UPC8172TK-E2 [RENESAS]
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO6, LEAD FREE, MINIMOLD, LEADLESS-6;
| 型号： | UPC8172TK-E2 |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO6, LEAD FREE, MINIMOLD, LEADLESS-6 局域网 蜂窝 射频 微波 光电二极管 |
| 文件： | 总35页 (文件大小：417K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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April 1st, 2010
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8172TK
SMALL PACKAGE FREQUENCY UP-CONVERTER IC
DESCRIPTION
The µPC8172TK is a silicon monolithic integrated circuit designed as frequency up-converter for cellular telephone
transmitter stage.
This TK suffix IC which is smaller package than conventional TB suffix IC contribute to reduce your system size.
This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
•
•
•
•
High output frequency
Circuit current
: fRFout = 0.8 to 2.5 GHz
: ICC = 9.0 mA TYP.
High-density surface mounting : 6-pin lead-less minimold package
Supply voltage : VCC = 2.7 to 3.3 V
APPLICAIONS
•
•
•
PCS1900M
2.4 GHz band transmitter/receiver system (wireless LAN etc.)
RF module etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
6A
Supplying Form
µ PC8172TK-E2 µ PC8172TK-E2-A 6-pin lead-less minimold
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
(1511) (Pb-Free)Note
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPC8172TK
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10407EJ02V0DS (2nd edition)
Date Published December 2004 CP(K)
The mark shows major revised points.
Printed in Japan
NEC Compound Semiconductor Devices, Ltd. 2003, 2004
µPC8172TK
CONTENTS
1. PIN CONNECTIONS........................................................................................................................
2. PRODUCT LINE-UP ........................................................................................................................
3. BLOCK DIAGRAM...........................................................................................................................
4. SYSTEM APPLICATION EXAMPLE..............................................................................................
5. PIN EXPLANATION.........................................................................................................................
6. ABSOLUTE MAXIMUM RATINGS.................................................................................................
7. RECOMMENDED OPERATING RANGE.......................................................................................
8. ELECTRICAL CHARACTERISTICS ...............................................................................................
9. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY ....................................
3
3
4
4
5
6
6
6
7
10. TEST CIRCUIT ...............................................................................................................................
10.1 TEST CIRCUIT 1 (fRFout = 0.9 GHz) .....................................................................................
8
8
10.2 TEST CIRCUIT 2 (fRFout = 1.9 GHz) ..................................................................................... 10
10.3 TEST CIRCUIT 3 (fRFout = 2.4 GHz) ..................................................................................... 12
11. TYPICAL CHARACTERISTICS..................................................................................................... 14
11.1 fRFout = 900 MHz MATCHING.................................................................................................. 15
11.2 fRFout = 1 900 MHz MATCHING............................................................................................... 19
11.3 fRFout = 1 950 MHz MATCHING............................................................................................... 23
11.4 fRFout = 2 400 MHz MATCHING............................................................................................... 25
12. S-PARAMETERS ............................................................................................................................ 29
13. PACKAGE DIMENSIONS .............................................................................................................. 30
14. NOTE ON CORRECT USE .......................................................................................................... 31
15. RECOMMENDED SOLDERING CONDITIONS............................................................................ 31
2
Data Sheet PU10407EJ02V0DS
µPC8172TK
1. PIN CONNECTIONS
Pin No.
Pin Name
IFinput
GND
(Top View)
(Bottom View)
1
2
3
4
5
6
1
2
3
6
5
4
6
5
4
1
2
3
LOinput
PS
VCC
RFoutput
Caution Pin arrangement differs from the conventional 6-pin super mini-mold type (µPC8172TB).
2. PRODUCT LINE-UP
CG (dB)
ICC
fRFout
Part No.
Package
@RF0.9 (GHz)Note
(mA)
(GHz)
@RF1.9 (GHz)
@RF2.4 (GHz)
µPC8172TK
µPC8106TB
µPC8109TB
µPC8163TB
µPC8172TB
µPC8187TB
6-pin lead-less minimold
6-pin super minimold
(1511)
9.0
9.0
0.8 to 2.5
0.4 to 2.0
0.4 to 2.0
0.8 to 2.0
0.8 to 2.5
0.8 to 2.5
9.5
9.0
6.0
9.0
9.5
11.0
8.5
7.0
4.0
5.5
8.5
11.0
8.0
−
5.0
−
16.5
9.0
−
8.0
10.0
15.0
PO (sat) (dBm)
OIP3 (dBm)
Part No.
@RF0.9 (GHz)Note
@RF0.9 (GHz)Note @RF1.9 (GHz)
@RF2.4 (GHz)
@RF1.9 (GHz)
+6.0
@RF2.4 (GHz)
µPC8172TK
µPC8106TB
µPC8109TB
µPC8163TB
µPC8172TB
µPC8187TB
+0.5
−2.0
−5.5
+0.5
+0.5
+4.0
0
−0.5
−
+7.5
+5.5
+1.5
+9.5
+7.5
+10.0
+4.0
−
−4.0
−7.5
−2.0
0
+2.0
−
−1.0
−
−
+6.0
−
−0.5
+1.0
+6.0
+4.0
+8.5
+2.5
+10.0
Note fRFout = 0.83 GHz@ µPC8163TB, µPC8187TB
Remarks 1. Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
2. To know the associated product, please refer to each latest data sheet.
3
Data Sheet PU10407EJ02V0DS
µPC8172TK
3. BLOCK DIAGRAM
µ
PC8172TK
Conventional
µ
PC8172TB
(Top View)
(Top View)
IFinput
GND
RFoutput
LOinput
GND
PS
VCC
VCC
LOinput
PS
IFinput
RFoutput
4. SYSTEM APPLICATION EXAMPLE
Low Noise Tr
RX
I
Q
DEMO.
