYP.
ORDERING INFORMATION
Part Number
Package
µPC1093J
µPC1093G
µPC1093T
µPC1093TA
3-pin plastic SIP (TO-92)
8-pin plastic SOP (225 mil)
Power mini mold (SOT-89)
5-pin plastic mini mold (SC-74A)
The information in this document is subject to change without notice.
The mark shows major revised points.
Document No. G10634EJ5V0DS00 (5th edition)
(Previous No. IC-1791)
Date Published September 1998 N CP(K)
Printed in Japan
1986
©
µPC1093
EQUIVALENT CIRCUIT
K
Q
Q
Q
12
13
14
R6
R5
C2
Q
Q
15
16
17
Q
6
REF
Q
1
Q
5
Q
Q
10
Q
2
R9
Q
11
Q
7
R1
R10
R7
C1
D1
R2
R3
Q
8
Q
3
Q
4
R8
Q
9
R4
A
PIN CONFIGURATION (Marking Side)
3-pin plastic SIP (TO-92)
8-pin plastic SOP (225 mil)
µPC1093G
•
µPC1093J
•
K
NC
NC
NC
REF
NC
A
1
2
3
4
8
7
6
5
1
2
3
NC
1 : REF
2 : A
3 : K
Power mini mold (SOT-89)
5-pin plastic mini mold (SC-74A)
µPC1093TA
•
µPC1093T
•
NC
5
A
4
A
REF : Reference
1
2
3
A : Anode
K : Cathode
K
A REF
1
2
3
NC : No Connection
REF
A
K
2
µPC1093
ABSOLUTE MAXIMUM RATING (TA = 25 °C, unless otherwise specified.)
Parameter
Cathode Voltage
Symbol
Ratings
Unit
V
VKA
37
150
Cathode Current
IK
mA
mA
V
Cathode-Anode Reverse Current
Reference Voltage
–IK
–100
VREF
IREF
–IREF
PT
7
Reference Input Current
Reference-Anode Reverse Current
50
µA
mA
mW
–10
Power Dissipation
µPC1093J
µPC1093G
µPC1093T
µPC1093TA
700
480
400/2 000Note 1
180/510Note 2
–20 ~ +85
–65 ~ +150
Operating Ambient Temperature
Storage Temperature
TA
°C
°C
Tstg
Notes 1. with 16 cm2 × 0.7 mm ceramic substrate
2. with 75 mm2 × 0.7 mm ceramic substrate
Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceed-
ing the ratings could cause permanent damage. The parameters apply independently. The device
should be operated within the limits specified under DC and AC Characteristics.
RECOMMENDED OPERATING CONDITIONS
Parameter
Cathode Voltage
Symbol
MIN.
VREF
1
TYP.
5
MAX.
36
Unit
V
VKA
Cathode Current
Power Dissipation
IK
10
50
50
50
50
100
mA
mW
µPC1093J
µPC1093G
µPC1093T
µPC1093TA
PT
220
150
125/640Note 1
58/160Note 2
+85
Operating Ambient Temperature
TA
–20
°C
Notes 1. with 16 cm2 × 0.7 mm ceramic substrate
2. with 75 mm2 × 0.7 mm ceramic substrate
3
µPC1093
ELECTRICAL CHARACTERISTICS (TA = 25 °C, IK = 10 mA, unless otherwise specified.)
Parameter
Reference Voltage
Symbol
Conditions
MIN.
TYP. MAX.
Unit
V
VREF
VKA = VREF
2.440 2.495 2.550
Reference Voltage Deviation Over
Temperature
∆VREF
0 °C ≤ TA ≤ 70 °C, VKA = VREF
7
17
mV
Reference Voltage Deviation Over
Cathode Voltage
∆VREF/∆V
| VREF | ≤ VKA ≤ 10 V
1.2
0.7
1
2.7
2
mV/V
mV/V
µA
10 V ≤ VKA ≤ 36 V
Reference Input Current
IREF
VKA = VREF, R1 = 10 kΩ, R2 = ∞
4
Reference Input Current Deviation
Over Temperature
∆IREF
0 °C ≤ TA ≤ 70 °C, VKA = VREF,
R1 = 10 kΩ, R2 = ∞
0.4
1.2
µA
Minimum Cathode Current
Off-state Cathode Current
Dynamic Impedance
IK min.
