UPD70F3040YGM-UEU-A [RENESAS]

IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,176PIN,PLASTIC;
UPD70F3040YGM-UEU-A
型号: UPD70F3040YGM-UEU-A
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

IC,MICROCONTROLLER,32-BIT,V850 CPU,CMOS,QFP,176PIN,PLASTIC

微控制器
文件: 总52页 (文件大小:1225K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATASHEET
MOS INTEGRATED CIRCUIT  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
V850/SV1TM  
32-BIT SINGLE-CHIP MICROCONTROLLERS  
DESCRIPTION  
The µPD70F3038, µPD70F3038Y, µPD70F3040, and µPD70F3040Y are products that substitute flash memory  
for the mask ROM of the µPD703038, µPD703038Y, µPD703039, 703040, and 703041, and µPD703039Y, 703040Y,  
and 703041Y, respectively. Since the µPD70F3038, µPD70F3038Y, µPD70F3040, and µPD70F3040Y can be read  
and written while mounted on the board, these products are ideal for evaluation during system development, multiple-  
version small-scale production or quick product release.  
Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before  
designing.  
V850/SV1 User’s Manual Hardware:  
U14462E  
V850 FamilyTM User’s Manual Architecture: U10243E  
FEATURES  
Pin compatible with µPD703038, 703039, 703040, 703041, 703038Y, 703039Y, 703040Y, and 703041Y  
{
For mass production, these can be replaced by a mask ROM version.  
µPD70F3038F1-EN2µPD703038F1-×××-EN2  
µPD70F3038YF1-EN2µPD703038YF1-×××-EN2  
µPD70F3040GM-UEUµPD703039GM-×××-UEU, 703040GM-×××-UEU, 703041GM-×××-UEU  
µPD70F3040F1-EN2µPD703039F1-×××-EN2, 703040F1-×××-EN2  
µPD70F3040YGM-UEUµPD703039YGM-×××-UEU, 703040YGM-×××-UEU, 703041YGM-×××-UEU  
µPD70F3040YF1-EN2µPD703039YF1-×××-EN2, 703040YF1-×××-EN2  
APPLICATIONS  
{
Camcorders (including DVC)  
ORDERING INFORMATION  
Part Number  
Package  
µPD70F3038F1-EN2  
µPD70F3038YF1-EN2  
µPD70F3040GM-UEU  
µPD70F3040F1-EN2  
µPD70F3040YGM-UEU  
µPD70F3040YF1-EN2  
180-pin plastic FBGA (13 × 13)  
180-pin plastic FBGA (13 × 13)  
176-pin plastic LQFP (fine pitch) (24 × 24)  
180-pin plastic FBGA (13 × 13)  
176-pin plastic LQFP (fine pitch) (24 × 24)  
180-pin plastic FBGA (13 × 13)  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. U14622EJ2V0DS00 (2nd edition)  
Date Published July 2001 N CP(K)  
Printed in Japan  
2000  
©
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
DIFFERENCES BETWEEN V850/SV1 PRODUCTS  
Internal ROM  
Internal RAM  
I2C  
VPP Pin  
Provided  
µPD70F3038  
µPD70F3038Y  
µPD70F3040  
µPD70F3040Y  
µPD703038  
384 KB (flash memory)  
16 KB  
16 KB  
16 KB  
8 KB  
None  
Provided  
None  
256 KB (flash memory)  
384 KB (mask ROM)  
256 KB (mask ROM)  
Provided  
None  
None  
µPD703038Y  
µPD703039  
Provided  
None  
µPD703039Y  
µPD703040  
Provided  
None  
16 KB  
8 KB  
µPD703040Y  
µPD703041  
Provided  
None  
192 KB (mask ROM)  
µPD703041Y  
Provided  
2
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
PIN CONFIGURATION  
176-pin plastic LQFP (fine pitch) (24 × 24)  
µPD70F3040GM-UEU  
µPD70F3040YGM-UEU  
P12/SCK0/SCL0Note 2  
P13/SI1/RXD0  
P14/SO1/TXD0  
P15/SCK1/ASCK0  
P20/SI2/SDA1Note 2  
P21/SO2  
1
132  
131  
130  
129  
128  
127  
126  
125  
124  
123  
122  
121  
120  
119  
118  
117  
116  
115  
114  
113  
112  
111  
110  
109  
108  
107  
106  
105  
104  
103  
102  
101  
100  
99  
P87/ANI15  
2
P86/ANI14  
3
P85/ANI13  
4
P84/ANI12  
5
P83/ANI11  
6
P82/ANI10  
P22/SCK2/SCL1Note 2  
P23/SI3/RXD1  
P24/SO3/TXD1  
P25/SCK3/ASCK1  
P26/TI2/TO2  
7
P81/ANI9  
8
P80/ANI8  
9
P77/ANI7  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
P76/ANI6  
P75/ANI5  
P27/TI3/TO3  
P74/ANI4  
V
DD  
SS  
P73/ANI3  
V
P72/ANI2  
P30/TI000  
P31/TI001  
P32/TI010  
P33/TI011  
P34/TO0  
P35/TO1  
P36/TI4/TO4  
P37/TI5/TO5  
P120/SI4  
P121/SO4  
P122/SCK4  
P123/CLO  
P124/TI6/TO6  
P125/TI7/TO7  
P126/TI10/TO10  
P127/TI11/TO11  
P180  
P71/ANI1  
P70/ANI0  
P147  
P146  
P145/RTPTRG1  
P144/TI9/INTTI9  
P143/INTCP93  
P142/INTCP92  
P141/INTCP91  
P140/INTCP90  
P137/TO81  
P136/TO80  
P135/TCLR8/INTTCLR8  
P134/TI8/INTTI8  
P133/INTCP83  
P132/INTCP82  
P131/INTCP81  
P130/INTCP80  
P181  
P182  
V
V
SS  
DD  
P183  
P184  
98  
P07/INTP6  
P185  
97  
P06/INTP5/RTPTRG0  
P05/INTP4/ADTRG  
P04/INTP3  
P186  
96  
P187  
95  
V
DD  
94  
P03/INTP2  
V
SS  
93  
P02/INTP1  
P190  
P191  
P192  
P193  
92  
P01/INTP0  
91  
P00/NMI  
90  
P157/RTP17  
P156/RTP16  
89  
Notes 1. Connect to VSS in the normal operation mode.  
2. SCL0, SCL1, SDA0, and SDA1 are valid only for the µPD70F3040Y.  
3
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
180-pin plastic FBGA (13 × 13)  
µ PD70F3038F1-EN2  
µ PD70F3038YF1-EN2  
µ PD70F3040F1-EN2  
µ PD70F3040YF1-EN2  
Top View  
Bottom View  
15  
14  
13  
12  
11  
10  
9
8
7
6
5
4
3
2
1
A B C D E F G H J K L M N P R  
R P N M L K J H G F E D C B A  
Pin  
Name  
Pin  
Name  
Pin  
Name  
Pin  
Name  
Number  
Number  
Number  
Number  
A1  
A2  
NCNote 1  
B1  
B2  
P13/SI1/RXD0  
P12/SCK0/SCL0Note  
2
C1  
C2  
P15/SCK1/ASCK0  
P20/SI2/SDA1Note 2  
D1  
D2  
P23/SI3/RXD1  
P21/SO2  
P11/SO0  
A3  
A4  
P10/SI0/SDA0Note 2  
P112  
B3  
B4  
P113  
C3  
C4  
P14/SO1/TXD0  
P111  
D3  
D4  
P22/SCK2/SCL1 Note 2  
P24/SO3/TXD1  
WAIT  
P110  
A5  
CLKOUT  
P62/A18  
P57/AD15  
P53/AD11  
BVSS  
B5  
P64/A20  
P60/A16  
P54/AD12  
P50/AD8  
P46/AD6  
P42/AD2  
P94/ASTB  
P91/UBEN  
AVDD  
C5  
P65/A21  
D5  
A6  
B6  
C6  
P63/A19  
D6  
P61/A17  
A7  
B7  
C7  
P56/AD14  
P52/AD10  
BVDD  
D7  
P55/AD13  
A8  
B8  
C8  
D8  
P51/AD9  
A9  
B9  
C9  
D9  
P47/AD7  
A10  
A11  
A12  
A13  
A14  
A15  
P45/AD5  
P41/AD1  
VSS  
B10  
B11  
B12  
B13  
B14  
B15  
C10  
C11  
C12  
C13  
C14  
C15  
P44/AD4  
P40/AD0  
P93/DSTB/RD  
P82/ANI10  
P86/ANI14  
P85/ANI13  
D10  
D11  
D12  
D13  
D14  
D15  
P43/AD3  
P96/HLDRQ  
P90/LBEN/WRL  
P81/ANI9  
AVSS  
AVREF  
NCNote 1  
VDD  
P84/ANI12  
P83/ANI11  
P87/ANI15  
Notes 1. Leave the NC pin open.  