PLL
VCO
N
÷
SW
PLL
I
0˚
Phase
shifter
TX
90˚
PA
Q
µ
PC8172TK
Caution To know the associated products, please refer to each latest data sheet.
4
Data Sheet PU10407EJ02V0DS
µPC8172TK
5. PIN EXPLANATION
Applied
Pin
Pin No. Pin Name
Voltage
(V)
Voltage
(V) Note
Function and Applications
Internal Equivalent Circuit
1
IFinput
–
1.3
This pin is IF input to double
balanced mixer (DBM). The input
is designed as high impedance.
The circuit contributes to suppress
spurious signal. Also this
symmetrical circuit can keep
specified performance insensitive
to process-condition distribution.
For above reason, double
5
6
balanced mixer is adopted.
2
3
GND
GND
–
GND pin.
3
Ground pattern on the board
should be formed as wide as
possible. Track Length should be
kept as short as possible to
minimize ground impedance.
1
LOinput
–
2.4
Local input pin.
Recommendable input level is
–10 to 0 dBm.
2
5
6
VCC
2.7 to 3.3
–
–
Supply voltage pin.
RFoutput Same bias
as VCC
This pin is RF output from DBM.
This pin is designed as open
collector. Due to the high
through
external
impedance output, this pin should
be externally equipped with LC
matching circuit to next stage.
inductor
V
CC
5
2
4
PS
VCC/GND
–
Power save control pin.
Bias controls operation as follows.
Pin bias
VCC
Control
Operation
Power Save
4
GND
GND
Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V
5
Data Sheet PU10407EJ02V0DS
µPC8172TK
6. ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Symbol
VCC
VPS
PD
Test Conditions
Ratings
3.6
Unit
V
TA = +25°C
TA = +25°C
TA = +85°C
PS pin input Voltage
3.6
V
Power Dissipation of Package
Operating Ambient Temperature
Storage Temperature
Input Power
Note
203
mW
°C
TA
−40 to +85
−55 to +150
+10
Tstg
°C
Pin
dBm
Note Mounted on double-side copper-clad 50 × 50 × 1.6 mm epoxy glass PWB
7. RECOMMENDED OPERATING RANGE
Parameter
Supply Voltage
Symbol
MIN.
2.7
TYP.
3.0
MAX.
3.3
Unit
V
Remarks
VCC
Same voltage should be applied
to pin 5 and pin 6.
Operating Ambient Temperature
Local Input Level
TA
−40
−10
0.8
50
+25
−5
−
+85
0
°C
PLOin
fRFout
fIFin
dBm
GHz
MHz
ZS = 50 Ω (without matching)
RF Output Frequency
IF Input Frequency
2.5
600
With external matching circuit
−
8. ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = −5
dBm, and VPS ≥ 2.7 V, unless otherwise specified)
Parameter
Symbol
ICC
Test Conditions
MIN.
5.5
−
TYP.
9.0
−
MAX.
13
Unit
mA
µA
Circuit Current
No signal
VPS = 0 V
Circuit Current In
Power Save Mode
ICC (PS)
2.0
Conversion Gain
CG1
CG2
fRFout = 0.9 GHz Note1
fRFout = 1.9 GHz Note2
fRFout = 2.4 GHz Note2
fRFout = 0.9 GHz Note1
fRFout = 1.9 GHz Note2
fRFout = 2.4 GHz Note2
6.5
5.5
9.5
8.5
8.0
+0.5
0
12.5
11.5
11.0
−
dB
dB
PIFin = −30 dBm
fIFin = 240 MHz
CG3
5.0
dB
Saturated RF output
Power
PO (sat) 1
PO (sat) 2
PO (sat) 3
−2.5
−3.5
−4.0
dBm
dBm
dBm
PIFin = 0 dBm
−
fIFin = 240 MHz
−0.5
−
Notes 1. fRFout < fLOin @ fRFout = 0.9 GHz
2. fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz
6
Data Sheet PU10407EJ02V0DS
µPC8172TK
9. OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY
(TA = +25°C, VCC = VRFout = 3.0 V, PLOin = −5 dBm, and VPS ≥ 2.7 V, unless otherwise specified)
Parameter
Symbol
OIP31
OIP32
OIP33
IIP31
Test Conditions
Data
+7.5
+6.0
+4.0
−2.0
−2.5
−4.0
9.5
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dB
fRFout = 0.9 GHz Note1
fRFout = 1.9 GHz Note2
fRFout = 2.4 GHz Note2
fRFout = 0.9 GHz Note1
fRFout = 1.9 GHz Note2
fRFout = 2.4 GHz Note2
Output 3rd Order Distortion
Intercept Point
fIFin1 = 240 MHz
