UPC1652G [RENESAS]
RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER;
| 型号： | UPC1652G |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER 放大器 射频 微波 功率放大器 |
| 文件： | 总10页 (文件大小：173K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010
Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Notice
1.
2.
All information included in this document is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
of Renesas Electronics or others.
3.
4.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
you or third parties arising from the use of these circuits, software, or information.
5.
When exporting the products or technology described in this document, you should comply with the applicable export control
laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
Electronics products or the technology described in this document for any purpose relating to military applications or use by
the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
under any applicable domestic or foreign laws or regulations.
6.
7.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
incurred by you resulting from errors in or omissions from the information included herein.
Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
expressly specified in a Renesas Electronics data sheets or data books, etc.
“Standard”:
Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; safety equipment; and medical equipment not specifically designed for life support.
“Specific”:
Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.
9.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ranges.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
DATASHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1652G
SILICON MONOLITHIC BIPOLAR INTEGRATED CIRCUIT
WIDE BAND AMPLIFIER
DESCRIPTION
PIN CONNECTIOS
The µPC1652G is
a
silicon monolithic integrated circuit
especially designed as a wide band amplifier convering HF band
through UHF band.
INPUT
GND
GND
D
1
2
3
4
8
7
6
5
GND
V
V
CC
CC
FEATURES
•
•
•
•
Excellent frequency response : 1 200 MHz TYP. @ 3 dB down
High power gain : 18 dB TYP. @ f = 500 MHz
Low voltage operation : VCC = 5 V
OUTPUT
SOP package
ABSOLUTE MAXIMUM RATINGS (TA = +25 °C)
Supply Voltage
VCC
PD
7
mW
°C
Total Power dissipation
Operating Ambient Temperature
Storage Temperature
440
TA
−20 to +75
−4to +15
Tstg
°C
EQUIVALENT CIRCUIT
ELCTRICAL CHARACTERISTICS (TA = +25 °C, VCC = 5 V)
HARACTERISTIC
icuit Current
Power Gain
SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS
V
CC
ICC
GP
15
16
20
18
25
20
mA No signals
dB f = 500 MHz
dB f = 500 MHz
MHz 3 dB down below flat gain
dB f = 500 MHz
dB f = 500 MHz
dB f = 500 MHz
dBm f = 500 MHz
Noise Figure
NF
BW
ISO
5.5 6.5
1000 1200
OUT
Band Width
Isolation
23
17
12
3
26
20
15
5
IN
Input Return Loss
Output Return Loss
Maximum Output Level
S11
S22
PO
GND
NEC cannot assume any responsibility for any circuits shown or represent that
they are free from patent infringement
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12443EJ5V0DS00 (5th edition)
Date Published November 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
1983, 1999
©
µPC1652G
TYPICAL CHARACTERISTICS (TA = +25 °C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
INPUT POWER vs. OUTPUT POWER
V
CC = 5 V
f = 500 MHz
20
10
+5
0
−5
0
1
2
3
4
5
6
−20
−15
−10
VCC-Supply Voltage-V
Pin-Input Power-dBm
NOISE FIGURE AND POWER GAIN
vs. FREQUENCY
INPUT AND OUTPUT RETURN LOSS
vs. FREQUENCY
V
CC
=
V
CC
=
5 V
5 V
oduct
10
8
25
20
0
−10
G
P
|S11
|
6
4
2
0
15
10
−20
−30
−40
NF
|S12
|
5
0
50
100
200
500
1000
2000
50
100
200
500
1000
2000
f-Frequency-MHz
f-Frequency-MHz
ued Pr
ISOLATION vs. FREQUENCY
V
CC
=
5 V
0
−10
−20
−30
−40
50
100
200
500
1000
2000
f-Frequency-MHz
Discontin
2
Data Sheet P12443EJ5V0DS00
µPC1652G
PACKAGE DIMENSIONS
8 PIN PLASTIC SOP (225 mil) (UNIT: mm)
8
5
detail of lead end
+7˚
–3˚
3˚
1
4
5.2 ± 0.2
oduct
6.5 ± 0.3
4.4 ± 0.15
1.57 ± 0.2
1.1 ± 0.2
1.49
0.85 MAX.
0.6 ± 0.2
0.10
+0.08
–0.07
1.27
0.17
+0.08
–0.07
ued Pr
0.42
M
0.12
0.1 ± 0.1
Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
NOTE
Discontin
3
Data Sheet P12443EJ5V0DS00
µPC1652G
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to keep minimum ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) The bypass capacitor should be attached to the VCC pin.
(5) The DC cut capacitor must be each attached to the input and output pins.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods an
conditions than the recommended conditions are to be consulted with our sales representatives.
µPC1652G
Rnded
Soldering Method
Infrared ray reflow
Soldering Conditions
Conn Symbol
Package peak temperature: 235 °C, Hour: within 30 s.
(more than 210 °C), Time: 3 times, Limited days: no.Note
IR35-00-3
VPS
Package peak temperature: 215 °C, Hour: within 40 s.
(more than 200 °C), Time: 3 times, Limited days: no.Note
VP15-00-3
WS60-00-1
Wave soldering
Pin part heating
Soldering tub temperature: less than 260 °C, Hour: thin 10 s.
Time: 1 time, Limited days: no.Note
Pin area temperature: less than 300 °C, Hour: withiin.
Limited days: no.Note
Note It is the storage days after opening a dry pack, te stoge conditions are 25 °C, less than 65 % RH.
Caution The combined use of soldering mhod is to be avoided (However, except the pin area heating
method).
For details of recommended solderng cnditions for surface mounting, refer to information document SEMICON-
DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
4
Data Sheet P12443EJ5V0DS00
µPC1652G
[MEMO]
5
Data Sheet P12443EJ5V0DS00
µPC1652G
[MEMO]
6
Data Sheet P12443EJ5V0DS00
µPC1652G
[MEMO]
7
Data Sheet P12443EJ5V0DS00
µPC1652G
• The information in this document is subject to change without notice. Before using this documentplea
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without thpriowritten
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors whh maappear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or oellectual property
rights of third parties by or arising from use of a device described herein or any other liaarising from use
of such device. No license, either express, implied or otherwise, is granted under aents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this docuent are provided for illustrative
purposes in semiconductor product operation and application examhe icorporation of these circuits,
software, and information in the design of the customer's equipment sl be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any loses incurred by the customer or third
parties arising from the use of these circuits, software, and infoation.
• While NEC Corporation has been making continuous effort to ethe reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To mze risks of damage or injury to persons or
property arising from a defect in an NEC semiconductvice, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-cotainet, and anti-failure features.
• NEC devices are classified into the following three quity grades:
"Standard", "Special", and "Specific". The Specific uaity grade applies only to devices developed based on a
customer designated "quality assurance proramfor a specific application. The recommended applications of
a device depend on its quality grade, as indiced below. Customers must check the quality grade of each device
before using it in a particular appliction.
Standard: Computers, office equipent, communications equipment, test and measurement equipment,
audio and visual equment, home electronic appliances, machine tools, personal electronic
equipment and instrial robots
Special: Transportatiquipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, ae systems, safety equipment and medical equipment (not specifically designed
for life suppo
Specific: Aircrat, aeospace equipment, submersible repeaters, nuclear reactor control systems, life
support ystems or medical equipment for life support, etc.
The quaity gdoNEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customes intend to use NEC devices for applications other than those specified for Standard quality grade,
thld cntact an NEC sales representative in advance.
M7 98. 8
相关型号：
©2020 ICPDF网 联系我们和版权申明