UPC259G2 [RENESAS]
High Performance, Low Noise Dual Operational Amplifier;
| 型号： | UPC259G2 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | High Performance, Low Noise Dual Operational Amplifier |
| 文件： | 总13页 (文件大小：320K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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April 1st, 2010
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC4560
HIGH PERFORMANCE DUAL OPERATIONAL AMPLIFIER
DESCRIPTION
The µPC4560 is a dual operational amplifier which features more improved slew rate and G.B. products than that of
µPC4559 with unity gain frequency compensation. Also very low input noise and high output current drive capability
make this device the optimum choice for audio applications and active filters.
FEATURES
• Internal frequency compensation
• Gain bandwidth products: 10 MHz TYP.
• Low noise: 6 µVp-p TYP.
• High output current
ORDERING INFORMATION
Part Number
µPC4560C
µPC4560G2
Package
8-pin plastic DIP (7.62 mm (300))
8-pin plastic SOP (5.72 mm (225))
EQUIVALENT CIRCUIT (1/2 Circuit)
PIN CONFIGURATION (Top View)
V+
µ
PC4560C, 4560G2
R1
Q
7
OUT
1
1
8
V+
5
Q
Q13
1
+
–
11
Q
I
I1
2
3
4
7
6
5
OUT
2
Q15
2
8
Q
+
6
–
R
Q1
2
Q
II
I
N1
I
I
I2
Q
9
N
I
7
R
8
R
R
5
V–
N2
2
C
Q
12
Q
14
OUT
Q
3
4
Q
Q
10
D
R
2
3
R
R
4
C
1
9
R
V–
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. G15805EJ4V0DS00 (4th edition)
Date Published March 2004 N CP(K)
Printed in Japan
The mark shows major revised points.
1987
µPC4560
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter
Symbol
Ratings
–0.3 to +36
30
Unit
V
Note 1
Voltage between V+ and V–
Differential Input Voltage
Input Voltage Note 2
V+ - V–
VID
V
VI
V––0.3 to V+ +0.3
V––0.3 to V+ +0.3
700
V
Output Voltage Note 3
VO
V
Power Dissipation
C Package Note 4
G2 Package Note 5
PT
mW
mW
sec
°C
°C
440
Output Short Circuit Duration Note 6
Operating Ambient Temperature
Storage Temperature
0
TA
–20 to +80
–55 to +125
Tstg
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction. Even during the transition
period of supply voltage, power on/off etc., this specification should be kept. The normal operation will
establish when the both inputs are within the Common Mode Input Voltage Range of electrical
characteristics.
3. This specification is the voltage which should be allowed to supply to the output terminal from external
without damage or destruction. Even during the transition period of supply voltage, power on/off etc., this
specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of
electrical characteristics.
4. Thermal derating factor is –7.0 mW/°C when operating ambient temperature is higher than 25°C.
5. Thermal derating factor is –4.4 mW/°C when operating ambient temperature is higher than 25°C.
6. Must not short to GND, V+, V–, and other Voltage source. Pay careful attention to the total power dissipation
not to exceed the absolute maximum ratings, Note 4 and Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
V
MIN.
4
TYP.
MAX.
16
Unit
V
Supply Voltage
2
Data Sheet G15805EJ4V0DS
µPC4560
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V)
Parameter
Symbol
VIO
Conditions
RS ≤ 10 Ω
MIN.
TYP.
±0.5
±5
MAX.
Unit
mV
nA
Input Offset Voltage
±6.0
±200
500
Input Offset Current Note
Input Bias Current Note
IIO
IB
60
nA
Large Signal Voltage Gain
Power Consumption
AV
RL ≥ 2 kΩ , VO = ±10 V
IO = 0 A
20,000
70
180,000
120
100
10
Pd
170
150
mW
dB
Common Mode Rejection Ratio
Source Variation Rejection Ratio
Output Voltage Swing
CMR
SVR
Vom
RS ≤ 10 kΩ
RS ≤ 10 kΩ
µV/V
V
RL ≥ 2 kΩ
±12
±10
±12
±14
±13
±14
2.8
IO = ±25 mA
V
Common Mode Input Voltage Range
Slew Rate
VICM
SR
Vn
V
AV = 1
V/µs
µVp-p
Input Equivalent Noise Voltage
RS = 1 kΩ, f = 1 Hz to 1 kHz
(Figure1)
6
Channel Separation
f = 1 kHz (Figure2)
105
dB
Note Input bias currents flow out from IC, because each currents are base current of PNP-transistor on input stage.
3
Data Sheet G15805EJ4V0DS
µPC4560
MEASUREMENT CIRCUIT
Figure1 Noise Measurement Circuit
+15 V
100 kΩ
1 kΩ
−
VO
+
V
O
Vn =
50 Ω
1 kΩ
2000
−15 V
Figure2 Channel Separation Measurement Circuit
50 kΩ
−
VO2
50 Ω
+
Channel separation
1
= 20 log (
1000
V
V
O2
O1
)
10 kΩ
10 kΩ
−
VO1
+
4
Data Sheet G15805EJ4V0DS
µPC4560
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.)