fIFin2 = 241 MHz
Input 3rd Order Distortion Intercept
Point
fIFin1 = 240 MHz
fIFin2 = 241 MHz
IIP32
IIP33
SSB Noize Figure
SSB⋅NF1 fRFout = 0.9 GHz, fIFin = 240 MHz
SSB⋅NF2 fRFout = 1.9 GHz, fIFin = 240 MHz
SSB⋅NF3 fRFout = 2.4 GHz, fIFin = 240 MHz
10.4
10.6
1.0
dB
dB
Power Save
Rise time
Fall time
TPS (rise)
VPS : GND → VCC
VPS : VCC → GND
µs
Response Time
TPS (fall)
1.5
µs
Notes1. fRFout < fLOin @ fRFout = 0.9 GHz
2. fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz
7
Data Sheet PU10407EJ02V0DS
µPC8172TK
10. TEST CIRCUIT
10.1 TEST CIRCUIT 1 (fRFout = 0.9 GHz)
Strip Line : 8 mm
Spectrum Analyzer
50 Ω
Signal Generator
100 pF
100 pF
1 pF
1
2
3
6
5
4
IFin
RFout
50 Ω
10 nH
GND
LOin
V
CC
Signal Generator
100 pF
1 000 pF
PS
50 Ω
1 000 pF
VCC
1 F
µ
µ
1 F
68 pF
8
Data Sheet PU10407EJ02V0DS
µPC8172TK
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
L
1
C
8
C
3
µ
PC8172TK
C
1
IF input
RF output
C
5
C
7
C
6
GND
C
2
C
4
PS
LO input
C
9
V
CC
COMPONENT LIST
Form
Symbol
Value
100 pF
1 000 pF
1 µF
Type code
Maker
(∗1) 35 × 42 × 0.4 mm polyimide board,
double-sided copper clad
Chip capacitor
C1, C2 ,C3
GRM39CH101J50PT
GRM39B102K50PT
murata
murata
murata
murata
murata
murata
(∗2) Ground pattern on rear of the board
(∗3) Solder plated patterns
C4
C5 ,C6
C7
GRM39F105Z10PT
(∗4)
: Through holes
68 pF
GRM39CH680J50PT
GRM39CH010C50PT
DFT301-801 × 7R102S50
C8
1 pF
Feed-through
Capacitor
C9
1 000 pF
Chip inductor
L1
10 nH
LL1608-F10N
TOKO
9
Data Sheet PU10407EJ02V0DS
µPC8172TK
10.2 TEST CIRCUIT 2 (fRFout = 1.9 GHz)
Strip Line : 12 mm
Strip Line : 5 mm
Spectrum Analyzer
50 Ω
Signal Generator
100 pF
100 pF
1
2
3
6
5
4
IFin
RFout
50 Ω
3 pF
100 nH
GND
LOin
V
CC
Signal Generator
100 pF
1 000 pF
PS
50 Ω
1 000 pF
VCC
1 000 pF 30 pF 1 000 pF
10
Data Sheet PU10407EJ02V0DS
µPC8172TK
EXAMPLE OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
L1
C
8
C
3
µ
PC8172TK
C
1
IF input
RF output
C
C
C
5
7
6
GND
C
2
C
4
PS
LO input
C
9
V
CC
COMPONENT LIST
Form
Symbol
Value
100 pF
1 000 pF
30 pF
Type code
Maker
(∗1) 35 × 42 × 0.4 mm polyimide board,
double-sided copper clad
Chip capacitor
C1, C2 ,C3
GRM39CH101J50PT
GRM39B102K50PT
murata
murata
murata
murata
murata
(∗2) Ground pattern on rear of the board
(∗3) Solder plated patterns
C4, C5, C6
C7
C8
C9
GRM39CH300J50PT
GRM39CH030C50PT
DFT301-801 × 7R102S50
(∗4)
: Through holes
3 pF
Feed-through
Capacitor
1 000 pF
Chip inductor
L1
100 nH
LL1608-FR10
TOKO
11
Data Sheet PU10407EJ02V0DS
µPC8172TK
10.3 TEST CIRCUIT 3 (fRFout = 2.4 GHz)
Strip Line : 8 mm
Strip Line : 7 mm
Spectrum Analyzer
Signal Generator
100 pF
100 pF
2 pF
1
2
3
6
5
4
IFin
RFout
50 Ω
50 Ω
470 nH
GND
LOin
V
CC
Signal Generator
100 pF
1 000 pF
PS
50 Ω
1 000 pF
VCC
1 000 pF 10 pF 1 000 pF
12
Data Sheet PU10407EJ02V0DS
µPC8172TK
EXAMPLE OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD
L1
C8
C3
µ
PC8172TK
C
1
IF input
RF output
C5
C7
C6
GND
C
2
C4
PS
LO input
C
9
VCC
COMPONENT LIST
Form
Symbol
Value
100 pF
1 000 pF
10 pF
Type code
Maker
(∗1) 35 × 42 × 0.4 mm polyimide board,
double-sided copper clad
Chip capacitor
C1, C2 ,C3
GRM39CH101J50PT
GRM39B102K50PT
murata
murata
murata
murata
murata
(∗2) Ground pattern on rear of the board
(∗3) Solder plated patterns
C4, C5, C6
C7
C8
C9
GRM39CH100D50PT
GRM39CH020C50PT
DFT301-801 × 7R102S50
(∗4)
: Through holes
2 pF
Feed-through
Capacitor
1 000 pF
Chip inductor
L1
470 nH
LL2012-FR47
TOKO
13
Data Sheet PU10407EJ02V0DS
µPC8172TK
11. TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
CIRCUIT CURRENT vs.