IK off
VKA = VREF, ∆VREF = 2 %
0.4
0.1
0.1
1
1
mA
µA
Ω
VKA = 36 V, VREF = 0
| ZKA |
VKA = VREF, f ≤ 1 kHz
1 mA ≤ IK ≤ 100 mA
0.5
TEST AND APPLICATION CIRCUIT
R0
V
IN
V
OUT
R
1
K
A
REF
R
R
1
2
.
V
OUT (1+
)
VREF
R2
GND
4
µPC1093
TYPICAL CHARACTERISTICS
P
d
vs T
A
( I )
P
d
vs T ( II )
A
0.8
0.6
0.4
0.2
(with 16 cm2×0.7 mm ceramic substrate)
µPC1093J
2.0
1.6
1.2
0.8
0.4
µPC1093T
62.5 °C/W
180 °C/W
µPC1093G
µPC1093T
260 °C/W
315 °C/W
µPC1093TA
245 °C/W
µPC1093TA
(with 75 mm2×0.7 mm ceramic
695 °C/W
substrate)
0
0
20
40
60
80
100
20
40
60
80
100
T
A
- Operating Ambient Temperature - °C
TA
- Operating Ambient Temperature - °C
V
REF vs T
A
IK vs VKA ( I )
20
10
1.2
1.0
0.8
0.6
0.4
0.2
T
V
A
= 25 °C
I
V
K
= 10 mA
KA = VREF
KA = VREF
0
–10
–20
–30
–25
0
25
50
75
100
0
1
2
3
T
A
- Operating Ambient Temperature - °C
V
KA - Cathode Voltage - V
IK vs VKA ( II )
VREF vs VKA
20
10
150
100
50
T
A
= 25 °C
T = 25 °C
VKA = VREF
A
I
K
= 10 mA
0
–10
0
–20
–30
–50
–100
0
10
20
30
40
–2
–1
0
1
2
3
V
KA - Cathode Voltage - V
VKA - Cathode Voltage - V
5
µPC1093
I
REF vs T
A
I
K off vs T
A
3
2
0.3
0.2
V
R
KA = VREF, I
K
= 10 mA
2
V
KA = 36 V
1
= 10 kΩ , R = ∞
V
REF = 0
µ
µ
1
0.1
0
–25
0
–25
0
25
50
75
100
0
25
50
75
100
T
A
-Operating Ambient Temperature - °C
T
A
-Operating Ambient Temperature - °C
Z
KA vs f
Pulse Response
100
T = 25 °C
A
T = 25 °C
A
V
KA = VREF
V
KA = VREF
RO
= 220 Ω
1 mA≤I ≤100 mA
K
5
0
10
1
3
2
1
0
0.1
0.01
100
1 k
10 k
100 k
1 M
0
2
4
6
8
10
f - Frequency - Hz
T - Time - µs
Av vs f
60
40
20
220 Ω
ν
o
I
K
10 kΩ
10 kΩ
ν
in
0
~
(I
K
= 10 mA)
–20
1 k
10 k
100 k
1 M
10 M
f - Frequency - Hz
6
µPC1093
STABILITY AREA
TEST CIRCUIT
100
90
80
70
60
50
40
30
20
10
0
a
a : VKA = VREF
b : VKA = 5 V
c : VKA = 10 V
d : VKA = 15 V
150 Ω
a
I
KA
a
b
c
b
C
KA
c
Stable
d
b, c, d
150 Ω
Unstable
I
KA
R
CKA
10 kΩ
0.001
0.01
0.1
KA - Load Capacitance - µF
1
10
C
KA : Monolithic Ceramic Capacitors
C
Caution of Stability Area
If the Aluminum electrolytic capacitor is used, it should be kept CKA ≥ 2.2 µF.