2. SCL0, SCL1, SDA0, and SDA1 are valid only for the µPD70F3038Y and 70F3040Y.  
4
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Pin  
Name  
Pin  
Name  
Pin  
Name  
Pin  
Name  
Number  
Number  
Number  
Number  
E1  
E2  
P27/TI3/TO3  
P25/SCK3/ASCK1  
P26/TI2/TO2  
VSS  
H12  
H13  
H14  
H15  
J1  
P144/TI9/INTTI9  
P143/INTCP93  
P146  
M1  
M2  
VDD  
P1  
P2  
P193  
P195  
P196  
P186  
E3  
M3  
P170/KR0  
P174/KR4  
P177/KR7  
P163/PWM3  
P167/HSOUT1  
RESET  
P3  
E4  
P141/INTCP91  
P125/TI7/TO7  
P124/TI6/TO6  
P126/TI10/TO10  
P127/TI11/TO11  
P140/INTCP90  
P137/TO81  
P142/INTCP92  
P135/TCLR8/INTTCLR8  
P181  
M4  
P4  
P176/KR6  
E5  
VDD  
M5  
P5  
P160/PWM0  
P164/CSYNCIN  
E11  
E12  
E13  
E14  
E15  
F1  
P95/HLDAK  
P92/R/W/WRH  
P76/ANI6  
P77/ANI7  
P80/ANI8  
P30/TI000  
P31/TI001  
P32/TI010  
P33/TI011  
P74/ANI4  
P72/ANI2  
P75/ANI5  
P70/ANI0  
P35/TO1  
J2  
M6  
P6  
Note 1  
J3  
M7  
P7  
VPP  
J4  
M8  
P8  
X2  
J12  
J13  
J14  
J15  
K1  
M9  
VSS  
P9  
P100/RTP00  
P104/RTP04  
P107/RTP07  
P150/RTP10  
P152/RTP12  
P153/RTP13  
P156/RTP16  
NCNote 2  
M10  
M11  
M12  
M13  
M14  
M15  
N1  
P103/RTP03  
P01/INTP0  
P04/INTP3  
P05/INTP4/ADTRG  
P03/INTP2  
P06/INTP5/RTPTRG0  
P191  
P10  
P11  
P12  
P13  
P14  
P15  
R1  
F2  
F3  
F4  
K2  
P180  
F12  
F13  
F14  
F15  
G1  
K3  
P182  
K4  
P183  
K12  
K13  
K14  
K15  
L1  
P134/TI8/INTTI8  
P133/INTCP83  
P136/TO80  
P132/INTCP82  
P185  
N2  
P192  
R2  
P194  
N3  
P197  
R3  
P171/KR1  
P172/KR2  
P161/PWM1  
P165/VSOUT  
XT1  
N4  
P173/KR3  
P175/KR5  
P162/PWM2  
P166/HSOUT0  
VDD  
R4  
G2  
P34/TO0  
N5  
R5  
G3  
P36/TI4/TO4  
P37/TI5/TO5  
P73/ANI3  
P147  
N6  
R6  
G4  
L2  
P184  
N7  
R7  
G12  
G13  
G14  
G15  
H1  
L3  
P187  
N8  
R8  
XT2  
L4  
VSS  
N9  
X1  
R9  
P101/RTP01  
P105/RTP05  
VSS  
P71/ANI1  
P145/RTPTRG1  
P121/SO4  
P120/SI4  
L5  
P190  
N10  
N11  
N12  
N13  
N14  
N15  
P102/RTP02  
P106/RTP06  
VDD  
R10  
R11  
R12  
R13  
R14  
R15  
L11  
L12  
L13  
L14  
L15  
VDD  
VSS  
P151/RTP11  
P154/RTP14  
P155/RTP15  
NC Note 2  
H2  
P07/INTP6  
P131/INTCP81  
P130/INTCP80  
P157/RTP17  
P00/NMI  
H3  
P122/SCK4  
P123/CLO  
H4  
P02/INTP1  
Notes 1. Connect this pin to VSS during normal operation mode.  
2. Leave the NC pin open.  
5
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
PIN IDENTIFICATION  
A16 to A21:  
AD0 to AD15:  
ADTRG:  
ANI0 to ANI15:  
ASCK0, ASCK1:  
ASTB:  
Address bus  
P120 to P127:  
P130 to P137:  
P140 to P147:  
P150 to P157:  
P160 to P167:  
P170 to P177:  
P180 to P187:  
P190 to P197:  
PWM0 to PWM3:  
RD:  
Port 12  
Address/data bus  
AD trigger input  
Port 13  
Port 14  
Analog input  
Port 15  
Asynchronous serial clock  
Address strobe  
Port 16  
Port 17  
AVDD:  
Analog power supply  
Analog reference voltage  
Analog ground  
Port 18  
AVREF:  
Port 19  
AVSS:  
Pulse width modulation  
Read  
BVDD:  
Bus interface power supply  
Bus interface ground  
Clock output  
BVSS:  
RESET:  
Reset  
CLKOUT:  
CLO:  
RTP00 to RTP07,:  
RTP10 to RTP17  
Real-time output port  
Clock output (divided)  
Csync input  
CSYNCIN:  
DSTB:  
RTPTRG0, RTPTRG1: RTP trigger input  
Data strobe  
R/W:  
Read/write status  
Receive data  
Serial clock  
Serial clock  
Serial data  
HLDAK:  
HLDRQ:  
Hold acknowledge  
Hold request  
RXD0, RXD1:  
SCK0 to SCK4:  
SCL0, SCL1:  
SDA0, SDA1:  
SI0 to SI4:  
SO0 to SO4:  
TCLR8:  
HSOUT0, HSOUT1: Hsync output  
INTCP80 to INTCP83,: Interrupt request from peripherals  
INTCP90 to INTCP93,  
Serial input  
INTP0 to INTP6,  
Serial output  
Timer clear  
INTTCLR8,  
INTTI8, INTTI9  
TI000, TI001, TI010,: Timer input  
TI011, TI2 to TI11  
KR0 to KR7:  
LBEN:  
Key return  
Lower byte enable  
TO0 to TO7, TO80,: Timer output  
TO81, TO10, TO11  
NMI:  
Non-maskable interrupt request  
P00 to P07:  
P10 to P15:  
P20 to P27:  
P30 to P37:  
P40 to P47:  
P50 to P57:  
P60 to P65:  
P70 to P77:  
P80 to P87:  
P90 to P96:  
P100 to P107:  
P110 to P113:  
Port 0  
Port 1  
Port 2  
Port 3  
Port 4  
Port 5  
Port 6  
Port 7  
Port 8  
Port 9  
Port 10  
Port 11  
TXD0, TXD1:  
UBEN:  
VDD:  
Transmit data  
Upper byte enable  
Power supply  
VPP:  
Programming power supply  
Vsync output  
VSOUT:  
VSS:  
Ground  
WAIT:  
Wait  
WRH:  
Write strobe high level data  
Write strobe low level data  
Crystal for main system clock  
Crystal for subsystem clock  
WRL:  
X1, X2:  
XT1, XT2:  
6
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
INTERNAL BLOCK DIAGRAM  
NMI  
INTP0 to INTP6  
ROM  
CPU  
INTC  
HLDRQ  
HLDAK  
INTCP80 to INTCP83,  
INTCP90 to INTCP93  
INTTCLR8  
Instruction  
queue  
ROM correction  
PC  
Note 1  
ASTB  
INTTI8, INTTI9  
TI000, TI001,  
32-bit barrel  
shifter  
Timer/counter  
16-bit timers:  
TM0, TM1  
DSTB/RD  
R/W/WRH  
UBEN  
LBEN/WRL  
WAIT  
A16 to A21  
AD0 to AD15  
Multiplier  
16 × 16 32  
TI010, TI011  
TO0, TO1  
System  
registers  
8-bit timers  
TM2 to TM7,  
TM10, TM11  
:
BCU  
RAM  
TO80, TO81  
TI8, TI9  
ALU  
General registers  
32 bits × 32  
24-bit timers:  
TM8, TM9  
TCLR8  
16 KB  
TI2/TO2, TI3/TO3  
TI4/TO4, TI5/TO5  
TI6/TO6, TI7/TO7  
TI10/TO10, TI11/TO11  
CSYNCIN  
Vsync/Hsync  
SIO  
HSOUT0, HSOUT1,  
VSOUT  
SO0  
SI0/SDA0Note 2  
SCK0/SCL0Note 2  
SO2  
CSI0/I2C0Note 3  
CSI2/I2C1Note 3  
CSI1/UART0  
CSI3/UART1  
CLKOUT  
Ports  
A/D  
converter  
CLO  
X1  
X2  
XT1  
XT2  
RESET  
SI2/SDA1Note 2  
SCK2/SCL1Note 2  
SO1/TXD0  
SI1/RXD0  
CG  
SCK1/ASCK0  
SO3/TXD1  
SI3/RXD1  
SCK3/ASCK1  
SO4  
V
V
BVDD  
BVSS  
DD  
SS  
Variable-  
length CSI4  
SI4  
SCK4  
Watch timer  
KR0 to KR7  
Key return function  
DMAC: 6 ch  
PWM  
Watchdog timer  
V
PP  
RTP00 to RTP07,  
RTP10 to RTP17  
RTPTRG0,  
RTP  
PWM0 to PWM3  
RTPTRG1  
Notes 1. 384 KB: µPD70F3038, 70F3038Y (flash memory)  
256 KB: µPD70F3040, 70F3040Y (flash memory)  
2. SDA0, SDA1, SCL0, and SCL1 are valid only for the 70F3038Y and µPD70F3040Y.  
3. The I2C function is valid only for the µPD703038Y and 70F3040Y.  
7
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
CONTENTS  
1. PIN FUNCTIONS.................................................................................................................................. 9  
1.1 Port Pins ....................................................................................................................................................9  
1.2 Non-Port Pins...........................................................................................................................................13  
1.3 Pin I/O Circuits, I/O Buffer Supply, and Recommended Connection of Unused Pins........................17  
2. ELECTRICAL SPECIFICATIONS ..................................................................................................... 21  
3. PACKAGE DRAWING....................................................................................................................... 44  
4. RECOMMENDED SOLDERING CONDITIONS ............................................................................... 46  
Preliminary Data Sheet U14622EJ1V0DS00  
8
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
1. PIN FUNCTIONS  
1.1 Port Pins  
(1/4)  
Pin Name  
P00  
I/O  
I/O  
PULL  
Yes  
Function  
Alternate Function  
NMI  
Port 0  
8-bit I/O port  
P01  
P02  
P03  
P04  
P05  
P06  
P07  
P10  
P11  
P12  
P13  
P14  
P15  
P20  
P21  
P22  
P23  
P24  
P25  
P26  
P27  
P30  
P31  
P32  
P33  
P34  
P35  
P36  
P37  
P40  
P41  
P42  
P43  
P44  
INTP0  
Input/output mode can be specified in 1-bit units.  
INTP1  
INTP2  
INTP3  
INTP4/ADTRG  
INTP5/RTPTRG0  
INTP6  
I/O  
Yes  
Port 1  
SI0/SDA0  
SO0  
6-bit I/O port  
Input/output mode can be specified in 1-bit units.  
SCK0/SCL0  
SI1/RXD0  
SO1/TXD0  
SCK1/ASCK0  
SI2/SDA1  
SO2  
I/O  
Yes  
Port 2  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
SCK2/SCL1  
SI3/RXD1  
SO3/TXD1  
SCK3/ASCK1  
TI2/TO2  
TI3/TO3  
TI000  
I/O  
Yes  
Port 3  
8-bit I/O port  
TI001  
Input/output mode can be specified in 1-bit units.  
TI010  
TI011  
TO0  
TO1  
TI4/TO4  
TI5/TO5  
AD0  
I/O  
No  
Port 4  
8-bit I/O port  
AD1  
Input/output mode can be specified in 1-bit units.  
AD2  
AD3  
AD4  
Remark PULL: On-chip pull-up resistor  
9
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(2/4)  
Pin Name  
P45  
I/O  
I/O  
PULL  
No  
Function  
Alternate Function  
AD5  
Port 4  
8-bit I/O port  
P46  
P47  
P50  
P51  
P52  
P53  
P54  
P55  
P56  
P57  
P60  
P61  
P62  
P63  
P64  
P65  
P70  
P71  
P72  
P73  
P74  
P75  
P76  
P77  
P80  
P81  
P82  
P83  
P84  
P85  
P86  
P87  
P90  
P91  
P92  
P93  
AD6  
Input/output mode can be specified in 1-bit units.  