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
OPERATING AMBIENT TEMPERATURE
12
12
11
10
9
V
CC = 3.3 V
10
8
3.0 V
T
A
= +85°C
+25°C
6
4
2
0
2.7 V
–40°C
8
7
6
0
0.5
1
1.5
2
2.5
3
3.5
4
–60 –40 –20
0
20
40
60
80 100
Supply Voltage VCC (V)
Operating Ambient Temperature T
A
(°C)
CIRCUIT CURRENT vs.
PS PIN INPUT VOLTAGE
12
10
8
VCC = 3.0 V, no signal
6
4
2
0
0
1
2
3
4
PS Pin Input Voltage VPS (V)
Remark The graphs indicate nominal characteristics.
14
Data Sheet PU10407EJ02V0DS
µPC8172TK
11.1 fRFout = 900 MHz MATCHING
RF OUTPUT LEVEL vs. IF INPUT LEVEL
CONVERSION GAIN vs. LOCAL INPUT LEVEL
10
15
VCC = 3.3 V
VCC = 3.3 V
3.0 V
3.0 V
5
0
10
5
2.7 V
2.7 V
–5
0
–10
–15
–20
–25
–5
fRFout = 900 MHz
fRFout = 900 MHz
fIFin = 240 MHz
fLOin = 1 140 MHz
PLOin = –5 dBm
fIFin = 240 MHz
fLOin = 1 140 MHz
PIFin = –30 dBm
–10
–15
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
Local Input Level PLOin (dBm)
IF Input Level PIFin (dBm)
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
10
15
TA = –40°C
+25°C
5
0
10
TA = –40°C
+25°C
+85°C
5
+85°C
–5
0
–10
–15
–20
–25
–5
–10
–15
VCC = 3.0 V
VCC = 3.0 V
fRFout = 900 MHz
fIFin = 240 MHz
fLOin = 1 140 MHz
PIFin = –30 dBm
fRFout = 900 MHz
fIFin = 240 MHz
fLOin = 1 140 MHz
PLOin = –5 dBm
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
Local Input Level PLOin (dBm)
IF Input Level PIFin (dBm)
PS PIN CONTROL RESPONSE TIME
REF LVL = 0 dBm
VCC = 3.0 V
10 dB/DIV (vertical axis) fRFout = 0.9 GHz
ATT = 10 dB
fIFin = 240 MHz
CENTER = 0.9 GHz
SPAN = 0 Hz
PIFin = –30 dBm
fLOin = 1 140 MHz
PLOin = –5 dBm
RBW = 2 MHz
VBW = 3 MHz
µ
∆MKR –20.0 dBm,14.7
s
µ
SWP = 50 sec
5
µ
sec/DIN (horizontal axis)
Response Time ( s)
µ
Remark The graphs indicate nominal characteristics.
15
Data Sheet PU10407EJ02V0DS
µPC8172TK
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
out (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
f
f
f
f
A
= –40°C
V
CC = 2.7 V
CC = 3.0 V
f
f
f
f
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
out (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
f
f
f
f
A
= +25°C
CC = 3.0 V
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
V
CC = 3.0 V
f
f
f
f
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
out (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
A
= +85°C
CC = 3.0 V
V
CC = 3.3 V
f
f
f
f
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
f
f
f
f
RFout = 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 140 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
Remark The graphs indicate nominal characteristics.
16
Data Sheet PU10407EJ02V0DS
µPC8172TK
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT LEVEL
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT LEVEL
–10
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
–90
V
CC = 2.7 V
3.0 V
3.3 V
V
CC = 3.3 V
f
f
f
RFout = 900 MHz
IFin = 240 MHz
LOin = 1 140 MHz
f
f
RFout = 900 MHz
LOin = 1 140 MHz
3.0 V
2.7 V
RFout = 50 Ω terminate
P
IFin = –30 dBm
–50
–40
–30
–20
–10
0
–40
–30
–20 –10 0
Local Input Level PLOin (dBm)
Local Input Level PLOin (dBm)
IF LEAKAGE AT RF PIN
vs. IF INPUT POWER
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
–20
–30
–40
–50
–60
–70
–80
–10
–15
–20
–25
–30
–35
–40
–45
V
CC = 3.3 V
3.0 V
f
f
f
RFout = 900 MHz
IFin = 240 MHz
LOin = 1 140 MHz
V
f
P
CC = 3.0 V
RFout = 900 MHz
LOin = –5 dBm
2.7 V
P
LOin = –5 dBm
RFport = 50 Ω terminate
–40
–30
–20
–10
0
0
500 1 000 1 500 2 000 2 500 3 000
IF Input Power PIFin (dBm)
Local Input Frequency fLOin (MHz)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
IF LEAKAGE AT RF PIN
vs. IF INPUT FREQUENCY
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–45
–50
–55
–60
–65
–70
–75
–80
–85
V
f
P
f
CC = 3.0 V
RFout = 900 MHz
IFin = –30 dBm
LOin = 1 140 MHz
V
f
P
CC = 3.0 V
RFout = 900 MHz
LOin = –5 dBm
PLOin = –5 dBm
IFport = 50 Ω terminate
0
500 1 000 1 500 2 000 2 500 3 000
0
100
200
300
400 500
Local Input Frequency fLOin (MHz)
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
17
Data Sheet PU10407EJ02V0DS
µPC8172TK
CONVERSION GAIN vs.