When using plural different types of capacitors, each capacitor is needed to be stable independently.
When designing a circuit, take the characteristic variation among devices into consideration, so that the designed
circuit has an enough characteristic margin supporting the standard specifications described above.
7
µPC1093
PACKAGE DRAWINGS
3 PIN PLASTIC SIP (TO-92)
A
N
M
1
3
Y
V
U
J
H
M
F
G
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
ITEM MILLIMETERS
A
F
5.0±0.2
+0.3
0.5
−0.1
G
H
J
0.12
1.27
1.33 MAX.
5.0±0.5
4.0±0.2
2.8 MAX.
0.5±0.1
15.0±0.7
M
N
U
V
Y
P3J-127B-2
8
µPC1093
8 PIN PLASTIC SOP (225 mil)
8
5
detail of lead end
P
1
4
A
H
I
F
J
G
S
B
L
N
S
E
C
K
M
D
M
NOTE
ITEM MILLIMETERS
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
+0.17
5.2
A
−0.20
B
C
0.78 MAX.
1.27 (T.P.)
+0.08
0.42
D
−0.07
E
F
G
H
I
0.1±0.1
1.59±0.21
1.49
6.5±0.3
4.4±0.15
1.1±0.2
J
+0.08
0.17
K
−0.07
L
M
N
0.6±0.2
0.12
0.10
+7°
3°
P
−3°
S8GM-50-225B-5
9
µPC1093
POWER MINI MOLD (SOT-89) (Unit: mm)
4.5±0.1
1.6±0.2
1.5±0.1
0.42±0.06
0.42±0.06
0.47
1.5
±0.06
3.0
+0.03
−0.05
0.41
10
µPC1093
5 PIN PLASTIC MINI MOLD
detail of lead end
F
G
R
L
E
A
H
I
J
B
S
C
N
S
ITEM MILLIMETERS
M
D
M
K
A
B
C
2.9±0.2
0.3
0.95 (T.P.)
+0.05
0.32
D
−0.02
0.05±0.05
E
F
1.4 MAX.
+0.2
1.1
G
−0.1
H
I
2.8±0.2
+0.2
1.5
−0.1
+0.1
0.65
J
−0.15
+0.1
0.16
K
−0.06
L
M
N
R
0.4±0.2
0.19
0.1
5°±5°
S5TA-95-15A
11
µPC1093
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Through-hole device
µPC1093J: 3-pin plastic SIP (TO-92)
Process
Conditions
Wave soldering
(only to leads)
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
Surface mount devices
µPC1093G: 8-pin plastic SOP (225 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
VPS
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
WS60-00-1
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
12
µPC1093
µPC1093T: Power mini mold (SOT-89)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
VPS
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
WS60-00-1
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
µPC1093TA: 5-pin plastic mini mold (SC-74A)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 3 times.
IR35-00-3
VPS
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 3 times.
VP15-00-3
WS60-00-1
Wave soldering
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
13
µPC1093
REFERENCE DOCUMENTS
Quality Grades on NEC Semiconductor Devices
Semiconductor Device Mounting Technology Manual
IC Package Manual
C11531E
C10535E
C10943X
X10679E
IEI-1212
Semiconductors Selection Guide
NEC Semiconductor Device Reliability/Quality Control System
-Three Terminal Regulator
REMARK OF THE PACKAGE MARK
The package marks of the µPC1093T and the µPC1093TA are the symbols as follows.
Part Number
µPC1093T
µPC1093TA
Mark
93
K93
14
µPC1093
[MEMO]
15
µPC1093
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
相关型号：
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