AD7  
I/O  
No  
Port 5  
AD8  
8-bit I/O port  
AD9  
Input/output mode can be specified in 1-bit units.  
AD10  
AD11  
AD12  
AD13  
AD14  
AD15  
A16  
I/O  
No  
Port 6  
6-bit I/O port  
A17  
Input/output mode can be specified in 1-bit units.  
A18  
A19  
A20  
A21  
Input  
No  
Port 7  
ANI0  
8-bit input port  
ANI1  
ANI2  
ANI3  
ANI4  
ANI5  
ANI6  
ANI7  
Input  
No  
Port 8  
ANI8  
8-bit input port  
ANI9  
ANI10  
ANI11  
ANI12  
ANI13  
ANI14  
ANI15  
LBEN/WRL  
UBEN  
R/W/WRH  
DSTB/RD  
I/O  
No  
Port 9  
7-bit I/O port  
Input/output mode can be specified in 1-bit units.  
Remark PULL: On-chip pull-up resistor  
10  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(3/4)  
Pin Name  
P94  
I/O  
I/O  
PULL  
No  
Function  
Alternate Function  
ASTB  
Port 9  
7-bit I/O port  
P95  
HLDAK  
HLDRQ  
RTP00  
RTP01  
RTP02  
RTP03  
RTP04  
RTP05  
RTP06  
RTP07  
Input/output mode can be specified in 1-bit units.  
P96  
P100  
P101  
P102  
P103  
P104  
P105  
P106  
P107  
P110  
P111  
P112  
P113  
P120  
P121  
P122  
P123  
P124  
P125  
P126  
P127  
P130  
P131  
P132  
P133  
P134  
P135  
P136  
P137  
P140  
P141  
P142  
P143  
P144  
P145  
P146  
P147  
I/O  
Yes  
Port 10  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
I/O  
I/O  
No  
No  
Port 11  
4-bit I/O port  
Input/output mode can be specified in 1-bit units.  
Port 12  
SI4  
8-bit I/O port  
SO4  
Input/output mode can be specified in 1-bit units.  
SCK4  
CLO  
TI6/TO6  
TI7/TO7  
TI10/TO10  
TI11/TO11  
INTCP80  
INTCP81  
INTCP82  
INTCP83  
TI8/INTTI8  
TCLR8/INTTCLR8  
TO80  
I/O  
No  
Port 13  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
TO81  
I/O  
No  
Port 14  
INTCP90  
INTCP91  
INTCP92  
INTCP93  
TI9/INTTI9  
RTPTRG1  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
Remark PULL: On-chip pull-up resistor  
11  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(4/4)  
Pin Name  
P150  
I/O  
I/O  
PULL  
No  
Function  
Alternate Function  
RTP10  
Port 15  
8-bit I/O port  
P151  
P152  
P153  
P154  
P155  
P156  
P157  
P160  
P161  
P162  
P163  
P164  
P165  
P166  
P167  
P170  
P171  
P172  
P173  
P174  
P175  
P176  
P177  
P180  
P181  
P182  
P183  
P184  
P185  
P186  
P187  
P190  
P191  
P192  
P193  
P194  
P195  
P196  
P197  
RTP11  
RTP12  
RTP13  
RTP14  
RTP15  
RTP16  
RTP17  
PWM0  
PWM1  
PWM2  
PWM3  
CSYNCIN  
VSOUT  
HSOUT0  
HSOUT1  
KR0  
Input/output mode can be specified in 1-bit units.  
I/O  
I/O  
I/O  
I/O  
No  
Yes  
No  
Port 16  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
Port 17  
8-bit I/O port  
KR1  
Input/output mode can be specified in 1-bit units.  
KR2  
KR3  
KR4  
KR5  
KR6  
KR7  
Port 18  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
No  
Port 19  
8-bit I/O port  
Input/output mode can be specified in 1-bit units.  
Remark PULL: On-chip pull-up resistor  
12  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
1.2 Non-Port Pins  
(1/4)  
Pin Name  
A16 to A21  
AD0 to AD7  
AD8 to AD15  
ADTRG  
I/O  
PULL  
No  
Function  
Alternate Function  
P60 to P65  
P40 to P47  
P50 to P57  
P05/INTP4  
P70 to P77  
P80 to P87  
P15/SCK1  
P25/SCK3  
P94  
Output  
I/O  
Address bus 16 to 21  
No  
Address/data multiplexed bus 0 to 15  
Input  
Input  
Input  
Input  
Yes  
No  
A/D converter external trigger input  
Analog input to A/D converter  
ANI0 to ANI7  
ANI8 to ANI15  
ASCK0  
No  
Yes  
Baud rate clock input for UART0 and UART1  
External address strobe signal output  
ASCK1  
ASTB  
Output  
No  
AV''  
Positive power supply for A/D converter and ports used for  
alternate functions  
AV5()  
AV66  
Input  
Reference voltage input for A/D converter  
Ground potential for A/D converter and ports used for alternate  
functions  
BV''  
BV66  
Positive power supply for bus interface and ports used for  
alternate functions  
Ground potential for bus interface and ports used for alternate  
functions  
CLKOUT  
CLO  
Output  
Output  
Input  
Internal system clock output  
CLO output signal  
P123  
No  
No  
No  
No  
No  
No  
CSYNCIN  
DSTB  
Csync signal input  
P164  
Output  
Output  
Input  
External data strobe signal output  
Bus hold acknowledge output  
Bus hold request input  
P93/RD  
P95  
HLDAK  
HLDRQ  
HSOUT0  
HSOUT1  
P96  
Output  
Hsync signal output before compensation  
Hsync signal output after compensation  
External capture input for CC80 to CC83  
P166  
P167  
INTCP80 to  
INTCP83  
Input  
Input  
Input  
No  
No  
P130 to P133  
INTCP90 to  
INTCP93  
External capture input for CP90 to CP93  
P140 to P143  
INTP0 to INTP3  
INTP4  
Yes  
External interrupt request input (analog noise elimination)  
External interrupt request input (digital noise elimination)  
P01 to P04  
P05/ADTRG  
P06/RTPTRG0  
P07  
INTP5  
INTP6  
External interrupt request input (digital noise elimination  
supporting remote controller)  
Remark PULL: On-chip pull-up resistor  
13  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(2/4)  
Pin Name  
INTTCLR8  
INTTI8  
I/O  
PULL  
No  
Function  
Alternate Function  
P135/TCLR8  
P134/TI8  
P144/TI9  
P170 to P177  
P90/WRL  
P00  
Input  
Input  
External interrupt request input (digital noise elimination)  
No  
INTTI9  
KR0 to KR7  
LBEN  
Input  
Output  
Input  
Yes  
No  
Yes  
No  
No  
Key return input  
Lower byte enable signal output for external data bus  
Non-maskable interrupt request input  
Output of PWM channels 0 to 3  
Bus read strobe signal output  
System reset input  
NMI  
PWM0 to PWM3 Output  
P160 to P163  
P93/DSTB  
RD  
Output  
Input  
RESET  
RTP00 to RTP07 Output  
RTP10 to RTP17  
Yes  
No  
Real-time output port  
P100 to P107  
P150 to P157  
P06  
RTPTRG0  
RTPTRG1  
R/W  
Input  
Yes  
No  
RTP external trigger input  
P145  
Output  
Input  
No  
External read/write status output  
P92/WRH  
P13/SI1  
RXD0  
RXD1  
SCK0  
SCK1  
SCK2  
SCK3  
SCK4  
SCL0  
SCL1  
SDA0  
SDA1  
SI0  
Yes  
Serial receive data input for UART0 and UART1  
P23/SI3  
I/O  
Yes  
Serial clock I/O for CSI0 to CSI3 (3-wire mode)  
P12/SCL0  
P15/ASCK0  
P22/SCL1  
P25/ASCK1  
P122  
No  
Variable-length CSI4 serial clock I/O  
I/O  
I/O  
Yes  
Serial clock I/O for I C0 and I C1  
P12/SCK0  
P22/SCK2  
P10/SI0  
(µPD70F3038Y, 70F3040Y)  
Yes  
Yes  
Serial transmit/receive data I/O for I C0 and I C1  
(µPD70F3038Y, 70F3040Y)  
P20/SI2  
Input  
Serial receive data input for CSI0 to CSI3 (3-wire mode)  
P10/SDA0  
P13/RXD0  
P20/SDA1  
P23/RXD1  
P120  
SI1  
SI2  
SI3  
SI4  
No  
Variable-length CSI4 serial receive data input  
Serial transmit data output for CSI0 to CSI3  
SO0  
Output  
Yes  
P11  
SO1  
P14/TXD0  
P21  
SO2  
SO3  
P24/TXD1  
P121  
SO4  
No  
No  
Variable-length CSI4 serial transmit data output  
External clear input for TM8  
TCLR8  
Input  
P135/INTTCLR8  
Remark PULL: On-chip pull-up resistor  
14  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(3/4)  
Pin Name  
TI000  
I/O  
PULL  
Yes  
Function  
External count clock input/external capture trigger input for TM0  
External capture trigger input for TM0  
External count clock input/external capture trigger input for TM1  
External capture trigger input for TM1  
External count clock input for TM2  
External count clock input for TM3  
External count clock input for TM4  
External count clock input for TM5  
External count clock input for TM6  
External count clock input for TM7  
External count clock input for TM8  
External count clock input for TM9  
External count clock input for TM10  
External count clock input for TM11  
Pulse signal output for TM0  
Alternate Function  
P30  
Input  
TI001  
TI010  
TI011  
TI2  
P31  
P32  
P33  
P26/TO2  
P27/TO3  
P36/TO4  
P37/TO5  
P124/TO6  
P125/TO7  
P134/INTTI8  
P144/INTTI9  
P126/TO10  
P127/TO11  
P34  
TI3  
TI4  
TI5  
TI6  
No  
TI7  
TI8  
TI9  
TI10  
TI11  
TO0  
TO1  
TO2  
TO3  
TO4  
TO5  
TO6  
TO7  
TO80  
TO81  
TO10  
TO11  
TXD0  
TXD1  
UBEN  
V''  
Output  
Yes  
Pulse signal output for TM1  
P35  
Pulse signal output for TM2  
P26/TI2  
P27/TI3  
P36/TI4  
P37/TI5  
P124/TI6  
P125/TI7  
P136  
Pulse signal output for TM3  
Pulse signal output for TM4  
Pulse signal output for TM5  
No  
Pulse signal output for TM6  
Pulse signal output for TM7  
Pulse signal output 0 for TM8  
Pulse signal output 1 for TM8  
P137  
Pulse signal output for TM10  
P126/TI10  
P127/TI11  
P14/SO1  
P24/SO3  
P91  
Pulse signal output for TM11  
Output  
Yes  
Serial transmit data output for UART0 and UART1  
Output  
No  
Higher byte enable signal output for external data bus  
Positive power supply pin  
V33  
High voltage application pin for program write/verify  
Vsync signal output  
VSOUT  
V66  
Output  
No  
P165  
Ground potential  
WAIT  
WRH  
WRL  
Input  
Output  
External WAIT signal input  
No  
Higher byte write strobe signal output for external data bus  
Lower byte write strobe signal output for external data bus  
P92/R/W  
P90/LBEN  
Remark PULL: On-chip pull-up resistor  
15  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(4/4)  
Pin Name  
I/O  
Input  
PULL  
Function  
Alternate Function  
X1  
X2  
Resonator connection for main system clock  
XT1  
XT2  
Input  
Resonator connection for subsystem clock  
Remark PULL: On-chip pull-up resistor  
16  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
1.3 Pin I/O Circuits, I/O Buffer Supply, and Recommended Connection of Unused Pins  
Table 1-1 shows the I/O circuit type of each pin and the recommended connection of unused pins.  
