UPC29M05AHF-AZ [RENESAS]
UPC29M05AHF-AZ;
| 型号： | UPC29M05AHF-AZ |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | UPC29M05AHF-AZ PC |
| 文件： | 总16页 (文件大小：394K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
μPC29M33A, 29M05A
THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR
DESCRIPTION
The μPC29M33A, 29M05A of low dropout voltage three terminal positive regulators is constructed with PNP output
transistor. The μPC29M33A, 29M05A feature the ability to source 0.5 A of output current with a low dropout voltage of
typically 0.5 V.
The power dissipation of the μPC29M33A, 29M05A can be drastically reduced mpared with the conventional three
terminal positive voltage regulators that is constructed with NPN output transishis series corresponds to the low
voltage output (3.3 V) which is not in the conventional low dropout regulatorries).
FEATURES
• Output current in excess of 0.5 A
• Low dropout voltage
VDIF = 0.5 V TYP. (IO = 0.5 A)
• On-chip over-current and thermal protection circuit
• On-chip output transistor safe operating area pr
PIN CONFIGURATIONS (Marking S
μ PC29M33AHF,
,
μPC29M33AT,
μ PC29M05AHF: Isolated TO-2
AHB: SC-64 (MP-3)
μPC29M05AT: SC-63 (MP-3Z)
4
4
1
2
3
1
2
3
1: INPUT
1: INPUT
1: INPUT
2: GND
3: OUTPUT
2: GNDNote1
3: OUTPUT
4: GND (Fin)
2: GNDNote2
3: OUTPUT
4: GND (Fin)
1
2 3
Notes 1. No.2 pin and No.4 fin are common GND.
2. No.2 pin is cut. No.2 pin and No.4 fin are common GND.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. G15368EJ4V0DS00 (4th edition)
Date Published August 2007 NS
Printed in Japan
2001, 2007
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
μPC29M33A, 29M05A
BLOCK DIAGRAM
INPUT
Safe operating
area protection
Start-up
circuit
Reference
voltage
Saturation
protection
Error
Amp.
Drive
circuit
OUTPUT
Thermal
shut down
Over-current
protection
GND
2
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
<R>
ORDERING INFORMATION
Part Number
Package
Output Voltage
Marking
μ PC29M33AHF
μ PC29M33AHB
μ PC29M33AT
μ PC29M05AHF
μ PC29M05AHB
μ PC29M05AT
Isolated TO-220 (MP-45G)
SC-64 (MP-3)
3.3 V
3.3 V
3.3 V
5.0 V
5.0 V
5.0 V
29M33A
29M33A
29M33A
29M05A
29M05A
29M05A
SC-63 (MP-3Z)
Isolated TO-220 (MP-45G)
SC-64 (MP-3)
SC-63 (MP-3Z)
Remark Tape-packaged products have the symbol -E1, or -E2 suffixed to the part number. Pb-free products have the
symbol -AZ, or -AY suffixed to the part number. Refer to the following table for details.
Part Number Note1
Package
Package Type
μ PC29MxxAHF
Isolated TO-220 (MP-45G)
Isolated TO-220 (MP-45G)
SC-64 (MP-3)
μ PC29MxxAHF-AZ Note2
μ PC29MxxAHB
op
μ PC29MxxAHB-AZ Note2
μ PC29MxxAHB-AY Note3
μ PC29MxxAT-E1
SC-64 (MP-3)
nvelop
SC-64 (MP-3)
d in envelop
SC-63 (MP-3Z)
6 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
Note2
μ PC29MxxAT-E1-AZ
μ PC29MxxAT-E1-AY
μ PC29MxxAT-E2
S
S(MP-3Z)
SC-63 (MP-3Z)
SC-63 (MP-3Z)
• 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
Note3
• 16 mm wide embossed taping
• Pin 1 on draw-out side
• 2000 pcs/reel
• 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
Note2
Note3
μ PC29MxxAT-E2-AZ
μ PC29MxxAT-E2-AY
• 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
• 16 mm wide embossed taping
• Pin 1 at take-up side
• 2000 pcs/reel
Notes 1. xx stands for symbols that indicate the output voltage.