POWER DISSIPATION
OPEN LOOP FREQUENCY RESPONSE
120
100
80
60
40
20
0
V+_
+_
15 V
=
800
600
400
200
µ
µ
PC4560C
PC4560G2
0
20
40
60
80
100
1
10 100 1 k 10 k 100 k 1 M 10 M
f- Frequency - Hz
T
A
- Operating Ambient Temperature - ˚C
LARGE SIGNAL FREQUENCY RESPONSE
OUTPUT CURRENT LIMIT
±20
±15
±10
±5
V ± = ±15 V
V+_
+_
15 V
=
32
28
24
20
16
12
8
VO
+, IO SOURCE
VO
−, IO SINK
4
0
100
1 k
10 k
100 k
1 M
0
20
40
60
80
f - Frequency - Hz
I
O
- Output Current - mA
INPUT BIAS CURRENT
SUPPLY CURRENT
6
5
4
3
2
V+_
+_
15 V
=
100
80
60
40
20
0
1
0
80
40
60
−20
0
20
+_
20
+_
10
0
V+_ - Supply Voltage - V
T
A
- Operating Ambient Temperature - ˚C
5
Data Sheet G15805EJ4V0DS
µPC4560
VOLTAGE FOLLOWER PULSE RESPONSE
COMMON MODE INPUT VOLTAGE RANGE
20
10
V+_
+
= 15 V
Av = 1
5
10
0
0
−5
−10
−20
−10
+
_
+
_
20
0
10
20
30
40
0
10
t - Time -
s
V - Supply Voltage - V
µ
INPUT EQUIVALENT NOISE VOLTAGE DENSITY
R
S
= 100
Ω
∆
f = 1 H
Z
100
30
10
0
1
10
100
1k
f - Frequency - Hz
6
Data Sheet G15805EJ4V0DS
µPC4560
APPLICATION CIRCUITS
Head Phone Amp
+20 V
51 kΩ
C
2
+
−
R1
µ
10 kΩ
R
10
F
5
51 kΩ
R2
−
180 Ω
µ
100
F
µ
+
PC4560
C
1
+
+
6
−
4
−
R
C
HEAD PHONE
8Ω
2.5 mW TYP.
Maximum Power
µ
0.47 F
R
10 kΩ
4
100 Ω
R7
100 kΩ
R3
+
−
C
4.7 F
3
µ
RIAA Amp
TOTAL HARMONIC DISTORTION
C
C
3µ
4µ
+15 V
0.0022
F
0.01
F
1.0
0.1
f = 1kH
Z
+
C
6
R
4
36 kΩ
R
5
100 F
µ
−
390 kΩ
−
µ
+
C
5
C
1
µ
33
F
PC4560
+
33
−
F
R
1
−
+
µ
2.2 kΩ
C
47
2
+
R
6
0.01
µ
F
−
C
7
10 kΩ
−
R
2
100 F
µ
R
3
56 kΩ
+
−15 V
1 kΩ
0.001
0.01
0.1
1.0
1
VO
- Output Voltage - Vr.m.s.
7
Data Sheet G15805EJ4V0DS
µPC4560
PACKAGE DRAWINGS (Unit : mm)
8-PIN PLASTIC DIP (7.62mm(300))
8
5
1
4
A
K
L
J
P
I
C
H
G
B
M
R
F
M
D
N
NOTES
ITEM MILLIMETERS
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
A
B
C
D
F
G
H
I
10.16 MAX.
1.27 MAX.
2.54 (T.P.)
0.50 0.10
1.4 MIN.
2. ltem "K" to center of leads when formed parallel.
3.2 0.3
0.51 MIN.
4.31 MAX.
5.08 MAX.
7.62 (T.P.)
6.4
J
K
L
+0.10
0.25
M
−0.05
N
P
R
0.25
0.9 MIN.
0∼15°
P8C-100-300B,C-2
8
Data Sheet G15805EJ4V0DS
µPC4560
8-PIN PLASTIC SOP (5.72 mm (225))
8
5
detail of lead end
P
1
4
A
H
I
F
J
G
S
B
L
N
S
C
K
M
D
M
E
NOTE
ITEM MILLIMETERS
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
+0.17
5.2
A
−0.20
B
C
0.78 MAX.
1.27 (T.P.)
+0.08
0.42
D
−0.07
E
F
G
H
I
0.1 0.1
1.59 0.21
1.49
6.5 0.3
4.4 0.15
1.1 0.2
J
+0.08
0.17
K
−0.07
L
M
N
0.6 0.2
0.12
0.10
+7°
3°
P
−3°
S8GM-50-225B-6
9
Data Sheet G15805EJ4V0DS
µPC4560
RECOMMENDED SOLDERING CONDITIONS
The µPC4560 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µPC4560G2: 8-pin plastic SOP (5.72 mm (225))
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 230°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 1 time.
IR30-00-1
Vapor Phase Soldering
Wave Soldering
Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 1 time.
VP15-00-1
WS60-00-1
–
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 300°C or below,
Partial Heating Method
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µPC4560C: 8-pin plastic DIP (7.62 mm (300))
Process
Wave Soldering
Conditions
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
(only to leads)
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure
that the package body does not get jet soldered.
10
Data Sheet G15805EJ4V0DS
µPC4560
•
The information in this document is current as of March, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
•
• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
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