For the I/O configuration of each circuit type, refer to Figure 1-1.  
Table 1-1. Types of Pin I/O Circuits and Recommended Connection of Unused Pins (1/2)  
Pin  
Alternate Function  
I/O Circuit  
Type  
I/O Buffer  
Power Supply  
Recommended Connection Method  
P00  
NMI  
5-W  
VDD  
Input:  
Independently connect to VDD or VSS  
via a resistor  
P01 to P04  
P05  
INTP0 to INTP3  
INTP4/ADTRG  
INTP5/RTPTRG0  
INTP6  
Output: Leave open  
P06  
P07  
P10  
SI0/SDA0  
SO0  
10-F  
10-E  
10-F  
5-W  
10-E  
10-F  
10-F  
10-E  
10-F  
5-W  
10-E  
10-F  
5-W  
5-W  
VDD  
P11  
P12  
SCK0/SCL0  
SI1/RXD0  
SO1/TXD0  
SCK1/ASCK0  
SI2/SDA1  
SO2  
P13  
P14  
P15  
P20  
VDD  
P21  
P22  
SCK2/SCL1  
SI3/RXD1  
SO3/TXD1  
SCK3/ASCK1  
TI2/TO2, TI3/TO3  
TI000, TI001  
TI010, TI011  
TO0, TO1  
TI4/TO4  
P23  
P24  
P25  
P26, P27  
P30, P31  
P32, P33  
P34, P35  
P36  
VDD  
5-A  
5-W  
P37  
TI5/TO5  
P40 to P47  
P50 to P57  
P60 to P65  
P70 to P77  
P80 to P87  
P90  
AD0 to AD7  
AD8 to AD15  
A16 to A21  
ANI0 to ANI7  
ANI8 to ANI15  
LBEN/WRL  
UBEN  
5
5
5
9
9
5
BVDD  
BVDD  
BVDD  
AVDD  
AVDD  
BVDD  
Input:  
Independently connect to BVDD or BVSS  
via a resistor  
Output: Leave open  
Connect to AVSS  
Input:  
Independently connect to BVDD or BVSS  
via a resistor  
Output: Leave open  
P91  
P92  
R/W/WRH  
DSTB/RD  
ASTB  
P93  
P94  
P95  
HLDAK  
P96  
HLDRQ  
P100 to P107  
P110 to P113  
P120  
RTP00 to RTP07  
10-E  
5
VDD  
VDD  
VDD  
Input:  
Independently connect to VDD or VSS  
via a resistor  
Output: Leave open  
SI4  
5-K  
17  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Table 1-1. Types of Pin I/O Circuits and Recommended Connection of Unused Pins (2/2)  
Pin  
Alternate Function  
I/O Circuit  
Type  
I/O Buffer  
Power Supply  
Recommended Connection Method  
P121  
P122  
P123  
P124  
P125  
P126  
P127  
SO4  
10-G  
10-H  
5
VDD  
Input:  
Independently connect to VDD or VSS  
via a resistor  
SCK4  
Output: Leave open  
CLO  
TI6/TO6  
5-K  
TI7/TO7  
TI10/TO10  
TI11/TO11  
P130 to P133  
P134  
INTCP80 to INTCP83  
5-K  
VDD  
TI8/INTTI8  
P135  
TCLR8/INTTCLR8  
P136, P137  
P140 to P143  
P144  
TO80, TO81  
5
INTCP90 to INTCP93  
5-K  
VDD  
TI9/INTTI9  
P145  
RTPTRG1  
P146, P147  
P150 to P157  
P160 to P163  
P164  
5
RTP10 to RTP17  
5
VDD  
VDD  
PWM0 to PWM3  
5
CSYNCIN  
5-K  
5
P165  
VSOUT  
P166  
HSOUT0  
P167  
HSOUT1  
P170 to P177  
P180 to P187  
P190 to P197  
CLKOUT  
WAIT  
KR0 to KR7  
5-K  
VDD  
VDD  
VDD  
BVDD  
BVDD  
VDD  
VDD  
VDD  
VDD  
VDD  
5
5
4
Leave open  
Connect to VDD via a resistor  
1
RESET  
X1  
2
X2  
Leave open  
Connect to VSS  
Leave open  
Connect to AVSS  
Connect to VSS  
XT1  
16-A  
XT2  
16-A  
AVREF  
VPP  
VDD  
VSS  
AVDD  
Connect to VDD  
Connect to VSS  
Connect to VDD  
Connect to VSS  
AVSS  
BVDD  
BVSS  
18  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Figure 1-1. Pin I/O Circuits (1/2)  
Type 1  
Type 5  
V
DD  
V
DD  
Data  
P-ch  
P-ch  
IN/OUT  
IN  
Output  
disable  
N-ch  
N-ch  
Input  
enable  
Type 2  
Type 5-A  
V
DD  
Pullup  
enable  
P-ch  
VDD  
Data  
P-ch  
N-ch  
IN  
IN/OUT  
Output  
disable  
Input  
Schmitt-triggered input with hysteresis characteristics  
Type 4  
enable  
Type 5-K  
V
DD  
V
DD  
Data  
P-ch  
N-ch  
Data  
P-ch  
IN/OUT  
OUT  
Output  
disable  
Output  
disable  
N-ch  
Input  
enable  
Push-pull output that can be set to high impedance output  
(both P-ch and N-ch are off)  
19  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Figure 1-1. Pin I/O Circuits (2/2)  
Type 5-W  
Type 10-G  
V
DD  
V
DD  
Pull-up  
enable  
Data  
P-ch  
P-ch  
V
DD  
IN/OUT  
Data  
P-ch  
Open drain  
N-ch  
IN/OUT  
Output  
disable  
Output  
disable  
N-ch  
Input  
enable  
Input  
enable  
Type 9  
Type 10-H  
V
DD  
P-ch  
N-ch  
Data  
P-ch  
N-ch  
Comparator  
+
IN  
IN/OUT  
Open drain  
Output  
V
REF (Threshold voltage)  
disable  
Input enable  
Input  
enable  
Type 10-E  
Type 16-A  
V
DD  
Pull-up  
enable  
P-ch  
V
DD  
Data  
P-ch  
IN/OUT  
Open  
Output  
disable  
N-ch  
XT1  
XT2  
Input  
enable  
Type 10-F  
V
DD  
Pull-up  
enable  
P-ch  
V
DD  
Data  
P-ch  
N-ch  
IN/OUT  
Open  
Output  
disable  
Input  
enable  
20  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
2. ELECTRICAL SPECIFICATIONS  
Absolute Maximum Ratings (TA = 25°C, VSS = 0 V)  
Parameter  
Supply voltage  
Symbol  
VDD  
Conditions  
Ratings  
Unit  
V
–0.5 to +4.6  
VPP  
–1.5 to +8.5  
V
AVDD  
BVDD  
VSS  
–0.5 to +4.6  
–0.5 to +4.6  
–0.5 to +0.5  
V
V
V
AVSS  
BVSS  
VI1  
VI2  
VK  
VIAN  
AVREF  
IOL  
–0.5 to +0.5  
V
–0.5 to +0.5  
V
V
V
V
V
V
mA  
mA  
mA  
mA  
mA  
mA  
mA  
Input voltage  
Note 1 (VDD)  
Note 2 (BVDD)  
X1, VDD = 2.7 to 3.6 V  
Note 3 (AVDD)  
AVREF pin  
Per pin  
Total for P00 to P07 and P150 to P157  
Total for P100 to P107 and P160 to P167  
Total for P170 to P177 and P190 to P197  
Total for P124 to P127 and P180 to P187  
Total for P30 to P37 and P120 to P123  
–0.5 to VDD + 0.5Note 4  
–0.5 to BVDD + 0.5Note 4  
Clock input voltage  
–0.5 to VDD + 1.0Note 4  
Analog input voltage  
Analog reference input voltage  
Output current, low  
–0.5 to AVDD + 0.5Note 4  
–0.5 to AVDD + 0.5Note 4  
4.0  
25  
25  
25  
25  
25  
25  
Total for P12 to P15, P20 to 27, and P110  
to P113  
Total for P50 to P57, P60 to P65, and  
CLKOUT  
25  
mA  
Total for P40 to P47 and P90 to P96  
Total for P130 to P137 and P140 to P147  
Per pin  
Total for P00 to P07 and P150 to P157  
Total for P100 to P107 and P160 to P167  
Total for P170 to P177 and P190 to P197  
Total for P124 to P127 and P180 to P187  
Total for P30 to P37 and P120 to P123  
25  
25  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
mA  
Output current, high  
IOH  
–4.0  
–25  
–25  
–25  
–25  
–25  
–25  
Total for P12 to P15, P20 to 27, and P110  
to P113  
Total for P50 to P57, P60 to P65, and  
CLKOUT  
–25  
mA  
Total for P40 to P47 and P90 to P96  
Total for P130 to P137 and P140 to P147  
Note 1, VDD = 2.7 to 3.6V  
Note 2, CLKOUT, BVDD = 2.7 to 3.6V  
Normal operation mode  
–25  
–25  
mA  
mA  
V
Output voltage  
VO1  
VO2  
TA  
–0.5 to VDD + 0.5Note 4  
–0.5 to BVDD + 0.5Note 4  
–40 to +85  
V
Operating ambient temperature  
Storage temperature  
°C  
°C  
°C  
Flash programming mode  
+10 to +40  
–40 to +125  
Tstg  
Notes 1. Ports 0, 1, 2, 3, 10, 11, 12, 13, 14, 15, 16, 17, 18, and 19 (includes alternate function pins)  
2. Ports 4, 5, 6, and 9 (includes alternate function pins)  
3. Ports 7 and 8 (includes alternate function pins)  
4. Be sure not to exceed each absolute maximum rating (MAX.).  
21  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Cautions 1. Avoid direct connections among the IC device output (or I/O) pins and between VDD or VCC  
and GND. However, direct connections among open-drain and open-connector pins are  
possible, as are direct connections to external circuits that have timing designed to prevent  
output contention with pins that become high-impedance.  