LOCAL INPUT FREQUENCY
SSB NOISE FIGURE vs. SUPPLY VOLTAGE
11.5
13
12
11
10
9
11.0
10.5
10.0
9.5
VCC = 3.3 V
3.0 V
2.7 V
8
f
f
P
RFout = 900 MHz
IFin = 240 MHz
IFin = –30 dBm
LOin = –5 dBm
7
f
f
P
RFout = 900 MHz
LOin = 1 140 MHz
LOin = –5 dBm
9.0
6
P
8.5
5
2.4
2.6
2.8
3.0
3.2
3.4
3.6
1 050
1 100
1 150
1 200
1 250
Supply Voltage VCC (V)
Local Input Frequency fLOin (MHz)
CONVERSION GAIN vs.
IF INPUT FREQUENCY
12
11
10
9
V
CC = 3.3 V
3.0 V
2.7 V
fRFout = 900 MHz
P
P
IFin = –30 dBm
LOin = –5 dBm
8
0
100 200 300 400 500 600 700
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
18
Data Sheet PU10407EJ02V0DS
µPC8172TK
11.2 fRFout = 1 900 MHz MATCHING
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
15
10
V
CC = 3.3 V
5
10
3.0 V
V
CC = 3.3 V
0
5
0
3.0 V
2.7 V
2.7 V
–5
–10
–15
–20
–25
–5
f
f
f
RFout = 1 900 MHz
IFin = 240 MHz
LOin = 1 660 MHz
LOin = –5 dBm
f
f
f
RFout = 1 900 MHz
IFin = 240 MHz
LOin = 1 660 MHz
IFin = –30 dBm
–10
P
P
–15
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
Local Input Level PLOin (dBm)
IF Input Level PIFin (dBm)
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
15
10
TA
= –40°C
+25°C
5
0
10
5
TA
= –40°C
+25°C
+85°C
+85°C
–5
0
–10
–15
–20
–25
–5
–10
–15
V
CC = 3.0 V
V
CC = 3.0 V
fRFout = 1 900 MHz
fIFin = 240 MHz
fLOin = 1 660 MHz
fRFout = 1 900 MHz
fIFin = 240 MHz
fLOin = 1 660 MHz
PIFin = –30 dBm
PLOin = –5 dBm
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
IF Input Level PIFin (dBm)
Local Input Level PLOin (dBm)
PS PIN CONTROL RESPONSE TIME
REF LVL = 0 dBm
VCC = 3.0 V
10 dB/DIV (vertical axis) fRFout = 1.9 GHz
ATT = 10 dB
f
IFin = 240 MHz
IFin = –30 dBm
LOin = 1 660 MHz
PLOin = –5 dBm
CENTER = 1.9 GHz
SPAN = 0 Hz
P
f
RBW = 2 MHz
VBW = 3 MHz
µ
∆MKR –21.0 dBm,17.9
s
µ
SWP = 50 sec
5
µ
sec/DIN (horizontal axis)
Response Time ( s)
µ
Remark The graphs indicate nominal characteristics.
19
Data Sheet PU10407EJ02V0DS
µPC8172TK
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM vs. IF INPUT LEVEL
3
10
10
0
0
–10
–10
P
P
out (des)
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
Pout (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
A
= –40°C
V
CC = 2.7 V
VCC = 3.0 V
f
f
f
f
RFout = 1 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 660 MHz
fRFout = 1 900 MHz
fIFin1 = 240 MHz
fIFin2 = 241 MHz
fLOin = 1 660 MHz
P
LOin = –5 dBm
PLOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–20
–10
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
out (des)
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
Pout (undes)
Pout (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
A
= +25°C
V
CC = 3.0 V
CC = 3.0 V
f
f
f
f
RFout = 1 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 660 MHz
f
f
f
f
RFout = 1 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 660 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
Pout (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
A
= +85°C
V
CC = 3.3 V
VCC = 3.0 V
f
f
f
f
RFout = 1 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 660 MHz
f
f
f
f
RFout = 1 900 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
LOin = 1 660 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–20
–10
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
Remark The graphs indicate nominal characteristics.
20
Data Sheet PU10407EJ02V0DS
µPC8172TK
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT LEVEL
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT LEVEL
–10
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
–90
V
CC = 2.7 V
3.0 V
3.3 V
V
CC = 3.3 V
f
f
f
RFout = 1 900 MHz
IFin = 240 MHz
LOin = 1 660 MHz
IFin = –30 dBm
f
f
RFout = 1 900 MHz
Loin = 1 660 MHz
3.0 V
2.7 V
RFout = 50 Ω terminate
–20 –10 0
P
–50
–40
–30
–20
–10
0
–40
–30
Local Input Level PLOin (dBm)
Local Input Level PLOin (dBm)
IF LEAKAGE AT RF PIN
vs. IF INPUT POWER
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
0
–10
–20
–30
–40
–50
–60
–70
–10
–15
–20
–25
–30
–35
–40
–45
V
CC = 3.0 V
V
CC = 3.3 V
fRFout = 1 900 MHz
3.0 V
PLOin = –5 dBm
RFport = 50 Ω terminate
2.7 V
f
f
f
RFout = 1 900 MHz
IFin = 240 MHz
LOin = 1 660 MHz
PLOin = –5 dBm
–50
–40
–30
–20
–10
0
0
500 1 000 1 500 2 000 2 500 3 000
Local Input Frequency fLOin (MHz)
IF Input Power PIFin (dBm)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
IF LEAKAGE AT RF PIN
vs. IF INPUT FREQUENCY
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–25
–30
–35
–40
–45
V
f
P
f
CC = 3.0 V
RFout = 1 900 MHz
IFin = –30 dBm
LOin = 1 660 MHz
LOin = –5 dBm
V
f
P
CC = 3.0 V
RFout = 1 900 MHz
LOin = –5 dBm
IFport = 50 Ω terminate
P
0
500 1 000 1 500 2 000 2 500 3 000
Local Input Frequency fLOin (MHz)
0
100
200
300
400
500
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
21
Data Sheet PU10407EJ02V0DS
µPC8172TK
CONVERSION GAIN vs.