2. Pb-free (This product does not contain Pb in the external electrode.)
3. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
3
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter
Rating
Unit
Symbol
μ PC2933AHF, 2905AHF
μ PC2933AHB, 2905AHB
μ PC2933AT, 2905AT
Input Voltage
VIN
20
V
W
Internal Power Dissipation (TC = 25°C) Note
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
PT
15
10
TA
−30 to +85
−30 to +150
−55 to +150
°C
TJ
°C
Tstg
Rth(J-C)
Rth(J-A)
°C
Thermal Resistance (junction to case)
Thermal Resistance (junction to ambient)
7
12.5
125
°C/W
°C/W
65
Note Internally limited. When the operating junction temperature rises above internal circuit shuts down the
output voltage.
Caution Product quality may suffer if the absolute maximn momentarily for any
parameter. That is, the absolute maximum ratingthe product is on the verge
of suffering physical damage, and therefore under conditions that ensure
that the absolute maximum ratings are not
TYPICAL CONNECTION
29M05A
INPUT
OUTPUT
+
D
2
COUT
CIN : 0.1 μ F or higher. Be sure tCIN to prevent parasitic oscillation. Set this value according to the length of the
line between the regulator and e INPUT pin. Use of a film capacitor or other capacitor with first-rate voltage and
temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that
CIN is 0.1 μF or higher for the voltage and temperature range to be used.
COUT: 47 μF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN
and COUT as close as possible to the IC pins (within 1 to 2 cm). Also, use an electrolytic capacitor with low
impedance characteristics if considering use at sub-zero temperatures.
D1 : If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode.
D2 : If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode.
Caution Make sure that no voltage is applied to the OUTPUT pin from external.
4
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
RECOMMENDED OPERATING CONDITIONS
Parameter
Input Voltage
Symbol
Type Number
MIN.
4.3
6
TYP.
MAX.
16
Unit
V
VIN
μ PC29M33A
μ PC29M05A
16
Output Current
IO
All
All
0
0.5
A
TA
−30
+85
°C
Operating Ambient Temperature
Operating Junction Temperature
TJ
All
−30
+125
°C
ELECTRICAL CHARACTERISTICS
μPC29M33A (TJ = 25°C, VIN = 5 V, IO = 350 mA, CIN = 0.22 μF, COUT = 47 μF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
TYP.
.3
MAX.
3.42
Unit
V
VO
0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 1
0 A ≤ IO ≤ 350 mA
3.46
0°C ≤ TJ ≤ 125°C, 0 A ≤
4.3 V ≤ VIN ≤ 16 V
Line Regulation
Load Regulation
Quiescent Current
REGIN
REGL
IBIAS
8
10
1.8
15
9
33
33
3.0
20
20
50
15
mV
mV
0 A ≤ IO ≤ 0.5 A
IO = 0 A
mA
mA
IO = 0.
Startup Quiescent Current
IBIAS (s)
V
VIN ≤ 16 V
, f = 120 Hz
5°C, IO = 0.5 A
V
Quiescent Current Change
Output Noise Voltage
Ripple Rejection
ΔIBIAS
V
2.9
56
mA
μ Vr.m.s.
dB
48
64
Dropout Voltage
0.5
1.1
0.6
1.2
1.0
1.0
1.5
V
Short Circuit Current
0.7
A
A
= 16 V
Peak Output Current
IOpea
VIN = 4.5 V
0.7
0.6
1.5
1.5
VIN = 16 V
Temperature Coefficient of
Output Voltage
ΔVO/ΔT
0°C ≤ TJ ≤ 125°C, IO = 5 mA
−0.4
mV/°C
5
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
μPC29M05A (TJ = 25°C, VIN = 8 V, IO = 350 mA, CIN = 0.22 μF, COUT = 47 μF, unless otherwise specified)
Parameter
Output Voltage
Symbol
Conditions
MIN.
4.83
TYP.
5.0
MAX.
5.18
Unit
V
VO
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V,
0 A ≤ IO ≤ 350 mA
4.75
5.25
0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 0.5 A
6 V ≤ VIN ≤ 16 V
Line Regulation
Load Regulation
Quiescent Current
REGIN
REGL
IBIAS
26
17
1.9
15
10
50
50
4.0
20
20
50
15
mV
mV
0 A ≤ IO ≤ 0.5 A
IO = 0 A
mA
mA
IO = 0.5 A
Startup Quiescent Current
IBIAS (s)
VIN = 4.5 V, IO = 0 A
VIN = 4.5 V, IO = 0.5 A
0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V
10 Hz ≤ f ≤ 100 kHz
6 V ≤ VIN ≤ 16 V, f = 120 Hz
0°C ≤ TJ ≤ 125°C, IO = 0.5 A
VIN = 6.5 V
Quiescent Current Change
Output Noise Voltage
Ripple Rejection
ΔIBIAS
Vn
2.4
87
mA
μ Vr.m.s.