2. Product quality may suffer if the absolute maximum rating is exceeded even momentarily for  
any parameter. That is, the absolute maximum ratings are rated values at which the product  
is on the verge of suffering physical damage, and therefore the product must be used under  
conditions that ensure that the absolute maximum ratings are not exceeded.  
The ratings and conditions indicated for DC characteristics and AC characteristics represent  
the quality assurance range during normal operation.  
Capacitance (TA = 25°C, VDD = AVDD = BVDD = VSS = 0 V = AVSS = BVSS)  
Parameter  
Input capacitance  
Symbol  
CI  
Conditions  
MIN.  
TYP.  
MAX.  
15  
Unit  
pF  
fC = 1 MHz  
Unmeasured pins returned to 0 V  
I/O capacitance  
CIO  
15  
pF  
Output capacitance  
CO  
15  
pF  
Operating Conditions  
(1) CPU operating frequency  
Parameter  
Symbol  
Conditions  
VDD = 2.7 to 3.6 V  
MIN.  
0.5  
0.5  
TYP.  
MAX.  
16  
20  
Unit  
CPU operating  
frequency  
fCPU  
MHz  
MHz  
VDD = 3.1 to 3.6 V  
(2) Operating frequency for each supply voltage  
Operating Frequency  
4 MHz fXX 16 MHz  
Supply Voltage (VDD = AVDD = BVDD)  
2.7 to 3.6 V  
3.1 to 3.6 V  
2.7 to 3.6 V  
4 MHz fXX 20 MHz  
fXT = 32.768 kHz (only watch operation)  
22  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Recommended Oscillator  
(1) Main clock oscillator (TA = 40 to +85°C)  
(a) Ceramic or crystal resonator connection  
X2  
X1  
Parameter  
Symbol  
fXX  
Conditions  
VDD = 2.7 to 3.6 V  
VDD = 3.1 to 3.6 V  
After reset release  
MIN.  
TYP.  
MAX.  
16  
Unit  
MHz  
MHz  
s
Oscillation frequency  
4
4
20  
Oscillation stabilization  
time  
219/fXX  
After STOP mode release  
Note  
s
Note Values vary depending on the settings of the oscillation stabilization selection register (OSTS).  
Remarks 1. Place the oscillator as close as possible to X1 and X2.  
2. Do not wire other signal lines within the broken lines.  
3. For resonator selection and oscillation constants, customers are advised to either evaluate the  
oscillation themselves, or apply to the resonator manufacturer for evaluation.  
(b) External clock input  
X1  
X2  
Open  
High-speed CMOS inverter  
External clock  
Parameter  
Symbol  
fXX  
Conditions  
MIN.  
TYP.  
MAX.  
16  
Unit  
MHz  
MHz  
Input frequency  
VDD = 2.7 to 3.6 V  
VDD = 3.1 to 3.6 V  
4
4
20  
Cautions 1. Place the high-speed CMOS inverter as close as possible to the X1 pin.  
2. Perform sufficient evaluation to determine whether the µPD70F3038, 70F3038Y, 70F3040, or  
70F3040Y matches the high-speed inverter.  
23  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(2) Subclock oscillator (TA = 40 to +85°C)  
XT1  
XT2  
Parameter  
Symbol  
fXT  
Conditions  
MIN.  
32  
TYP.  
32.768  
10  
MAX.  
35  
Unit  
kHz  
s
Oscillation frequency  
Oscillation stabilization time  
VDD = 2.7 to 3.6 V  
Remarks 1. Place the oscillator as close as possible to XT1 and XT2.  
2. Do not wire other signal lines within the broken lines.  
3. For resonator selection and oscillation constants, customers are advised to either evaluate the  
oscillation themselves, or apply to the resonator manufacturer for evaluation.  
24  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
DC Characteristics  
(1) 16 MHz operation (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V)  
Parameter  
Symbol  
VIH1  
VIH2  
VIH3  
VIH4  
VIH5  
VIL1  
Conditions  
Pins in Note 1, WAIT  
MIN.  
0.7BVDD  
0.7VDD  
0.75VDD  
0.7AVDD  
0.8VDD  
BVSS  
TYP.  
MAX.  
BVDD  
Unit  
V
Input voltage, high  
Pins in Note 2  
Pins in Note 3, RESET  
Pins in Note 4  
X1  
VDD  
V
VDD  
V
AVDD  
V
VDD  
V
Input voltage, low  
Pins in Note 1, WAIT  
Pins in Note 2  
Pins in Note 3, RESET  
Pins in Note 4  
X1  
0.3BVDD  
0.3VDD  
0.2VDD  
0.3AVDD  
0.2VDD  
0.2VDD  
V
VIL2  
VSS  
V
VIL3  
VSS  
V
VIL4  
AVSS  
V
VIL5  
VSS  
V
VPP supply current  
VPP1  
VOH1  
VOH2  
VOL1  
VOL2  
During normal operation  
Note 1, CLKOUT  
Notes 2, 3  
0
V
Output voltage, high  
IOH = –3 mA  
IOH = –1 mA  
0.8BVDD  
0.8VDD  
V
V
Output voltage, low  
Note 1, CLKOUT  
0.4  
0.4  
V
Notes 2, 3 (excluding  
V
P10, P12, P20, P22)  
VOL3  
ILIH1  
ILIH2  
ILIL1  
ILIL2  
ILOH  
ILOL  
IDD1  
IDD2  
IDD3  
IDD4  
P10, P12, P20, P22  
0.4  
5
V
Input leakage current, high  
Input leakage current, low  
VI = VDD = AVDD = BVDD  
Other than X1  
µA  
µA  
µA  
µA  
µA  
µA  
mA  
mA  
mA  
µA  
X1  
20  
–5  
–20  
5
VI = 0 V  
Other than X1  
X1  
Output leakage current, high  
Output leakage current, low  
Supply current  
VO = VDD = AVDD = BVDD  
VO = 0 V  
–5  
58  
32  
9
Normal operation (fXX = 16 MHz)  
HALT mode (fXX = 16 MHz)  
IDLE mode (fXX = 16 MHz)  
40  
19  
6
STOP mode (subclock operation: fXT =  
32.768 kHz, watch timer operation  
13  
115  
STOP mode (subclock stopped, XT1 = VSS)  
VIN = 0V  
5
100  
100  
µA  
k  
Pull-up resistor  
RL  
10  
30  
Notes 1. Ports 4, 5, 6, and 9 (includes alternate function pins)  
2. P11, P14, P21, P24, P34, P35, P100 to P107, P110 to P113, P121, P123, P136, P137, P146, P147, P150 to  
P157, P160 to P163, P165 to P167, P180 to P187, and P190 to P197 (includes alternate function pins)  
3. P00 to P07, P10, P12, P13, P15, P20, P22, P23, P25 to P27, P30 to P33, P36, P37, P120, P122, P124  
to P127, P130 to P135, P140 to P145, P164, and P170 to P177 (includes alternate function pins)  
4. Ports 7, and 8 (includes alternate function pins)  
Caution The TYP. value of VDD is 3.3 V. The current that is consumed at output buffers is not included.  
25  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(2) 20 MHz operation  
(TA = –40 to +85°C, VDD = AVDD = BVDD = 3.1 to 3.6 V, VSS = AVSS = BVSS = 0 V)  
Parameter  
Symbol  
Conditions  
MIN.  
TYP.  
MAX.  
Unit  
Input voltage, high  
VIH1  
VIH2  
VIH3  
VIH4  
VIH5  
VIL1  
VIL2  
VIL3  
VIL4  
VIL5  
VPP1  
VOH1  
VOH2  
VOL1  
VOL2  
Pins in Note 1, WAIT  
0.7 BVDD  
0.7 VDD  
0.75 VDD  
0.7 AVDD  
0.8 VDD  
BVSS  
BVDD  
VDD  
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Pins in Note 2  
Pins in Note 3, RESET  
Pins in Note 4  
X1  
VDD  
AVDD  
VDD  
Input voltage, low  
Pins in Note 1, WAIT  
Pins in Note 2  
Pins in Note 3, RESET  
Pins in Note 4  
X1  
0.3 BVDD  
0.3 VDD  
0.2 VDD  
0.3 AVDD  
0.2 VDD  
0.2 VDD  
VSS  
VSS  
AVSS  
VSS  
VPP supply voltage  
Output voltage, high  
Normal operation  
Note 1, CLKOUT  
Notes 2, 3  
0
IOH = 3 mA  
IOH = 1 mA  
IOL = 1.6 mA  
0.8 BVDD  
0.8 VDD  
Output voltage, low  
Note 1, CLKOUT  
0.4  
0.4  
Notes 2, 3 (excluding IOL = 1.6 mA  
P10, P12, P20, P22)  
VOL3  
ILIH1  
ILIH2  
ILIL1  
ILIL2  
ILOH  
P10, P12, P20, P22  
IOL = 3 mA  
0.4  
5
V
Input leakage current,  
high  
VI = VDD = AVDD = Other than X1  
µA  
µA  
µA  
µA  
µA  
BVDD  
X1  
20  
5  
20  
5
Input leakage current, low  
VI = 0 V  
Other than X1  
X1  
Output leakage current,  
high  
VO = VDD = AVDD = BVDD  
Output leakage current,  
Supply current  
ILOL  
IDD1  
IDD2  
IDD3  
IDD4  
VO = 0 V  
5  
64  
µA  
mA  
mA  
mA  
µA  
Normal operation (fXX = 20 MHz)  
HALT mode (fXX = 20 MHz)  
45  
20  
6.5  
13  
35  
IDLE mode (fXX = 20 MHz)  
10  
STOP mode (subclock operation: fXT =  
32.768 kHz, watch timer operation)  
115  
STOP mode (subclock stopped, XT1 = VSS  
)
5
100  
100  
µA  
kΩ  
Pull-up resistor  
RL  
VIN = 0 V  
10  
30  
Notes 1. Ports 4, 5, 6, and 9 (includes alternate function pins)  
2. P11, P14, P21, P24, P34, P35, P100 to P107, P110 to P113, P121, P123, P136, P137, P146, P147,  
P150 to P157, P160 to P163, P165 to P167, P180 to P187, and P190 to P197 (includes alternate function  
pins)  
3. P00 to P07, P10, P12, P13, P15, P20, P22, P23, P25 to P27, P30 to P33, P36, P37, P120, P122, P124  
to P127, P130 to P135, P140 to P145, P164, and P170 to P177 (includes alternate function pins)  
5. Ports 7 and 8 (includes alternate function pins)  
Caution The TYP. value of VDD is 3.3 V. The current that is consumed at output buffers is not included.  