LOCAL INPUT FREQUENCY
SSB NOISE FIGURE vs. SUPPLY VOLTAGE
11.5
12
11
10
9
f
f
P
P
RFout = 1 900 MHz
IFin = 240 MHz
IFin = –30 dBm
LOin = –5 dBm
11.0
10.5
10.0
9.5
VCC = 3.3 V
3.0 V
2.7 V
8
f
f
RFout = 1 900 MHz
IFin = 240 MHz
7
P
f
P
IFin = –20 dBm
LOin = 1 660 MHz
LOin = –5 dBm
9.0
8.5
6
5
2.4
2.6
2.8
3.0
3.2
3.4
3.6
1 550
1 600
1 650
1 700
1 800
1 750
Supply Voltage VCC (V)
Local Input Frequency fLOin (MHz)
CONVERSION GAIN vs. IF INPUT
FREQUENCY (fLOin < fRFout
CONVERSION GAIN vs. IF INPUT
FREQUENCY (fLOin > fRFout
)
)
11
10
9
11
10
9
V
CC = 3.3 V
V
CC = 3.3 V
3.0 V
3.0 V
2.7 V
2.7 V
8
8
fRFout = 1 900 MHz
fRFout = 1 900 MHz
P
P
IFin = –30 dBm
LOin = –5 dBm
P
P
IFin = –30 dBm
LOin = –5 dBm
7
7
0
100 200 300 400 500 600 700
0
100 200 300 400 500 600 700
IF Input Frequency fIFin (MHz)
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
22
Data Sheet PU10407EJ02V0DS
µPC8172TK
11.3 fRFout = 1 950 MHz MATCHING
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
15
5
V
CC = 3.3 V
3.0 V
V
CC = 3.3 V
3.0 V
10
5
0
2.7 V
–5
2.7 V
0
–10
–15
–20
–25
–5
–10
–15
f
f
f
RFout = 1 950 MHz
IFin = 570 MHz
LOin = 2 520 MHz
IFin = –30 dBm
f
f
f
RFout = 1 950 MHz
IFin = 570 MHz
LOin = 2 520 MHz
P
P
LOin = –5 dBm
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
Local Input Level PLOin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
1 948 MHz
1 951 MHz
1 949 MHz
1 950 MHz
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
1 949 MHz
1 950 MHz
1 951 MHz
1 948 MHz
V
CC = 2.7 V
VCC = 3.0 V
f
f
f
f
RFout = 1 950 MHz
IFin1 = 570 MHz
IFin2 = 571 MHz
LOin = 2 520 MHz
f
f
f
f
RFout = 1 950 MHz
IFin1 = 570 MHz
IFin2 = 571 MHz
LOin = 2 520 MHz
P
–10
LOin = –5 dBm
PLOin = –5 dBm
–30
–25
–20
–15
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
10
0
V
CC = 2.7 V
3.0 V
–10
1 948 MHz
1 951 MHz
–20
–30
–40
–50
–60
–70
–80
1 949 MHz
1 950 MHz
3.3 V
V
CC = 3.3 V
f
f
f
f
RFout = 1 950 MHz
IFin1 = 570 MHz
IFin2 = 571 MHz
LOin = 2 520 MHz
f
LOin = 2 520 MHz
P
LOin = –5 dBm
–40 –35 –30 –25 –20 –15 –10 –5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
Local Input Level PLOin (dBm)
Remark The graphs indicate nominal characteristics.
23
Data Sheet PU10407EJ02V0DS
µPC8172TK
IF LEAKAGE AT RF PIN
vs. IF INPUT POWER
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT LEVEL
–10
–20
–30
–40
–50
–60
–30
–35
–40
–45
–50
–55
–60
–65
–70
VCC = 3.3 V
3.0 V
VCC = 3.3 V
3.0 V
2.7 V
2.7 V
fIFin = 570 MHz
fLOin = 2 520 MHz
PLOin = –5 dBm
fIFin = 570 MHz
fLOin = 2 520 MHz
PIF = –30 dBm
–70
–
50
–45
–40
–35
–30
–25
–20
–15
–10
–5
0
–40 –35 –30 –25 –20 –15 –10 –5
0
IF Input Power PIFin (dBm)
Local Input Level PLOin (dBm)
CONVERSION GAIN vs.
SSB NOISE FIGURE vs. SUPPLY VOLTAGE
LOCAL INPUT FREQUENCY
10.0
10
fIFin = 570 MHz
PIFin = –30 dBm
PLOin = –5 dBm
VCC = 3.3 V
3.0 V
9.5
9.0
8.5
8.0
8
6
4
2
2.7 V
fRFout = 1 950 MHz
fLOin = 2 520 MHz
PLOin = –5 dBm
7.5
0
7.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
2 000
2 200
2 400
2 600
2 800
3 000
Supply Voltage VCC (V)
Local Input Frequency fLOin (MHz)
CONVERSION GAIN vs.