dB
R•R
VDIF
IOshort
Dropout Voltage
0.6
1.2
1.1
1.0
1.5
V
Short Circuit Current
A
A
VIN = 16 V
Peak Output Current
IOpeak
VIN = 6.5 V
6
1.5
1.5
VIN = 16 V
Temperature Coefficient of
Output Voltage
ΔVO/ΔT
0°C ≤ TJ
0.5
mV/°C
6
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
TYPICAL CHARACTERISTICS
ΔVO vs TJ
150
100
50
20
15
10
5
Solid line:
μ
PC29M33AHF, μPC29M05AHF
Broken line:
PC29M33AHB , PC29M05AHB
PC29M33AT , PC29M05AT
μ
μ
μ
μ
With infinite heatsink
μ
PC29M05A
0
μ
PC29M33A
–50
–100
–150
–200
1.92
1.0
0
I
O
= 5 mA
0
25
50
75
100
125
150
0
50
100 150
–50
T
A
- Operating Ambient Temperature - ˚C
T
J - Operon Temperature - ˚C
5A)
μ
VO vs. VIN ( PC29M33A)
8
7
4.0
3.5
3.0
2.5
2.0
1.5
1.0
T
J
= 25˚C
TJ = 25˚C
I
O
= 5 mA
I = 0.35 A
O
IO = 0.5 A
0
0.5
0
0
1
2
3
4
5
6
7
8
0
1
2
3
4
VIN - Input Voltage - V
V
IN - Inp
I
BIAS (IBIAS(
IBIAS (IBIAS(s)) vs. VIN
μ
( PC29M05A)
50
40
30
20
50
40
30
20
T
= 25˚C
I
O
= 0.5 A
IO
= 0.5 A
I
O
= 0.35 A
10
0
10
0
I = 0.35 A
O
I = 0 A
O
O
= 0 A
0
2
4
6
8
10 12 14 16 18 20
0
2
4
6
8
10 12 14 16 18 20
V
IN - Input Voltage - V
VIN - Input Voltage - V
7
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
V
DIF vs. T
J
I
Opeak vs. VDIF ( PC29M33A)
μ
1.0
0.8
0.6
0.4
0.2
0
1.5
1.0
TJ = 0˚C
PC29M05A
μ
T
J
= 25˚C
PC29M33A
μ
TJ = 125˚C
0.5
0.0
I
O
= 0.5 A
125
-25
0
25
50
75
100
150
0
5
10
15
20
VDIF - Dropout Voltage - V
TJ - Operating Junction Temperature - ˚C
s f
I
μ
Opeak vs. VDIF ( PC2905A)
80
70
60
1.5
1.0
T = 0˚C
J
T = 25˚C
J
0.5
0.0
T = 125˚C
J
TJ
= 25˚C, I
4.3 V ≤ VIN ≤ 16 V
6 V≤ VIN ≤ 16 V PC29M05A
O = 0.5 A
μ
PC29M33A
μ
100
1 k
10 k
100 k
0
5
10
f - Frequency - Hz
V
DIF - Dropout Voltag
.
V
DIF vs. I
O
80
70
60
50
1.0
TJ = 25˚C
0.8
0.6
0.4
μ
PC29M05A
μ
PC29M33A
T
J
= 25˚C, f = 120 Hz
PC29M05A
μ
4.3 V ≤ VIN ≤ 16 V PC29M33A
6 V≤ VIN ≤ 16 V PC29M05A
μ
40
30
0.2
0
μ
0
0.1
0.2
0.3
0.4
0.5
0
0.1
0.2
0.3
0.4
0.5
IO - Output Current - A
IO - Output Current - A
8
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
VO
vs. I ( PC29M05A)
μ
O
V
O
vs. I ( PC29M33A)
O
μ
6
5
4
3
2
1
6
5
4
3
2
1
T = 25˚C
J
T = 25˚C
J
VIN =
8 V
V
= 5 V
VIN = 16 V
V
IN = 16 V
VIN = 6 V
VIN
= 4.3 V
0
0.2
0.4
0.6
0.8
1.0
1.2
0
0.2
0.4
0.6
0.8
1.0
1.2
I
O
- Output Current - A
I
O
- Output Current - A
9
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
PACKAGE DRAWINGS
μPC29M33AHF, μPC29M05AHF
3PIN PLASTIC SIP (MP-45G)
A
B
N
P
E
I
L
M
D
1
2
3
V
U
M
G
NOTE
Each n 0.25 mm of
its tmaterial condition.