26  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Data Retention Characteristics  
(TA = –40 to +85°C, VSS = AVSS = BVSS = 0 V, CL = 50pF)  
Parameter  
Data retention voltage  
Data retention current  
Supply voltage rise time  
Supply voltage fall time  
Symbol  
VDDDR  
IDDDR  
tRVD  
Conditions  
STOP mode  
MIN.  
1.8  
TYP.  
5
MAX.  
3.6  
Unit  
V
VDDDR [V], XT1 = VSS  
100  
µA  
µs  
200  
200  
0
tFVD  
µs  
Supply voltage hold time  
(from STOP mode setting)  
tHVD  
ms  
STOP release signal input time  
tDREL  
VIHDR  
VILDR  
0
VIHn  
0
ms  
V
Data retention high-level input voltage  
Data retention low-level input voltage  
All input ports  
All input ports  
VDDDR  
VILn  
V
Remark n = 1 to 5  
Setting STOP mode  
2.7 V  
t
FVD  
t
RVD  
V
DD  
V
DDDR  
t
HVD  
t
DREL  
V
V
IHDR  
RESET (input)  
IHDR  
STOP release interrupt (NMI, etc.)  
(when STOP mode is released  
at falling edge)  
STOP release interrupt (NMI, etc.)  
(when STOP mode is released  
at rising edge)  
V
ILDR  
Cautions 1. Be sure to shift to and return from STOP mode when VDD is 2.7 V or higher (when fxx = 16  
MHz) and VDD = 3.1 V or higher (when fxx = 20 MHz).  
2. VDD = 2.7 V is the lowest operating voltage (when fxx = 16 MHz) of the V850/SV1.  
27  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
AC Characteristics  
AC Test Input Measurement points (VDD, BVDD, AVDD)  
V
DD  
V
IH  
IL  
V
IH  
Measurement  
points  
V
V
IL  
0 V  
AC Test Output Measurement points (BVDD, VDD)  
BVDD  
V
OH  
OL  
V
OH  
Measurement  
points  
V
V
OL  
0 V  
Load Conditions  
DUT  
(Device Under Test)  
CL = 50 pF  
Caution If the load capacitance exceeds 50 pF due to the circuit configuration, bring the load  
capacitance of the device to 50 pF or less by inserting a buffer or by some other means.  
28  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Clock Timing  
(1) 16 MHz operation  
(TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
X1 input cycle  
Symbol  
Conditions  
MIN.  
62.5  
28.2  
28.2  
MAX.  
250  
Unit  
ns  
tCYX  
<1>  
<2>  
<3>  
<4>  
<5>  
<6>  
<7>  
<8>  
<9>  
<10>  
X1 input high-level width  
X1 input low-level width  
X1 input rise time  
tWXH  
tWXL  
tXR  
ns  
ns  
0.5 (<1><2><3>)  
0.5 (<1><2><3>)  
2 µs  
ns  
X1 input fall time  
tXF  
ns  
CLKOUT output cycle  
CLKOUT high-level width  
CLKOUT low-level width  
CLKOUT rise time  
tCYK  
tWKH  
tWKL  
tKR  
62.5 ns  
0.4tCYK10  
0.4tCYK10  
ns  
ns  
ns  
ns  
10  
10  
CLKOUT fall time  
tKF  
(2) 20 MHz operation  
(TA = –40 to +85°C, VDD = AVDD = BVDD = 3.1 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
X1 input cycle  
Symbol  
<1>  
Conditions  
MIN.  
50.0  
22.5  
22.5  
MAX.  
250  
Unit  
ns  
tCYX  
tWXH  
tWXL  
tXR  
<2>  
<3>  
<4>  
<5>  
<6>  
<7>  
<8>  
<9>  
<10>  
X1 input high-level width  
X1 input low-level width  
X1 input rise time  
ns  
ns  
0.5 (<1><2><3>)  
0.5 (<1><2><3>)  
2µs  
ns  
X1 input fall time  
tXF  
ns  
CLKOUT output cycle  
CLKOUT high-level width  
CLKOUT low-level width  
CLKOUT rise time  
tCYK  
tWKH  
tWKL  
tKR  
50 ns  
0.4tCYK10  
0.4tCYK10  
ns  
ns  
ns  
ns  
10  
10  
CLKOUT fall time  
tKF  
29  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Clock Timing  
<1>  
<2>  
<3>  
X1 (input)  
<4>  
<5>  
<6>  
<7>  
<8>  
CLKOUT (output)  
<9>  
<10>  
Timing of Pins Other Than CLKOUT, P4, P5, P6, and P9 Pins  
(TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
Symbol  
Conditions  
MIN.  
MAX.  
20  
Unit  
ns  
Output rise time  
Output fall time  
tOR  
tOF  
<11>  
<12>  
20  
ns  
<11>  
<12>  
Output signal  
30  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Bus Timing (CLKOUT Asynchronous)  
(TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
Symbol  
Conditions  
MIN.  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Address setup time (to ASTB)  
Address hold time (from ASTB)  
Delay time from DSTBto address float  
Setup time from address to data input  
Setup time from DSTBto data input  
Delay time from ASTBto DSTB↓  
Data input hold time (from DSTB)  
Address output time from DSTB↑  
Delay time from DSTBto ASTB↑  
Delay time from DSTBto ASTB↓  
DSTB low-level width  
tSAST  
tHSTA  
tFDA  
<13>  
<14>  
<15>  
<16>  
<17>  
<18>  
<19>  
<20>  
<21>  
<22>  
<23>  
<24>  
<25>  
<26>  
<27>  
<28>  
<29>  
<30>  
<31>  
<32>  
<33>  
<34>  
<35>  
<36>  
<37>  
<38>  
<39>  
<40>  
0.5T 20  
0.5T 15  
2
tSAID  
(2 + n)T 30  
(1 + n)T 30  
tSDID  
tDSTD  
0.5T 15  
0
tHDID  
tDDA  
(1 + i)T 15  
0.5T 15  
(1.5 + i)T 15  
(1 + n)T 15  
T 15  
tDDST1  
tDDST2  
tWDL  
ASTB high-level width  
tWSTH  
tDDOD  
tSODD  
tHDOD  
tSAWT1  
tSAWT2  
tHAWT1  
tHAWT2  
tSSTWT1  
tSSTWT2  
tHSTWT1  
tHSTWT2  
tWHQH  
tWHAL  
tDHAC  
Data output time from DSTB↓  
Data output setup time (to DSTB)  
Data output hold time (from DSTB)  
WAIT setup time (to address)  
15  
(1 + n)T 20  
T 15  
n 1  
n 1  
n 1  
n 1  
1.5T 30  
(1.5 + n)T 30  
WAIT hold time (from address)  
WAIT setup time (to ASTB)  
WAIT hold time (from ASTB)  
(0.5 + n)T  
(1.5 + n)T  
T 25  
(1 + n)T 25  
nT + 5  
(1 + n)T + 5  
T + 10  
T 15  
0
HLDRQ high-level width  
HLDAK low-level width  
Delay time from HLDAKto bus output  
Delay time from HLDRQto HLDAK↓  
Delay time from HLDRQto HLDAK↑  
tDHQHA1  
tDHQHA2  
(2n + 7.5)T + 25  
1.5T + 25  
0.5T  
Remarks 1. T = 1/fCPU (fCPU: CPU operation clock frequency)  
2. n: Number of wait clocks inserted in the bus cycle.  
Sampling timing changes when a programmable wait is inserted.  
3. i: Number of idle states inserted after the read cycle (0 or 1).  
4. The specifications described above are the values for when a clock with a duty ratio of 1:1 is input  
from X1.  
31  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Bus Timing (CLKOUT Synchronous)  
(TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
Symbol  
Conditions  
MIN.  
0
MAX.  
19  
Unit  
ns  
Delay time from CLKOUTto address  
tDKA  
<41>  
<42>  
Delay time from CLKOUTto address  
tFKA  
12  
7
ns  
float  
Delay time from CLKOUTto ASTB  
Delay time from CLKOUTto DSTB  
Data input setup time (to CLKOUT)  
Data input hold time (from CLKOUT)  
tDKST  
tDKD  
<43>  
<44>  
<45>  
<46>  
<47>  
12  
5  
15  
5
7
ns  
ns  
ns  
ns  
ns  
14  
tSIDK  
tHKID  
tDKOD  
Delay time from CLKOUTto data  
19  
output  
WAIT setup time (to CLKOUT)  
tSWTK  
tHKWT  
tSHQK  
tHKHQ  
tDKF  
<48>  
<49>  
<50>  
<51>  
<52>  
<53>  
15  
5
ns  
ns  
ns  
ns  
ns  
ns  
WAIT hold time (from CLKOUT)  
HLDRQ setup time (to CLKOUT)  
HLDRQ hold time (from CLKOUT)  
Delay time from CLKOUTto bus float  
Delay time from CLKOUTto HLDAK  
15  
5
19  
19  
tDKHA  
Remark The specifications described above are the values of when a clock with a duty ratio of 1:1 is input from  
X1.  
32  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Read Cycle (CLKOUT Synchronous/Asynchronous, 1 Wait)  
T1  
T2  
TW  
T3  
CLKOUT (output)  
<41>  
A16 to A21 (output), Note  
<16>  
<45> <46>  
Data  
<42>  
Hi-Z  
AD0 to AD15 (I/O)  
ASTB (output)  
Address  
<43>  
<43>  
<14>  
<13>  
<19>  
<24>  
<44>  
<18>  
<21>  
<15>  
<17>  
<20>  
<22>  
<44>  
DSTB (output),  
RD (output)  
<23>  
<48> <49>  
<32> <48> <49>  
<34>  
<33>  
<35>  
WAIT (input)  
<28>  
<30>  
<29>  
<31>  
Note R/W (output), UBEN (output), LBEN (output)  
Remark WRL and WRH are high level.  
33  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Write Cycle (CLKOUT Synchronous/Asynchronous, 1 Wait)  
T1  
T2  
TW  
T3  
CLKOUT (output)  
<41>  
A16 to A21 (output), Note  
<47>  
AD0 to AD15 (I/O)  
ASTB (output)  
Address  
<43>  
Data  
<43>  
<13>  
<14>  
<24>  
<21>  
<44>  
<18>  
<44>  
<25>  
<26>  
<27>  
DSTB (output),  
WRL (output),  
WRH (output)  
<23>  
<48> <49>  
<32> <48> <49>  
<34>  
<33>  
<35>  
WAIT (input)  
<28>  
<30>  
<29>  
<31>  
Note R/W (output), UBEN (output), LBEN (output)  
Remark RD is high level.  