IF INPUT FREQUENCY
CONVERSION GAIN vs.
IF INPUT FREQUENCY
12
11
10
9
10
8
fRFout = 1 950 MHz
PIFin = –30 dBm
PLOin = –5 dBm
VCC = 3.3 V
3.0 V
2.7 V
6
8
4
VCC = 3.3 V
3.0 V
7
2
2.7 V
fLOin = 2 520 MHz
PIFin = –30 dBm
PLOin = –5 dBm
6
0
5
0
100 200 300 400 500 600 700
IF Input Frequency fIFin (MHz)
300
400
500
600
700
800
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
24
Data Sheet PU10407EJ02V0DS
µPC8172TK
11.4 fRFout = 2 400 MHz MATCHING
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
15
10
VCC = 3.3 V
VCC = 3.3 V
3.0 V
5
0
10
5
3.0 V
2.7 V
2.7 V
–5
0
–10
–15
–20
–25
–5
fRFout = 2 400 MHz
fRFout = 2 400 MHz
fIFin = 240 MHz
fLOin = 2 160 MHz
PLOin = –5 dBm
fIFin = 240 MHz
fLOin = 2 160 MHz
PIFin = –30 dBm
–10
–15
–30 –25 –20 –15 –10 –5
0
5
10
–30 –25 –20 –15 –10 –5
0
5
10
Local Input Level PLOin (dBm)
IF Input Level PIFin (dBm)
CONVERSION GAIN vs. LOCAL INPUT LEVEL
RF OUTPUT LEVEL vs. IF INPUT LEVEL
15
10
TA = –40°C
+25°C
5
0
10
TA = –40°C
+25°C
5
+85°C
–5
+85°C
0
–10
–15
–20
–25
–5
VCC = 3.0 V
VCC = 3.0 V
fRFout = 2 400 MHz
fIFin = 240 MHz
fLOin = 2 160 MHz
fRFout = 2 400 MHz
fIFin = 240 MHz
fLOin = 2 160 MHz
PLOin = –5 dBm
–10
PIFin = –30 dBm
–30 –25 –20 –15 –10 –5
Local Input Level PLOin (dBm)
–15
–30 –25 –20 –15 –10 –5
0
5
10
0
5
10
IF Input Level PIFin (dBm)
PS PIN CONTROL RESPONSE TIME
REF LVL = 0 dBm
VCC = 3.0 V
10 dB/DIV (vertical axis) fRFout = 2.4 GHz
ATT = 10 dB
fIFin = 240 MHz
CENTER = 2.4 GHz
SPAN = 0 Hz
PIFin = –30 dBm
fLOin = 2 160 MHz
PLOin = –5 dBm
RBW = 2 MHz
VBW = 3 MHz
µ
∆MKR –21.5 dBm,13.8
s
µ
SWP = 50 sec
sec/DIN (horizontal axis)
5
µ
Response Time ( s)
µ
Remark The graphs indicate nominal characteristics.
25
Data Sheet PU10407EJ02V0DS
µPC8172TK
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM vs. IF INPUT LEVEL
3
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
IM3 (des)
out (undes)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
A
= –40°C
V
CC = 2.7 V
CC = 3.0 V
f
f
f
f
RFout = 2 400 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
Loin = 2 160 MHz
fRFout = 2 400 MHz
fIFin1 = 240 MHz
fIFin2 = 241 MHz
fLoin = 2 160 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
out (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
f
f
f
f
A
= +25°C
CC = 3.0 V
RFout = 2 400 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
Loin = 2 160 MHz
V
CC = 3.0 V
f
f
f
f
RFout = 2 400 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
Loin = 2 160 MHz
P
LOin = –5 dBm
P
LOin = –5 dBm
–30
–25
–20
–15
–10
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
RF OUTPUT LEVEL, IM
3
vs. IF INPUT LEVEL
10
10
0
0
–10
–10
P
P
out (des)
P
P
out (des)
–20
–30
–40
–50
–60
–70
–80
–20
–30
–40
–50
–60
–70
–80
out (undes)
out (undes)
IM3 (des)
IM3 (des)
IM3 (undes)
IM3 (undes)
T
V
f
f
f
f
A
= +85°C
CC = 3.0 V
RFout = 2 400 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
Loin = 2 160 MHz
V
CC = 3.3 V
f
f
f
f
RFout = 2 400 MHz
IFin1 = 240 MHz
IFin2 = 241 MHz
Loin = 2 160 MHz
P
LOin = –5 dBm
P
–10
LOin = –5 dBm
–30
–25
–20
–15
–5
0
–30
–25
–20
–15
–10
–5
0
IF Input Level PIFin (dBm)
IF Input Level PIFin (dBm)
Remark The graphs indicate nominal characteristics.