ITEM MILLIMETERS
A
B
C
D
E
F
G
H
I
10.0 0.2
7.0 0.2
1.50 0.2
17.0 0.3
φ
3.3 0.2
0.75 0.10
0.25
2.54 (T.P.)
5.0 0.3
J
2.46 0.2
5.0 0.2
K
L
8.5 0.2
M
N
P
U
V
Y
Z
8.5 0.2
4.5 0.2
2.8 0.2
2.4 0.5
0.65 0.10
8.9 0.7
1.30 0.2
P3HF-254B-4
10
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
μPC29M33AHB, μPC29M05AHB
SC-64 (MP-3) (Unit: mm)
6.5 0.2
5.0 0.2
2.3 0.2
0.5 0.1
4
1
2
3
1.1 0.1
+0.2
−0.1
0.5
2.3 2.3
μPC29M33AT, μ PC29M05AT
SC-63 (MP-3Z) (Unit: mm)
<R>
2
2.3 0.2
0.5 0.1
Note
Note
4
3
1
2
0.5 0.1
2.3 0.3
0.5 0.1
2.3 0.3
0.15 0.15
Note The depth of notch at the top of the fin is from 0 to 0.2 mm.
11
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
<R>
RECOMMENDED SOLDERING CONDITIONS
The μPC29M33A, 29M05A should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Surface Mount Device
μ PC29MxxAT Series: SC-63 (MP-3Z)
Process
Conditions
Symbol
Infrared Ray Reflow
Peak temperature: 235°C or below (Package surface temperae),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less
IR35-00-3
Vapor Phase Soldering
Partial Heating Method
Peak temperature: 215°C or below (Package sur
Reflow time: 40 seconds or less (at 200°C or
Maximum number of reflow processes: 3
VP15-00-3
P350
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (P
μ PC29MxxAT-AZ Series Note1, μ PC29MxxAT-AY S
Process
Symbol
Infrared Ray Reflow
Peak temperaturce temperature),
Reflow time: igher),
Maximum mes or less.
IR60-00-3
Partial Heating Method
Pin t
P350
each side of the device).
Notes 1. Pb-free (This n the external electrode.)
2. Pb-free (This prodPb in the external electrode, Sn100% plating.)
Caution Apply only one kind oering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended.
12
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
Through-hole devices
μ PC29MxxAHF Series, μ PC29MxxAHF-AZ Series Note1: Isolated TO-220 (MP-45G)
μ PC29MxxAHB Series, μ PC29MxxAHB-AZ Series Note1, μ PC29MxxAHB-AY Series Note2: SC-64 (MP-3)
Process
Conditions
Symbol
Wave soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less.
WS60-00-1
(only to leads)
Partial heating method
Pin temperature: 350°C or below, Heat time: 3 seconds or less (Per each pin).
P350
Notes 1. Pb-free (This product does not contain Pb in the external electrode.)
2. Pb-free (This product does not contain Pb in the external electrode, Sn100% plating.)
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
NOTES ON USE
When the μPC29M33A, 29M05A are used with an input vovalue indicated in the
recommended operating conditions, a high quiescent current flosaturation of the transistor of
the output stage. (Refer to the “IBIAS (IBIAS(S)) vs. VIN curves TICS”).
These products have saturation protector, but a currey flow through the device. Thus the
power supply on the input side must have sufficient nt current to pass when the device starts
up.
REFERENCE DOCUMENTS
USER’S MANUAL USAGE OF TORS
REVIEW OF QUALITY AND
INFORMATION VOLTAG
SEMICONDUCTOR DEV
Document No.G12702E
Document No.C12769E
Document No.G11872E
http://www.necel.com/pkg/en/mount/index.html
13
Data Sheet G15368EJ4V0DS
μPC29M33A, 29M05A
•
The information in this document is current as of August, 2007. The information is subject to
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circuits, software and information in the design of a customdone under the full
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customers or third parties arising from the use of these cation.
•
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M8E 02. 11-1
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