34  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Bus Hold  
TH  
TH  
TH  
TI  
CLKOUT (output)  
HLDRQ (input)  
<50>  
<50> <51>  
<36>  
<53>  
<53>  
<39>  
<40>  
HLDAK (output)  
<52>  
<37>  
<38>  
Hi-Z  
A16 to A21 (output), Note  
AD0 to AD15 (I/O)  
ASTB (output)  
Data  
Hi-Z  
Hi-Z  
Hi-Z  
DSTB (output), RD (output),  
WRL (output), WRH (output)  
Note R/W (output), UBEN (output), LBEN (output)  
35  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Reset/Interrupt Timing  
(TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
RESET high-level width  
RESET low-level width  
NMI high-level width  
NMI low-level width  
Symbol  
tWRSH  
Conditions  
MIN.  
500  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
<54>  
<55>  
<56>  
<57>  
<58>  
tWRSL  
tWNIH  
tWNIL  
tWITH  
500  
500  
500  
INTPn high-level width  
n = 0 to 3, analog noise elimination  
n = 4, 5, digital noise elimination  
n = 6, digital noise elimination  
n = 0 to 3, analog noise elimination  
n = 4, 5, digital noise elimination  
n = 6, digital noise elimination  
500  
3T + 20  
3Tsmp + 20  
500  
INTPn low-level width  
tWITL  
<59>  
3T + 20  
3Tsmp + 20  
Remarks 1. T = 1/fXX  
2. Tsmp = Noise elimination sampling clock frequency  
Reset  
<54>  
<55>  
RESET (input)  
Interrupt  
<56>  
<57>  
<59>  
NMI (input)  
<58>  
INTPn (input)  
Remark n = 0 to 6  
36  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
TIn Input Timing  
(TA = –40 to +85°C, VDD = AVDD =BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
Tl0n0, Tl0n1 (n = 0, 1)  
Symbol  
Conditions  
MIN.  
2Tsam + 20Note  
MAX.  
Unit  
ns  
tTIIH  
<60>  
<61>  
High-level width  
Tln (n = 2 to 7, 10, 11)  
High-level width  
3T + 20  
2Tsam + 20Note  
3T + 20  
ns  
ns  
ns  
Tl0n0, Tl0n1 (n = 0, 1)  
Low-level width  
tTIL  
Tln (n = 2 to 7, 10, 11)  
Low-level width  
Note  
Tsam can be selected by setting the PRMn2 to PRMn0 bits of prescaler mode registers n0, n1 (PRMn0,  
PRMn1) (n = 0, 1).  
TM0 (PRM00, PRM01 registers): Tsam = 2T, 4T, 16T, 64T, 256T, 1/INTWTN period  
TM1 (PRM10, PRM11 registers): Tsam = 2T, 4T, 16T, 32T, 128T, 256T  
However, when the TIn0 valid edge is selected as the count clock, Tsam = 2T (n = 0, 1).  
Remark T: I/fXX  
<61>  
<60>  
TIn  
Remark n = 000, 001, 010, 011, 10, 11, 2 to 7  
37  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
3-Wire SIO Timing  
(1) Master mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
SCKn cycle time  
Symbol  
Conditions  
MIN.  
400  
140  
140  
50  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
tKCY1  
<62>  
<63>  
<64>  
<65>  
<66>  
<67>  
SCKn high-level width  
tKH1  
tKL1  
SCKn low-level width  
SIn setup time (to SCKn)  
SIn hold time (from SCKn)  
Delay time from SCKnto SOn output  
tSIK1  
tKSI1  
tKSO1  
50  
60  
Remark n = 0 to 3  
(2) Slave mode (TA = –40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
SCKn cycle time  
Symbol  
Conditions  
MIN.  
400  
180  
180  
50  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
tKCY2  
<62>  
<63>  
<64>  
<65>  
<66>  
<67>  
SCKn high-level width  
tKH2  
tKL2  
SCKn low-level width  
SIn setup time (to SCKn)  
SIn hold time (from SCKn)  
Delay time from SCKnto SOn output  
tSIK2  
tKSI2  
tKSO2  
50  
60  
Remark n = 0 to 3  
<62>  
<63>  
<64>  
<65>  
SCKn (I/O)  
SIn (input)  
<66>  
<67>  
SOn (output)  
Remark n = 0 to 3  
38  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
3-Wire Variable-Length CSI Timing  
(1) Master mode (TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
SCK4 cycle time  
Symbol  
Conditions  
MIN.  
400  
140  
140  
50  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
tKCY1  
tKH1  
tKL1  
<68>  
<69>  
<70>  
<71>  
<72>  
<73>  
SCK4 high-level width  
SCK4 low-level width  
SI4 setup time (to SCK4)  
SI4 hold time (from SCK4)  
Delay time from SCK4to SO4 output  
tSIK1  
tKSI1  
tKSO1  
50  
60  
(2) Slave mode (TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
SCK4 cycle time  
Symbol  
Conditions  
MIN.  
400  
180  
180  
50  
MAX.  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
tKCY2  
tKH2  
tKL2  
<68>  
<69>  
<70>  
<71>  
<72>  
<73>  
SCK4 high-level width  
SCK4 low-level width  
SI4 setup time (to SCK4)  
SI4 hold time (from SCK4)  
Delay time from SCK4to SO4 output  
tSIK2  
tKSI2  
tKSO2  
50  
60  
<68>  
<69>  
<70>  
SCK4 (I/O)  
SI4 (input)  
<72>  
<71>  
<73>  
SO4 (output)  
39  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
UART Timing (TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter  
ASCKn cycle time  
Symbol  
Conditions  
MIN.  
200  
80  
MAX.  
Unit  
ns  
tKCY13  
tKH13  
tKL13  
<74>  
<75>  
<76>  
ASCKn high-level width  
ASCKn low-level width  
ns  
80  
ns  
Remark n = 0, 1  
<74>  
<76>  
<75>  
ASCKn (input)  
Remark n = 0, 1  
40  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
I2C Bus Mode (Only for µPD70F3038Y and 70F3040Y)  
(TA = 40 to +85°C, VDD = AVDD = BVDD = 2.7 to 3.6 V, VSS = AVSS = BVSS = 0 V, CL = 50 pF)  
Parameter Symbol Standard Mode High-Speed Mode  
MIN. MAX.  
400  
Unit  
MIN.  
MAX.  
100  
SCLn clock frequency  
fCLK  
tBUF  
0
0
kHz  
Bus free time  
<77>  
4.7  
1.3  
µs  
(between stop/start conditions)  
Hold timeNote 1  
tHD : STA  
tLOW  
<78>  
<79>  
<80>  
<81>  
<82>  
4.0  
4.7  
0.6  
1.3  
0.6  
0.6  
µs  
µs  
µs  
µs  
µs  
µs  
ns  
ns  
ns  
µs  
ns  
SCLn clock low-level width  
SCLn clock high-level width  
Setup time of start/restart conditions  
tHIGH  
4.0  
tSU : STA  
4.7  
Data hold  
time  
CBUS-compatible master tHD : DAT  
I2C bus mode  
5.0  
0Note 2  
0Note 2  
100Note 4  
20 + 0.1CbNote 5  
20 + 0.1CbNote 5  
0.6  
0.9Note 3  
Data setup time  
tSU : DAT  
<83>  
<84>  
<85>  
<86>  
<87>  
250  
Rising time of SDAn and SCLn signals  
tR  
1000  
300  
300  
300  
Falling time of SDAn and SCLn signals tF  
Setup time of stop condition  
tSU : STO  
4.0  
Pulse width of spike suppressed by  
input filter  
tSP  
0
50  
Load capacitance of bus line  
Cb  
400  
400  
pF  
Notes 1. The first clock pulse in the start condition is generated after the hold time.  
2. The system must internally provide at least 300 ns hold time for the SDAn signal (at VIHmin. of the SCLn  
signal) in order to fill the undefined period that appears at the SCLn falling edge.  
3. If the system does not extend the low-state hold time (tLOW), only the maximum data hold time (tHD: DAT)  
has to be satisfied.  
4. The high-speed I2C bus is available in a standard mode I2C bus system. In this case, the following  
conditions should be satisfied.  
When the system does not extend the low-state hold time of the SCLn signal  
tSU: DAT 250 ns  
When the system extends the low-state hold time of the SCLn signal  
Send the next data bit to the SDAn line before the SCLn line is released (tRmax. + tSU: DAT = 1000 +  
250 = 1250 ns: Standard mode I2C bus specification).  
5. Cb: Total capacitance of one bus line (Unit: pF)  
Remarks 1. n = 0, 1  
2. The maximum operating frequency of I2C is fXX = 17 MHz.  
However, when 16 MHz < fXX 17 MHz, use the system with VDD = 3.1 V to 3.6 V.  
41  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
I2C Bus Mode (Only for µPD70F3038Y and 70F3040Y)  
<80>  
<84>  
<79>  
<85>  
SCLn  
SDAn  
<82>  
<81>  
<86>  
<87>  
<83>  
<78>  
Start  
<78>  
<77>  
<85>  
<84>  
Stop  
Restart  
condition  
Stop  
condition  
condition condition  
Remark n = 0, 1  
A/D Converter (TA = 40 to +85°C, VDD = AVDD = AVREF = 2.7 to 3.6 V, AVSS = VSS = 0 V, CL = 50 pF)  
Parameter  
Resolution  
Symbol  
Conditions  
MIN.  
10  
TYP.  
10  
MAX.  
10  
Unit  
bit  
Overall errorNote 1  
0.8  
100  
0.4  
0.4  
4.0  
4.0  
3.6  
%FSR  
µs  
Conversion time  
tCONV  
5
Zero-scale errorNote 1  
Full-scale errorNote 1  
%FSR  
%FSR  
LSB  
LSB  
V
Integral linearity errorNote 2  
Differential linearity errorNote 2  
Analog reference voltage  
Analog input voltage  
AVREF current  
AVREF  
VIAN  
AVREF = AVDD  
2.7  
AVSS  
AVREF  
500  
3
V
AIREF  
AIDD  
360  
1
µA  
A/D converter supply current  
During normal operation  
During STOP mode  
mA  
AIDDS  
1
10  
µA  
Notes 1. Excluding quantization error ( 0.05%FSR)  
2. Excluding quantization error ( 0.5LSB)  
Remark LSB: Least Significant Bit  
FSR: Full Scale Range  
42  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Flash Memory Programming Mode  
Basic Characteristics (TA = 10 to 40 °C, VDD = AVDD = BVDD = 3.0 to 3.6 V, VSS = AVSS = BVSS = 0 V)  
Parameter  
VPP supply voltage  
Symbol  
VPP2  
Conditions  
In flash memory programming  
mode  
MIN.  