26
Data Sheet PU10407EJ02V0DS
µPC8172TK
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT LEVEL
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT LEVEL
–20
–30
–40
–50
–60
–70
–80
–90
–10
–20
–30
–40
–50
–60
–70
–80
V
CC = 2.7 V
3.0 V
3.3 V
V
CC = 3.3 V
f
f
f
RFout = 2 400 MHz
IFin = 240 MHz
LOin = 2 160 MHz
IFin = –30 dBm
f
f
RFout = 2 400 MHz
LOin = 2 160 MHz
3.0 V
2.7 V
P
RFout = 50 Ω terminate
–20 –10
–40
–30
0
–50
–40
–30
–20
–10
0
Local Input Level PLOin (dBm)
Local Input Level PLOin (dBm)
IF LEAKAGE AT RF PIN
vs. IF INPUT POWER
LOCAL LEAKAGE AT IF PIN
vs. LOCAL INPUT FREQUENCY
–10
–15
–20
–25
–30
–35
–40
–45
0
–10
–20
–30
–40
–50
–60
–70
V
CC = 3.0 V
V
CC = 3.3 V
fRFout = 2 400 MHz
2.7 V
PLOin = –5 dBm
RFport = 50Ω terminate
3.0 V
f
f
f
RFout = 2 400 MHz
IFin = 240 MHz
LOin = 2 160 MHz
P
LOin = –5 dBm
0
500 1 000 1 500 2 000 2 500 3 000
Local Input Frequency fLOin (MHz)
–50
–40
–30
–20
–10
0
IF Input Power PIFin (dBm)
LOCAL LEAKAGE AT RF PIN
vs. LOCAL INPUT FREQUENCY
IF LEAKAGE AT RF PIN
vs. IF INPUT FREQUENCY
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–25
–30
–35
–40
–45
V
f
P
f
CC = 3.0 V
RFout = 2 400 MHz
IFin = –30 dBm
LOin = 2 160 MHz
LOin = –5 dBm
V
CC = 3.0 V
f
P
RFout = 2 400 MHz
LOin = –5 dBm
IFport = 50 Ω terminate
P
0
500 1 000 1 500 2 000 2 500 3 000
Local Input Frequency fLOin (MHz)
0
100
200
300
400
500
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
27
Data Sheet PU10407EJ02V0DS
µPC8172TK
CONVERSION GAIN vs.
LOCAL INPUT FREQUENCY
SSB NOISE FIGURE vs. SUPPLY VOLTAGE
12.5
12
11
10
9
f
f
P
P
RFout = 2 400 MHz
IFin = 240 MHz
IFin = –30 dBm
LOin = –5 dBm
12.0
11.5
11.0
10.5
8
V
CC = 3.3 V
3.0 V
2.7 V
7
10.0
f
f
RFout = 2 400 MHz
LOin = 2 160 MHz
6
P
LOin = –5 dBm
9.5
5
2.4
2.6
2.8
3.0
3.2
3.4
3.6
2 050
2 100
2 150
2 200
2 250
Supply Voltage VCC (V)
Local Input Frequency fLOin (MHz)
CONVERSION GAIN vs.
IF INPUT FREQUENCY
11
10
9
f
P
P
RFout = 2 400 MHz
IFin = –30 dBm
LOin = –5 dBm
VCC = 3.3 V
3.0 V
8
2.7 V
7
0
100 200 300 400 500 600 700
IF Input Frequency fIFin (MHz)
Remark The graphs indicate nominal characteristics.
28
Data Sheet PU10407EJ02V0DS
µPC8172TK
12. S-PARAMETERS
RF port Inpedance (at L loaded)
LO port Inpedance (at L loaded)
CH1 B22 1 U FB B : 22.96 Ω –107.45 Ω 617.19 fF
CH1 B11 1 U FB B : 17.816 Ω –49.146 Ω 1.3493 pF
2 400.000 000 MHz
2 400.000 000 MHz
1: 63.672 Ω
–275.47 Ω
900 MHz
1: 45.734 Ω
–136.26 Ω
900 MHz
2: 28.953 Ω
–141.21 Ω
1.90 Hz
2: 22.445 Ω
–85.655 Ω
1.90 Hz
MARKER 3
2.4 GHz
MARKER 3
2.4 GHz
1
3
1
3
2
2
START 100.000 000 MHz
STOP 3 100.000 000 MHz
START 100.000 000 MHz
STOP 3 100.000 000 MHz
IF port Inpedance (at L loaded)
CH1 B11 1 U FB B : 25.383 Ω –96.613 Ω 672.47 fF
2 400.000 000 MHz
1: 66.539 Ω
–236.11 Ω
900 MHz
2: 34.626 Ω
–121.79 Ω
1.90 Hz
MARKER 3
2.4 GHz
1
3
2
START 100.000 000 MHz
STOP 3 100.000 000 MHz
29
Data Sheet PU10407EJ02V0DS
µPC8172TK
13. PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
(Top View)
(Bottom View)
1.1 0.1
0.2 0.1
0.9 0.1
1.3 0.05
Remark ( ) : Reference value
30
Data Sheet PU10407EJ02V0DS
µPC8172TK
14. NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Connect a bypass capacitor (example : 1 000 pF) to the VCC pin.
(4) Connect a matching circuit to the RF output pin.
(5) The DC cut capacitor must be attached to input and output pin.
15. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
WS260
HS350
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Caution Do not use different soldering methods together (except for partial heating).
31
Data Sheet PU10407EJ02V0DS
µPC8172TK
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
•
The information in this document is current as of December, 2004. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
•
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4-0110
32
Data Sheet PU10407EJ02V0DS
µPC8172TK
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
TEL: +852-3107-7303
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
TEL: +82-2-558-2120
FAX: +82-2-558-5209
FAX: +852-3107-7309
Hong Kong Head Office
Taipei Branch Office
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
TEL: +1-408-988-3500 FAX: +1-408-988-0279
http://www.cel.com/
0406
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