7.5  
TYP.  
7.8  
MAX.  
8.1  
Unit  
V
VDD supply current  
IDD  
µPD70F3038,  
µPD70F3038Y  
VPP = VPP2  
fXX = 16 MHz,  
VDD = 3.0 to 3.6 V  
fXX = 20 MHz,  
VDD = 3.1 to 3.6 V  
fXX = 16 MHz,  
VDD = 3.0 to 3.6 V  
fXX = 20 MHz,  
66  
72  
mA  
mA  
mA  
mA  
µPD70F3040,  
µPD70F3040Y  
VPP = VPP2  
61  
67  
VDD = 3.1 to 3.6 V  
VPP supply voltage  
Step erase time  
Total erase time per area  
Writeback time  
IPP  
tER  
tERA  
tWB  
VPP = VPP2  
Note 1  
Step erase time = 0.2 s, Note 2  
Note 3  
200  
20  
mA  
s
s/area  
ms  
0.2  
1
Number of writebacks per CWB  
writeback command  
Writeback time = 1 ms, Note 4  
300  
16  
Times/  
Writeback command  
Time  
µs  
Number of erases – writebacks  
Step write time  
CERWB  
tWR  
Note 5  
20  
20  
Total write time per word  
tWRW  
When step write time is set to 20 µ s  
(1 word = 4 bytes), Note 6  
One erase + one write after erase  
= One rewrite, Note 7  
20  
200  
µs/  
word  
Times/  
area  
Number of rewrites per area  
CERWR  
Notes 1. The recommended set value of the step erase time is 0.2 s.  
2. The value does not include the prewrite and erase verify (writeback) time prior to erase.  
3. The recommended set value of the writeback time is 1 ms.  
4. Issuing a writeback command performs one writeback. Therefore, subtract the number of times a  
command is issued from this value to set the number of retries.  
5. The recommended set value of the step write time is 20 µ s.  
6. The actual write time per word is the total of this value and 20 µs. It does not include the internal verify  
time during and after writing.  
7. When a product is written for the first time, both erase write and write only is considered as one  
rewrite.  
Example (P: Write, E: Erase)  
Product  
P E P E P: 3 rewrites  
Product E P E P E P: 3 rewrites  
Remarks 1. The operation clock range in the flash memory programming mode is the same as that during  
normal operation.  
••  
••  
2. When the PG-FP3 is used, time parameters required for write/erase are automatically set by  
downloading a parameter file. Unless otherwise specified, do not change the set values.  
3. Area 0 = 00000H to 1FFFFH, area 1 = 20000H to 3FFFFH, area 2 = 040000 to 05FFFFH (µ  
PD70F3038, 70F3038Y)  
Area 0 = 00000H to 1FFFFH, area 1 = 20000H to 3FFFFH (µ PD70F3040, 70F3040Y)  
43  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
3. PACKAGE DRAWING  
176-PIN PLASTIC LQFP (FINE PITCH) (24x24)  
A
B
132  
133  
89  
88  
detail of lead end  
S
P
T
C
D
R
L
U
Q
176  
1
45  
44  
F
M
J
G
H
I
K
S
S
M
N
NOTE  
ITEM MILLIMETERS  
Each lead centerline is located within 0.10 mm of  
its true position (T.P.) at maximum material condition.  
A
B
C
D
F
G
H
I
26.0 0.2  
24.0 0.2  
24.0 0.2  
26.0 0.2  
1.25  
1.25  
0.22 0.05  
0.08  
J
0.5 (T.P.)  
1.0 0.2  
0.5  
K
L
+0.03  
M
0.17  
0.07  
0.08  
N
P
Q
1.4  
0.1 0.05  
+4°  
3°  
R
3°  
1.5 0.1  
S
T
0.25  
U
0.60 0.15  
S176GM-50-UEU-1  
44  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
180-PIN PLASTIC FBGA (13x13)  
D
w
S
B
ZD  
B
15  
14  
13  
12  
11  
10  
9
ZE  
A
8
E
7
6
5
4
3
2
1
R P N M L K J H G F E D C B A  
w
S
A
INDEX MARK  
A
y1  
A2  
S
S
ITEM MILLIMETERS  
13.00 0.10  
13.00 0.10  
0.2  
D
E
y
e
A1  
B
w
S
A
1.48 0.10  
0.35 0.06  
1.13  
A1  
A2  
e
φ
b
φ
x
M
S
A
0.80  
b
0.50 0.05  
0.08  
x
y
0.10  
0.20  
y1  
ZD  
ZE  
0.90  
0.90  
P180F1-80-EN2  
45  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
4. RECOMMENDED SOLDERING CONDITIONS  
The µPD70F3038, 70F3038Y, 70F3040, and 70F3040Y should be soldered and mounted under the following  
recommended conditions.  
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting  
Technology Manual (C10535E).  
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.  
Table 4-1. Surface Mounting Type Soldering Conditions  
(a) µPD70F3040GM-×××-UEU: 176-pin plastic LQFP (fine pitch) (24 × 24)  
µPD70F3040YGM-×××-UEU: 176-pin plastic LQFP (fine pitch) (24 × 24)  
Soldering Method  
Soldering Conditions  
Recommended  
Condition Symbol  
Infrared reflow  
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or  
higher), Count: Twice or less, Exposure limit: 3 daysNote (after that, prebake at  
125°C for 10 hours)  
IR35-103-2  
VP15-103-2  
VPS  
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or  
higher), Count: Twice or less, Exposure limit: 3 daysNote (after that, prebake at  
125°C for 10 hours)  
Partial heating  
Pin temperature: 300°C max., Time 3 seconds max. (per pin row)  
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.  
Caution Do not use different soldering methods together (except for partial heating).  
46  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
(b) µ PD70F3038F1-EN2: 180-pin plastic FBGA (13 × 13)  
µ PD70F3038YF1-EN2: 180-pin plastic FBGA (13 × 13)  
µ PD70F3040F1-EN2: 180-pin plastic FBGA (13 × 13)  
µ PD70F3040YF1-EN2: 180-pin plastic FBGA (13 × 13)  
Soldering Method  
Soldering Conditions  
Recommended  
Condition Symbol  
Infrared reflow  
VPS  
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),  
Count: Twice or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for  
10 hours)  
IR35-107-2  
VP15-107-2  
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),  
Count: Twice or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for  
10 hours)  
Partial heating  
Pin temperature: 300°C max., Time 3 seconds max. (per pin row)  
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.  
Caution Do not use different soldering methods together (except for partial heating).  
47  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
[MEMO]  
48  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
[MEMO]  
49  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
NOTES FOR CMOS DEVICES  
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS  
Note:  
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and  
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity  
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control  
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using  
insulators that easily build static electricity. Semiconductor devices must be stored and transported  
in an anti-static container, static shielding bag or conductive material. All test and measurement  
tools including work bench and floor should be grounded. The operator should be grounded using  
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need  
to be taken for PW boards with semiconductor devices on it.  
2
HANDLING OF UNUSED INPUT PINS FOR CMOS  
Note:  
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided  
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence  
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels  
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused  
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of  
being an output pin. All handling related to the unused pins must be judged device by device and  
related specifications governing the devices.  
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES  
Note:  
Power-on does not necessarily define initial status of MOS device. Production process of MOS  
does not define the initial operation status of the device. Immediately after the power source is  
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does  
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the  
reset signal is received. Reset operation must be executed immediately after power-on for devices  
having reset function.  
Purchase of NEC I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C  
system, provided that the system conforms to the I2C Standard Specification as defined by Philips.  
Related document  
µPD703038, 703038Y, 703039, 703039Y, 703040, 703040Y, 703041, 703041Y Data  
Sheet (U13953E)  
Note  
Reference document Electrical Characteristics for Microcomputer (U15170J)  
Note This document number is that of the Japanese version.  
The documents indicated in this publication may include preliminary versions. However, preliminary  
versions are not marked as such.  
V850 Family and V850/SV1 are trademarks of NEC Corporation.  
50  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
Regional Information  
Some information contained in this document may vary from country to country. Before using any NEC  
product in your application, pIease contact the NEC office in your country to obtain a list of authorized  
representatives and distributors. They will verify:  
Device availability  
Ordering information  
Product release schedule  
Availability of related technical literature  
Development environment specifications (for example, specifications for third-party tools and  
components, host computers, power plugs, AC supply voltages, and so forth)  
Network requirements  
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary  
from country to country.  
NEC Electronics Inc. (U.S.)  
Santa Clara, California  
Tel: 408-588-6000  
800-366-9782  
NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd.  
Benelux Office  
Hong Kong  
Eindhoven, The Netherlands  
Tel: 040-2445845  
Tel: 2886-9318  
Fax: 2886-9022/9044  
Fax: 408-588-6130  
800-729-9288  
Fax: 040-2444580  
NEC Electronics Hong Kong Ltd.  
Seoul Branch  
Seoul, Korea  
Tel: 02-528-0303  
Fax: 02-528-4411  
NEC Electronics (France) S.A.  
Velizy-Villacoublay, France  
Tel: 01-3067-5800  
NEC Electronics (Germany) GmbH  
Duesseldorf, Germany  
Tel: 0211-65 03 02  
Fax: 01-3067-5899  
Fax: 0211-65 03 490  
NEC Electronics Singapore Pte. Ltd.  
Novena Square, Singapore  
Tel: 253-8311  
NEC Electronics (France) S.A.  
Madrid Office  
Madrid, Spain  
Tel: 091-504-2787  
Fax: 091-504-2860  
NEC Electronics (UK) Ltd.  
Milton Keynes, UK  
Tel: 01908-691-133  
Fax: 250-3583  
Fax: 01908-670-290  
NEC Electronics Taiwan Ltd.  
Taipei, Taiwan  
Tel: 02-2719-2377  
NEC Electronics Italiana s.r.l.  
Milano, Italy  
Tel: 02-66 75 41  
NEC Electronics (Germany) GmbH  
Scandinavia Office  
Taeby, Sweden  
Fax: 02-2719-5951  
Fax: 02-66 75 42 99  
Tel: 08-63 80 820  
Fax: 08-63 80 388  
NEC do Brasil S.A.  
Electron Devices Division  
Guarulhos-SP, Brasil  
Tel: 11-6462-6810  
Fax: 11-6462-6829  
J01.2  
51  
Data Sheet U14622EJ2V0DS  
µPD70F3038, 70F3038Y, 70F3040, 70F3040Y  
The information in this document is current as of June, 2001. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data  
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products  
and/or types are available in every country. Please check with an NEC sales representative for  
availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4  

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